CN219203122U - Chip transfer system - Google Patents
Chip transfer system Download PDFInfo
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- CN219203122U CN219203122U CN202320027325.3U CN202320027325U CN219203122U CN 219203122 U CN219203122 U CN 219203122U CN 202320027325 U CN202320027325 U CN 202320027325U CN 219203122 U CN219203122 U CN 219203122U
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- chip
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- throwing
- driving substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application discloses a chip transfer system, which comprises a cavity for accommodating a driving substrate; the chip throwing pipelines are arranged on one side of the cavity and are communicated with the cavity; the chip throwing pipelines are in one-to-one correspondence with the columns/rows of the chip array; a chip throwing port is arranged on the chip throwing pipeline; one end of the chip throwing pipeline is communicated with the cavity, the other end of the chip throwing pipeline is connected with an external air supply device, so that chips in the chip throwing pipeline are conveyed to a target position on the driving substrate through air flow, the chips are only required to be transferred into the chip throwing pipeline no matter what display mode is required to be realized through the driving substrate, and then the chips are transferred from the chip throwing pipeline to the two transfer processes of the driving substrate, the chip transfer times are reduced, and the chip transfer yield is improved.
Description
Technical Field
The application relates to the technical field of chip transfer, in particular to a chip transfer system.
Background
For Micro-LED chips, a chip with only one color light can be grown on one growth substrate; and finally, three-color light chips are required to be arranged into an array in a manner of a chip set when being transferred to a driving substrate, wherein each chip set comprises an R-red light chip, a G-green light chip and a B-blue light chip which are arranged in parallel.
In the prior art, the mass transfer of the chips is realized by firstly peeling the chips from the growth substrate, temporarily storing the chips on the temporary substrate, arranging the chips on the temporary substrate, and then transferring the chips from the temporary substrate to the driving substrate; especially when full color painting is realized, transfer needs to be performed even three times or more. In the process, the alignment precision is low when the chip is transferred to the driving substrate due to the fact that the number of times of transferring the chip is large, and the chip transfer yield is greatly reduced.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
The technical problem to be solved by the application is to provide a chip transfer system aiming at the defects in the prior art, aiming at reducing the number of chip transfer times and improving the chip transfer yield.
The technical scheme adopted for solving the technical problems is as follows:
a chip transfer system, comprising:
the cavity is used for accommodating the driving substrate;
the chip throwing pipelines are arranged on one side of the cavity and are communicated with the cavity; the chip throwing pipelines are in one-to-one correspondence with the columns/rows of the chip array;
a chip throwing port is arranged on the chip throwing pipeline; one end of the chip throwing pipeline is communicated with the cavity, and the other end of the chip throwing pipeline is connected with an external air supply device so as to convey the chips in the chip throwing pipeline to a target position on the driving substrate through air flow.
According to the scheme, after the chip is stripped from the growth substrate, the chip is placed into the chip throwing pipeline through the chip throwing port, an external air supply device is started, and the chip is conveyed to a target position on the driving substrate through air flow, so that the chip can be transferred from the growth substrate to the driving substrate; that is, no matter what display mode is required to be realized through the driving substrate, the chip is only required to be transferred into the chip throwing pipeline, and then the chip is transferred from the chip throwing pipeline to the driving substrate for two transfer processes, so that the chip transfer times are reduced, and the chip transfer yield is improved.
Optionally, the chip transfer system further comprises:
the airflow outlet is arranged on the side wall of the cavity.
Through the scheme, after the air flow enters the cavity from the chip throwing pipeline, the air flow can be discharged from the air flow outlet, so that the air pressure in the cavity is balanced.
Optionally, the air flow outlet and the chip throwing pipeline are respectively located at two opposite sides of the cavity.
Through the scheme, the smoothness of the airflow discharged from the airflow outlet after passing through the cavity can be improved, and the balance capacity of the air pressure in the cavity is further improved.
Optionally, an assembly gap is formed between the side wall of the cavity and the driving substrate; a gap is formed between the bottom surface of the cavity and the driving substrate; the air flow outlet corresponds to the gap; the assembly gap, the gap and the air flow outlet are sequentially communicated to form an air flow channel.
Through the scheme, the air flow is discharged from the air flow outlet after passing through the gap, so that the influence of the air flow on the bearing surface of the driving substrate is weakened, and the alignment error between the chip and the target position is avoided.
