CN219216767U

CN219216767U - Silicon chip is regular mechanism and conveyer belt that are difficult for scattering

Info

Publication number: CN219216767U
Application number: CN202223175868.4U
Authority: CN
Inventors: 颜亮; 武瑞; 白大伟; 武治军; 曹政民; 王大伟; 万遥; 李瑞鹏; 尹贤铮; 杨晨
Original assignee: Wuxi Zhonghuan Application Material Co ltd
Current assignee: Wuxi Zhonghuan Application Material Co ltd
Priority date: 2022-11-29
Filing date: 2022-11-29
Publication date: 2023-06-20
Anticipated expiration: 2032-11-29

Abstract

The utility model discloses a silicon wafer regular mechanism which is not easy to scatter, comprising a bracket, wherein a pair of vertically arranged clamping plates and a first pushing assembly for pushing the two clamping plates to translate in opposite directions are arranged on the bracket, a plurality of suction holes are arranged on the inner side surfaces of the two clamping plates, a pump body is arranged on the bracket, and an air pipe communicated with the suction holes is arranged on the pump body. The utility model also discloses a conveyer belt, which comprises a conveyer belt body, wherein a regulating mechanism is arranged at the input end of the conveyer belt body, and clamping plates are arranged at two sides of the conveyer belt body. According to the utility model, the pump body enables the air suction hole to generate negative pressure, the stacked silicon wafer groups are pumped through the air suction hole, the adsorption force between the wafers is increased, and the risk of wafer slipping is avoided in the circulation process.

Description

Silicon chip is regular mechanism and conveyer belt that are difficult for scattering

Technical Field

The utility model relates to the field of silicon wafer circulation equipment, in particular to a regulating mechanism with silicon wafers not easy to scatter.

Background

In the silicon wafer production process, the stacked silicon wafers are circulated, the whole stack of silicon wafers needs to be carried, air exists between the silicon wafers, and the adsorptivity between the silicon wafers is small, so that the phenomena of silicon wafer scattering and sliding in the subsequent carrying process can occur.

Disclosure of Invention

The utility model aims to provide a regulating mechanism for a silicon wafer, which is not easy to scatter.

The utility model also provides a conveying belt.

The utility model has the innovation point that the pump body enables the air suction hole to generate negative pressure, the stacked silicon wafer groups are pumped through the air suction hole, the adsorption force between the wafers is increased, and the risk of wafer slipping is avoided in the circulation process.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

the utility model provides a regular mechanism that silicon chip is difficult for scattering, includes the support, is equipped with a pair of splint of vertical arrangement and promotes the first promotion subassembly of two splint opposite translation on the support, has arranged a plurality of suction holes on two splint medial surfaces, is equipped with the pump body on the support, is equipped with the trachea with suction hole intercommunication on the pump body.

The first pushing component pushes the clamping plates to clamp the silicon wafer group, then the pump body works, negative pressure is formed in the air pipe, air between the silicon wafers is sucked through the suction holes, the adsorption force between the wafers is increased, and the risk of sliding the wafers does not exist in the circulation process.

Preferably, the first pushing assembly comprises a first air cylinder arranged on the support, and the clamping plate is fixedly connected to a first piston rod extending out of the first air cylinder. Simple structure and convenient maintenance.

Preferably, the clamping plate comprises a connecting plate fixed with a first piston rod and a contact plate provided with a suction hole, a plurality of first guide rods parallel to the first piston rod are penetrated through the connecting plate, one ends of the first guide rods are provided with limiting blocks, the other ends of the first guide rods are fixedly connected with the contact plate, springs are sleeved on the first guide rods, one ends of the springs are propped against the contact plate, and the other ends of the springs are propped against the connecting plate. The first cylinder has impact force when pushing the contact plate when stretching out the first piston rod, the contact plate can damage the silicon chip, and when the contact plate contacts the silicon chip group, the silicon chip is buffered through the elasticity of the spring, and the silicon chip is protected.

Preferably, a pair of stop rods are arranged between the two clamping plates, a second air cylinder for pushing the stop rods to move is arranged on the connecting plate, the translation direction of the stop rods is perpendicular to that of the clamping plates, a supporting plate is fixed on a second piston rod extending out of the second air cylinder, a plurality of second guide rods parallel to the second piston rod are arranged on the supporting plate in a penetrating mode, one ends of the second guide rods are provided with limiting blocks, the other ends of the second guide rods are fixedly connected to the stop rods, springs are sleeved on the second guide rods, and one ends of the springs abut against the limiting blocks, and the other ends of the springs abut against the supporting plate. The second piston rod of the second air cylinder drives the stop lever to move, limits the other direction of the silicon wafer group, and performs secondary normalization so as to facilitate subsequent packaging or encapsulation treatment; the spring also protects the spring.

