CN219248154U - MiniLED lamp plate of low-cost high performance - Google Patents

Abstract

The utility model relates to a low-cost high-performance MiniLED lamp panel, which comprises a MINILED lamp, a wire layer, an aluminum substrate, an insulating layer and a jumper element, wherein the insulating layer is paved on the aluminum substrate, the wire layer is arranged on the insulating layer, the wire layer comprises a first wire and a second wire, a gap is formed between the first wires, the jumper element is spanned above the gap and communicated with the first wires at two ends of the gap, the second wire passes through the gap, heat generated by the MINILED lamp is conducted to the aluminum substrate through the insulating layer to dissipate heat, the wiring defect of the single-sided aluminum substrate is overcome, and the wiring effect of a double-layer plate is achieved.

Description

MiniLED lamp plate of low-cost high performance

Technical Field

The utility model relates to the field of MiniLED lamp panels, in particular to a design of a direct display of a MiniLED lamp panel and a MiniLED backlight.

Background

The existing MiniLED lamp panel generally adopts a PCB (printed Circuit Board), is made of FR4 or BT (British patent), adopts a multilayer board punching mode to carry out jumper wire, and can be 2 layers or 4 layers according to actual conditions, besides the PCB, a Glass substrate is adopted, and the jumper wire is carried out in a multilayer plating mode; or adopt FPC+SUS reinforcement, punch through the multiply wood and carry out the wire jumper, adopt above mode cost higher, FPC's cost is higher than BT, BT's cost is higher than the PCB board, and the heat conduction ability of substrate is poor, is unfavorable for MINILED lamp and LED drive IC heat dissipation, and PCB's coefficient of thermal expansion is than great, and the lamp plate dimensional stability of making is poor and warp easily.

Disclosure of Invention

The utility model aims to provide a MiniLED lamp panel with low cost, strong heat conduction capability and high stability.

The utility model provides a low-cost high performance MiniLED lamp plate, includes MINILED lamp, wire layer, aluminium base board, insulating layer and wire jumper component, the insulating layer is laid on aluminium base board, the wire layer is located on the insulating layer, the wire layer includes first wire and second wire, form the clearance between the first wire, wire jumper component strides and locates the clearance top and intercommunication the first wire at clearance both ends, the second wire is followed the clearance passes.

In the scheme, the aluminum substrate is a lamp panel substrate of the MINILED lamp, the aluminum substrate is provided with the insulating layer, the insulating layer conducts heat generated by the MINILED lamp to the aluminum substrate for heat dissipation, the upper surface of the insulating layer is provided with the wire layer, the wire layer is etched to form a printed circuit for connecting components of the MINILED lamp and the like, and because the aluminum substrate is single-layer, the wire cannot be led through when the wires are intersected, the jumper element is adopted as a bridge, so that the wiring effect of the double-layer plate can be achieved, the aluminum substrate is low in cost, good in thermal conductivity and stable in size.

Further, the LED driving circuit further comprises an LED driving IC, a plurality of MINILED lamps are connected with the LED driving IC through a wire layer, and adjacent MINILED lamps are connected through the wire layer.

In the above scheme, the MINILED lamps need to be matched with proper LED driving ICs to function to the greatest extent, one LED driving IC can control a plurality of MINILED lamps, so that a plurality of MINILED lamps are connected around the LED driving ICs, adjacent MINILED lamps are connected in parallel through a wire layer, and the above circuit layout mode can maximally utilize space for installing the MINILED lamps.

Further, the jumper element is inverted U-shaped and is arranged on the wire layer.

In the above scheme, the aluminum substrate is a single-layer substrate and cannot achieve the effect of double-layer wiring, the jumper element mainly plays a role of a bridge, so that the shape of the first wire is in an inverted U shape, the MINILED lamp is a sub-millimeter light-emitting diode, the size is extremely small, more crystals are needed to be embedded in the aluminum substrate in order to solve the problem that the regional control luminosity of the traditional LED lamp is not fine enough, and the jumper element is adopted to enable the circuit on the wire layer to be more compact.

Further, the jumper element includes a first contact and a second contact, which are connected to the first wires at both ends of the gap, respectively.

In the above scheme, a gap exists at the intersection position of the first wire and the second wire, and the first contact and the second contact of the jumper element connect the two endpoints of the first wire, so that the first wire is conducted, the second wire passes through the gap below the jumper element, the effect of wiring the double-layer board is achieved, the cost is greatly reduced compared with that of the double-layer board, and the jumper element is generally zero ohm resistance or a patch guide sheet.

Further, the insulating layer is filled with a thermally conductive filler.

