CN219218214U - Electrolytic treatment device for processing semiconductor precursor - Google Patents
Electrolytic treatment device for processing semiconductor precursor Download PDFInfo
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- CN219218214U CN219218214U CN202223043324.2U CN202223043324U CN219218214U CN 219218214 U CN219218214 U CN 219218214U CN 202223043324 U CN202223043324 U CN 202223043324U CN 219218214 U CN219218214 U CN 219218214U
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Abstract
The utility model discloses an electrolytic treatment device for processing semiconductor precursors, relates to the technical field of semiconductor electrolytic treatment devices, and aims to solve the problems that when the conventional electrolytic treatment device is used, the semiconductor precursors are required to be manually placed into electrolytic solutions one by one, so that hands are easy to be stained with the electrolytic solutions, and the hands are corroded and burned even caused by reaction. An electrolytic solution bin is arranged below the electrolytic processor; the lifting frame is arranged above the electrolytic solution bin, the lifting frame and the electrolytic solution bin are of an integrated structure, lifting screws are arranged on two sides of the interior of the lifting frame, the lifting screws are connected with the lifting frame in an embedded mode, lifting limit grooves are formed in the front end and the rear end of the lifting screws, and the lifting limit grooves and the lifting screws are of an integrated structure; the lifting plate is arranged below the lifting screws on two sides, the lifting screws are connected with the lifting plate in a welded mode, an electrolyte basket is arranged below the lifting plate, and the electrolyte basket is connected with the lifting plate in an embedded separable mode.
Description
Technical Field
The utility model relates to the technical field of semiconductor electrolytic processing devices, in particular to an electrolytic processing device for processing a semiconductor precursor.
Background
When the semiconductor is processed, the semiconductor is subjected to treatment works such as polishing by an electrolysis mode;
for example, chinese copyrighted patent publication No. CN101250745B (electrolytic polishing apparatus used for implementing the electrolytic polishing method of semiconductor material), wherein the illumination system comprises a lamp tube sealed in a glass tube, the lamp tube selecting a corresponding far-infrared lamp, near-infrared lamp, red lamp, yellow lamp, green lamp, ultraviolet lamp, or other light source of a specific wavelength; the lead in the electrolyte is sealed and protected by a glass tube, and is externally connected with an alternating current power supply through an electrolytic tank cover, and the glass tube is supported and fixed in the electrolytic tank by a bracket; the adjusting device comprises a threaded sleeve and a loading block, wherein the external threads of the threaded sleeve and the threaded hole of the electrolytic tank cover form a bolt-nut pair, and the screw rod of the loading block and the internal threads of the threaded sleeve form a bolt-nut pair; the anode is adhered to the bottom surface of the carrier block by conductive adhesive; the cathode and the anode are correspondingly connected with the cathode and the anode of the direct current power supply.
However, when the conventional electrolytic processing device is used, the semiconductor precursors are manually placed into the electrolytic solution one by one, so that the hands are easy to be stained with the electrolytic solution, and the hands are even eroded and burned due to reaction; therefore, the existing requirements are not met, and an electrolytic processing device for processing semiconductor precursors is provided.
Disclosure of Invention
The utility model aims to provide an electrolytic treatment device for processing semiconductor precursors, which solves the problems that the conventional electrolytic treatment device provided in the background art needs to manually put the semiconductor precursors into electrolytic solution one by one, so that hands are easy to be stained with the electrolytic solution, and the hands are corroded and burned even due to reaction.
In order to achieve the above purpose, the present utility model provides the following technical solutions: an electrolytic treatment device for processing a semiconductor precursor comprises an electrolytic treatment machine, wherein an electrolytic solution bin is arranged below the electrolytic treatment machine;
further comprises:
the lifting frame is arranged above the electrolytic solution bin, the lifting frame and the electrolytic solution bin are of an integrated structure, lifting screws are arranged on two sides of the interior of the lifting frame, the lifting screws are connected with the lifting frame in an embedded mode, lifting limit grooves are formed in the front end and the rear end of the lifting screws, and the lifting limit grooves and the lifting screws are of an integrated structure;
the lifting plate is arranged below the lifting screws on two sides, the lifting screws are connected with the lifting plate in a welded mode, an electrolyte basket is arranged below the lifting plate, and the electrolyte basket is connected with the lifting plate in an embedded separable mode.
