CN219194870U - Copper foil adhesive tape for fingerprint module - Google Patents
Copper foil adhesive tape for fingerprint module Download PDFInfo
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- CN219194870U CN219194870U CN202320350823.1U CN202320350823U CN219194870U CN 219194870 U CN219194870 U CN 219194870U CN 202320350823 U CN202320350823 U CN 202320350823U CN 219194870 U CN219194870 U CN 219194870U
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- release film
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Abstract
The utility model provides a copper foil sticky tape for fingerprint module, relates to sticky tape technical field, including upper bonding layer, polyamide layer, copper foil layer and the lower bonding layer that top-down set up, upper bonding layer is including first adhesive layer and first release membranous layer, the lower surface of first release membranous layer is laminated with the upper surface of first adhesive layer, the lower surface of first adhesive layer is laminated with the upper surface of polyamide layer; the lower adhesive layer comprises a second adhesive layer and a second release film layer, wherein the upper surface of the second release film layer is attached to the lower surface of the second adhesive layer, and the upper surface of the second adhesive layer is attached to the lower surface of the copper foil layer. The copper foil adhesive tape for the fingerprint module has the advantages of high toughness resistance, good oxidation resistance, long service life, good use effect and the like.
Description
Technical Field
The utility model relates to the technical field of adhesive tapes, in particular to a copper foil adhesive tape for a fingerprint module.
Background
With the development of modern technology, electronic products are gradually popularized in our daily lives, and mobile phones, computers and other electronic products become one of the important tools for modern life, but long-term use of these tools can endanger our health, so that shielding is sometimes needed. The copper foil tape has excellent electromagnetic shielding performance, so the copper foil tape is widely applied to mobile phones, notebook computers and other electronic products to play a role in electric shielding or magnetic shielding, the copper foil tape is generally made of rolled copper foil or electrolytic copper foil by single-sided or double-sided gluing, and conductive particles can be added in the glue to play a role in conducting electricity. The copper foil adhesive tape is generally used on the fingerprint module, the overall thickness of the adhesive tape is required, the thickness of the used copper foil material is thinner, the thinner copper foil material is easily torn and broken in the coating process, the quality of the adhesive tape is affected, and the moisture of the external air is easily caused to enter the adhesive tape in the storage process, so that the oxidation phenomenon is caused, and the use effect is affected.
Disclosure of Invention
The utility model aims to provide a copper foil tape for a fingerprint module, which aims to solve the technical problems, and has the advantages of high toughness resistance, good oxidation resistance, long service life, good use effect and the like.
In order to achieve the above purpose, the present utility model is realized by the following technical scheme:
the copper foil adhesive tape for the fingerprint module comprises an upper adhesive layer, a polyamide layer, a copper foil layer and a lower adhesive layer which are arranged from top to bottom, wherein the upper adhesive layer comprises a first adhesive layer and a first release film layer, the lower surface of the first release film layer is attached to the upper surface of the first adhesive layer, and the lower surface of the first adhesive layer is attached to the upper surface of the polyamide layer; the lower adhesive layer comprises a second adhesive layer and a second release film layer, wherein the upper surface of the second release film layer is attached to the lower surface of the second adhesive layer, and the upper surface of the second adhesive layer is attached to the lower surface of the copper foil layer. Compared with the common traditional polymer material, the polyamide (BOPA) material has the advantages of good transparency, high glossiness, high mechanical strength, good toughness, strong odor barrier property, strong oil resistance and heat resistance, and the like.
Further, the thickness of the copper foil layer is 4.5-12 μm.
Further, the polyamide layer has a thickness of 15 to 20 μm.
Further, the first adhesive layer is made of transparent acrylic adhesive material, and the thickness of the first adhesive layer is 3-6 mu m.
Further, the first release film layer is made of transparent PET material, and the thickness of the first release film layer is 12-50 mu m.
Further, the second release film layer is made of transparent PET material, and the thickness of the second release film layer is 12-50 mu m.
Further, the second adhesive layer is made of black acrylic adhesive material, and the thickness of the second adhesive layer is 3-9 mu m.
