CN219269207U

CN219269207U - Contact array packaging structure with height-controllable welding spots

Info

Publication number: CN219269207U
Application number: CN202223181208.7U
Authority: CN
Inventors: 乔金彪; 侯庆河; 宋方震
Original assignee: Jiangsu Yanxin Microelectronics Co ltd
Current assignee: Jiangsu Yanxin Microelectronics Co ltd
Priority date: 2022-11-29
Filing date: 2022-11-29
Publication date: 2023-06-27
Anticipated expiration: 2032-11-29

Abstract

The utility model discloses a contact array packaging structure with a controllable welding spot height, relates to the related field of packaging structures, and aims to solve the problem that a spherical welding structure of the traditional packaging structure can influence the shearing capability between a chip and a PCB (printed circuit board) during thermal mismatch in the prior art. The upper end of PCB board is provided with ceramic substrate, ceramic substrate is provided with a plurality of, ceramic substrate sets up to rectangular plate, adjacent two set up to fixed connection between the ceramic substrate, be provided with the solder post between ceramic substrate and the PCB board, the solder post sets up to cylindric, the solder post is provided with a plurality of, a plurality of the solder post is the matrix arrangement, the upper and lower extreme of solder post all is provided with eutectic solder, the solder post passes through eutectic solder with PCB board and ceramic substrate respectively and is connected, ceramic substrate's upper end is provided with sealed apron, sealed apron sets up to rectangular cover plate.

Description

Contact array packaging structure with height-controllable welding spots

Technical Field

The utility model relates to the field of packaging structure, in particular to a contact array packaging structure with a controllable welding spot height.

Background

The package structure is a shell for mounting semiconductor integrated circuit chips, plays roles of placing, fixing, sealing, protecting chips and enhancing electrothermal performance, and is also a bridge for communicating the world inside the chips with external circuits, namely, joints on the chips are connected to pins of the package shell by wires, and the pins are connected with other devices by wires on a printed board. Therefore, packaging plays an important role for both CPU and other LSI integrated circuits.

For example, chinese issued patent (a heat dissipation flip-chip package structure with high reliability solder joint structure and method) with publication number CN114220785 a: the flip chip packaging structure comprises a substrate, bonding pads, chips and cooling fins, wherein the substrate is arranged at the bottom of the flip chip packaging structure, metal circuit layers are arranged on the upper surface and the lower surface of the substrate, the metal circuit layers are interconnected with metal circuits vertically distributed in the substrate, the bonding pads are in a concave shape and are arranged above the substrate, the number of the bonding pads is a plurality of the bonding pads, and the plurality of the concave-shaped bonding pads are connected to the corresponding metal circuit layers of the substrate;

the prior art has the advantages that the contact area of the bump and the bonding pad on the chip is increased and the bump and the bonding pad can be better contacted when the prior art is used, but the prior packaging structure is a spherical welding structure because the prior packaging structure is used, and when the thermal mismatch phenomenon occurs, the shearing capacity of the chip and the PCB is influenced, so that the market is urgently required to develop a contact array packaging structure with the height controllable welding point to help people solve the prior problem.

Disclosure of Invention

The utility model aims to provide a contact array packaging structure with a controllable welding spot height, which solves the problem that the shearing capability between a chip and a PCB (printed circuit board) can not be influenced when a spherical welding structure of the traditional packaging structure is subjected to thermal mismatch.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a solder joint height-controllable contact array packaging structure, includes the PCB board, the upper end of PCB board is provided with ceramic substrate, ceramic substrate is provided with a plurality ofly, ceramic substrate sets up to rectangular plate, adjacent two set up to fixed connection between the ceramic substrate, be provided with the solder post between ceramic substrate and the PCB board, the solder post sets up to cylindric, the solder post is provided with a plurality ofly, a plurality of the solder post is matrix arrangement.

Preferably, eutectic solder is arranged at the upper end and the lower end of the solder column, and the solder column is connected with the PCB and the ceramic substrate respectively through the eutectic solder.

Preferably, a sealing cover plate is arranged at the upper end of the ceramic substrate, the sealing cover plate is in a rectangular cover plate shape, sealing solder is arranged at the joint of the sealing cover plate and the ceramic substrate, and the sealing cover plate is connected with the ceramic substrate through the sealing solder.

Preferably, the inner side of the sealing cover plate is provided with a chip main body, the lower end of the chip main body is provided with a fixing pad, and the fixing pad is fixedly connected with the chip main body.

Preferably, the fixing pad is provided with a first groove, the first groove is in a round groove shape, the first groove is provided with a plurality of grooves, two sides of the first groove are provided with supporting connecting grooves, the supporting connecting grooves are in a round groove shape, and the supporting connecting grooves are provided with a plurality of grooves.

