CN219256301U

CN219256301U - Multi-runner mold

Info

Publication number: CN219256301U
Application number: CN202223473339.2U
Authority: CN
Inventors: 金龙日
Original assignee: Suzhou Yaoshi Precision Mould Co ltd
Current assignee: Suzhou Yaoshi Precision Mould Co ltd
Priority date: 2022-12-22
Filing date: 2022-12-22
Publication date: 2023-06-27
Anticipated expiration: 2032-12-22

Abstract

The utility model discloses a multi-runner mold, which comprises an upper mold and a lower mold, wherein the lower mold is arranged at the lower position of the upper mold, the surface of the lower mold is provided with an injection runner, the tail end of the injection runner extends into a forming cavity, the surface of the lower mold is symmetrically provided with assembly grooves, and the assembly grooves of the lower mold are detachably connected with a buffer assembly; the surface of the lower die is provided with a heat dissipation runner, and the opening positions of the two ends of the heat dissipation runner are provided with heat dissipation components. The buffer component at the position of the assembly groove of the lower die comprises a bottom plate, a stand column, a connecting rod and an arc-shaped gasket, wherein in the process of die assembly, the upper die is close to the lower die and performs pressing action, the upper die is firstly contacted with the arc-shaped gasket, and the arc-shaped gasket is elastically deformed under the action of pressure, so that the impact force and noise in the process of die assembly are effectively reduced, and the environment protection is facilitated; the bottom plate is detachably connected with the lower die through bolts, and assembling and disassembling treatment are carried out according to the use requirement.

Description

Multi-runner mold

Technical Field

The utility model belongs to the technical field of dies, and particularly relates to a multi-runner die.

Background

The die has a specific contour or cavity shape, and the blank can be separated (blanked) according to the contour shape by using the contour shape with the cutting edge. The blank can obtain a corresponding three-dimensional shape by using the shape of the inner cavity. The multi-runner mold is one of the molds.

In the prior art, when the multi-runner mold is used for producing injection molding parts, the impact force of mold closing is large, noise is generated, and the comfort level of the working environment is reduced; the problem that the heat conduction and heat dissipation treatment cannot be effectively performed due to the heat generation on the surface of the mold is that a multi-runner mold needs to be designed to solve the problem.

Disclosure of Invention

The present utility model is directed to a multi-runner mold, which solves the above-mentioned problems of the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the multi-runner mold comprises an upper mold and a lower mold, wherein the lower mold is arranged at a position below the upper mold, an injection runner is arranged on the surface of the lower mold, the tail end of the injection runner extends into a molding cavity, assembly grooves are symmetrically formed in the surface of the lower mold, and a buffer assembly is detachably connected to the position of the assembly grooves of the lower mold; the surface of the lower die is provided with a heat dissipation runner, and the opening positions of the two ends of the heat dissipation runner are provided with heat dissipation components.

Preferably, the buffer assembly comprises a bottom plate, upright posts, connecting rods and circular arc-shaped gaskets, wherein the upright posts are symmetrically arranged on the upper surface of the bottom plate, the inner walls of the two groups of upright posts are fixedly connected through the connecting rods, and the circular arc-shaped gaskets are adhered to the top ends of the connecting rods.

Preferably, the heat dissipation assembly comprises a copper-aluminum alloy carrier plate and a copper-aluminum alloy seat, wherein heat dissipation holes are formed in the middle of the surface of the copper-aluminum alloy carrier plate, and the copper-aluminum alloy seat is symmetrically arranged on the surface of the copper-aluminum alloy carrier plate.

Preferably, the graphene patches are symmetrically adhered to the back of the copper-aluminum alloy carrier plate, the copper-aluminum alloy carrier plate is located at the opening position of the end face of the heat dissipation flow channel, and the heat dissipation holes on the surface of the copper-aluminum alloy carrier plate correspond to the heat dissipation flow channel.

Preferably, the lower mould surface symmetry is provided with heat conduction subassembly, heat conduction subassembly includes copper aluminum alloy welt and radiating fin, radiating fin is installed to copper aluminum alloy welt surface equidistance.

Preferably, the copper-aluminum alloy lining plate and the radiating fins are located below the upper die.

