CN219266405U

CN219266405U - Test board for measuring differential impedance

Info

Publication number: CN219266405U
Application number: CN202222977167.6U
Authority: CN
Inventors: 林荣利; 张锦炀; 刘少模; 胡湘
Original assignee: Xinli Photoelectric Renshou Co Ltd
Current assignee: Xinli Photoelectric Renshou Co Ltd
Priority date: 2022-11-08
Filing date: 2022-11-08
Publication date: 2023-06-27
Anticipated expiration: 2032-11-08

Abstract

The utility model discloses a test board for measuring differential impedance, and belongs to the technical field of impedance testing. The utility model provides a test board for measuring differential impedance, includes the base plate, the base plate upper surface is equipped with test part, test part includes connector, circuit and pad, connector level fixed mounting is on the base plate, electric connection between circuit and the connector, pad fixed mounting is away from the tip of connector on the circuit. The utility model solves the problem that the metal probe for measuring the differential impedance cannot directly measure the golden finger corresponding to the MIPI circuit because the FPC binding bit golden finger Pitch value is very small.

Description

Test board for measuring differential impedance

Technical Field

The utility model relates to the technical field of impedance testing, in particular to a testing board for measuring differential impedance.

Background

The MIPI circuit of the FPC of the mobile phone display module has the differential impedance requirement. The MIPI circuit on the FPC is communicated to the display glass and the mobile phone host through binding the golden finger, and in recent years, along with the rapid development of electronic products such as desktop computers (PC), notebook computers, mobile phones, digital televisions, set top boxes, consumer electronics (MP 3, MP4, game machines, digital cameras and the like), communication equipment, automobile electronics and the like, the signal transmission frequency and the signal transmission speed are higher and higher, and strict characteristic impedance test requirements are put forward for the used circuit board. The characteristic impedance of the circuit is related to the physical dimensions of the circuit on the board, the manufacturing materials, the processing techniques, etc., and may be different from one circuit board to another. In order to control the line impedance, manufacturers need to perform strict characteristic impedance tests on each circuit board produced to check whether the circuit board meets the design and production requirements; according to the test result, the manufacturer can adjust or compensate the characteristic impedance of PCBs in different batches by changing the line width, the lamination thickness, controlling etching and the like, thereby meeting the requirement of customers on the control precision of the characteristic impedance of the PCBs, and the dielectric constant (DK) is a physical quantity for measuring the electrostatic energy stored by insulating substances in unit volume under the gradient of each unit potential. The dielectric has the function of generating induced charges under the external electric field to weaken the electric field, while the impedance is the vector sum of conductor resistance, inductance and capacitance, and the dielectric constant has a significant influence on the impedance.

The prior patent document with the application number of 201811190004.5 discloses a test PCB impedance radio frequency probe, which comprises a grounding needle, a grounding shell, a grounding spring, a front end outer conductor, a front end insulator, a signal needle, an outer insulator, an outer conductor spring, an intermediate insulator, a flange, a main outer conductor and a rear end insulator; the front-end insulator is embedded into the front-end outer conductor, and the outer part of the main outer conductor is sleeved with the outer insulator and the outer conductor spring and then embedded into the inner hole of the front-end outer conductor to be in interference fit with the front-end outer conductor; the outer insulator is positioned at one side close to the front end outer conductor, the flange is sleeved outside the main outer conductor and props against the outer conductor spring sleeved outside the main outer conductor, and the middle insulator is inserted into an inner hole of the flange to insulate the outer conductor spring from the flange; the rear end of the main outer conductor is provided with an external thread to manufacture an SMA female head structure, and a rear end insulator is embedded into an inner hole of the main outer conductor from the rear end of the main outer conductor and is in flat contact with the end face of the inner hole of the main outer conductor; the signal needle is placed in the main outer conductor, the front end of the signal needle penetrates through the front end insulator, the rear end of the signal needle penetrates through the rear end insulator, the front end insulator and the rear end insulator respectively insulate the signal needle from the front end outer conductor and the main outer conductor, the grounding needle is arranged in the grounding shell, a grounding spring is arranged between the grounding needle and the grounding shell, the grounding needle head is exposed out of the front end of the grounding shell, and the two grounding shells are embedded from the front end part of the front end outer conductor and are in interference tight fit with the front end outer conductor; the signal pin head is exposed from the front end of the front end outer conductor. According to the technical scheme, two grounding pins and one signal pin are arranged, and in the testing process, as the flange wraps the main outer conductor shell, when the flange is pressed down, 3 contact pins are ensured to be free of eccentricity; the 3 contact pins perfectly contact the test points of the PCB, so that the contact is good and the eccentricity is avoided; the radio frequency probe connector is in the form of an SMA female connector structure, adopts a standard structure, is mature and stable, has high frequency and simple processing, and has the use frequency of the radio frequency probe larger than the actual use frequency of a PCB (printed circuit board); the working frequency can completely adapt to the test bandwidth required by the PCB, but because the FPC binding golden finger Pitch value is extremely small, the golden finger width is generally 0.06mm, and the golden finger corresponding to the MIPI circuit cannot be directly measured by the metal probe for measuring the differential impedance.