Optionally, the chip transfer system further comprises:
a stage located in the gap and used for carrying the driving substrate;
a plurality of support bars spaced apart in the gap; one end of the supporting rod is connected with the objective table, and the other end of the supporting rod is connected with the bottom surface of the cavity.
Through the scheme, the supporting rod supports the objective table, and the driving substrate is borne by the objective table, so that the driving substrate is supported, and the gap between the driving substrate and the bottom surface of the cavity is ensured to be reserved.
Optionally, the objective table is provided with an air suction channel and a plurality of air suction holes; the air suction channel is used for being connected with an external vacuumizing device; the suction hole communicates with the suction channel, and an opening of the suction hole is arranged toward the driving substrate.
Through the scheme, when the external vacuumizing device is started, the objective table can adsorb the driving substrate through the air suction holes, so that the driving substrate is supported and positioned at the same time, and displacement of the driving substrate is avoided.
Optionally, the chip transfer system further comprises:
the pressing device is arranged in the cavity in a lifting manner and is used for being connected with an external lifting driving device; the driving substrate is positioned between the pressing device and the objective table and is positioned in the travel range of the pressing device.
Through the scheme, after the chip is transferred to the target position of the driving substrate, the external lifting driving device controls the pressing device to move towards the direction of the objective table and is matched with the objective table to press the chip array, so that the chip is more tightly contacted with the driving substrate, and bonding between the chip and the driving substrate is facilitated.
Optionally, the pressing device includes:
the sucker is used for being connected with the external lifting driving device and the vacuumizing device;
and the pressing backboard is arranged on one side of the sucker, which faces the driving substrate.
Optionally, an accommodating groove is formed in the sucker, and the pressing backboard is located in the accommodating groove.
Through the scheme, the contact area between the pressing backboard and the sucker is increased, the stability of the pressing backboard absorbed by the sucker can be improved, and the pressing backboard is effectively prevented from being separated from the sucker in the moving process.
Optionally, the chip transfer system further comprises:
the baffle is rotationally connected to the chip throwing pipeline and is positioned at the chip throwing port; the baffle is used for shielding/opening the chip throwing port.
Through the scheme, after the chip throwing opening is used for throwing the chip into the chip throwing pipeline, the baffle is rotated to shield the chip throwing opening, so that the adverse effect of external air pressure at the chip throwing opening on air pressure supplied by the air supply device to the chip throwing pipeline is avoided, the probability of chip deviation is further reduced, and the alignment precision between the chip and the groove is improved.
In the application, the chip peeled from the growth substrate is placed into the chip throwing pipeline through the chip throwing port, an external air supply device is started, and the chip is conveyed to a target position on the driving substrate through air flow, so that the chip can be transferred from the growth substrate to the driving substrate; that is, no matter what display mode is required to be realized through the driving substrate, the chip is only required to be transferred into the chip throwing pipeline, and then the chip is transferred from the chip throwing pipeline to the driving substrate for two transfer processes, so that the chip transfer times are reduced, and the chip transfer yield is improved.
Drawings
FIG. 1 is a schematic cross-sectional view of a chip transfer system as described herein;
FIG. 2 is a reference diagram of the usage state of the chip transfer system when the chip is pressed by the pressing device;
FIG. 3 is a reference diagram of the use state of the chip transfer system after the chip transfer is completed;
FIG. 4 is a schematic view of the assembly of the subject table with an external vacuum device described herein.
Reference numerals illustrate:
1-driving a substrate; 2-grooves; 3-a cavity; 4-chip throwing pipeline; 5-a chip throwing port; 6-void; 7-an air flow outlet; 8-a pressing device; 9-stage; 11-a substrate body; 12-driving electrodes; 10-red light chip; 20-green light chip; 30-blue light chip; 40-assembly gap; 50-fitting the gap; 51-baffle; 81-sucking discs; 82-pressing the back plate; 91-supporting rods; 92-inhalation channel; 93-an air suction hole; 100-a gas supply device; 200-vacuumizing device; 300-lifting driving device.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application clearer and more specific, the present application will be described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
The present application provides a chip transfer system, as shown in fig. 1-3, comprising a cavity 3 and a plurality of chip throwing pipelines 4; the cavity 3 is used for accommodating the driving substrate 1, and the driving substrate 1 is used for bearing a chip array; the chip throwing pipelines 4 are arranged on one side of the cavity 3 and are communicated with the cavity 3; the chip throwing pipelines 4 are in one-to-one correspondence with the columns/rows of the chip array, so that single-color light chips in one column/row can be thrown at a time.