Preferably, the lower extreme of fixed pad is provided with the connection pad, the connection pad sets up to rectangular disk, connection pad and ceramic substrate set up to fixed connection, the upper end of connection pad is provided with the solder paste strip, the solder paste strip coats in the outside of connection pad.

Preferably, the connection pad is provided with a second groove, the second groove is arranged to be round, the second groove is provided with a plurality of grooves, the two sides of the second groove are provided with supporting blocks, the supporting blocks are arranged to be semicircular blocks, the supporting blocks are provided with a plurality of grooves, and the supporting blocks are fixedly connected with the connection pad.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, through the arrangement of the solder columns, when a user uses the contact array packaging structure, the anti-fatigue capability of welding spots of the contact array packaging structure can be improved by arranging the cylindrical solder columns, so that the shearing capability between the ceramic substrate and the PCB caused by thermal mismatch can be relieved, the problem that the shearing capability between the chip and the PCB is influenced when the spherical welding structure of the traditional packaging structure is in thermal mismatch is solved, and the service life of the whole contact array packaging structure can be greatly prolonged;

2. according to the utility model, through the arrangement of the ceramic substrates, when a user uses the contact array packaging structure, the user can realize the protection of the chip and the fixing pad through the arrangement of the plurality of ceramic substrates, so that the use safety of the whole contact array packaging structure can be improved to a certain extent, and the use comfort of the user can be greatly improved.

Drawings

FIG. 1 is a block diagram of a solder joint height controllable contact array package structure of the present utility model;

FIG. 2 is a partial cross-sectional view of a solder joint height controllable contact array package structure of the present utility model;

FIG. 3 is a diagram of a separation structure of a connection pad and a capture pad of the present utility model;

fig. 4 is a combined structure diagram of a connection pad and a fixing pad of the present utility model.

In the figure: 1. a PCB board; 2. a solder column; 3. a ceramic substrate; 4. eutectic solder; 5. sealing the cover plate; 6. sealing the solder; 7. a chip main body; 8. a support connection groove; 9. a first groove; 10. a connection pad; 11. a second groove; 12. a support block; 13. a solder paste strip; 14. and fixing the bonding pads.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1-4, an embodiment of the present utility model is provided: the utility model provides a solder joint height-controllable contact array packaging structure, includes PCB board 1, and the upper end of PCB board 1 is provided with ceramic substrate 3, and ceramic substrate 3 is provided with a plurality ofly, and ceramic substrate 3 sets up to rectangular plate, sets up to fixed connection between two adjacent ceramic substrates 3, is provided with solder post 2 between ceramic substrate 3 and the PCB board 1, and solder post 2 sets up to cylindric, and solder post 2 is provided with a plurality ofly, and a plurality of solder posts 2 are the matrix arrangement.

During the use, can improve the antifatigue ability of its solder joint through setting up cylindric solder post 2 to can alleviate the shearing ability between ceramic substrate 3 and the PCB board 1 that causes by thermal mismatch more, with the problem that the spherical welded structure of solving current packaging structure can influence the shearing ability between chip and the PCB board when thermal mismatch, and then can increase substantially whole contact array packaging structure's life.

Further, eutectic solder 4 is arranged at the upper end and the lower end of the solder column 2, the solder column 2 is respectively connected with the PCB 1 and the ceramic substrate 3 through the eutectic solder 4, and protection of the chip main body 7 and the fixing pad 14 can be realized through the arrangement of the ceramic substrates 3, so that the use safety of the whole contact array packaging structure can be improved to a certain extent, and the use comfort of a user can be greatly improved.

Further, a sealing cover plate 5 is arranged at the upper end of the ceramic substrate 3, the sealing cover plate 5 is in a rectangular cover plate shape, sealing solder 6 is arranged at the joint of the sealing cover plate 5 and the ceramic substrate 3, and the sealing cover plate 5 is connected with the ceramic substrate 3 through the sealing solder 6.

Further, the inner side of the sealing cover plate 5 is provided with a chip main body 7, the lower end of the chip main body 7 is provided with a fixing pad 14, and the fixing pad 14 is fixedly connected with the chip main body 7.

Further, the fixing pad 14 is provided with a first groove 9, the first groove 9 is provided in a circular groove shape, the first groove 9 is provided in plurality, both sides of the first groove 9 are provided with support connecting grooves 8, the support connecting grooves 8 are provided in a circular groove shape, and the support connecting grooves 8 are provided in plurality.

Further, the lower end of the fixing pad 14 is provided with a connection pad 10, the connection pad 10 is provided in a rectangular disk shape, the connection pad 10 and the ceramic substrate 3 are provided in fixed connection, the upper end of the connection pad 10 is provided with a solder paste bar 13, and the solder paste bar 13 is coated on the outer side of the connection pad 10.