Compared with the prior art, the utility model has the beneficial effects that:

1. the buffer component at the position of the assembly groove of the lower die comprises a bottom plate, a stand column, a connecting rod and an arc-shaped gasket, wherein in the process of die assembly, the upper die is close to the lower die and performs pressing action, the upper die is firstly contacted with the arc-shaped gasket, and the arc-shaped gasket is elastically deformed under the action of pressure, so that the impact force and noise in the process of die assembly are effectively reduced, and the environment protection is facilitated; the bottom plate is detachably connected with the lower die through bolts, and assembling and disassembling treatment are carried out according to the use requirement.

2. The heat dissipation assembly comprises a copper-aluminum alloy carrier plate and a copper-aluminum alloy seat, heat inside the lower die is dissipated along a heat dissipation runner, the contact area between the heat and air is increased by the copper-aluminum alloy carrier plate and the copper-aluminum alloy seat, the heat dissipation performance is improved, and heat accumulation is reduced.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of the lower die structure of the present utility model;

FIG. 3 is a schematic view of a buffer assembly according to the present utility model.

In the figure: 1. an upper die; 2. a lower die; 201. injection molding a runner; 202. a molding cavity; 3. a buffer assembly; 301. a bottom plate; 302. a column; 303. a connecting rod; 304. arc-shaped gaskets; 4. a heat conducting component; 401. a copper-aluminum alloy lining plate; 402. a heat radiation fin; 5. a heat dissipation assembly; 6. a copper-aluminum alloy carrier plate; 7. a heat radiation hole; 8. a copper-aluminum alloy seat; 9. a graphene patch; 10. and a heat dissipation flow channel.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Embodiment one:

referring to fig. 1 to 3, the present utility model provides a multi-runner mold technical scheme: the device comprises an upper die 1 and a lower die 2, wherein the lower die 2 is arranged at the lower position of the upper die 1, an injection runner 201 is arranged on the surface of the lower die 2, the tail end of the injection runner 201 extends into a forming cavity 202, assembly grooves are symmetrically arranged on the surface of the lower die 2, and a buffer assembly 3 is detachably connected at the position of the assembly grooves of the lower die 2; the surface of the lower die 2 is provided with a heat dissipation runner 10, and heat dissipation components 5 are arranged at the opening positions of the two ends of the heat dissipation runner 10.

The buffer assembly 3 comprises a bottom plate 301, upright posts 302, connecting rods 303 and circular arc-shaped gaskets 304, wherein the upright posts 302 are symmetrically arranged on the upper surface of the bottom plate 301, the inner walls of the two groups of upright posts 302 are fixedly connected through the connecting rods 303, and the top ends of the connecting rods 303 are adhered with the circular arc-shaped gaskets 304.

From the above description, the present utility model has the following advantageous effects: the buffer assembly 3 at the position of the assembly groove of the lower die 2 comprises a bottom plate 301, a stand column 302, a connecting rod 303 and an arc-shaped gasket 304, in the process of die assembly, the upper die 1 is close to the lower die 2 and performs pressing action, the upper die 1 is firstly contacted with the arc-shaped gasket 304, the arc-shaped gasket 304 is subjected to elastic deformation under the action of pressure, so that the impact force and noise in the process of die assembly are effectively relieved, and the environment protection is facilitated; the bottom plate 301 is detachably connected with the lower die 2 by bolts, and is subjected to assembling and disassembling processes according to the use requirement.

Embodiment two:

referring to fig. 1 to 2, on the basis of the first embodiment, the present utility model provides a multi-runner mold technical scheme: the heat dissipation assembly 5 comprises a copper-aluminum alloy carrier plate 6 and a copper-aluminum alloy seat 8, wherein heat dissipation holes 7 are formed in the middle of the surface of the copper-aluminum alloy carrier plate 6, the copper-aluminum alloy seat 8 is symmetrically arranged on the surface of the copper-aluminum alloy carrier plate 6, graphene patches 9 are symmetrically adhered to the back surface of the copper-aluminum alloy carrier plate 6, the copper-aluminum alloy carrier plate 6 is located at the opening position of the end face of the heat dissipation flow channel 10, and the heat dissipation holes 7 on the surface of the copper-aluminum alloy carrier plate 6 correspond to the heat dissipation flow channel 10.

By adopting the technical scheme, the heat dissipation assembly 5 comprises the copper-aluminum alloy carrier plate 6 and the copper-aluminum alloy seat 8, heat inside the lower die 2 is dissipated along the heat dissipation flow channel 10, and the contact area between the heat and the air is increased by the copper-aluminum alloy carrier plate 6 and the copper-aluminum alloy seat 8, so that the heat dissipation performance is improved, and the accumulation of heat is reduced.