As shown in fig. 1, the chip throwing pipe 4 is provided with a chip throwing port 5 so as to throw chips into the chip throwing pipe 4 through the chip throwing port 5. One end of the chip throwing pipeline 4 is communicated with the cavity 3, and the other end is connected with an external air supply device 100; the chip throwing pipeline 4 is used for receiving the air flow output by the air supply device 100, so that the chips in the chip throwing pipeline 4 are conveyed to the target position on the driving substrate 1 by utilizing the parabolic principle and the free falling principle under the blowing action of the air flow.
Specifically, the distance X between the target position on the driving substrate 1 and the chip throwing port 5 and the distance X between the target position on the driving substrate 1 and the chip throwing pipeline 4 can be obtained by measurementIs the y-axis direction distance H; from the following components
So as to obtain the falling time t of the chip from the chip to the target position when the throwing pipeline falls; obtaining a chip falling speed V according to X=Vt; according to v=v 0 +at, and V 0 =0, obtaining chip falling acceleration a; obtaining the gas pressure F that the gas supply device 100 should supply to the chip throwing pipe 4, based on f=ma, where m is the height of the chip; finally, the opening degree of the air valve of the air supply device 100 is obtained according to the corresponding relation between the air pressure and the air flow rate and the air valve opening degree.
After the monochromatic light chip is placed into the chip throwing pipeline 4 through the chip throwing port 5, the external air supply device 100 is started, and the air valve of the air supply device 100 is opened to a corresponding opening degree, so that power can be provided for the monochromatic light chip, the monochromatic light chip falls to a target position on the driving substrate 1, and finally, the arrangement and the transfer of the monochromatic light chip on the driving substrate 1 are realized.
In the application, the chip peeled from the growth substrate is placed into the chip throwing pipeline 4 through the chip throwing port 5, and the external air supply device 100 is started, and the chip is conveyed to a target position on the driving substrate 1 through air flow, so that the transfer of the chip from the growth substrate to the driving substrate 1 can be realized; that is, no matter what display mode is required to be realized by the driving substrate 1, the chip is only required to be transferred into the chip throwing pipeline 4, and then the chip is transferred from the chip throwing pipeline 4 to the driving substrate 1 for two transfer processes, so that the chip transfer times are reduced, and the chip transfer yield is improved.
As shown in fig. 1 and 2, the chip transfer system further includes an air outlet 7, where the air outlet 7 is disposed on a side wall of the cavity 3, so that after the air enters the cavity 3 from the chip throwing pipe 4, the air can be discharged from the air outlet 7, so as to balance the air pressure in the cavity 3.
In this embodiment, as shown in fig. 1, the air flow outlet 7 and the chip throwing pipe 4 are respectively located at opposite sides of the cavity 3, so that the air flow is discharged from opposite sides of the air inlet direction, thereby improving smoothness of the air flow discharged from the air flow outlet 7 after passing through the cavity 3, and further improving balancing capability of air pressure in the cavity 3.
An assembly gap 40 is formed between the side wall of the cavity 3 and the driving substrate 1; a gap 6 is formed between the bottom surface of the cavity 3 and the driving substrate 1; the air flow outlet 7 corresponds to the interspace 6, i.e. the air flow outlet 7 is located at the same level as the interspace 6. The assembly gap 40, the gap 6 and the air flow outlet 7 are sequentially communicated to form an air flow channel.
After the gas supply device 100 is turned on, the air flow is blown into the cavity 3 through the chip throwing pipe 4, and then sequentially passes through the assembly gap 40 and the gap 6 and is discharged from the air flow outlet 7, so that an air flow channel is formed to balance the air pressure in the cavity 3; meanwhile, the air flow is discharged from the air flow outlet 7 after passing through the gap 6, so that the influence of the air flow on the bearing surface of the driving substrate 1 is weakened, and the alignment error between the chip and the target position is avoided.
