CN219201679U - Test base for chip test - Google Patents
Test base for chip test Download PDFInfo
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- CN219201679U CN219201679U CN202223273192.2U CN202223273192U CN219201679U CN 219201679 U CN219201679 U CN 219201679U CN 202223273192 U CN202223273192 U CN 202223273192U CN 219201679 U CN219201679 U CN 219201679U
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- base body
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Abstract
The utility model discloses a test base for chip test, which comprises a base body, wherein the top of one side of the base body is connected with a cover plate through a hinge shaft, a heating cavity is arranged in the cover plate, through the arrangement of an electric heating pipe, the electric heating pipe can heat conduction oil, the heat conduction oil can radiate heat to heat the inside of the base body through a metal heating plate, different temperature environments can be simulated, through the arrangement of a temperature sensor, the temperature sensor can detect the temperature of the inner cavity of the base body, when the temperature detected by the temperature sensor is higher than the highest temperature arranged on a single chip microcomputer controller, the single chip microcomputer controller controls the electric heating pipe to stop heating, and when the temperature detected by the temperature sensor is lower than the lowest temperature arranged on the single chip microcomputer controller, the single chip microcomputer controller controls the electric heating pipe to be started for heating, the different temperature environments can be simulated, and chips under different temperature environments can be tested.
Description
Technical Field
The utility model relates to the technical field of chip testing, in particular to a testing base for chip testing.
Background
The wafer is a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, the wafer is a wafer because the wafer is round in shape, the chip is a silicon wafer containing the integrated circuit, the volume is very small and is often a part of a computer or other electronic equipment, the wafer is a semiconductor material on which the chip is manufactured, the chip manufactured by the wafer is placed on a machine platform through a base, the chip is subjected to open circuit test and terminal test in a contact pressing mode, and the chip which is qualified through detection is subjected to subsequent packaging process, so that the yield of the packaged chip is ensured.
The utility model of application number 201921705226.6 discloses a base for chip testing, which comprises: the chip testing base comprises a base body, wherein a rectangular groove is formed in the top surface of the base body, two bosses are arranged on the base body at the rectangular groove, the top ends of the bosses protrude out of the top surface of the base body, the side surfaces of the top ends of the bosses are inclined planes, positioning holes are formed in the top of the bosses, vacuum tubes are arranged on the base body at four inner corners of the rectangular groove, and openings are formed in the rectangular groove at the top ends of the vacuum tubes; and be equipped with the vacuum tube of being connected with air extraction equipment in four interior angles department of rectangular groove, through the foreign matter extraction in the air extraction equipment with rectangular groove, the clearance to the base body is convenient, can guarantee going on smoothly of follow-up chip test, but this base for chip test can not regulate and control the test temperature of chip, can not simulate different temperature environment, can not test the chip under the different temperature environment.
For the problems in the related art, no effective solution has been proposed at present.
Disclosure of Invention
The present utility model provides a test base for chip testing, which solves the above-mentioned problems of the prior art.
For this purpose, the utility model adopts the following specific technical scheme:
the utility model provides a test base for chip test, includes the base body, base body one side top is connected with the apron through the hinge, the inside heating chamber that is equipped with of apron, the heating chamber inner chamber is equipped with conduction oil and electric heating pipe, the fixed metal heating board that is equipped with in apron bottom, base body inner chamber one side is fixed to be equipped with temperature sensor, rectangular groove has been seted up to base body inner chamber bottom, just rectangular groove bottom is equipped with the water conservancy diversion slope, rectangular groove inner chamber is fixed to be equipped with the boss, the locating hole has been seted up on the boss, base body bottom is equipped with the chip removal mouth, base body bottom symmetry is fixed to be equipped with the fixed landing leg, base body front side fixed surface is equipped with the singlechip controller.
Preferably, the fixing support leg comprises an L-shaped support, and a fixing hole is formed in the L-shaped support.
Preferably, a lifting handle is fixedly arranged at the top of one side of the cover plate.
Preferably, the bottom end of the chip removal port is provided with a connecting flange, the bottom of the chip removal port is connected with a vacuum pipe through the connecting flange, and the other end of the vacuum pipe is connected with a vacuum pump.