Preferably, the below of electrolyte basket is provided with places the basket, the top of placing the basket is provided with the fixed plate, and the fixed plate with place basket structure as an organic whole, the top of fixed plate is provided with the embedded plate, and embedded plate and fixed plate structure as an organic whole, and embedded plate and lifter plate embedded separable connection.
Preferably, the opposite side of the inside front end of lifter plate is provided with spacing spout, and spacing spout and lifter plate structure as an organic whole, the inside of spacing spout is provided with ejecting card, and ejecting card and spacing spout embedded swing joint, the opposite side of ejecting card is provided with the removal top card, the upper and lower side of removal top card is provided with spacing slide card, and spacing slide card and removal top card structure as an organic whole.
Preferably, a lifting motor is arranged above the lifting frame and connected with the lifting frame through bolts, a transmission mechanism is arranged inside the lifting frame and is in transmission connection with the lifting motor, and the transmission mechanism is in threaded connection with the lifting screw.
Preferably, one side of the electrolytic solution bin is provided with an injection box, the injection box is connected with the electrolytic solution bin through a conveying pipeline, the other side of the electrolytic solution bin is provided with a suction box, and the suction box is connected with the electrolytic solution bin through the conveying pipeline.
Preferably, the lifting plate, the embedded plate and one side of the inner part of the fixed plate are respectively provided with a wire hole, and the three wire holes are aligned.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the lifting frame is arranged above the electrolytic solution bin, the lifting screw rod is arranged in the lifting frame, and the screw rod nut connected with the lifting screw rod is driven to rotate by the lifting motor during use, so that the lifting screw rod is driven to lift, the lifting plate below the lifting plate and the electrolyte basket are further driven to lift, and the semiconductor precursors can be placed in the electrolyte basket, so that the semiconductor precursors can be soaked in the electrolytic solution or taken out from the electrolytic solution at one time, the problem that the semiconductor precursors need to be placed in the electrolytic solution one by one manually during use of the electrolytic treatment device, the hands are easy to be stained with the electrolytic solution, and even the hands are corroded and burned is caused.
2. Through setting up ejecting card in the inside of lifter plate, after sliding into the lifter plate with the embedded plate inside, the embedded plate can promote ejecting card to the opposite side, when needs are dismantled the embedded plate, can pull ejecting card to one side removal to in pushing out the lifter plate with the embedded plate, so that take off the electrolyte basket, take out the semiconductor precursor of inside and carry out next work.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the structure of the electrolyte basket lifting mechanism of the present utility model;
FIG. 3 is a schematic view of an embedded board connection structure according to the present utility model;
FIG. 4 is a schematic view of an ejector card according to the present utility model;
in the figure: 1. an electrolytic processor; 2. an electrolytic solution bin; 3. an injection tank; 4. a suction box; 5. a lifting frame; 6. a lifting motor; 7. lifting screw rods; 8. a lifting plate; 9. an electrolyte basket; 10. an embedded plate; 11. a fixing plate; 12. placing a basket; 13. limiting sliding grooves; 14. ejecting the card; 15. limiting slide card; 16. moving the top card; 17. a delivery conduit; 18. lifting limit grooves; 19. and (5) a wire hole.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-4, an embodiment of the present utility model is provided: an electrolytic treatment device for processing a semiconductor precursor comprises an electrolytic treatment machine 1, wherein an electrolytic solution bin 2 is arranged below the electrolytic treatment machine 1;
further comprises:
the lifting frame 5 is arranged above the electrolytic solution bin 2, the lifting frame 5 and the electrolytic solution bin 2 are of an integrated structure, lifting screws 7 are arranged on two sides of the interior of the lifting frame 5, the lifting screws 7 are connected with the lifting frame 5 in an embedded mode, lifting limit grooves 18 are formed in the front end and the rear end of the lifting screws 7, and the lifting limit grooves 18 and the lifting screws 7 are of an integrated structure;
Referring to fig. 2-3, a placing basket 12 is disposed below the electrolyte basket 9, a fixing plate 11 is disposed above the placing basket 12, the fixing plate 11 and the placing basket 12 are in an integrated structure, an embedded plate 10 is disposed above the fixing plate 11, the embedded plate 10 and the fixing plate 11 are in an integrated structure, the embedded plate 10 is connected with the lifting plate 8 in an embedded and separable manner, and the embedded plate 10 can slide into the lifting plate 8 so as to fix the electrolyte basket 9 on the lifting plate 8 for lifting.