Preferably, the contact plate is a nylon plate, and the stop lever is coated with a nylon protective layer. The contact plate and the stop lever are directly contacted with the silicon wafer, and the silicon wafer is protected by nylon, so that the silicon wafer is prevented from being knocked.

Preferably, the support is provided with a pressing component for pressing the silicon wafer group, the pressing component comprises a pressing cylinder, and a pressing block is arranged on a third piston rod extending out of the pressing cylinder. When sucking, the silicon wafer group is pressed down by the pressing component, so that air among silicon wafers can be exhausted as soon as possible, and the effect is better.

Preferably, the lower pressing block is a block made of soft rubber. Avoiding the impact of the pressing block on the silicon wafer.

The conveying belt comprises a conveying belt body, wherein a regulating mechanism is arranged at the input end of the conveying belt body, and clamping plates are arranged on two sides of the conveying belt body.

After the silicon wafer group is detected, the silicon wafer group is conveyed to a packaging procedure through a conveying belt, when the conveying belt conveys the silicon wafer group, the adsorption force between the silicon wafers is poor and is easy to scatter on the conveying belt, so that a regulating mechanism is added at the input end of the conveying belt, air of the silicon wafer group is sucked, and the adsorption force between the silicon wafers is increased.

The beneficial effects of the utility model are as follows:

1. according to the utility model, the pump body enables the air suction hole to generate negative pressure, the stacked silicon wafer groups are pumped through the air suction hole, the adsorption force between the wafers is increased, and the risk of wafer slipping is avoided in the circulation process.

2. According to the utility model, the spring and the first guide rod are added, and the silicon wafer is protected by buffering through the elasticity of the spring.

3. When the pressing component is added in the utility model for sucking, the pressing component presses the silicon wafer group, so that air between silicon wafers can be exhausted as soon as possible, and the effect is better.

Drawings

Fig. 1 is a top view of the present utility model.

Fig. 2 is a front view of the present utility model.

Fig. 3 is a top view of a conveyor belt body with a normalization mechanism disposed.

Fig. 4 is a side view of a conveyor belt body with a normalization mechanism disposed.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings.

Example 1: as shown in fig. 1 and 2, the silicon wafer regulating mechanism comprises a bracket 1, wherein a pair of vertically arranged clamping plates 2 and a first pushing component 3 for pushing the two clamping plates 2 to translate in opposite directions are arranged on the bracket 1, a plurality of suction holes 2.1 are arranged on the inner side surfaces of the two clamping plates 2, a pump body 4 is arranged on the bracket 1, and an air pipe 4.1 communicated with the suction holes 2.1 is arranged on the pump body 4; the first pushing component 3 comprises a first cylinder 3.1 arranged on the bracket 1, and the clamping plate 2 is fixedly connected to a first piston rod 3.11 extending out of the first cylinder 3.1; the clamping plate 2 comprises a connecting plate 2.2 fixed with a first piston rod 3.11 and a contact plate 2.3 provided with a suction hole 2.1, a plurality of first guide rods 2.4 arranged in parallel with the first piston rod 3.11 are penetrated through the connecting plate 2.2, one ends of the first guide rods 2.4 are provided with limiting blocks, the other ends of the first guide rods are fixedly connected with the contact plate 2.3, springs are sleeved on the first guide rods 2.4, one ends of the springs are propped against the contact plate 2.3, the other ends of the springs are propped against the connecting plate 2.2, a pair of stop rods 5 are arranged between the two clamping plates 2, a second air cylinder 6 for pushing the stop rods 5 to move is arranged on the connecting plate 2.2, the translation direction of the stop rods 6 is perpendicular to the translation direction of the clamping plate 2, a supporting plate 7 is fixed on the second piston rods 6.1 extending out of the second air cylinder 6, a plurality of second guide rods 8 arranged in parallel with the second piston rods 6.1 are penetrated through the supporting plate 7, one ends of the second guide rods 8 are provided with limiting blocks, the other ends of the second guide rods are fixedly connected with the stop rods 5, springs are sleeved on the second guide rods 8, one ends of the other ends of the springs are propped against the supporting plates 7; the contact plate 2.3 is a nylon plate, and the stop lever 5 is coated with a nylon protective layer; the support 1 is provided with a pressing component 9 for pressing the silicon wafer group 11, the pressing component 9 comprises a pressing cylinder 9.1, a third piston rod 9.11 extending out of the pressing cylinder 9.1 is provided with a pressing block 9.2, and the pressing block 9.2 is made of soft rubber.