As shown in fig. 1 and 2, the chip transfer system further includes a stage 9 and a plurality of support rods 91; the stage 9 and the support bar 91 are both positioned in the gap. The objective table 9 is used for bearing the driving substrate 1;
a plurality of support rods 91 are arranged in the gap 6 at intervals; one end of the supporting rod 91 is connected with the objective table 9, and the other end is connected with the bottom surface of the cavity 3, so as to support the objective table 9, and load the driving substrate 1 through the objective table 9, and ensure that the gap 6 can be reserved between the driving substrate 1 and the bottom surface of the cavity 3 while supporting the driving substrate 1.
As shown in fig. 1, there is an assembly gap 50 between the outer periphery of the stage 9 and the inner side wall of the chamber 3, and the assembly gap 50 communicates with the assembly gap 40 and the gap 6, respectively, so that the air flow can pass through the assembly gap 40, the assembly gap 50 and the gap 6 at a time and then be discharged from the air flow outlet 7.
As shown in fig. 4, the stage 9 is provided with a suction channel 92 and a plurality of suction holes 93; the air suction channel 92 is used for being connected with an external vacuumizing device 200; the suction holes 93 communicate with the suction passage 92, and openings of the suction holes 93 are arranged toward the driving substrate 1. When the external vacuum-pumping device 200 is turned on, the stage 9 may adsorb the driving substrate 1 through the suction hole 93, so as to support the driving substrate 1 and simultaneously position the driving substrate 1, thereby avoiding displacement of the driving substrate 1.
As shown in fig. 1 and 2, the chip transferring system further includes a pressing device 8, where the pressing device 8 is disposed in the cavity 3 in a liftable manner and is used for being connected with an external lifting driving device 300; the driving substrate 1 is located between the pressing device 8 and the stage 9, and is located within the range of travel of the pressing device 8.
The pressing device 8 can be lifted in the cavity 3 under the driving of the external lifting driving device 300, so as to finish the pressing of the chip and the reset after the pressing. Specifically, after the chip is transferred to the target position of the driving substrate 1, the external lifting driving device 300 controls the pressing device 8 to move towards the direction of the objective table 9, and cooperates with the objective table 9 to press the chip array, so that the chip is more tightly contacted with the driving substrate 1, and bonding between the chip and the driving substrate 1 is more facilitated.
In one embodiment of the present application, the external lifting driving device 300 may use an air cylinder; the free end of the piston rod of the air cylinder extends into the cavity 3 and is connected with the pressing device 8, so that the pressing device 8 is driven to lift in the cavity 3.
As shown in fig. 1 and 2, the pressing device 8 includes a suction cup 81 and a pressing back plate 82; the suction cup 81 is used for being connected with an external lifting driving device 300 and a vacuumizing device 200; the pressing back plate 82 is disposed on a side of the suction cup 81 facing the driving substrate 1.
The pressing backboard 82 is arranged at the bottom of the sucker 81 and is positioned at one side of the driving substrate 1 away from the objective table 9; the drive base plate 1 is located within the stroke range of the pressing back plate 82. The sucking disc 81 adsorbs the pressing backplate 82, when the sucking disc 81 is driven to move downwards by the external lifting driving device 300, the pressing backplate 82 can move downwards under the driving of the sucking disc 81, and the chip array is pressed.
Be provided with the holding tank on the sucking disc 81, the suppression backplate 82 is located the holding tank has increased the suppression backplate 82 with area of contact between the sucking disc 81 can promote the suppression backplate 82 by the absorptive stability of sucking disc 81 effectively avoids moving the in-process the suppression backplate 82 breaks away from sucking disc 81.
Meanwhile, since the pressing backboard 82 is connected with the external lifting driving device 300 through the suction disc 81, no direct connection relationship exists between the pressing backboard 82 and the external lifting driving device 300, so that drilling on the pressing backboard 82 is avoided, the consistency of the overall strength of the pressing backboard 82 is ensured, and the pressing backboard 82 is more balanced in pressing force on the chip array.
As shown in fig. 1 and 2, the chip transferring system further includes a baffle plate 51, and the baffle plate 51 is rotatably connected to the chip throwing pipe 4 and is located at the chip throwing port 5; the shutter 51 is used to block/unblock the chip throwing port 5.
