CN219266743U - Backlight module and display device - Google Patents

Abstract

The embodiment of the application provides a backlight module and display device, including base plate, a plurality of luminous subassembly and light guide plate, wherein, a plurality of luminous subassembly intervals set up on the base plate, and the light guide plate sets up relatively with the base plate, and the light guide plate interval is provided with a plurality of through-holes, and at least luminous subassembly inlays and locates in the through-hole, and the pore wall of through-hole is the inclined plane to make luminous subassembly's light can get into the light guide plate through the pore wall. The application provides a backlight unit, light can transversely propagate in the light guide plate, has enlarged single luminous subassembly's effective irradiation range for light distribution is more even, is favorable to realizing backlight unit's frivolity and reduces backlight unit's cost.

Description

Backlight module and display device

Technical Field

The application belongs to the technical field of display, and particularly relates to a backlight module and a display device.

Background

The liquid crystal display is widely used in display devices such as televisions, smart phones, tablet computers and the like as a communication interface between a user and information due to its excellent characteristics such as high space utilization, low electromagnetic interference, no radiation and the like. The liquid crystal module of the liquid crystal display does not emit light, but the backlight module provides a light source for the liquid crystal module, and the backlight module of the liquid crystal display comprises a direct type backlight module and a side-in type backlight module, wherein the direct type backlight module has the advantages of high brightness, partition light control, high contrast ratio and the like, and gradually becomes the main stream of the market.

The existing direct type backlight module is generally matched with a thicker diffusion plate, the LED light sources are arranged densely, the distance between the adjacent LED light sources is very small, and a larger light mixing distance is reserved between the LED light sources and the diffusion plate, so that the thickness of the backlight module is thicker, the light and thin of the backlight module is difficult to realize, and the cost of the direct type backlight module is higher due to the dense LED light sources.

Disclosure of Invention

The embodiment of the application provides a backlight module and a display device, which are used for solving the problems that the prior direct type backlight module has dense arrangement of LED light sources and larger light mixing distance, and the backlight module is difficult to lighten and thin and has low cost.

The embodiment of the application provides a backlight module, the backlight module includes:

a substrate;

the light-emitting assemblies are arranged on the substrate at intervals;

the light guide plate is arranged opposite to the base plate, a plurality of through holes are formed in the light guide plate at intervals, at least one light emitting component is embedded in the through holes, and the hole walls of the through holes are inclined surfaces so that light rays of the light emitting component can enter the light guide plate through the hole walls.

In some embodiments, the aperture of the through hole gradually decreases from a side closer to the substrate to a side farther from the substrate.

In some embodiments, the light emitting component includes a transparent support, a first LED chip and a packaging adhesive layer, the transparent support is connected with the substrate, the transparent support has an accommodation space with a top opening, the first LED chip and the packaging adhesive layer are disposed in the accommodation space, the packaging adhesive layer covers the first LED chip, one side of the packaging adhesive layer, which faces away from the first LED chip, is provided with a first reflective layer, and the first reflective layer can reflect light rays emitted from the top of the first LED chip, so that the light rays exit through the side surface of the transparent support.

In some embodiments, the light emitting component includes a second LED chip and a lens, the second LED chip is connected to the substrate, the lens covers the second LED chip, and the lens can scatter light emitted from the top of the LED chip, so that the light exits through a side surface of the lens.

In some embodiments, a convex arc surface is arranged on one side of the lens, which faces away from the second LED chip, and a conical groove is formed in the center of the arc surface in a concave manner, and the tip of the conical groove faces the second LED chip.

In some embodiments, a light emitting surface is formed on a surface of the light guide plate facing away from the substrate, and the light emitting component is not higher than the light emitting surface.

In some embodiments, a first lattice point is disposed on a surface of the light guide plate, which is close to the substrate, and the distribution trend of the first lattice point is that the distribution trend is sparse when the first lattice point is close to the through hole.

In some embodiments, a surface of the light guide plate facing away from the substrate is further provided with second dots, and the second dots are distributed along the periphery of the through hole.

In some embodiments, the backlight module further includes a second reflective layer, the second reflective layer is disposed on the substrate, the second reflective layer includes a plurality of hollow areas, and the light emitting component is disposed on the substrate exposed by the hollow areas.

In some embodiments, the backlight module further includes an optical film disposed on a side of the light guide plate facing away from the substrate.

The embodiment of the application also provides a display device, which comprises the backlight module set in any embodiment.