Example 2: referring to embodiment 1, as shown in fig. 3 and 4, a conveyor belt includes a conveyor belt body 10, at an input end of which a regulating mechanism is disposed, and clamp plates 2 are disposed on both sides of the conveyor belt body 10.

When the conveying belt is in operation, the conveying mechanical arm places the silicon wafer group at the input end of the conveying belt body 1, a first piston rod 3.11 of a first cylinder stretches out, the connecting plate 2.2 and the contact plate 2.3 are pushed, the contact plate 2.3 contacts the silicon wafer group 11, the spring 2.6 is compressed, and the distance between the connecting plate 2.2 and the contact plate 2.3 is gradually reduced to be finally attached; then a second piston rod 6.1 of a second air cylinder 6 extends out, a supporting plate 7 is pushed, the supporting plate 7 and a stop lever 5 are pushed, the stop lever 5 contacts with the silicon wafer group, a spring 2.6 on a second guide rod 8 is compressed, and the silicon wafer group 11 is well regulated; the pump body 4 works, negative pressure is formed in the air pipe 4.1, the suction hole 2.1 sucks air between silicon wafers, meanwhile, the lower pressing cylinder 9.1 pushes the lower pressing block 9.2 to move downwards and press the silicon wafers on the uppermost layer, after the lower pressing block 9.2 stays for a preset time, the third piston rod 9.11 of the lower pressing cylinder 9.1 is retracted, then the second piston rod 6.1 and the first piston rod 3.11 are sequentially retracted, and the conveying belt body 1 is conveyed.

The described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Claims

1. The utility model provides a regular mechanism that silicon chip is difficult for scattering, includes the support, is equipped with a pair of splint of vertical arrangement and promotes the first promotion subassembly of two splint opposite translation on the support, its characterized in that has arranged a plurality of suction holes on two splint medial surfaces, is equipped with the pump body on the support, is equipped with the trachea with suction hole intercommunication on the pump body.

2. The wafer alignment mechanism of claim 1 wherein the first pushing assembly comprises a first cylinder disposed on the support, and the clamping plate is fixedly connected to a first piston rod extending from the first cylinder.

3. The silicon wafer arranging mechanism which is not easy to scatter according to claim 2, wherein the clamping plate comprises a connecting plate fixed with a first piston rod and a contact plate provided with a suction hole, a plurality of first guide rods which are arranged in parallel with the first piston rod are penetrated on the connecting plate, one ends of the first guide rods are provided with limiting blocks, the other ends of the first guide rods are fixedly connected with the contact plate, springs are sleeved on the first guide rods, one ends of the springs are propped against the contact plate, and the other ends of the springs are propped against the connecting plate.

4. The silicon wafer alignment mechanism of claim 3, wherein a pair of stop bars are arranged between the two clamping plates, a second cylinder for pushing the stop bars to move is arranged on the connecting plate, the translation direction of the stop bars is perpendicular to the translation direction of the clamping plates, a supporting plate is fixed on a second piston rod extending out of the second cylinder, a plurality of second guide bars parallel to the second piston rod are penetrated through the supporting plate, one end of each second guide bar is provided with a limiting block, the other end of each second guide bar is fixedly connected to the stop bars, a spring is sleeved on each second guide bar, and one end of each spring abuts against the limiting block, and the other end of each spring abuts against the supporting plate.

5. The wafer alignment mechanism of claim 4 wherein the contact plate is a nylon plate and the stop lever is covered with a nylon protective layer.

6. The silicon wafer arranging mechanism which is not easy to scatter according to claim 1, wherein a pressing component for pressing the silicon wafer group is arranged on the support, the pressing component comprises a pressing cylinder, and a pressing block is arranged on a third piston rod extending out of the pressing cylinder.

7. The wafer alignment mechanism of claim 6 wherein the lower press block is a soft plastic block.

8. A conveyor belt comprising the normalization mechanism of any one of claims 1 to 7, comprising a conveyor belt body, characterized in that the normalization mechanism is arranged at the input end of the conveyor belt body, and that the clamping plates are arranged on both sides of the conveyor belt body.