Referring to fig. 2-4, a limiting chute 13 is disposed on the other side of the front end of the inner portion of the lifting plate 8, the limiting chute 13 and the lifting plate 8 are in an integrated structure, an ejector card 14 is disposed in the limiting chute 13, the ejector card 14 is movably connected with the limiting chute 13 in an embedded manner, a movable ejector card 16 is disposed on the other side of the ejector card 14, a limiting slide card 15 is disposed on one side of the upper portion and the lower portion of the movable ejector card 16, the limiting slide card 15 and the movable ejector card 16 are in an integrated structure, the ejector card 14 is pushed to drive the embedded plate 10 to move so as to take the electrolyte basket 9 out of the lifting plate 8, and the semiconductor precursor is taken out for further processing.
Referring to fig. 1, a lifting motor 6 is disposed above the lifting frame 5, the lifting motor 6 is connected with the lifting frame 5 through a bolt, a transmission mechanism is disposed inside the lifting frame 5 and is in transmission connection with the lifting motor 6, the transmission mechanism is in threaded connection with a lifting screw 7, and the lifting motor 6 can drive a screw nut connected with the lifting screw 7 to rotate so as to drive the lifting screw 7 to lift.
Referring to fig. 1, an injection tank 3 is disposed at one side of an electrolytic solution bin 2, the injection tank 3 is connected with the electrolytic solution bin 2 through a conveying pipeline 17, a suction tank 4 is disposed at the other side of the electrolytic solution bin 2, the suction tank 4 is connected with the electrolytic solution bin 2 through the conveying pipeline 17, the injection tank 3 can inject electrolytic solution into the electrolytic solution bin 2 for use, and the suction tank 4 can draw out used electrolytic solution for replacement.
Referring to fig. 2 to 3, the lifting plate 8, the embedded plate 10 and the fixing plate 11 are provided with wire holes 19 on one side thereof, and the three wire holes 19 are aligned, and the wire holes 19 can pass through wires to supply power to the semiconductor precursor for electrolytic treatment.
Working principle: when the device is used, a semiconductor precursor is placed in the placement basket 12, the fixing plate 11 slides into the lifting plate 8, an electric wire passing through the wire hole 19 is connected with the semiconductor precursor, the fixing plate 11 is thoroughly pushed into the lifting plate 8, the ejection clamp 14 is pushed to the other side, the lifting motor 6 is started, the lifting motor 6 drives the screw nut connected with the lifting screw 7 to rotate, the lifting screw 7 is enabled to descend under the action of threads, the lifting screw 7 drives the lifting plate 8, the lifting plate 8 drives the electrolyte basket 9 to descend, the semiconductor precursor is immersed into the electrolyte, the electrolysis is started after the electrolysis is completed, the lifting motor 6 is driven to reverse, the lifting screw 7 drives the lifting plate 8 and the electrolyte basket 9 to ascend, so that the semiconductor precursor is separated from the electrolyte, after the electrolyte is drained, the ejection clamp 14 is pushed to move to one side, the fixing plate 11 is pushed out of the lifting plate 8, the electrolyte basket 9 is taken down, the semiconductor precursor is taken out to perform the next work, and the problem that the electrolyte is easy to burn the hands of the hand is easily caused by placing the semiconductor precursor in the electrolysis device when the conventional electrolysis treatment device is used is avoided.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. An electrolytic treatment device for processing a semiconductor precursor comprises an electrolytic treatment machine (1), wherein an electrolytic solution bin (2) is arranged below the electrolytic treatment machine (1);
the method is characterized in that: further comprises:
the lifting frame (5) is arranged above the electrolytic solution bin (2), the lifting frame (5) and the electrolytic solution bin (2) are of an integrated structure, lifting screws (7) are arranged on two sides of the interior of the lifting frame (5), the lifting screws (7) are connected with the lifting frame (5) in an embedded mode, lifting limit grooves (18) are formed in the front end and the rear end of the lifting screws (7), and the lifting limit grooves (18) and the lifting screws (7) are of an integrated structure;
lifting plate (8), it sets up the below of both sides lifting screw (7), and lifting screw (7) and lifting plate (8) welded connection, the below of lifting plate (8) is provided with electrolyte basket (9), and electrolyte basket (9) and lifting plate (8) embedded separable connection.