According to the backlight module provided by the embodiment of the application, the light emitting component is embedded in the through hole of the light guide plate, and as the hole wall of the through hole is the inclined surface, light rays emitted by the light emitting component can be emitted into the light guide plate through the hole wall, and can be emitted from one surface of the light guide plate away from the substrate after being reflected and diffused for multiple times in the light guide plate, so that the conversion from a point light source to a surface light source is realized, the light rays are distributed more uniformly, the light mixing distance of the backlight module is reduced, and the light and thin backlight module is realized; meanwhile, light rays can be transversely transmitted in the light guide plate, so that the effective irradiation range of a single light-emitting component is enlarged, the distribution density of the light-emitting component can be reduced, and the cost of the backlight module is further reduced.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

For a more complete understanding of the present application and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which like reference numerals represent like parts throughout the following description.

Fig. 1 is a schematic structural diagram of a backlight module according to an embodiment of the present application.

Fig. 2 is an enlarged schematic view of the portion a shown in fig. 1.

Fig. 3 is a light diffusion schematic diagram of the backlight module shown in fig. 1.

Fig. 4 is a schematic diagram of a second structure of the backlight module according to the embodiment of the present application.

Fig. 5 is an enlarged schematic view of the portion B shown in fig. 4.

Fig. 6 is a light diffusion schematic diagram of the backlight module shown in fig. 4.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by a person skilled in the art without any inventive effort, are intended to be within the scope of the present application based on the embodiments herein.

The existing direct type backlight module is generally matched with a thicker diffusion plate, the LED light sources are arranged densely, the distance between the adjacent LED light sources is very small, and a larger light mixing distance is reserved between the LED light sources and the diffusion plate, so that the thickness of the backlight module is thicker, the light and thin of the backlight module is difficult to realize, and the cost of the direct type backlight module is higher due to the dense LED light sources.

The embodiment of the application provides a backlight module and a display device, which are used for solving the problems that the prior direct type backlight module has dense arrangement of LED light sources and larger light mixing distance, and the backlight module is difficult to lighten and thin and has low cost.

It should be noted that, the backlight module provided in the embodiment of the present application is a direct type backlight module, which has a plurality of backlight partitions, and can realize a partition light control function. The direct type backlight module is mainly applied to display devices such as liquid crystal televisions, smart phones and tablet personal computers so as to provide a backlight source for a liquid crystal display panel.

Referring to fig. 1 to 3, fig. 1 is a schematic diagram of a first structure of a backlight module according to an embodiment of the present application, fig. 2 is an enlarged schematic diagram of a portion a shown in fig. 1, and fig. 3 is a light diffusion schematic diagram of the backlight module shown in fig. 1. The backlight module 100 provided in this embodiment of the disclosure includes a substrate 10, a plurality of light emitting assemblies 20 and a light guide plate 30, where the plurality of light emitting assemblies 20 are disposed on the substrate 10 at intervals, the light guide plate 30 is disposed opposite to the substrate 10, and the light guide plate 30 is located at a side of the light emitting assemblies 20 facing away from the substrate 10.

The substrate 10 may be a PCB or a flexible circuit board, and the substrate 10 is an important electronic component, is a support for electronic components, and is a carrier for electrically connecting the electronic components. The light emitting component 20 is disposed on the substrate 10 and electrically connected to the substrate 10.

In this embodiment, the number of the light emitting assemblies 20 is plural, and the plural light emitting assemblies 20 are arranged at intervals and are arranged on the substrate 10 in an array manner, or are arranged on the substrate 10 in other regular or irregular manners, which is not particularly limited in this application. For example, the light emitting elements 20 are disposed on the surface of the substrate 10 in an arrangement of M rows by N columns, where M and N are positive integers not less than 2.

In this application, the light emitting component 20 is a multi-surface light source, for example, the peripheral side surface of the light emitting component 20 emits light, or the peripheral side surface and the top surface of the light emitting component 20 emit light simultaneously.

Referring to fig. 1 to 3, the light guide plate 30 is provided with a plurality of through holes 31 at intervals, at least one light emitting component 20 is embedded in the through holes 31, and hole walls 32 of the through holes 31 are inclined surfaces, so that light of the light emitting component 20 can enter the light guide plate 30 through the hole walls 32. It should be noted that, the hole wall 32 is also equivalent to the light incident surface 34 of the light guide plate 30, the light emitted by the light emitting component 20 can be incident into the light guide plate 30 through the light incident surface 34, and the light can be emitted from the surface of the light guide plate 30 away from the substrate 10 after being reflected and diffused in the light guide plate 30 for multiple times, so as to realize the conversion from a point light source to a surface light source, so that the light distribution is more uniform, the light mixing distance of the backlight module 100 is reduced, and the light and thin backlight module 100 is realized; meanwhile, the light can be laterally transmitted in the light guide plate 30, so that the effective irradiation area of the single light emitting component 20 is enlarged, and therefore, the distribution density of the light emitting components 20 can be reduced, and the cost of the backlight module 100 can be further reduced.