Preferably, the metal heating plate is any one of a copper plate and an aluminum plate, and heating fins are fixedly arranged at the bottom of the metal heating plate at equal intervals.
Preferably, the temperature sensor, the singlechip controller and the electric heating pipe are connected through wires.
The beneficial effects of the utility model are as follows: 1. through setting up electric heating pipe, electric heating pipe can heat conduction oil, and the electric heating pipe is opened to heat to the inside of base body through the heat dissipation of metal hot plate, can simulate different temperature environment, through setting up temperature sensor, temperature sensor can detect the temperature of base body inner chamber, when temperature sensor detects the temperature and is higher than the maximum temperature that sets up on the singlechip controller, singlechip controller control electric heating pipe stops heating, when temperature sensor detects the temperature and is lower than the minimum temperature that sets up on the singlechip controller, singlechip controller control electric heating pipe opens to heat, can simulate different temperature environment, can test the chip under the different temperature environment;
2. the chip removal mouth bottom passes through flange connection vacuum tube, and the vacuum pump is connected to the vacuum tube other end, can absorb the foreign matter that the inner chamber bottom of rectangle recess accumulated through the vacuum pump and take away, conveniently clear up the inside base body, can guarantee going on smoothly of follow-up chip test.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a diagram of a test base structure for chip testing according to an embodiment of the present utility model;
FIG. 2 is a cross-sectional view of a test base for chip testing according to an embodiment of the utility model;
FIG. 3 is a front view of a test base for chip testing according to an embodiment of the present utility model;
fig. 4 is a top view of a base body of a test base for chip testing according to an embodiment of the present utility model.
In the figure:
1. a base body; 2. a hinge shaft; 3. a cover plate; 4. a heating chamber; 5. heat conducting oil; 6. an electric heating tube; 7. a metal heating plate; 8. a temperature sensor; 9. rectangular grooves; 10. a boss; 11. positioning holes; 12. a chip removal port; 13. a fixed support leg; 14. a singlechip controller; 15. an L-shaped bracket; 16. a fixing hole; 17. a lifting handle; 18. a connecting flange; 19. heating fins.
Detailed Description
For the purpose of further illustrating the various embodiments, the present utility model provides the accompanying drawings, which are a part of the disclosure of the present utility model, and which are mainly used to illustrate the embodiments and, together with the description, serve to explain the principles of the embodiments, and with reference to these descriptions, one skilled in the art will recognize other possible implementations and advantages of the present utility model, wherein elements are not drawn to scale, and like reference numerals are generally used to designate like elements.
According to an embodiment of the present utility model, a test base for chip testing is provided.
Example 1
As shown in fig. 1-4, a test base for testing chips according to the embodiment of the utility model comprises a base body 1, a cover plate 3 is connected to the top of one side of the base body 1 through a hinge shaft 2, a heating cavity 4 is arranged in the cover plate 3, heat conducting oil 5 and an electric heating pipe 6 are arranged in the cavity of the heating cavity 4, a metal heating plate 7 is fixedly arranged at the bottom of the cover plate 3, the electric heating pipe 6 can heat the heat conducting oil 5, the heat conducting oil 5 can radiate heat through the metal heating plate 7 to heat the inside of the base body 1, different temperature environments can be simulated, a temperature sensor 8 is fixedly arranged at one side of the cavity of the base body 1, a rectangular groove 9 is formed in the bottom of the cavity of the base body 1, a diversion slope is arranged at the bottom of the rectangular groove 9, foreign matters can be guided by the diversion slope, a boss 10 is fixedly arranged in the cavity of the rectangular groove 9, positioning holes 11 are formed in the boss 10, the number of the positioning holes 11 is the same as the number of the positioning pins at two ends of a chip, the positioning pins at the chip are respectively inserted into the positioning holes 11 in the boss 10, the chip can be fixedly arranged on the base body 1, a chip is fixedly arranged at the bottom of the base body 1, a chip removal port 12 is arranged at the bottom of the base body 1, a support leg 13 is symmetrically arranged at the bottom of the base body 1, a support 13 is fixedly arranged at one side of the base body is fixedly arranged, a support 13 is fixedly arranged at one side of the base body is provided with a support 17, and the support is fixedly arranged at the top of the metal support 17 is fixedly arranged at the top of the base body is 13, and is fixed by the top of the base body is 13, and is provided with a support 17, and is fixed by the support is provided with the support 17, and is fixed with the support frame is 13, and is provided with the support frame is 13 is by the support frame is 13 and is provided with the support frame is 13 and has and is 13. The heating fins 19 can improve the heating efficiency of the metal heating plate 7 to the inner cavity of the base body 1.