In the above scheme, the insulating layer is made of polymer filled with ceramic powder with high heat conductivity and high insulation, the polymer is mainly epoxy resin, the insulating layer has high insulating strength, good bonding performance and good heat conduction performance, the ceramic powder is a heat conducting filler, if the heat conducting filler is not added, the insulating layer does not have the high-strength insulating performance, and the heat conducting capability of the epoxy resin is poor, so that the heat conducting capability of the insulating layer is limited.

Further, the aluminum substrate is a single-sided aluminum substrate, and the MINILED lamp is arranged on one side of the aluminum substrate.

In the scheme, the aluminum substrate is arranged on one side, compared with two layers of PCB (printed circuit board), only one solder paste printing-paster-reflow soldering process is needed, the process can be simplified, the cost is reduced, the aluminum substrate is provided with a single-side aluminum substrate and a double-side aluminum substrate, the MINILED lamp can be pasted on one side of the single-side aluminum substrate, the single-side wiring is adopted, the double-side aluminum substrate is provided with two layers of wirings and can be pasted with LEDs on both sides, compared with the single-side aluminum substrate, the double-side aluminum substrate is provided with a lamination process, but the cost is high, the function of the double-side aluminum substrate can be realized by adopting jumper elements to solve the wiring defect of the single-side aluminum substrate, the process difficulty is reduced, and the cost is reduced

Further, the lead layer is a copper wiring, and the copper wiring is arranged on the insulating layer in a printed manner.

In the above-mentioned scheme, the conductive wire layer is etched to form a printed circuit, so that the components of the element are connected to each other, and a large current carrying capacity is generally required, so that thicker copper wires are used, the copper wires are easily bonded on the insulating layer, and the printed protection layer is received, and the printed circuit is etched to form a pattern of the circuit.

Further, an insulating material is arranged at the intersection position of the first wire and the second wire.

In the above scheme, the two end points of the first wire gap are conducted through the jumper element, the second wire passes through the first wire from the lower side of the jumper element, and the short circuit is easy to occur when the first wire is intersected with the second wire, so that an insulating material is added below the jumper element to prevent the first wire and the second wire from being in direct contact.

Further, the insulating layer and the wire layer are coated with white oil.

In the scheme, the white oil has the function of light reflection, the higher the reflectivity is, the better the light effect is, the function of anti-welding protection is achieved, black character printing ink can be printed on the white oil for marking, the MINILED lamp adopts an LED crystal with the size of tens of millimeters, the pixel is better than the LED lamp, the problem that backlight unevenness cannot occur due to accurate dimming is supported, and the MiniLED lamp panel performance is better due to the reflection function of the white oil.

The low-cost high-performance MiniLED lamp panel has at least the following beneficial effects:

first, with low costs, adopt single face aluminium base board as MINILED lamp plate, compare in the PCB board of two-layer, simplified the technology of processing, adopt jumper wire component to solve single face aluminium base board's wiring drawback, the technology degree of difficulty reduces.

And the second aluminum substrate has good heat-conducting capability, an insulating layer is paved on the aluminum substrate, the insulating layer is formed by filling high-heat-conducting and high-insulation ceramic powder into a polymer, the aluminum substrate has good heat-radiating performance, and heat generated by the MINILED lamp is conducted to the aluminum substrate through the insulating layer to radiate.

Thirdly, the product stability is high, the dimensional change of the aluminum substrate is smaller, and the aluminum substrate is stable compared with a PCB and the like, and the aluminum substrate has good heat dissipation function, so that the expansion caused by heat and contraction caused by cold of components are relieved, and the reliability and stability of the product are improved.

Drawings

Fig. 1 is a block diagram of a MiniLED lamp panel according to an embodiment.

FIG. 2 is a plan view of a MiniLED lamp panel according to an embodiment

Reference numerals illustrate: 1. an aluminum substrate; 2. an insulating layer; 3. a wire layer; 31. a first wire; 32. a second wire; 4. white oil; 5. MINILED lamp; 6. a jumper element; 61. a first contact; 62. a second contact; 7. an LED driving IC; 8. an insulating material.

Description of the embodiments

The utility model relates to a low-cost high-performance MiniLED lamp panel, which is further described in detail below with reference to specific embodiments and drawings.

