CN219181889U - Structural member and mobile terminal - Google Patents

Abstract

The embodiment of the application provides a structural member and a mobile terminal, wherein the structural member comprises a structural member body and a planar structural member, and the structural member body is provided with a connecting area; the plane structural member is connected with the connecting area to form an accommodating cavity for accommodating electronic functional devices in the mobile terminal; the plane structure part is provided with at least one of an avoidance part and a connecting part, and at least part of the avoidance part and the connecting part are positioned on the plane. The avoidance portion is configured to avoid the electronic function device, and the connection portion is configured to connect the electronic function device to the planar structural member. The structural part can simplify the processing technology of the structural part, shorten the processing time of the structural part and reduce the processing cost of the structural part.

Description

Structural member and mobile terminal

Technical Field

The application relates to the technical field of electronics, in particular to a structural member and a mobile terminal.

Background

Mobile terminals such as mobile phones, notebook computers, tablet computers and the like are becoming one of the necessities of modern life.

Taking a mobile phone as an example, in order to load a circuit board, a battery, a display screen, and other devices in the mobile terminal, a large-area planar structure is often designed on the middle frame, for example, the planar structure may be a battery compartment for loading the battery or a circuit board compartment for loading the circuit board. In order to realize the specific function of the middle frame at the planar structure, the planar structure often needs to be provided with fine structures such as screw holes, screw bosses, positioning columns, avoiding holes, embedded grooves of the flexible circuit board, and perforations of the flexible circuit board on the surface of the planar structure. The presence of these fine structures can lead to complex design and processing of the middle frame, as well as increased processing costs of the middle frame.

How to reduce the complexity of the processing technology of the structural member of the mobile terminal and the processing cost are the technical problems to be solved.

Disclosure of Invention

The application provides a structure and mobile terminal, can simplify the processing technology of structure, shorten the processing time of structure, reduce the processing cost of structure.

The first aspect of the embodiment of the application provides a structural member, which is applied to a mobile terminal, and comprises a structural member body and a planar structural member, wherein the structural member body is provided with a connecting area; the plane structural member is connected with the connecting area to form an accommodating cavity for accommodating electronic functional devices in the mobile terminal;

the surface of the planar structural member, which is away from the structural member body, is provided with a plane matched with the structure of the electronic functional device, the planar structural member is provided with at least one of an avoidance part and a connecting part, and at least part of the avoidance part and the connecting part are positioned on the plane; the avoidance portion is configured to avoid the electronic function device, and the connection portion is configured to connect the electronic function device to the planar structural member.

According to the embodiment of the application, through the arrangement of the structural member body and the planar structural member in the structural member, the connection area connected with the planar structural member is used for forming the accommodating cavity for accommodating the electronic functional device in the mobile terminal, and due to the arrangement of the avoidance part and the connection part on the plane of the planar structural member, the structural integrity of the structural member and the connection of the structural member and the electronic functional device can be ensured through the connection of the structural member body and the planar structural member. And through the setting of structure body and plane structure, can divide into different structures with the structure for structure body and plane structure can process respectively. Compared with the CNC integrated forming process of the existing structural part (such as a middle frame) adopted in the mobile terminal, the CNC integrated forming process of the structural part can be used for reducing CNC machining procedures of the structural part, simplifying the machining process of the structural part, shortening the machining time, reducing the machining cost of the structural part and reducing waste generated in the machining process of the structural part. Compared with the existing die-casting integrated forming process of the structural part adopted in the mobile terminal, the die-casting die has the advantages that the design of a die-casting die used in die-casting of the structural part can be simplified, the processing difficulty of the die-casting die is reduced, and the processing cost of the structural part is reduced.

In some alternative embodiments, the relief portion forms at least a portion of a cavity wall of the receiving cavity to relieve an electronic functional device received within the receiving cavity. Alternatively, a portion of the peripheral contour of the planar structural member forms at least a portion of the cavity wall of the receiving cavity to form the receiving cavity.