Example two
As shown in fig. 1-4, a test base for chip test according to an embodiment of the present utility model includes a base body 1, a cover plate 3 is connected to the top of one side of the base body 1 through a hinge 2, a heating cavity 4 is provided inside the cover plate 3, a heat conducting oil 5 and an electric heating pipe 6 are provided in the cavity of the heating cavity 4, a metal heating plate 7 is fixedly provided at the bottom of the cover plate 3, the electric heating pipe 6 can heat the heat conducting oil 5, the heat conducting oil 5 can radiate heat through the metal heating plate 7 to heat the inside of the base body 1, different temperature environments can be simulated, a temperature sensor 8 is fixedly provided at one side of the cavity of the base body 1, a rectangular groove 9 is provided at the bottom of the cavity of the base body 1, a diversion slope is provided at the bottom of the rectangular groove 9, the diversion slope can guide foreign matters, a boss 10 is fixedly provided in the cavity of the rectangular groove 9, the boss 10 is provided with the locating holes 11, the number of the locating holes 11 is the same as that of the locating pins at two ends on the chip, the locating pins at two ends on the chip are respectively inserted into the locating holes 11 on the boss 10, the chip can be fixedly installed on the base body 1, the bottom of the base body 1 is provided with the chip discharge port 12, the bottom of the base body 1 is symmetrically and fixedly provided with the fixing support legs 13, the front side surface of the base body 1 is fixedly provided with the singlechip controller 14, the bottom of the chip discharge port 12 is provided with the connecting flange 18, the bottom of the chip discharge port 12 is connected with the vacuum pipe through the connecting flange 18, the other end of the vacuum pipe is connected with the vacuum pump, foreign matters accumulated at the bottom of the inner cavity of the rectangular groove 9 can be sucked and removed through the vacuum pump, the inside of the base body 1 can be cleaned conveniently, and the subsequent chip test can be ensured to be smoothly carried out.
Example III
As shown in fig. 1-4, a test base for chip test according to an embodiment of the present utility model includes a base body 1, a cover plate 3 is connected to the top of one side of the base body 1 through a hinge 2, a heating cavity 4 is provided inside the cover plate 3, a heat conducting oil 5 and an electric heating pipe 6 are provided in the cavity of the heating cavity 4, a metal heating plate 7 is fixedly provided at the bottom of the cover plate 3, the electric heating pipe 6 can heat the heat conducting oil 5, the heat conducting oil 5 can radiate heat through the metal heating plate 7 to heat the inside of the base body 1, different temperature environments can be simulated, a temperature sensor 8 is fixedly provided at one side of the cavity of the base body 1, a rectangular groove 9 is provided at the bottom of the cavity of the base body 1, a guiding slope is provided at the bottom of the rectangular groove 9, guiding of a foreign matter is provided, a boss 10 is fixedly provided in the cavity of the rectangular groove 9, a positioning hole 11 is provided on the boss 10, the number of the positioning holes 11 is the same as that of the positioning pins at the two ends of the chip, the positioning pins at the two ends of the chip are respectively inserted into the positioning holes 11 on the boss 10, the chip can be fixedly installed on the base body 1, the chip discharge port 12 is arranged at the bottom of the base body 1, the fixed supporting legs 13 are symmetrically and fixedly arranged at the bottom of the base body 1, the singlechip controller 14 is fixedly arranged on the surface of the front side of the base body 1, the temperature sensor 8, the singlechip controller 14 and the electric heating pipe 6 are connected through wires, the temperature sensor 8 can detect the temperature of the inner cavity of the base body 1, when the temperature detected by the temperature sensor 8 is higher than the highest temperature arranged on the singlechip controller 14, the singlechip controller 14 controls the electric heating pipe 6 to stop heating, when the temperature detected by the temperature sensor 8 is lower than the lowest temperature arranged on the singlechip controller 14, the singlechip controller 14 controls the electric heating pipe 6 to be started for heating, so that different temperature environments can be simulated, and chips in different temperature environments can be tested.
