CN219275581U - Ceramic tile grinding block - Google Patents
Ceramic tile grinding block Download PDFInfo
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- CN219275581U CN219275581U CN202320128221.1U CN202320128221U CN219275581U CN 219275581 U CN219275581 U CN 219275581U CN 202320128221 U CN202320128221 U CN 202320128221U CN 219275581 U CN219275581 U CN 219275581U
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- polishing
- grinding
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- block
- tile
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/60—Production of ceramic materials or ceramic elements, e.g. substitution of clay or shale by alternative raw materials, e.g. ashes
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Abstract
The utility model relates to the field of ceramic tile grinding blocks, and particularly discloses a ceramic tile grinding block which comprises a grinding assembly, wherein the grinding assembly comprises a first polishing part and a second polishing part, the first polishing part is of a trapezoid structure, the second polishing part is of a rectangular structure, grinding blocks are arranged on the grinding assembly and symmetrically distributed on the grinding assembly along a horizontal central axis, the first polishing part comprises at least one row of grinding blocks, the second polishing part comprises at least two rows of grinding blocks, the grinding blocks are of a triangle structure, gaps are arranged between every two adjacent grinding blocks, the side edges of every two adjacent grinding blocks are parallel to each other, and chip removal grooves are arranged between every two adjacent rows of grinding blocks, so that the ceramic tile grinding block can be ground more uniformly during ceramic tile polishing, and scratches on the ceramic tile can be effectively avoided.
Description
Technical Field
The utility model relates to the field of tile grinding block industry, in particular to a tile grinding block.
Background
Currently, the grinding block is the main mold for glaze polishing, and is mounted on the grinding head of the polishing machine for polishing the glazed tile.
The existing tile polishing grinding block is characterized in that the grinding layer of the existing tile polishing grinding block mainly comprises rectangular toothed cutter head tile grinding blocks which are arranged at intervals vertically and horizontally, so that the grinding layer forms a gap between the horizontal and vertical directions, when the polishing grinding block rotates at a high speed for polishing, a grinding mark of a channel easily appears on a polished processing surface along the direction of a motion track, the polishing quality is affected, and the production efficiency is reduced.
Disclosure of Invention
The utility model aims to provide a ceramic tile grinding block, which aims to solve the problem that grinding marks are easy to appear on a polished processing surface of a ceramic tile in the prior art.
In order to achieve the above purpose, the utility model provides a ceramic tile grinding block, which comprises a grinding assembly, wherein the grinding assembly comprises a first polishing part and a second polishing part, the first polishing part comprises two groups, the two groups of first polishing parts are respectively positioned at two sides of the second polishing part, the first polishing part is in a trapezoid structure, the second polishing part is in a rectangular structure, the grinding assembly is provided with grinding blocks, the grinding blocks are symmetrically distributed on the surface of the grinding assembly along a horizontal central axis, the first polishing part comprises at least one row of grinding blocks, the second polishing part comprises at least two rows of grinding blocks, the grinding blocks are in a triangle structure, gaps are arranged between every two adjacent grinding blocks, the side edges of the two adjacent grinding blocks on each row are parallel, and chip removal grooves are arranged between the two adjacent rows of grinding blocks.
Through adopting above-mentioned technical scheme, can make this ceramic tile abrasive brick more even that polishes when polishing the ceramic tile, can effectively avoid appearing the mar on the ceramic tile, and the shape structure of this ceramic tile abrasive brick can effectively avoid two adjacent ceramic tile abrasive bricks to bump when using to form the interference on the burnishing machine, and the first polishing portion of trapezium structure is fit for polishing ceramic tile edge, and the second polishing portion of rectangle structure can be used to the polishing of large tracts of land and polishes, can improve the utilization ratio of this abrasive brick.
Preferably, the first polishing portions are provided with two groups, and the two groups of first polishing portions are respectively positioned at two sides of the second polishing portion.
By adopting the technical scheme, the edges of the ceramic tile can be polished on both sides of the ceramic tile grinding block, the part of the grinding disc of the polishing machine extending out of the surface of the ceramic tile can be reduced, and further, the utilization rate of the ceramic tile grinding block is improved.