In some alternative embodiments, the planar surface has an area greater than the projected area of the electronic functional device on the planar surface so that the electronic functional device is received within a receiving cavity formed by the planar structural member.

The connecting area is a plane area on the surface of the structural member body, and the area of the connecting area is larger than the projection area of the plane structural member on the structural member body, so that the plane structural member is arranged on the structural member body.

In some alternative embodiments, the planar structural member includes at least one of a first planar structural member and a second planar structural member, the first planar structural member and the second planar structural member having different shapes, and the connection regions of the first planar structural member and the second planar structural member being located at different positions on the same face of the structural member body, respectively.

Through the setting of at least one in first plane structure spare and the second plane structure spare like this, can form different acceptation chamber on the structure spare to when the structure spare holds the different electronic function devices in the mobile terminal, can also simplify the processing technology of structure spare, simplify die casting die's design, reduce die casting die's the processing degree of difficulty and the processing cost of structure spare.

In some optional embodiments, the first planar structural member and the second planar structural member are rigidly connected with the structural member body, so that the first planar structural member or the second planar structural member and the structural member body are respectively processed, the processing technology of the structural member is simplified, the design of a die casting die used in die casting of the structural member is simplified, the processing difficulty of the die casting die and the processing cost of the structural member are reduced, and meanwhile the structural member can be stably connected with the structural member body through the first planar structural member and the second planar structural member, so that the stability of the structural member is enhanced.

In some alternative embodiments, the first planar structural member and the structural member body together define a first receiving cavity; the second plane structural member is internally provided with a second accommodating cavity;

the housing cavity includes at least one of a first housing cavity and a second housing cavity configured to house different electronic functional devices.

Through the arrangement of the first accommodating cavity and the second accommodating cavity, accommodating of different electronic functional devices by the structural member can be realized.

In some alternative embodiments, the electronic functional device includes a circuit board, the first receiving cavity is configured to receive the circuit board, and the first planar structural member is electrically connected to the structural member body.

Thus, the assembly of the circuit board in the structural member can be realized through the arrangement of the first accommodating cavity. And because the first plane structural member is electrically connected with the structural member body, on one hand, the grounding of the circuit board on the structural member can be realized, and on the other hand, the design requirement of the radio frequency function of the mobile terminal on the structural member can be met, so that the radio frequency function of the mobile terminal can be realized.

In some alternative embodiments, the first planar structural member includes a first body that is a planar plate-like structure having a plane extending parallel to the connection region, the first body being conductively connected to the structural member body.

Thus, by the arrangement of the first body, a plane structure with a larger area can be formed on the structural member so as to bear the circuit board.

In some alternative embodiments, the density of the first body is less than the density of the structural member body, so that the weight of the structural member can be reduced while the circuit board is being carried.

In some alternative embodiments, the first body is a fiber composite board or a woven polymer board.

Thus, the fiber composite board and the organic polymer board are arranged so as to achieve the aim of reducing the weight of the structural member. And through the arrangement of the organic polymer board, the first body can also have the characteristic of a larger modification space so as to enable the first plane structural member to have a specific function through modification.

In some alternative embodiments, the first planar structural member further comprises a conductive coating applied to the surface of the fiber composite panel and in conductive communication with the structural member body.

On the basis of achieving the aim of reducing the weight of the structural member, the fiber composite board can be modified through the arrangement of the conductive coating, so that the conductive function of the first plane structural member is achieved under the condition that auxiliary materials are not added, and the aim of further thinning the structural member is achieved.

In some alternative embodiments, the conductive coating is a metal coating, so that the conductivity of the metal coating is used to achieve the conductive function of the conductive coating.

In some alternative embodiments, the surface of the first planar structural member has a relief portion and a connecting portion;

the avoiding part is arranged opposite to the functional module on the circuit board and is configured to avoid the functional module on the circuit board; the connection portion is configured to connect the first planar structural member with the circuit board.

Through the setting of dodging the portion like this for first plane structure can dodge the functional module on the circuit board of bearing. In addition, the electronic function device can be conveniently connected with the first plane structural member through the arrangement of the connecting part.