2. The electrolytic processing device for processing a semiconductor precursor according to claim 1, wherein: the electrolyte basket (9) is characterized in that a placing basket (12) is arranged below the electrolyte basket (9), a fixing plate (11) is arranged above the placing basket (12), the fixing plate (11) and the placing basket (12) are of an integrated structure, an embedded plate (10) is arranged above the fixing plate (11), the embedded plate (10) and the fixing plate (11) are of an integrated structure, and the embedded plate (10) is connected with the lifting plate (8) in an embedded and separable mode.
3. The electrolytic processing device for processing a semiconductor precursor according to claim 1, wherein: the lifting plate is characterized in that a limiting sliding groove (13) is formed in the other side of the front end of the lifting plate (8), the limiting sliding groove (13) and the lifting plate (8) are of an integrated structure, an ejector card (14) is arranged in the limiting sliding groove (13), the ejector card (14) is movably connected with the limiting sliding groove (13) in an embedded mode, a movable ejector card (16) is arranged on the other side of the ejector card (14), a limiting sliding card (15) is arranged on one side of the upper portion and the lower portion of the movable ejector card (16), and the limiting sliding card (15) and the movable ejector card (16) are of an integrated structure.
4. The electrolytic processing device for processing a semiconductor precursor according to claim 1, wherein: lifting motor (6) will be provided with in the top of crane (5), and lifting motor (6) are connected with crane (5) through the bolt, the inside of crane (5) is provided with drive mechanism, and drive mechanism and lifting motor (6) transmission connection, and drive mechanism and lifting screw (7) threaded connection.
5. The electrolytic processing device for processing a semiconductor precursor according to claim 1, wherein: one side of the electrolytic solution bin (2) is provided with an injection box (3), the injection box (3) is connected with the electrolytic solution bin (2) through a conveying pipeline (17), the other side of the electrolytic solution bin (2) is provided with a suction box (4), and the suction box (4) is connected with the electrolytic solution bin (2) through the conveying pipeline (17).
6. An electrolytic processing apparatus for processing a semiconductor precursor according to claim 2, wherein: the lifting plate (8) and the embedded plate (10) and the fixed plate (11) are respectively provided with a wire hole (19) on one side of the inside, and the three wire holes (19) are aligned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223043324.2U CN219218214U (en) | 2022-11-16 | 2022-11-16 | Electrolytic treatment device for processing semiconductor precursor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223043324.2U CN219218214U (en) | 2022-11-16 | 2022-11-16 | Electrolytic treatment device for processing semiconductor precursor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219218214U true CN219218214U (en) | 2023-06-20 |
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ID=86746165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223043324.2U Active CN219218214U (en) | 2022-11-16 | 2022-11-16 | Electrolytic treatment device for processing semiconductor precursor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219218214U (en) |
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2022
- 2022-11-16 CN CN202223043324.2U patent/CN219218214U/en active Active
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