Preferably, each row of polishing blocks is provided with at least three polishing blocks, and the three polishing blocks are in a splicing structure so as to form at least three inclined angle gaps on the grinding assembly.
By adopting the technical scheme, the grinding marks of the whole grinding surface of the ceramic tile grinding block are more uniform, and the ceramic tile grinding block can have a certain water retention capacity, so that overheating of the ceramic tile grinding block can be avoided, and the service life of the ceramic tile grinding block is influenced.
Preferably, the area of the polishing blocks on the second polishing portion is larger than the area of the polishing blocks on the first polishing portion, and the distribution density of the polishing blocks on the second polishing portion is smaller than the distribution density of the polishing blocks on the first polishing portion.
Through adopting above-mentioned technical scheme, the first polishing portion and the second polishing portion can consume in step, can effectively guarantee the stationarity when this ceramic tile abrasive brick polishes to can effectively avoid appearing the mar on the ceramic tile.
Preferably, the sanding block is configured as a trapezoid, and the cross-sectional area of the sanding block on the side facing the grinding assembly is greater than the cross-sectional area of the sanding block on the side facing away from the grinding assembly.
By adopting the technical scheme, the sharpness of the polishing block can be effectively maintained, and the polishing effect is better.
Preferably, the polishing block located on the first polishing portion is provided with a buffer portion, the buffer portion is arranged in an inclined structure, and the inclined direction is upward inclined along the bottom of the polishing block in a direction away from the second polishing portion.
Through adopting above-mentioned technical scheme, can effectively avoid appearing the mar on the ceramic tile to can reduce the abnormal consumption that the polishing piece produced because of direct striking ceramic tile on this ceramic tile abrasive brick, and then prolong this ceramic tile abrasive brick life.
Preferably, the grinding machine further comprises a clamping head and a cushion pad, wherein the cushion pad is fixed between the clamping head and the grinding assembly and is respectively in adhesive connection with the clamping head and the grinding assembly.
By adopting the technical scheme, the practicality of the ceramic tile grinding block is met.
Preferably, the buffer pads are respectively connected with the clamping head and the grinding assembly in an adhesive mode, at least two buffer pads are arranged, and the chip removal groove is located between two adjacent buffer pads.
Through adopting above-mentioned technical scheme, can effectively avoid leaking the phenomenon of throwing because of the blotter elastic retraction appears to enable this ceramic tile abrasive brick to have certain water retention volume, and then can avoid its overheated.
The tile grinding block provided by the utility model can enable the tile grinding block to be ground more uniformly when polishing and grinding tiles, can effectively avoid scratches on the tiles, and can effectively avoid the collision and interference of two adjacent tile grinding blocks on a polishing machine when in use, and the tile grinding block can polish and grind the edges of the tiles and the tile panels well, so that the utilization rate of the polishing block can be effectively improved.
Drawings
FIG. 1 is a schematic view of a tile abrasive block of the present utility model;
fig. 2 is a schematic side view of a tile abrasive block of the present utility model.
Reference numerals illustrate: 1. a grinding assembly; 11. a first polishing section; 12. a second polishing section; 13. polishing the block; 14. a chip removal groove; 15. a buffer section; 2. a clamping head; 3. and a cushion pad.
Detailed Description
The present utility model will be described in detail with reference to specific examples.
In the present utility model, unless explicitly stated and limited otherwise, when terminology such as "disposed," "connected," or "connected" is intended to be interpreted broadly, such as, for example, a fixed connection, a removable connection, or an integral connection; may be directly connected or connected through one or more intermediaries. The specific meaning of the terms described above in the present utility model can be understood by those skilled in the art according to the specific circumstances. The direction words appearing in the utility model are used for better explaining the characteristics of the features and the relation among the features, and it is understood that when the arrangement direction of the utility model is changed, the characteristics of the features and the directions of the relation among the features are correspondingly changed, so that the direction words do not form absolute limiting effect on the characteristics of the features and the relation among the features in space, and only play a role in relative limiting.