As shown in fig. 1, in a preferred embodiment, the low-cost high-performance MiniLED lamp panel of the present utility model includes an aluminum substrate 1, an insulating layer 2, a wire layer 3, a MiniLED lamp 5 and a jumper element 6, wherein the insulating layer 2 is laid on the aluminum substrate 1, the wire layer 3 is disposed on the insulating layer 2, the wire layer includes a first wire 31 and a second wire 32, a gap is formed between the first wires 31, the jumper element 6 spans over the gap and is communicated with the first wires 31 at two ends of the gap, and the second wire 32 passes through the gap. The aluminum substrate 1 is a lamp panel substrate of the MINILED lamp 5, the aluminum substrate 1 is provided with the insulating layer 2, the insulating layer 2 conducts heat generated by the MINILED lamp 5 to the aluminum substrate 1 for heat dissipation, the upper surface of the insulating layer 2 is provided with the wire layer 3, the wire layer 3 is etched to form a printed circuit for connecting components of the MINILED lamp 5 and the like, the first wire 31 cannot be etched at the position intersected with the second wire 32 so that gaps appear, and because the aluminum substrate 1 is single-layer, the jumper wire element 6 is adopted as a bridge, the first wire 31 is in gap communication, the second wire 32 passes through the gaps, so that the wiring effect of the double-layer board is achieved, the aluminum substrate 1 is low in cost, good in heat conductivity and stable in size.

As shown in fig. 2, in some embodiments, the LED driving IC7 is further included, and several mini LED lamps 5 are connected to the LED driving IC7 through the wire layer 3, and adjacent mini LED lamps 5 are connected through the wire layer 3. The MINILED lamps 5 need to be matched with proper LED driving ICs 7 to exert the functions to the greatest extent, one LED driving IC7 can control a plurality of MINILED lamps 5, so that a plurality of MINILED lamps 5 are connected around the LED driving ICs 7, adjacent MINILED lamps 5 are connected in parallel through the wire layer 3, the above circuit layout mode can maximally utilize the space for installing the MINILED lamps 5, more MINILED crystals can be embedded in the MINILED lamps 5 on the aluminum substrate 1 with unit area, and the brightness, the color saturation and the contrast are higher.

As shown in fig. 1, in some embodiments, the jumper element 6 is inverted U-shaped and is disposed on the wire layer 3, and the jumper element 6 mainly plays a role of a bridge, so that the shape of the jumper element 6 mounted on the first wire 31 is inverted U-shaped, the MINILED lamp 5 is a sub-millimeter light emitting diode, the size is very small, more crystals are needed to be embedded in the aluminum substrate 1 to solve the problem that the zonal control luminosity of the conventional LED lamp is not fine enough, and the jumper element 6 is adopted to enable the wires on the wire layer 3 to be more compact, thereby realizing accurate dimming and saving electricity.

As shown in fig. 1 and 2, in some embodiments, the jumper element 6 includes a first contact 61 and a second contact 62, the first contact 61 and the second contact 62 being connected to the first wires 31 at both ends of the gap, respectively. A gap exists at the intersection position of the first wire 31 and the second wire 32, the first contact 61 and the second contact 62 of the jumper element 6 connect two endpoints of the first wire 31, so that the first wire 31 is conducted in a circuit mode, the second wire 32 penetrates through the gap below the jumper element 6, the connection position of the MINILED lamp 5 and the LED driving IC7 cannot be etched, a bridge is built by the jumper element 6, the circuits can be normally connected, other circuits cannot be penetrated on the wire layers 3 of adjacent MINILED lamps 5, the jumper elements 6 are used for connection, the jumper elements 6 are generally zero ohm resistors or patch conductors, the effect of double-layer plate wiring is achieved, and cost is greatly reduced compared with that of double-layer plates.

As shown in fig. 1 and 2, in some embodiments, the aluminum substrate 1 is a single-sided aluminum substrate 1, and the miniled lamp 5 is mounted on one side of the aluminum substrate 1. The aluminum substrate 1 is arranged on one side, compared with two layers of PCB boards, the solder paste printing process of the LED high-density small bonding pad is facilitated, only one solder paste printing-pasting-reflow soldering process is needed, the process can be simplified, the cost is reduced, the aluminum substrate 1 is provided with the single-sided aluminum substrate 1 and the double-sided aluminum substrate 1, only one side of the single-sided aluminum substrate 1 can be pasted with the MINILED lamp 5, wires are arranged in a single-layer mode, the double-sided aluminum substrate 1 is provided with two layers of wires, LEDs can be pasted on two sides of the double-sided aluminum substrate 1, and compared with the single-sided aluminum substrate 1, the double-sided aluminum substrate 1 is provided with one pressing process, but the cost is high, the function of the double-sided aluminum substrate 1 can be realized by adopting the jumper element 6 to solve the wire defect of the single-sided aluminum substrate 1, the process difficulty is reduced, and the cost is reduced.