Further, referring to fig. 2, the heat conducting component 4 is symmetrically arranged on the surface of the lower die 2, the heat conducting component 4 comprises a copper-aluminum alloy lining plate 401 and radiating fins 402, the radiating fins 402 are mounted on the surface of the copper-aluminum alloy lining plate 401 at equal intervals, the copper-aluminum alloy lining plate 401 and the radiating fins 402 are located at the lower position of the upper die 1, the heat conducting component 4 on the surface of the lower die 2 comprises the copper-aluminum alloy lining plate 401 and the radiating fins 402, and the copper-aluminum alloy lining plate 401 and the radiating fins 402 have good heat conducting performance and accelerate heat dissipation.

The working principle and the using flow of the utility model are as follows: the buffer assembly 3 at the position of the assembly groove of the lower die 2 comprises a bottom plate 301, a stand column 302, a connecting rod 303 and an arc-shaped gasket 304, in the process of die assembly, the upper die 1 is close to the lower die 2 and performs pressing action, the upper die 1 is firstly contacted with the arc-shaped gasket 304, the arc-shaped gasket 304 is subjected to elastic deformation under the action of pressure, so that the impact force and noise in the process of die assembly are effectively relieved, and the environment protection is facilitated; the bottom plate 301 is detachably connected with the lower die 2 through bolts, and is assembled and disassembled according to the use requirement; the heat dissipation assembly 5 comprises a copper-aluminum alloy carrier plate 6 and a copper-aluminum alloy seat 8, heat inside the lower die 2 is dissipated along a heat dissipation flow channel 10, and the contact area between the heat and air is increased by the copper-aluminum alloy carrier plate 6 and the copper-aluminum alloy seat 8, so that the heat dissipation performance is improved, and the accumulation of heat is reduced.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The foregoing is merely illustrative of the present utility model and not restrictive, and other modifications and equivalents thereof may occur to those skilled in the art without departing from the spirit and scope of the present utility model.

Claims

1. The utility model provides a multithread way mould, includes mould (1) and lower mould (2), lower mould (2) set up in last mould (1) below position, lower mould (2) surface is provided with runner (201) of moulding plastics, the end of runner (201) of moulding plastics extends to shaping intracavity (202) inside, its characterized in that: the surface of the lower die (2) is symmetrically provided with assembly grooves, and the positions of the assembly grooves of the lower die (2) are detachably connected with buffer assemblies (3); the surface of the lower die (2) is provided with a heat dissipation runner (10), and heat dissipation components (5) are arranged at the opening positions of the two ends of the heat dissipation runner (10).

2. A multi-runner mold as described in claim 1 wherein: the buffer assembly (3) comprises a bottom plate (301), upright posts (302), connecting rods (303) and circular arc-shaped gaskets (304), wherein the upright posts (302) are symmetrically arranged on the upper surface of the bottom plate (301), the inner walls of the two groups of upright posts (302) are fixedly connected through the connecting rods (303), and the top ends of the connecting rods (303) are adhered with the circular arc-shaped gaskets (304).

3. A multi-runner mold as described in claim 1 wherein: the heat dissipation assembly (5) comprises a copper-aluminum alloy carrier plate (6) and a copper-aluminum alloy seat (8), heat dissipation holes (7) are formed in the middle of the surface of the copper-aluminum alloy carrier plate (6), and the copper-aluminum alloy seat (8) is symmetrically arranged on the surface of the copper-aluminum alloy carrier plate (6).

4. A multi-runner mold according to claim 3, wherein: the graphene patch (9) is symmetrically adhered to the back surface of the copper-aluminum alloy carrier plate (6), the copper-aluminum alloy carrier plate (6) is located at the opening position of the end face of the heat dissipation flow channel (10), and the heat dissipation holes (7) on the surface of the copper-aluminum alloy carrier plate (6) correspond to the heat dissipation flow channel (10).

5. A multi-runner mold as described in claim 1 wherein: the surface symmetry of lower mould (2) is provided with heat conduction subassembly (4), heat conduction subassembly (4) are including copper aluminum alloy welt (401) and radiating fin (402), radiating fin (402) are installed to copper aluminum alloy welt (401) surface equidistance.

6. A multi-runner mold as described in claim 5 wherein: the copper-aluminum alloy lining plate (401) and the radiating fins (402) are located below the upper die (1).