Referring to fig. 1-2, the present utility model provides a technical solution for a tile grinding block: including grinding subassembly 1, grinding subassembly 1 is including first polishing portion 11 and second polishing portion 12, first polishing portion 11 is including two sets of, two sets of first polishing portions 11 are located second polishing portion 12 both sides respectively, first polishing portion 11 is trapezium structure, second polishing portion 12 is rectangular structure, be provided with polishing piece 13 on the grinding subassembly 1, polishing piece 13 is along horizontal axis symmetric distribution on grinding subassembly 1 surface, first polishing portion 11 is including at least one row of polishing piece 13, second polishing portion 12 is including at least two rows of polishing piece 13, polishing piece 13 is triangle-shaped structure, be provided with the clearance between the adjacent two polishing piece 13, the side of adjacent two polishing piece 13 is parallel to each other on every row, be provided with chip groove 14 between the adjacent two rows of polishing piece 13.
Through adopting above-mentioned technical scheme, can make this ceramic tile abrasive brick polish more even when polishing the ceramic tile, can effectively avoid appearing the mar on the ceramic tile, and the shape structure of this ceramic tile abrasive brick can effectively avoid two adjacent ceramic tile abrasive bricks to bump when using to form the interference on the burnishing machine, and this ceramic tile abrasive brick polishes to the polishing that ceramic tile edge and ceramic tile panel can both be fine, can effectively improve the utilization ratio of this piece 13 of polishing.
In this embodiment, the first polishing parts 11 are provided with two groups, the two groups of first polishing parts 11 are respectively located at two sides of the second polishing part 12, the two sides of the tile grinding block can polish the edges of the tile, the part of the grinding disc of the polishing machine extending out of the tile surface can be reduced, and further, the utilization rate of the grinding block 13 is improved.
As shown in fig. 2, the tile grinding block further comprises a clamping head 2 and a cushion pad 3, the cushion pad 3 is fixed between the clamping head 2 and the grinding assembly 1, the cushion pad 3 is respectively in adhesive connection with the clamping head 2 and the grinding assembly 1, the cushion pad 3 is provided with at least two chip grooves 14 between two adjacent cushion pads 3, the practicality of the tile grinding block is met, when the tile grinding block is used, the tile grinding block is fixed on a polishing machine through the clamping head 2, and the cushion pad 3 can enable the grinding block 13 to be better attached to tiles.
In this embodiment, the chip grooves 14 are three, the buffer pads 3 are four, the chip grooves 14 are spaced between two adjacent buffer pads 3, the sectional buffer pads 3 can effectively avoid the phenomenon of missing throwing due to the elastic retraction of the buffer pads 3, and the tile grinding block can have a certain water retention capacity to avoid overheating.
In this embodiment, each row of polishing blocks 13 is provided with at least three polishing blocks 13 respectively, and the three polishing blocks 13 are in a splicing structure, so that at least three inclined angle gaps are formed on the grinding assembly 1, and the gaps between each row of polishing blocks 13 for forming the chip grooves 14 and at least two intersecting and penetrating inclined gaps are respectively formed, so that the polishing marks of the whole polishing surface of the tile polishing block are more uniform, the tile polishing block can have a certain water retention capacity, and overheating of the tile polishing block can be avoided, and the service life of the tile polishing block is influenced.
As shown in fig. 2, the polishing block 13 is configured as a trapezoid structure, the cross-sectional area of the polishing block 13 facing the side of the grinding assembly 1 is larger than the cross-sectional area of the polishing block facing the side of the grinding assembly 1, and the sharpness of the polishing block 13 can be effectively maintained by the polishing block 13 with a trapezoid structure, so that the polishing effect is better.
It should be noted that, in this embodiment, the area of the polishing block 13 on the second polishing portion 12 is larger than the area of the polishing block 13 on the first polishing portion 11, and the distribution density of the polishing blocks 13 on the second polishing portion 12 is smaller than the distribution density of the polishing blocks 13 on the first polishing portion 11, so that the first polishing portion 11 and the second polishing portion 12 can be consumed synchronously, the stability of the tile during polishing of the tile polishing block can be effectively ensured, and scratches on the tile can be effectively avoided.