Disclosure of Invention

The present utility model is directed to a test board for measuring differential impedance, so as to solve the problems set forth in the background art: because the FPC binding position golden finger Pitch value is very small, and the golden finger width is generally 0.06mm, the metal probe for measuring differential impedance can not directly measure the golden finger corresponding to the MIPI circuit.

In order to achieve the above purpose, the present utility model provides a test board for measuring differential impedance, which is implemented by adopting the following technical scheme:

the utility model provides a test board for measuring differential impedance, includes the base plate, the base plate upper surface is equipped with test part, test part includes connector, circuit and pad, connector level fixed mounting is on the base plate, electric connection between circuit and the connector, pad fixed mounting is away from the tip of connector on the circuit.

As an optimized implementation mode of the test board for measuring differential impedance, the circuit and the bonding pads are preferably arranged in multiple groups, and the multiple groups of the circuit and the bonding pads are symmetrically arranged on two sides of the connector.

As an optimized implementation manner of the test board for measuring differential impedance, preferably, the upper surface of the bonding pad is provided with a window, and the window is circular.

As an optimized embodiment of the test board for measuring differential impedance provided by the present utility model, preferably, the test board may be a printed circuit board or a flexible circuit board.

As an optimized implementation manner of the test board for measuring differential impedance provided by the utility model, preferably, the connector is provided with a male seat or a female seat for connecting with a test item.

As an optimized embodiment of the test board for measuring differential impedance provided by the utility model, it is preferable that the test board further comprises a supporting member for fixing the test member.

As an optimized implementation mode of the test board for measuring differential impedance, which is provided by the utility model, the substrate is fixed and protected, and meanwhile, the strength of the substrate is enhanced, preferably, the supporting component comprises a shell and four groups of locking devices, the upper surface of the shell is provided with a groove, the four groups of locking devices are symmetrically and fixedly arranged at the bottom side in the groove, and the substrate is fixed in the groove through the four groups of locking devices.

As an optimized embodiment of the test board for measuring differential impedance provided by the utility model, preferably, a sliding component is arranged on the upper side of the shell, and a cleaning component is arranged on the sliding component.

As an optimized implementation mode of the test board for measuring differential impedance, which is provided by the utility model, the movement of the cleaning component is supported, preferably, the sliding component comprises two guide rails and two sliding blocks, the two guide rails are symmetrically and horizontally fixedly arranged at the top end of the shell, and the two sliding blocks are respectively and slidably embedded on the two guide rails.

As an optimized implementation mode of the test board for measuring differential impedance, provided by the utility model, the surface of the test component is cleaned to avoid bad influence of dust on the test, and preferably, the cleaning component comprises a scraping plate and a plurality of filaments, wherein the scraping plate is horizontally and radially arranged, two ends of the scraping plate are respectively and fixedly connected with one surface of the two sliding blocks, which is close to each other, the filaments are vertically and fixedly arranged at the bottom of the scraping plate, and a pushing block is fixedly arranged at the top end of the scraping plate.

Compared with the prior art, the utility model has the following beneficial effects:

(1) When the differential impedance of the MIPI circuit of a certain flexible circuit board or a printed point circuit board needs to be measured, the differential impedance can be measured through the bonding pad of the test component only by buckling the connecting end of the circuit board to the connector of the substrate for communication, and the operation is convenient;

(2) According to the utility model, the supporting part is used for fixing and protecting the test part, the rigidity of the substrate can be enhanced, the use is convenient, meanwhile, the cleaning part can be used for cleaning the surface of the test part, and dust adhered to the surface of the bonding pad is removed before the test, so that the adverse effect on the test is avoided.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, in which the drawings are only some embodiments of the present utility model, and other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic top view of a test component in a test board for measuring differential impedance according to the present utility model;

FIG. 2 is a schematic perspective view of a test board for measuring differential impedance according to the present utility model;

fig. 3 is a schematic top view of a test board for measuring differential impedance according to the present utility model.

The reference numerals in the figures illustrate:

1. a substrate; 2. a connector; 3. a line; 4. a bonding pad; 5. windowing; 6. a housing; 7. a locking device; 8. a groove; 9. a guide rail; 10. a slide block; 11. a scraper; 12. a hairline; 13. and pushing the block.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

As described in the background art, since the FPC binding bit golden finger Pitch is extremely small, and the golden finger is generally 0.06mm wide, the metal probe for measuring the differential impedance cannot directly measure the golden finger corresponding to the MIPI line.