In some alternative embodiments, the relief is a relief hole and the connection is at least one of a first connection hole and a connection boss.

The avoidance of the functional module on the bearing circuit board can be realized through the arrangement of the avoidance holes, and the connection between the first planar structural member and the circuit board is realized through the arrangement of the first connecting holes and the connecting bosses.

In some alternative embodiments, the structural member further comprises a conductive adhesive layer, wherein the conductive adhesive layer is connected between the first planar structural member and the structural member body, so that the stability of the connection between the first planar structural member and the structural member body can be further enhanced while the conductive connection between the first planar structural member and the structural member body is realized.

In some alternative embodiments, the structural member further comprises a first adhesive layer, the first adhesive layer and the conductive adhesive layer being located at different positions between the first planar structural member and the structural member body to connect the first planar structural member and the structural member body.

Through the setting of first adhesive linkage like this to realize the stable connection of first plane structure and structure body, strengthen the reliability of the electrically conductive connection of first plane structure and structure body.

In some alternative embodiments, the electronic functional device comprises a battery, and the second receiving cavity is configured to receive the battery so as to enable assembly of the battery within the structural member.

In some alternative embodiments, the second planar structural member comprises a second body having a planar portion and a partition portion, the surface of the planar portion having a plane, and the direction of extension of the planar portion being parallel to the connection region;

the partition part is arranged on the peripheral edge of one side, away from the structural member body, of the planar part in a surrounding mode, and forms a second planar structural member together with the planar part.

By providing the planar portion in this way, a planar structure of a larger area can be formed on the second planar structural member so as to carry the battery. Further, by providing the partition portion, the second planar structural member having the second accommodation chamber can be formed with the planar portion.

In some alternative embodiments, the second body has a density less than that of the structural member body so as to provide weight reduction of the structural member while carrying the circuit board.

In some alternative embodiments, the second body is a fiber woven body or an organic polymer board, and the fiber woven body and the organic polymer board are three-dimensional structures with a plane part and a partition part, so that the aim of reducing the weight of the structural member is achieved, and meanwhile, the preparation material (such as an organic polymer) of the second body can have the characteristic of larger modification space through the arrangement of the organic polymer board, so that the second planar structural member is prepared by modifying the preparation material of the second body, and the second planar structural member has a specific function.

In some alternative embodiments, the second planar structural member further comprises a thermally conductive filler that is filled within the fiber braid and forms an integral structure with the fiber braid.

On the basis of achieving the aim of reducing the weight of the structural member, the fiber composite board can be modified through the arrangement of the heat conduction filling part, so that the heat conduction function of the second planar structural member is achieved under the condition that auxiliary materials are not added, and the aim of reducing the structural member is achieved.

In some alternative embodiments, the structural member body has a void region in the connection region, and the second body is located in the void region and bonded to the structural member body.

Through the setting of clearance area like this, not only be convenient for the connection of second plane structure and structure body but also can further realize the attenuate of structure and subtract heavy.

In some alternative embodiments, the structural member body has a first overlap at the edge of the void region and a second overlap at the corner of the second body, the second overlap being attached to and bonded with the first overlap.

Thus, when the structural member is further thinned and weight is reduced, the second body and the structural member body can be connected through the arrangement of the first lap joint part and the second lap joint part, so that the structural integrity of the structural member is ensured.

In some alternative embodiments, the surface of the planar portion has a relief portion configured to receive a flexible circuit board in the mobile terminal to relieve a battery received in the second receiving cavity.

Through the arrangement of the avoiding part, the flexible circuit board can be conveniently embedded in the second plane structural part while the containing of the battery in the second containing cavity is not influenced.

In some alternative embodiments, the avoidance portion includes a through hole and at least one avoidance groove, where the through hole is located laterally of one of the avoidance grooves and communicates with the avoidance groove, so that an end of the flexible circuit board passes through the planar portion.

Through the setting of dodging the groove like this, can be convenient for flexible circuit board inlay and establish in the second plane structure to through the setting of wearing to establish the hole, can also be convenient for inlay the flexible circuit board of establishing in the second plane structure and pass plane portion, in order to realize the connected function of flexible circuit board in mobile terminal.