In this embodiment, the aperture of the through hole 31 gradually decreases from the side close to the substrate 10 to the side far away from the substrate 10, so that the hole wall 32 forms an inclined plane, so that the light of the light emitting component 20 can enter the light guide plate 30 through the hole wall 32.

As shown in fig. 2, the light emitting assembly 20 includes a transparent support 21, a first LED chip 22 and a packaging adhesive layer 23, wherein the transparent support 21 is connected with the substrate 10, the transparent support 21 has an accommodating space with an open top, the first LED chip 22 is disposed in the accommodating space and connected with the bottom of the transparent support 21, and the packaging adhesive layer 23 is disposed in the accommodating space and covers the first LED chip 22. It should be noted that, the first LED chip 22 is encapsulated by the encapsulation adhesive layer 23, so as to maintain the air tightness of the first LED chip 22 and protect the first LED chip 22 from the temperature and humidity in the surrounding environment, and also prevent the first LED chip 22 from being damaged by mechanical vibration and impact or causing characteristic change to affect the light emitting performance.

In some embodiments, phosphor particles may be further disposed in the encapsulation adhesive layer 23, and the light emitted by the first LED chip 22 may be converted into white light by the phosphor particles.

The light emitted by the first LED chip 22 may pass through the transparent support 21. Preferably, the transparent support 21 may be a structure with transparent side walls and opaque bottom. In other embodiments, the transparent support 21 may be a transparent structure, i.e., transparent on the peripheral side walls and bottom. In a specific embodiment, the transparent support 21 may be made of any one of transparent plastic, transparent silica gel, transparent ceramic or transparent glass.

With continued reference to fig. 2 and 3, the light emitting assembly 20 further includes a first reflective layer 24, where the first reflective layer 24 is disposed on a side of the encapsulation adhesive layer 23 away from the first LED chip 22, that is, the first reflective layer 24 covers the opening of the transparent support 21. In a specific embodiment, the first reflective layer 24 may be white ink silk-screened on the surface of the encapsulation adhesive layer 23.

It should be noted that, the first reflective layer 24 can reflect a portion of the light emitted from the top of the first LED chip 22, so that the light is emitted to the light guide plate 30 through the transparent support 21. It may be also understood that a part of the light emitted from the top of the first LED chip 22 is reflected by the first reflective layer 24 and exits through the side surface of the transparent support 21, another part of the light may directly penetrate through the first reflective layer 24, and the light emitted from the side surface of the first LED chip 22 may directly pass through the transparent support 21 and be emitted to the light guide plate 30. Therefore, the first reflective layer 24 can reduce the light output right above the first LED chip 22, so that the light emitted from the top of the first LED chip 22 is reflected to the periphery, which is equivalent to increasing the light output angle and the light intensity of the periphery of the first LED chip 22, thereby being beneficial to reducing the arrangement density of the light emitting components 20 and further reducing the cost of the backlight module 100.

Referring to fig. 4 to 6, fig. 4 is a schematic diagram of a second structure of the backlight module according to the embodiment of the present application, fig. 5 is an enlarged schematic diagram of a portion B shown in fig. 4, and fig. 6 is a light diffusion schematic diagram of the backlight module shown in fig. 4. In this embodiment, the light emitting assembly 20 includes a second LED chip 25 and a lens 26, the second LED chip 25 is connected with the substrate 10, and the lens 26 is located on the substrate 10 and covers the second LED chip 25. The lens 26 can reflect the light emitted from the top of the second LED chip 25, so that the light exits through the side of the lens 26.

As shown in fig. 5 and fig. 6, one surface of the lens 26 facing away from the second LED chip 25 is an outwards protruding arc surface 261, a central groove of the arc surface 261 forms a conical groove 2611, the tip of the conical groove 2611 faces the second LED chip 25, the arc surface 261 can refract, reflect or scatter light emitted by the second LED chip 25, so that light emitted by the top of the second LED chip 25 can be emitted to the periphery at a larger deflection angle, and the light output of the top of the second LED chip 25 is weakened, so that light emitted by the top of the second LED chip 25 is reflected to the periphery, which is equivalent to increasing the light output angle and the peripheral light intensity of the second LED chip 25, which is beneficial to reducing the arrangement density of the light emitting assembly 20, and further reducing the cost of the backlight module 100.