The copper foil tape for the fingerprint module has the following beneficial effects:
1. the utility model relates to a copper foil adhesive tape for a fingerprint module, which comprises an upper adhesive layer, a polyamide layer, a copper foil layer and a lower adhesive layer which are arranged from top to bottom, wherein the upper adhesive layer comprises a first adhesive layer and a first release film layer, the lower surface of the first release film layer is attached to the upper surface of the first adhesive layer, and the lower surface of the first adhesive layer is attached to the upper surface of the polyamide layer; the lower adhesive layer comprises a second adhesive layer and a second release film layer, the upper surface of the second release film layer is attached to the lower surface of the second adhesive layer, and the upper surface of the second adhesive layer is attached to the lower surface of the copper foil layer;
2. the copper foil adhesive tape for the fingerprint module, disclosed by the utility model, has the advantages that the lower surface of the first release film layer is attached to the upper surface of the first adhesive layer, the upper surface of the second release film layer is attached to the lower surface of the second adhesive layer, the first release film layer and the second release film layer can be prevented from being damaged before use, and the copper foil adhesive tape is easy to peel and free from adhesive residue during use.
Drawings
FIG. 1 is a schematic view of a copper foil tape for a fingerprint module according to the present utility model;
FIG. 2 is a schematic view of the structure of the upper bonding layer shown in FIG. 1;
fig. 3 is a schematic view of the structure of the lower adhesive layer shown in fig. 1.
Detailed Description
In order to make the technical solution of the present utility model better understood by those skilled in the art, the following further details of the present utility model will be described with reference to examples and drawings.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present; when an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 to 3, a copper foil tape for a fingerprint module comprises an upper bonding layer 1, a polyamide layer 2, a copper foil layer 3 and a lower bonding layer 4 which are arranged from top to bottom, wherein the upper bonding layer 1 comprises a first adhesive layer 5 and a first release film layer 6, the lower surface of the first release film layer 6 is attached to the upper surface of the first adhesive layer 5, and the lower surface of the first adhesive layer 5 is attached to the upper surface of the polyamide layer 2; the lower adhesive layer 4 comprises a second adhesive layer 7 and a second release film layer 8, wherein the upper surface of the second release film layer 8 is attached to the lower surface of the second adhesive layer 7, and the upper surface of the second adhesive layer 7 is attached to the lower surface of the copper foil layer 3.
In this embodiment, the thickness of the copper foil layer 3 is 4.5-12 μm. Preferably, the thickness of the copper foil layer 3 may be 4.5 μm, 6 μm, 8 μm, 10 μm or 12 μm. More preferably, the thickness of the copper foil layer 3 is 8 μm. The thickness of the copper foil layer 3 in this embodiment cannot be lower than 4.5 μm, and too low can deteriorate the mechanical properties of the adhesive tape, and the thickness cannot be higher than 12 μm, which is beneficial to the better use of the adhesive tape on the fingerprint module.
In this embodiment, the thickness of the polyamide layer 2 is 15-20 μm. Preferably, the thickness of the polyamide layer 2 may be 15 μm, 16 μm, 17 μm, 19 μm or 20 μm. More preferably, the thickness of the polyamide layer 2 is 17 μm. The thickness of the polyamide layer 2 of the present embodiment cannot be less than 15 μm, and if it is less than this size, it is disadvantageous to increase the breaking strength of the adhesive tape.
In this embodiment, the first adhesive layer 5 is made of a transparent acrylic adhesive material, and the thickness of the first adhesive layer 5 is 3-6 μm. Preferably, the thickness of the first adhesive layer 5 may be 3 μm, 4 μm, 5 μm or 6 μm. More preferably, the thickness of the first adhesive layer 5 may be 4 μm.
In this embodiment, the second adhesive layer 7 is made of a black acrylic adhesive material, and the thickness of the second adhesive layer 7 is 3-9 μm. The thickness of the second adhesive layer 7 may be 3 μm, 5 μm, 6 μm, 7 μm or 9 μm. More preferably, the thickness of the second adhesive layer 7 is 6 μm.
The first adhesive layer 5 is made of a transparent acrylic adhesive material, and the second adhesive layer 7 is made of a black acrylic adhesive material, and the acrylic adhesive material has the advantages of water resistance, cold resistance, heat resistance, corrosion resistance and the like. The design of the first adhesive layer 5 and the second adhesive layer 7 increases the oxidation resistance of the adhesive tape, so that the utility model is not easy to generate oxidation phenomenon in the storage process.