A second aspect of the embodiments provides a mobile terminal comprising a housing assembly comprising the structural member of any one of the above.

According to the method, through the arrangement of the structural part in the mobile terminal, the CNC machining procedure of the structural part can be reduced, the machining process of the structural part is simplified, the machining time is shortened, the machining cost is reduced, the waste generated by machining is reduced, and the design and machining difficulty of a die used in die casting of the structural part can be simplified, so that the machining cost is reduced.

Drawings

Fig. 1 is a schematic structural diagram of a mobile terminal according to an embodiment of the present application;

fig. 2 is a split schematic diagram of a mobile terminal according to an embodiment of the present application;

fig. 3 is a schematic view showing a structure of a middle frame equipped with electronic functional devices in a battery compartment in the related art;

FIG. 4 is a cross-sectional view taken along the direction A-A of FIG. 3;

fig. 5 is a schematic structural view of a middle frame assembled with electronic functional devices in a main board warehouse in the related art;

FIG. 6 is an internal schematic view of FIG. 5 at B1;

FIG. 7 is a schematic diagram of the structure of FIG. 5 at B2;

FIG. 8 is a schematic diagram of the structure of FIG. 5 at B3;

FIG. 9 is a schematic diagram of the assembly of a functional module on a circuit board at B4 of FIG. 5;

FIG. 10 is an assembly schematic of a functional module on a circuit board at B5 of FIG. 5;

FIG. 11 is a schematic diagram of the circuit board at B6 in FIG. 5;

fig. 12 is a schematic view of a connection process of an internal structure in a structural member according to an embodiment of the present application;

fig. 13 is a schematic structural view of a structural member according to an embodiment of the present disclosure;

FIG. 14 is a schematic view of another structural member according to an embodiment of the present disclosure;

FIG. 15 is a schematic view of the connection of the first planar structural member to the structural member body at C1 of FIG. 13;

FIG. 16 is a schematic view of the connection of the first planar structural member to the structural member body at C2 of FIG. 13;

FIG. 17 is a schematic view of the connection of the first planar structural member to the structural member body at C3 of FIG. 13;

FIG. 18 is a schematic view of an electronic functional device provided in an embodiment of the present application assembled onto the structural member of FIG. 14;

fig. 19 is a schematic connection diagram of the second planar structure and the structural member body according to the embodiment of the present application;

FIG. 20 is a schematic illustration of a process for making the structural member of FIG. 13 provided in an embodiment of the present application;

FIG. 21 is a schematic illustration of the fabrication process of the structural body of FIG. 20;

FIG. 22 is a schematic illustration of a process for making the first planar structural member of FIG. 20;

FIG. 23 is a schematic illustration of a process for making the structural member of FIG. 14 provided in an embodiment of the present application;

fig. 24 is a schematic view of a process for making the second planar structure of fig. 23.

Reference numerals illustrate:

100-mobile terminals; 1-an electronic functional device; 11-a display screen; 12-a first circuit board; 121-a camera module; 122-an electronic device; 13-a second circuit board; 14-a battery;

2-a middle frame; 21-a middle plate; 22-frame; 23-a battery compartment; 231-a battery compartment body; 232-partition strips; 233-a first embedded groove; 234-a second embedded groove; 235-perforating; 24-a main board bin; 241-screw boss; 242-screw holes; 243-positioning columns; 244-ground; 2441-a conductive layer; 245-an empty-keeping structure; 25-copper foil; 3-a rear cover;

4-structural members; 41-a structural member body; 411-linking region; 412-top; 413-a bottom end; 414-an empty region; 415-a first overlap; 42-a planar structural member; 421-avoidance; 4211-avoidance holes; 4212-perforating holes; 4213-avoiding grooves; 422-connection; 4221-first connection holes;

423-a first planar structural member; 4231-a first body; 4232-conductive plating; 4233-a second connection hole; 424-a second planar structural member; 4241-a planar portion; 4242-a partition; 4243-a second lap portion; 43-a first receiving cavity; 44-a second receiving cavity; 45-a conductive adhesive layer; 46-a first adhesive layer; 47-a second adhesive layer; 5-shrapnel; 6-a flexible circuit board; 7-back glue; 8-fasteners.