The walls of the tapered groove 2611 are convex arc, and the convex arc walls can disperse the central light toward the outer side of the lens 26, so as to avoid the central condensation of the lens 26, and further prevent the central brightness of the light emitting component 20 from being higher, thereby ensuring the light emitting uniformity of the light emitting component 20.

As shown in fig. 1 to 6, the light guide plate 30 is provided with a plurality of through holes 31 at intervals, for example, the through holes 31 may be arranged in an array on the light guide plate 30. It should be noted that, the arrangement of the through holes 31 is required to correspond to the light emitting assemblies 20, so that each light emitting assembly 20 can be embedded into the corresponding through hole 31. Preferably, each light emitting component 20 is correspondingly embedded in a through hole 31. In other embodiments, two or more light emitting assemblies 20 may be disposed in one through hole 31, which is not particularly limited in this application.

As shown in fig. 2 and fig. 4, the hole wall 32 of the through hole 31 forms a light incident surface 34, and the light emitted by the light emitting component 20 can enter the light guide plate 30 through the hole wall 32, and exit from the surface of the light guide plate 30 away from the substrate 10 after being reflected and diffused for multiple times in the light guide plate 30, so as to realize the conversion from a point light source to a surface light source, so that the light distribution is more uniform, the light mixing distance of the backlight module 100 is reduced, and the light and thin backlight module 100 is realized; meanwhile, light can be transversely transmitted in the light guide plate 30, so that the effective irradiation area of the single light emitting component 20 is enlarged, the distribution density of the light emitting components 20 is reduced, and the cost of the backlight module 100 is reduced.

The light-emitting surface 33 is formed on the surface of the light guide plate 30 facing away from the substrate 10. Preferably, the light emitting component 20 is not higher than the light emitting surface 33, so that the light emitted by the light emitting component 20 can be emitted into the light guide plate 30 through the hole wall 32 of the through hole 31.

In some embodiments, the light guide plate 30 is provided with first dots on a side thereof adjacent to the substrate 10, and the first dots are micro-convex and/or micro-concave structures on the side of the light guide plate 30 adjacent to the substrate 10. Preferably, the first mesh points are distributed around the through holes 31, and the distribution trend of the first mesh points is that the closer to the through holes 31, the more sparse the distribution, and the more dense the distribution of the first mesh points away from the through holes 31, so as to achieve the effect of uniform surface light source.

In some embodiments, a second dot is further disposed on a surface of the light guide plate 30 facing away from the substrate 10, and the second dot is a slightly convex and/or concave structure disposed on a surface of the light guide plate 30 facing away from the substrate 10, and the second dot is located on the light emitting surface 33. It should be noted that, the second dots are distributed on the periphery of the through hole 31, and the second dots can reflect the light emitted from the periphery of the through hole 31 to the light emitting surface 33 back to the light guide plate 30, so as to prevent the peripheral brightness of the through hole 31 from being too high, and achieve the effect of uniform light emitting of the light guide plate 30.

Referring to fig. 1 to 6, in some embodiments, the backlight module 100 further includes a second reflective layer 40, the second reflective layer 40 is disposed on the substrate 10, the second reflective layer 40 includes a plurality of hollow areas, and the light source assembly is disposed on the substrate 10 exposed by the hollow areas. It should be noted that, by providing the second reflective layer 40, the brightness of the surface light source of the backlight module 100 can be further improved, the utilization rate of the outgoing light of the light emitting assembly 20 can be maximized, and the uniformity of light mixing can be improved. Meanwhile, the light emitted from the light emitting component 20 to the substrate 10 can enter the light guide plate 30 again after being reflected by the second reflecting layer 40, so that the light leakage problem of the light emitting component 20 can be avoided, and the performance of the backlight module 100 is further improved.

The second reflective layer 40 may be a reflective sheet attached to the substrate 10, and the reflective sheet includes a plurality of hollow areas, and the hollow areas may leak out the light emitting components 20 disposed on the substrate 10. Specifically, when the reflective sheet is attached to the substrate 10, each hollowed-out area corresponds to the light emitting component 20, and then the reflective sheet is pressed and assembled to the substrate 10, so that the light emitting component 20 is exposed.

In some embodiments, the second reflective layer 40 may also be a reflective coating, such as a metal coating, sprayed onto the substrate 10. When the reflective coating is sprayed, the hollowed-out area can be covered, and the reflective coating is sprayed on the uncovered area to form the reflective layer.