In this embodiment, the first release film layer 6 is made of transparent PET material. The release film made of the transparent PET material has the advantages of high transparency, no toxicity, no smell, high tensile strength, easy stripping, difficult adhesive residue, good stiffness, burn-out resistance, difficult breakage, excellent electrical and optical properties, good oxygen and humidity resistance and the like. The thickness of the first release film layer 6 is 12-50 mu m. The thickness of the first release film layer 6 may be 12 μm, 20 μm, 30 μm, 40 μm or 50 μm. More preferably, the thickness of the first release film 67 is 30 μm. The thickness of the first release film layer 6 of this embodiment is controlled to 12 to 50 μm, and if it is below this size, the adhesion is insufficient and the protective effect is poor, and if it exceeds this size, peeling is not easy.
In this embodiment, the second release film layer 8 is made of transparent PET material, and the thickness of the second release film layer 8 is 12-50 μm. The thickness of the second release film layer 8 may be 12 μm, 20 μm, 30 μm, 40 μm or 50 μm. More preferably, the thickness of the second release film layer 8 is 30 μm. The thickness of the second release film layer 8 of this embodiment is controlled to 12 to 50 μm, and if it is below this size, the adhesion is insufficient and the protective effect is poor, and if it exceeds this size, peeling is not easy.
The above description is only of the preferred embodiments of the present utility model, and is not intended to limit the present utility model in any way; those skilled in the art will readily appreciate that the present utility model may be implemented as shown in the drawings and described above; however, those skilled in the art should appreciate that many modifications, adaptations, and variations of the present utility model can be made without departing from the scope of the present utility model as set forth in the above-described aspects; meanwhile, any equivalent changes, modifications and evolution of the above embodiments according to the essential technology of the present utility model still fall within the scope of the present utility model.
Claims (7)
1. A copper foil sticky tape for fingerprint module, its characterized in that: the adhesive comprises an upper adhesive layer, a polyamide layer, a copper foil layer and a lower adhesive layer which are arranged from top to bottom, wherein the upper adhesive layer comprises a first adhesive layer and a first release film layer, the lower surface of the first release film layer is attached to the upper surface of the first adhesive layer, and the lower surface of the first adhesive layer is attached to the upper surface of the polyamide layer;
the lower adhesive layer comprises a second adhesive layer and a second release film layer, wherein the upper surface of the second release film layer is attached to the lower surface of the second adhesive layer, and the upper surface of the second adhesive layer is attached to the lower surface of the copper foil layer.
2. The copper foil tape for fingerprint module according to claim 1, wherein: the thickness of the copper foil layer is 4.5-12 mu m.
3. The copper foil tape for fingerprint module according to claim 2, wherein: the polyamide layer has a thickness of 15-20 μm.
4. The copper foil tape for fingerprint module according to claim 3, wherein: the first adhesive layer is made of transparent acrylic adhesive material, and the thickness of the first adhesive layer is 3-6 mu m.
5. The copper foil tape for fingerprint module according to claim 4, wherein: the first release film layer is made of transparent PET material, and the thickness of the first release film layer is 12-50 mu m.
6. The copper foil tape for fingerprint module according to claim 5, wherein: the second release film layer is made of transparent PET material, and the thickness of the second release film layer is 12-50 mu m.
7. The copper foil tape for fingerprint module according to claim 6, wherein: the second adhesive layer is made of black acrylic adhesive material, and the thickness of the second adhesive layer is 3-9 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320350823.1U CN219194870U (en) | 2023-03-01 | 2023-03-01 | Copper foil adhesive tape for fingerprint module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320350823.1U CN219194870U (en) | 2023-03-01 | 2023-03-01 | Copper foil adhesive tape for fingerprint module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219194870U true CN219194870U (en) | 2023-06-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320350823.1U Active CN219194870U (en) | 2023-03-01 | 2023-03-01 | Copper foil adhesive tape for fingerprint module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219194870U (en) |
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2023
- 2023-03-01 CN CN202320350823.1U patent/CN219194870U/en active Active
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