Further, be provided with second recess 11 on connection pad 10, second recess 11 sets up to the circular slot form, second recess 11 is provided with a plurality of, the both sides of second recess 11 all are provided with supporting shoe 12, supporting shoe 12 sets up to semicircle bulk, supporting shoe 12 is provided with a plurality of, supporting shoe 12 sets up to fixed connection with connection pad 10, can make connection pad 10 and fixed pad 14 can support chip main body 7 after the connection is accomplished through the setting of supporting shoe 12, so that the solder joint height between second recess 11 and the first recess 9 is controllable, and then can be by a wide margin improve whole contact array packaging structure's stability in use.

Working principle: during the use, the user can be through fixing the fixed pad 14 on connecting pad 10 in the upper end of connecting pad 10, and make support spread groove 8 and supporting shoe 12 and first recess 9 and second recess 11 set up to the one-to-one, and push down chip main part 7, make solder paste strip 13 can be full of in first recess 9, the inside of second recess 11 and support spread groove 8, rethread reflow process, make fixed pad 14 can form metallurgical bonding with the solder in the solder paste strip 13, can realize the combination treatment to this contact array packaging structure, and the user can improve the antifatigue ability of its solder joint through setting up cylindric solder post 2 in the in-process that uses this contact array packaging structure, thereby can alleviate the shearing ability between ceramic substrate 3 and the PCB board 1 that causes by thermal mismatch more, in order to solve the spherical welded structure of current packaging structure can influence the chip and the problem of the shearing ability between the PCB board during thermal mismatch, and then can increase substantially whole contact array packaging structure's life, also can form the metallurgical bonding through the solder in solder paste strip 13, can realize the combination treatment to this contact array packaging structure to the whole, and can improve the safety and comfort in order to use the safety of the pad is greatly improved to the use of the pad 14 to the degree.

It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a solder joint height-controllable contact array packaging structure, includes PCB board (1), its characterized in that: the upper end of PCB board (1) is provided with ceramic substrate (3), ceramic substrate (3) are provided with a plurality of, ceramic substrate (3) set up to rectangular plate, adjacent two set up to fixed connection between ceramic substrate (3), be provided with solder post (2) between ceramic substrate (3) and PCB board (1), solder post (2) set up to cylindric, solder post (2) are provided with a plurality of, a plurality of solder post (2) are matrix arrangement.

2. The solder joint height controllable contact array package structure of claim 1, wherein: the upper end and the lower end of the solder column (2) are respectively provided with eutectic solder (4), and the solder column (2) is respectively connected with the PCB (1) and the ceramic substrate (3) through the eutectic solder (4).

3. The solder joint height controllable contact array package structure of claim 1, wherein: the upper end of ceramic substrate (3) is provided with sealed apron (5), sealed apron (5) are set up to rectangle lid platy, sealed apron (5) are provided with sealed solder (6) with the junction of ceramic substrate (3), sealed apron (5) are connected through sealed solder (6) with ceramic substrate (3).

4. A solder joint height controllable contact array package structure according to claim 3, wherein: the inner side of the sealing cover plate (5) is provided with a chip main body (7), the lower end of the chip main body (7) is provided with a fixing pad (14), and the fixing pad (14) is fixedly connected with the chip main body (7).

5. The solder joint height controllable contact array package structure of claim 4, wherein: the fixing pad is characterized in that a first groove (9) is formed in the fixing pad (14), the first groove (9) is formed in a round groove shape, a plurality of first grooves (9) are formed in the first groove, supporting connecting grooves (8) are formed in two sides of the first groove (9), the supporting connecting grooves (8) are formed in the round groove shape, and a plurality of supporting connecting grooves (8) are formed in the supporting connecting grooves.

6. The solder joint height controllable contact array package structure of claim 4, wherein: the lower extreme of fixed pad (14) is provided with connection pad (10), connection pad (10) set up to rectangular disk, connection pad (10) set up to fixed connection with ceramic substrate (3), the upper end of connection pad (10) is provided with solder paste strip (13), solder paste strip (13) are coated in the outside of connection pad (10).

7. The solder joint height controllable contact array package structure of claim 6, wherein: the connecting pad is characterized in that a second groove (11) is formed in the connecting pad (10), the second groove (11) is in a round groove shape, a plurality of second grooves (11) are formed in the second groove, supporting blocks (12) are arranged on two sides of the second groove (11), the supporting blocks (12) are arranged in a semicircular block shape, the supporting blocks (12) are arranged in a plurality, and the supporting blocks (12) are fixedly connected with the connecting pad (10).