In some embodiments, to further enhance the light-emitting performance of the backlight module 100, the backlight module 100 may further include an optical film 50, such as a diffusion film, an anti-reflection film, and the like. The optical film 50 is disposed on one side of the light guide plate 30 away from the substrate 10, where the optical film 50 has functions of homogenizing, atomizing and brightening, so that the light emitted from the light emitting surface 33 is refracted or scattered towards different directions, thereby changing the traveling route of the light, and fully scattering the light to generate an optical diffusion effect, so that the light incident into the liquid crystal display module is softer, and meanwhile, the brightness of the backlight module 100 can be improved.

The embodiment of the application also provides a display device, which includes a liquid crystal module and the backlight module 100 described in any of the embodiments, wherein the backlight module 100 can provide a backlight for the liquid crystal module. The display device may be: any product or component with display function such as a liquid crystal display panel, electronic paper, mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator and the like.

In summary, in the backlight module 100 and the display device provided by the embodiments of the present application, the light-emitting assembly 20 is embedded in the through hole 31 of the light guide plate 30, and since the hole wall 32 of the through hole 31 is an inclined surface, the light emitted by the light-emitting assembly 20 can be injected into the light guide plate 30 through the hole wall 32 of the through hole 31, and the light can be emitted from the surface of the light guide plate 30 away from the substrate 10 after being reflected and diffused for multiple times in the light guide plate 30, so as to realize the conversion from a point light source to a surface light source, so that the light distribution is more uniform, the light mixing distance of the backlight module 100 is reduced, and the light and thin of the backlight module 100 is realized. Meanwhile, the light can be laterally transmitted in the light guide plate 30, so that the effective irradiation area of the single light emitting component 20 is enlarged, and therefore, the distribution density of the light emitting components 20 can be reduced, and the cost of the backlight module 100 can be further reduced.

In the description of the present application, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more features.

The backlight module and the display device provided by the embodiments of the present application are described in detail, and specific examples are applied to illustrate the principles and embodiments of the present application, and the description of the above embodiments is only used to help understand the method and core ideas of the present application; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the ideas of the present application, the contents of the present specification should not be construed as limiting the present application in summary.

Claims (11)

1. A backlight module, comprising:

a substrate;

the light-emitting assemblies are arranged on the substrate at intervals;

the light guide plate is arranged opposite to the base plate, a plurality of through holes are formed in the light guide plate at intervals, at least one light emitting component is embedded in the through holes, and the hole walls of the through holes are inclined surfaces so that light rays of the light emitting component can enter the light guide plate through the hole walls.

2. A backlight module according to claim 1, wherein the aperture of the through hole is gradually reduced from a side closer to the substrate to a side farther from the substrate.

3. The backlight module according to claim 1, wherein the light emitting component comprises a transparent support, a first LED chip and a packaging adhesive layer, the transparent support is connected with the substrate, the transparent support has an accommodating space with an open top, the first LED chip and the packaging adhesive layer are arranged in the accommodating space, the packaging adhesive layer covers the first LED chip, a first reflecting layer is arranged on one side of the packaging adhesive layer facing away from the first LED chip, and the first reflecting layer can reflect light rays emitted from the top of the first LED chip so that the light rays exit from the side surface of the transparent support.

4. The backlight module according to claim 1, wherein the light emitting assembly comprises a second LED chip and a lens, the second LED chip is connected with the substrate, the lens covers the second LED chip, and the lens can scatter light emitted from the top of the LED chip, so that the light exits from the side surface of the lens.

5. The backlight module according to claim 4, wherein one side of the lens away from the second LED chip is an arc surface with a convex shape, a conical groove is concavely formed in the center of the arc surface, and the tip of the conical groove faces the second LED chip.

6. The backlight module according to claim 1, wherein a light emitting surface is formed on a surface of the light guide plate facing away from the substrate, and the light emitting component is not higher than the light emitting surface.

7. A backlight module according to any one of claims 1 to 6, wherein a first lattice point is disposed on a surface of the light guide plate, which is close to the substrate, and the distribution trend of the first lattice point is that the distribution trend is sparse when the first lattice point is close to the through hole.

8. The backlight module according to claim 7, wherein a surface of the light guide plate facing away from the substrate is further provided with second dots, and the second dots are distributed along the periphery of the through hole.

9. A backlight module according to any one of claims 1 to 6, further comprising a second reflective layer disposed on the substrate, wherein the second reflective layer comprises a plurality of hollow areas, and the light emitting component is disposed on the substrate exposed by the hollow areas.

10. A backlight module according to any one of claims 1 to 6, further comprising an optical film disposed on a side of the light guide plate facing away from the substrate.

11. A display device comprising the backlight module of any one of claims 1 to 10.

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