The baffle plate 51 is rotated to adjust the chip throwing port 5 to an open state (as shown in fig. 1), so that chips can be thrown into the chip throwing pipeline 4 through the chip throwing port 5; after the chip is put in, the baffle plate 51 is rotated to shield the chip throwing port 5, so that adverse effects on the air pressure in the chip throwing pipeline 4 caused by external air pressure at the chip throwing port 5 are avoided, the probability of chip deviation is further reduced, and the alignment precision between the chip and the target position on the driving substrate 1 is improved.
As shown in fig. 1, a groove 2 is disposed on the bearing surface of the driving substrate 1 corresponding to the target position of each chip; the driving substrate 1 is used for bearing a chip array; the grooves 2 on the driving substrate 1 are arranged in an array mode according to the arrangement mode of the chip array, so that the grooves 2 and the chips can be in one-to-one correspondence.
The recess 2 is arranged recessed inwards from the carrying surface of the drive substrate 1, so that the top of the recess 2 forms an opening for the chip to enter. The recess 2 is adapted to receive a chip, i.e. each chip of the array of chips is received in a corresponding recess 2. The application is in add on the surface of drive base plate 1 recess 2, through recess 2 holds the chip, carries out spacingly to the chip, avoids the chip to shift to in the recess 2 after shifting other chips's influence down production skew for a monochromatic light chip shifts and need not to pressfitting and heating it after accomplishing, can carry out the transfer of seed monochromatic light chip, thereby has avoided adopting the phenomenon that leads to the chip damage when shifting the chip of a huge number of transfer modes of single, has promoted the chip and has shifted the yield.
Specifically, for example, after the red light chip 10 is transferred and the red light chip 10 is arranged in the corresponding groove 2 on the driving substrate 1, the green light chip 20 and the blue light chip 30 can be sequentially transferred, without pressing and heating the red light chip 10 before transferring the green light chip 20, and without pressing and heating the red light chip 10 and the green light chip 20 before transferring the blue light chip 30, and only after all the red light chip 10, the green light chip 20 and the blue light chip 30 are transferred and arranged, the red light chip 10, the green light chip 20 and the blue light chip 30 on the driving substrate 1 are pressed and heated at one time, thereby completing huge quantity transfer of chips and bonding between the chips and the driving substrate 1.
As shown in fig. 1, the recess 2 is an inverted trapezoid recess 2, that is, the opening area of the recess 2 is larger than the bottom area, so that the side wall of the recess 2 is sloped, and the sloped side wall of the recess 2 is used to guide the transfer of the chip into the recess 2. Specifically, even if the chip deviates from the bottom center of the groove 2 by a certain amount, the chip can also slide to the bottom center of the groove 2 under the guiding action of the side wall of the groove 2, so that the chip is prevented from deviating, and the alignment precision of the chip is improved.
As shown in fig. 1, the driving substrate 1 includes a substrate body 11 and a driving electrode 12; the groove 2 is arranged on the substrate body 11; the driving electrodes 12 are disposed in the grooves 2 and are used for bonding with the chips in a one-to-one correspondence. When the chip array is bonded with the corresponding driving electrode 12, the upper surface of the chip array is flush, so that the chip array is uniformly stressed when the chip array is pressed in the later period, the phenomenon that poor contact and crushed electrodes of chips are caused by uneven stress of the chips in the pressing process is avoided, and the chip transfer yield is further improved.
In an embodiment of the present application, the depths of the grooves 2 corresponding to the three kinds of monochromatic light chips are different, and the heights of the driving electrodes 12 corresponding to the three kinds of monochromatic light chips are equal, so as to realize: the upper surface of the chip array is flush when the chip array is bonded to the corresponding drive electrode 12. Specifically, since the height of the red light chip 10 and the height of the blue light chip 30 are both lower than the height of the green light chip 20, the depth of the groove 2 corresponding to the red light chip 10 and the depth of the groove 2 corresponding to the blue light chip 30 are both smaller than the depth of the groove 2 corresponding to the green light chip 20.
In another embodiment of the present application, the depths of the grooves 2 corresponding to the three kinds of monochromatic light chips are equal, and the heights of the driving electrodes 12 corresponding to the three kinds of monochromatic light chips are different, so as to realize: the upper surface of the chip array is flush when the chip array is bonded to the corresponding drive electrode 12. Specifically, since the height of the red light chip 10 and the height of the blue light chip 30 are both lower than the height of the green light chip 20, the height of the driving electrode 12 corresponding to the red light chip 10 and the height of the driving electrode 12 corresponding to the blue light chip 30 are both greater than the height of the driving electrode 12 corresponding to the green light chip 20.