As shown in fig. 1 and 2, in some embodiments, the conductive line layer 3 is a copper trace, and the copper trace is printed on the insulating layer 2. The conductor layer 3 is etched to form a printed circuit, which connects the individual components of the component to each other, and generally requires a large current carrying capacity, so that thicker copper tracks are used, which are easily bonded to the insulating layer 2 and receive a printed protection layer, which is etched to form a pattern of the circuit.

As shown in fig. 1, in some embodiments, the first wire 31 and the second wire 32 intersect with an insulating material 8. The two end points of the gap between the first wires 31 are conducted through the jumper element 6, the second wires 32 pass through the first wires 31 from the lower side of the jumper element 6, and short circuit is easy to occur when the first wires 31 are intersected with the second wires 32, so that an insulating material 8 is added below the jumper element 6 to prevent the first wires 31 and the second wires 32 from being in direct contact, thereby playing a role of protecting a circuit.

As shown in fig. 1 and 2, in some embodiments, the insulating layer 2 and the wire layer 3 further comprise white oil 4, and the white oil 4 is coated on the surfaces of the insulating layer 2 and the wire layer 3. White oil 4 has the function of light reflection, and white oil 4 that the reflectivity is higher, the light effect is better, plays the function of preventing welding protection simultaneously, can print black characters's printing ink on white oil 4 and mark, and MINILED lamp 5 adopts tens of millimeter level LED crystal, and the pixel is better than the LED lamp, supports accurate dimming moreover and can not appear the inhomogeneous problem in a poor light, and the reflection function that makes MiniLED lamp plate backlight effect better, the performance is better in addition white oil 4.

According to the working principle and the working process of the low-cost high-performance MiniLED lamp panel, the insulating layer 2 is arranged on the aluminum substrate 1, the conducting wire layer 3 is etched and printed on the insulating layer 2 to connect the MINILED lamp 5, the LED driving IC7 and other elements, white oil 4 is coated around the MINILED lamp 5 and the jumper wire element 6, the MINILED lamp 5 emits light under the driving of the LED driving IC7, the light effect is better under the reflection of the white oil 4, the heat generated by the MINILED lamp 5 is conducted to the aluminum substrate 1 through the insulating layer 2, the insulating layer 2 is generally filled by high-heat-conductivity high-insulation ceramic powder, the aluminum substrate 1 is a single-sided aluminum substrate 1, the cost is low, the MINILED lamp 5 is small, the single-sided aluminum substrate 1 is used for facilitating the solder paste printing process of the LED high-density small bonding pads, the dimension of the aluminum substrate 1 is stable, the jumper wire elements 6 such as zero ohm resistance or patch guide pieces are used for realizing the wire layout of the single-sided aluminum substrate 1, and the double-layer board layout effect is achieved.

In the description of the present utility model, it should be understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

While the utility model has been described in conjunction with the specific embodiments above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, all such alternatives, modifications, and variations are included within the spirit and scope of the following claims.

Claims (9)

1. The utility model provides a low-cost high performance MiniLED lamp plate, includes MINILED lamp and wire layer, its characterized in that still includes aluminium base board, insulating layer, jumper wire component, the insulating layer is laid on aluminium base board, the wire layer is located on the insulating layer, the wire layer includes first wire and second wire, form the clearance between the first wire, jumper wire component strides and locates the clearance top and intercommunication the first wire at clearance both ends, the second wire is followed the clearance passes.

2. The low-cost high-performance MiniLED lamp panel according to claim 1, further comprising LED driving ICs, wherein a plurality of MINILED lamps are connected with the LED driving ICs through wire layers, and adjacent MINILED lamps are connected with each other through wire layers.

3. The low cost high performance MiniLED light panel of claim 1, wherein the jumper elements are inverted U-shaped on the wire guide layer.

4. The low cost, high performance MiniLED light board of claim 3, wherein the jumper element comprises a first contact and a second contact, the first contact and the second contact being connected to first wires at both ends of the gap, respectively.

5. The low cost high performance MiniLED light panel of claim 1, wherein the insulating layer is filled with a thermally conductive filler.

6. The low-cost high-performance MiniLED lamp panel of claim 1, wherein the aluminum substrate is a single-sided aluminum substrate, and the MINILED lamp is mounted on one side of the aluminum substrate.

7. The low-cost high-performance MiniLED lamp panel of claim 1, wherein the wire layer is a copper wire, and the copper wire is arranged on the insulating layer in a printed manner.

8. The low cost, high performance MiniLED lamp panel of claim 1, wherein the first wire and the second wire are provided with insulating material at their intersection.

9. The low cost high performance MiniLED lamp panel of claim 1, further comprising white oil, wherein the white oil is coated on the surface of the insulating layer and the wire layer.

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