To this end, the present inventors have proposed a test board for measuring differential impedance to solve the above-mentioned technical problems. Specifically, referring to fig. 1, the utility model provides a test board for measuring differential impedance, which comprises a substrate 1, wherein a test component is arranged on the upper surface of the substrate 1, the test component comprises a connector 2, a circuit 3 and a bonding pad 4, the connector 2 is horizontally and fixedly arranged on the substrate 1, the circuit 3 is electrically connected with the connector 2, and the bonding pad 4 is fixedly arranged at the end part of the circuit 3 far away from the connector 2. The circuits 3 and the bonding pads 4 are multiple groups, the multiple groups of circuits 3 and the bonding pads 4 are symmetrically arranged on two sides of the connector 2, and channel serial numbers are marked on the upper surface of the substrate 1 at the positions corresponding to the bonding pads 4, so that a tester can identify channels to be tested.

Through the structural design, when the MIPI line differential impedance of a flexible circuit board or a printed point circuit board needs to be measured, the differential impedance can be measured through the bonding pad 4 of the test component only by buckling the connecting end of the circuit board to the connector 2 of the substrate 1 for communication.

In order to make the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model.

Thus, the following detailed description of the embodiments of the utility model is not intended to limit the scope of the utility model, as claimed, but is merely representative of some embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, under the condition of no conflict, the embodiments of the present utility model and the features and technical solutions in the embodiments may be combined with each other.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

Example 1 of the test plate for measuring differential impedance of the present utility model:

referring to fig. 1, a test board for measuring differential impedance includes a substrate 1, a test component is disposed on an upper surface of the substrate 1, the test component includes a connector 2, a circuit 3 and a pad 4, the connector 2 is horizontally and fixedly mounted on the substrate 1, the circuit 3 is electrically connected with the connector 2, and the pad 4 is fixedly mounted at an end of the circuit 3 far from the connector 2.

The circuits 3 and the bonding pads 4 are multiple groups, the multiple groups of circuits 3 and the bonding pads 4 are symmetrically arranged on two sides of the connector 2, and channel serial numbers are marked on the upper surface of the substrate 1 at the positions corresponding to the bonding pads 4, so that a tester can identify channels to be tested.

The upper surface of the bonding pad 4 is provided with a window 5, and the window 5 is round.

Each PIN of the connector 2 leads out of a square pad 4 through a line 3. The size of the bonding pad 4 is optionally 0.5mm by 0.5mm, the distance between the upper square bonding pad 4 and the lower square bonding pad 4 is 0.5mm, and the distance between the left square bonding pad 4 and the right square bonding pad 4 is 0.3mm. At each square pad 4 there is a circular window 5 to allow copper of the square pad 4 to escape. Such a sizing allows the metal probes to be bumped onto the pads 4, making the measurement convenient.

The substrate 1 may be a printed circuit board or a flexible circuit board.

The connector 2 is provided with a male or female socket for connection with a test item.

When it is desired to measure the differential impedance of the MIPI line of a certain flexible circuit board or printed point circuit board, the differential impedance can be measured by the pads 4 of the test part by simply snapping the connection terminals of the circuit board onto the connector 2 of the substrate 1 for communication.

The lines 2 are typically in pairs, typically on the same side of the connector 2.

In order to improve the versatility of the test board, a plurality of connectors 2 of different specifications are simultaneously arranged in parallel on the test board.

Example 2 of the test plate for measuring differential impedance of the present utility model:

referring to fig. 1, a test board for measuring differential impedance includes a substrate 1, a test component is disposed on an upper surface of the substrate 1, the test component includes a connector 2, a circuit 3 and a pad 4, the connector 2 is horizontally and fixedly mounted on the substrate 1, the circuit 3 is electrically connected with the connector 2, and the pad 4 is fixedly mounted at an end of the circuit 3 far from the connector 2. The circuits 3 and the bonding pads 4 are multiple groups, the multiple groups of circuits 3 and the bonding pads 4 are symmetrically arranged on two sides of the connector 2, and channel serial numbers are marked on the upper surface of the substrate 1 at the positions corresponding to the bonding pads 4, so that a tester can identify channels to be tested. Referring to fig. 2-3, the test board for measuring differential impedance further includes a support member for fixing the test member.

The supporting part comprises a shell 6 and four groups of locking devices 7, a groove 8 is formed in the upper surface of the shell 6, the four groups of locking devices 7 are symmetrically and fixedly arranged on the bottom side inside the groove 8, and the substrate 1 is fixed in the groove 8 through the four groups of locking devices 7.