In summary, the present application provides a chip transfer system, which includes a cavity for accommodating a driving substrate; the chip throwing pipelines are arranged on one side of the cavity and are communicated with the cavity; the chip throwing pipelines are in one-to-one correspondence with the columns/rows of the chip array; a chip throwing port is arranged on the chip throwing pipeline; one end of the chip throwing pipeline is communicated with the cavity, the other end of the chip throwing pipeline is connected with an external air supply device, so that chips in the chip throwing pipeline are conveyed to a target position on the driving substrate through air flow, the chips are only required to be transferred into the chip throwing pipeline no matter what display mode is required to be realized through the driving substrate, and then the chips are transferred from the chip throwing pipeline to the two transfer processes of the driving substrate, the chip transfer times are reduced, and the chip transfer yield is improved.
It is to be understood that the application of the present application is not limited to the examples described above, but that modifications and variations can be made by a person skilled in the art from the above description, all of which modifications and variations are intended to fall within the scope of the claims appended hereto.
Claims (10)
1. A chip transfer system, comprising:
the cavity is used for accommodating the driving substrate;
the chip throwing pipelines are arranged on one side of the cavity and are communicated with the cavity; the chip throwing pipelines are in one-to-one correspondence with the columns/rows of the chip array;
a chip throwing port is arranged on the chip throwing pipeline; one end of the chip throwing pipeline is communicated with the cavity, and the other end of the chip throwing pipeline is connected with an external air supply device so as to convey the chips in the chip throwing pipeline to a target position on the driving substrate through air flow.
2. The chip transfer system of claim 1, further comprising:
the airflow outlet is arranged on the side wall of the cavity.
3. The chip transfer system of claim 2, wherein the air flow outlet and the chip throwing conduit are located on opposite sides of the cavity, respectively.
4. The chip transfer system of claim 2, wherein a sidewall of the cavity has an assembly gap with the drive substrate; a gap is formed between the bottom surface of the cavity and the driving substrate; the air flow outlet corresponds to the gap; the assembly gap, the gap and the air flow outlet are sequentially communicated to form an air flow channel.
5. The chip transfer system of claim 4, further comprising:
a stage located in the gap and used for carrying the driving substrate;
a plurality of support bars spaced apart in the gap; one end of the supporting rod is connected with the objective table, and the other end of the supporting rod is connected with the bottom surface of the cavity.
6. The chip transfer system according to claim 5, wherein the stage is provided with a suction channel and a plurality of suction holes; the air suction channel is used for being connected with an external vacuumizing device; the suction hole communicates with the suction channel, and an opening of the suction hole is arranged toward the driving substrate.
7. The chip transfer system of claim 5, further comprising:
the pressing device is arranged in the cavity in a lifting manner and is used for being connected with an external lifting driving device; the driving substrate is positioned between the pressing device and the objective table and is positioned in the travel range of the pressing device.
8. The chip transfer system of claim 7, wherein the bonding device comprises:
the sucker is used for being connected with the external lifting driving device and the vacuumizing device;
and the pressing backboard is arranged on one side of the sucker, which faces the driving substrate.
9. The chip transfer system of claim 8, wherein said suction cup has a receiving slot therein, said hold down backplate being positioned within said receiving slot.
10. The chip transfer system of claim 1, further comprising:
the baffle is rotationally connected to the chip throwing pipeline and is positioned at the chip throwing port; the baffle is used for shielding/opening the chip throwing port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320027325.3U CN219203122U (en) | 2023-01-05 | 2023-01-05 | Chip transfer system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320027325.3U CN219203122U (en) | 2023-01-05 | 2023-01-05 | Chip transfer system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219203122U true CN219203122U (en) | 2023-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320027325.3U Active CN219203122U (en) | 2023-01-05 | 2023-01-05 | Chip transfer system |
Country Status (1)
| Country | Link |
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| CN (1) | CN219203122U (en) |
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- 2023-01-05 CN CN202320027325.3U patent/CN219203122U/en active Active
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