In summary, by means of the above technical scheme of the utility model, when the device is used, the number of the positioning holes 11 is the same as that of the positioning pins at two ends on the chip, the positioning pins at two ends on the chip are respectively inserted into the positioning holes 11 on the boss 10, the chip can be fixedly installed on the base body 1 for testing, the heat conducting oil 5 can be heated through the electric heating pipe 6, the heat conducting oil 5 can radiate heat through the metal heating plate 7 for heating the inside of the base body 1, the temperature sensor 8 can detect the temperature of the inner cavity of the base body 1, when the temperature detected by the temperature sensor 8 is higher than the highest temperature set on the single chip controller 14, the single chip controller 14 controls the electric heating pipe 6 to stop heating, when the temperature detected by the temperature sensor 8 is lower than the lowest temperature set on the single chip controller 14, the single chip controller 14 is controlled to be started for heating, different temperature environments can be simulated, the chip under different temperature environments can be tested, the foreign matters accumulated at the bottom of the inner cavity of the rectangular groove 9 can be sucked through the vacuum pump, the inside of the base body can be conveniently sucked, and the inside of the base body can be conveniently cleaned, and the subsequent test can be carried out.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (6)
1. Test base for chip testing, comprising a base body (1), characterized in that: the novel solar energy heating device is characterized in that a cover plate (3) is connected to the top of one side of the base body (1) through a hinge shaft (2), a heating cavity (4) is formed in the cover plate (3), heat conducting oil (5) and an electric heating pipe (6) are arranged in the inner cavity of the heating cavity (4), a metal heating plate (7) is fixedly arranged at the bottom of the cover plate (3), a temperature sensor (8) is fixedly arranged on one side of the inner cavity of the base body (1), a rectangular groove (9) is formed in the bottom of the inner cavity of the base body (1), a diversion slope is formed in the bottom of the rectangular groove (9), a boss (10) is fixedly arranged in the inner cavity of the rectangular groove (9), a positioning hole (11) is formed in the boss (10), a chip removal port (12) is formed in the bottom of the base body (1), a fixing support leg (13) is symmetrically and fixedly arranged at the bottom of the base body (1), and a singlechip controller (14) is fixedly arranged on the surface of the front side of the base body (1).
2. A test pad for chip testing according to claim 1, wherein: the fixed support leg (13) comprises an L-shaped support (15), and a fixed hole (16) is formed in the L-shaped support (15).
3. A test pad for chip testing according to claim 2, wherein: a lifting handle (17) is fixedly arranged at the top of one side of the cover plate (3).
4. A test pad for chip testing according to claim 3, wherein: the bottom of the chip removal port (12) is provided with a connecting flange (18), the bottom of the chip removal port (12) is connected with a vacuum tube through the connecting flange (18), and the other end of the vacuum tube is connected with a vacuum pump.
5. A test pad for chip testing as defined in claim 4, wherein: the metal heating plate (7) is any one of a copper plate and an aluminum plate, and heating fins (19) are fixedly arranged at the bottom of the metal heating plate (7) at equal intervals.
6. A test pad for chip testing as defined in claim 5, wherein: the temperature sensor (8), the singlechip controller (14) and the electric heating pipe (6) are connected through wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223273192.2U CN219201679U (en) | 2022-12-07 | 2022-12-07 | Test base for chip test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223273192.2U CN219201679U (en) | 2022-12-07 | 2022-12-07 | Test base for chip test |
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| Publication Number | Publication Date |
|---|---|
| CN219201679U true CN219201679U (en) | 2023-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223273192.2U Active CN219201679U (en) | 2022-12-07 | 2022-12-07 | Test base for chip test |
Country Status (1)
| Country | Link |
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| CN (1) | CN219201679U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117129838A (en) * | 2023-08-02 | 2023-11-28 | 法特迪精密科技（苏州）有限公司 | Circulation structure of high-temperature aging test socket |
-
2022
- 2022-12-07 CN CN202223273192.2U patent/CN219201679U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117129838A (en) * | 2023-08-02 | 2023-11-28 | 法特迪精密科技（苏州）有限公司 | Circulation structure of high-temperature aging test socket |
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