Through four sets of locker 7 that set up symmetrically, can fix base plate 1 in casing 6, fix and protect base plate 1, simultaneously, when base plate 1 is the flexible circuit board, casing 6 can increase the rigidity of base plate 1, is convenient for its measurement.

Example 3 of the test plate for measuring differential impedance of the present utility model:

as a further optimization of embodiment 2, referring to fig. 2-3, a sliding member is provided on the upper side of the housing 6, and a cleaning member is provided on the sliding member.

The sliding part comprises two guide rails 9 and two sliding blocks 10, the two guide rails 9 are symmetrically and horizontally fixedly arranged at the top end of the shell 6, and the two sliding blocks 10 are respectively and slidably embedded on the two guide rails 9.

The cleaning component comprises a scraping plate 11 and a plurality of broken filaments 12, wherein the scraping plate 11 is horizontally and radially arranged, two ends of the cleaning component are respectively fixedly connected with one surface of the two sliding blocks 10, which is close to each other, the broken filaments 12 are vertically and fixedly arranged at the bottom of the scraping plate 11, and a pushing block 13 is fixedly arranged at the top end of the scraping plate 11.

After the test part is fixed into the shell 6 through the locking device 7, the push block 13 can be pushed, the push block 13 drives the scraping plate 11 to slide under the support of the two sliding blocks 10 and the two guide rails 9, and drives the plurality of filaments 12 positioned at the bottom side of the scraping plate 11 to move, so that the surface of the test part is cleaned, and the adverse effect of adhered dust on the test is avoided.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

It is apparent that the embodiments described above are only some embodiments of the present application, but not all embodiments, the preferred embodiments of the present application are given in the drawings, but not limiting the patent scope of the present application. This application may be embodied in many different forms, but rather, embodiments are provided in order to provide a more thorough understanding of the present disclosure. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing, or equivalents may be substituted for elements thereof. All equivalent structures made by the specification and the drawings of the application are directly or indirectly applied to other related technical fields, and are also within the protection scope of the application.

Claims

1. A test board for measuring differential impedance, comprising a substrate (1), characterized in that: the test device is characterized in that a test component is arranged on the upper surface of the substrate (1), the test component comprises a connector (2), a circuit (3) and a bonding pad (4), the connector (2) is horizontally and fixedly arranged on the substrate (1), the circuit (3) is electrically connected with the connector (2), and the bonding pad (4) is fixedly arranged at the end part, far away from the connector (2), of the circuit (3).

2. A test board for measuring differential impedance as defined in claim 1, wherein: the circuit (3) and the bonding pads (4) are multiple groups, and the multiple groups of the circuit (3) and the bonding pads (4) are symmetrically arranged on two sides of the connector (2).

3. A test board for measuring differential impedance as defined in claim 1, wherein: the upper surface of the bonding pad (4) is provided with a window (5), and the window (5) is round.

4. A test board for measuring differential impedance as defined in claim 1, wherein: the test board may be a printed circuit board or a flexible circuit board.

5. A test board for measuring differential impedance as defined in claim 1, wherein: the connector (2) is provided with a male seat or a female seat which is used for being connected with a test item.

6. A test board for measuring differential impedance as defined in claim 1, wherein: the test device further comprises a support component for fixing the test component.

7. A test board for measuring differential impedance as defined in claim 6, wherein: the supporting component comprises a shell (6) and four groups of locking devices (7), wherein the upper surface of the shell (6) is provided with a groove (8), the four groups of locking devices (7) are symmetrically and fixedly arranged on the bottom side inside the groove (8), and the substrate (1) is fixed in the groove (8) through the four groups of locking devices (7).

8. A test board for measuring differential impedance as defined in claim 7, wherein: the upper side of the shell (6) is provided with a sliding part, and the sliding part is provided with a cleaning part.

9. A test board for measuring differential impedance as defined in claim 8, wherein: the sliding part comprises two guide rails (9) and two sliding blocks (10), the two guide rails (9) are symmetrically and horizontally fixedly arranged at the top end of the shell (6), and the two sliding blocks (10) are respectively and slidably embedded on the two guide rails (9).

10. A test board for measuring differential impedance as defined in claim 9, wherein: the cleaning component comprises a scraping plate (11) and a plurality of filaments (12), wherein the scraping plate (11) is horizontally and radially arranged, two ends of the scraping plate are fixedly connected with one surface of the two sliding blocks (10) close to each other respectively, the filaments (12) are vertically and fixedly arranged at the bottom of the scraping plate (11), and a pushing block (13) is fixedly arranged at the top end of the scraping plate (11).