In this embodiment, the polishing block 13 located on the first polishing portion 11 is provided with the buffer portion 15, the buffer portion 15 is configured to be of an inclined structure, the inclined direction is upward along the direction that the bottom of the polishing block 13 is away from the second polishing portion 12, it is to be noted that, in the actual use process, the front end and the rear end of the tile polishing block are contacted with rough glaze, the buffer portion 15 can effectively avoid scratches on the tile, and abnormal consumption of the polishing block 13 on the tile polishing block due to direct impact on the tile can be reduced, so that the service life of the tile polishing block is prolonged.
The working principle of the utility model is as follows: the clearance that forms at least three kind inclination on this ceramic tile abrasive brick can make this ceramic tile abrasive brick polish more even when polishing the ceramic tile, can effectively avoid appearing the mar on the ceramic tile, and the shape structure of this ceramic tile abrasive brick can effectively avoid two adjacent ceramic tile abrasive bricks to bump when using to form the interference on the burnishing machine, and the first polishing portion 11 of trapezium structure is fit for polishing the ceramic tile edge, and the second polishing portion 12 of rectangle structure can be used to the polishing of large tracts of land and polishes, can improve the utilization ratio of this piece 13 of polishing.
The above-described embodiments and features of the embodiments may be combined with each other without conflict.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the scope of the present utility model, and although the present utility model has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.
Claims (7)
1. A tile abrasive brick, characterized in that: including grinding subassembly (1), grinding subassembly (1) is including first polishing portion (11) and second polishing portion (12), first polishing portion (11) are including two sets of, two sets of first polishing portion (11) are located second polishing portion (12) both sides respectively, first polishing portion (11) are the trapezium structure, second polishing portion (12) are rectangular structure, be provided with on grinding subassembly (1) and polish piece (13), polish piece (13) are along horizontal axis symmetric distribution on grinding subassembly (1) surface, first polishing portion (11) is including at least one row of polish piece (13), second polishing portion (12) are including at least two rows of polish piece (13), polish piece (13) are triangle-shaped structure, be provided with the clearance between two adjacent polish piece (13) on every row, the side of two adjacent polish piece (13) are parallel to each other, be provided with chip groove (14) between two adjacent polish piece (13).
2. A tile abrasive block according to claim 1, wherein: each row of polishing blocks (13) is respectively provided with at least three polishing blocks (13) which are in a splicing structure, so that at least three inclined angle gaps are formed on the grinding assembly (1).
3. A tile abrasive block according to claim 1, wherein: the area of the polishing blocks (13) on the second polishing part (12) is larger than the area of the polishing blocks (13) on the first polishing part (11), and the distribution density of the polishing blocks (13) on the second polishing part (12) is smaller than that of the polishing blocks (13) on the first polishing part (11).
4. A tile abrasive block according to claim 1, wherein: the polishing block (13) is of a trapezoid structure, and the cross-sectional area of the polishing block (13) facing the side of the grinding assembly (1) is larger than the cross-sectional area of the polishing block facing the side of the grinding assembly (1).
5. A tile abrasive block according to claim 1, wherein: the polishing block (13) located on the first polishing portion (11) is provided with a buffer portion (15), the buffer portion (15) is arranged in an inclined structure, and the inclined direction is upward in an inclined manner along the bottom of the polishing block (13) in a direction away from the second polishing portion (12).
6. A tile abrasive block according to claim 1, wherein: still include gripping head (2), blotter (3) are fixed in between gripping head (2) and grinding subassembly (1), and blotter (3) are connected with gripping head (2) and grinding subassembly (1) bonding respectively.
7. A tile abrasive block according to claim 6, wherein: at least two cushions (3) are arranged, and chip removal grooves (14) are arranged between two adjacent cushions (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320128221.1U CN219275581U (en) | 2023-01-14 | 2023-01-14 | Ceramic tile grinding block |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320128221.1U CN219275581U (en) | 2023-01-14 | 2023-01-14 | Ceramic tile grinding block |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219275581U true CN219275581U (en) | 2023-06-30 |
Family
ID=86932391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320128221.1U Active CN219275581U (en) | 2023-01-14 | 2023-01-14 | Ceramic tile grinding block |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219275581U (en) |
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2023
- 2023-01-14 CN CN202320128221.1U patent/CN219275581U/en active Active
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