Detailed Description

The terminology used in the description section of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the present application.

The embodiment of the application provides a mobile terminal, which may include, but is not limited to, a mobile terminal having a housing inside, such as a mobile phone, a tablet computer (i.e., pad), a notebook computer, an intelligent wearable device, etc., and a planar structure with a larger area on the housing. The smart wearable device may include, but is not limited to being, a watch, a bracelet, AR (Augmented Reality) glasses, or Virtual Reality (VR) glasses.

The structure of the mobile terminal according to the embodiment of the present application will be further described below by taking a mobile phone as an example.

Fig. 1 illustrates a schematic structure of a mobile terminal 100, and fig. 2 illustrates a split schematic of the mobile terminal 100. Referring to fig. 1 and 2, a mobile terminal 100 provided in an embodiment of the present application may include a middle frame 2 and a rear cover 3, wherein the rear cover 3 is connected to one side of the middle frame 2 and forms a housing assembly of the mobile terminal 100 with the middle frame 2, and provides a structural frame for the mobile terminal 100.

Referring to fig. 2, the middle frame 2 generally includes a middle plate 21 and a side frame 22 connected to each other, and the side frame 22 generally has a square ring structure formed by connecting a plurality of side frames 22 end to end. The rim 22 is provided around the peripheral edge of the middle plate 21, and forms the middle frame 2 together with the middle plate 21.

It should be noted that the structure of the middle frame 2 in fig. 2 is merely a schematic illustration of the structure of the outline of the middle frame that is conventional in the related art, so as to facilitate understanding of the structure of the mobile terminal 100.

Referring to fig. 2, in some embodiments, when the mobile terminal 100 has a display function, the mobile terminal 100 further includes a display 11, and the display 11 is received on a side of the middle frame 2 opposite to the rear cover 3. The side of the display 11 forms the front of the mobile terminal 100, and the side of the rear cover 3 forms the back of the mobile terminal 100.

With continued reference to fig. 2, the mobile terminal 100 may further include circuit boards, and in some embodiments, the number of circuit boards may be two, and for convenience of description, two circuit boards are defined as a first circuit board 12 and a second circuit board 13, and the first circuit board 12 and the second circuit board 13 may be accommodated in the middle frame 2.

The first circuit board 12 may also be referred to as a motherboard of the mobile terminal 100. The first circuit board 12 may carry electronic devices such as a system on a chip (SoC), an antenna module, a bluetooth module, a wireless communication module (such as a WIFI module), a positioning module, a Radio Frequency (RF) chip, a radio frequency power amplifier (radio frequency poZer amplifier, RFPA), a memory module (such as a Double Data Rate (DDR) memory), a power management module, a charging module, and a screen display and operation module.

The display screen 11 is electrically connected with a screen display and operation module on the first circuit board 12, so that the display screen 11 can realize display or operation functions. The second circuit board 13 may also be referred to as a tablet of the mobile terminal 100. The second circuit board 13 may carry functional modules such as a speaker, a microphone, a headphone, etc., and the second circuit board 13 is typically electrically connected through a flexible circuit board within the mobile terminal 100.

As shown in fig. 2, the mobile terminal 100 may further include a battery 14, and the battery 14 may be accommodated in the middle frame 2 and disposed on a side of the middle frame 2 facing the rear cover 3 together with the first circuit board 12 and the second circuit board 13. The battery 14 may be electrically connected to a power management module on the first circuit board 12 through a charging module. The first circuit board 12, the second circuit board 13, the battery 14 and the display 11 together constitute the electronic function device 1 of the mobile terminal 100.

In some embodiments, when the mobile terminal 100 has a photographing function, the mobile terminal 100 may further include a camera module 121. The image capturing module 121 may include, but is not limited to, a variable focal length module such as an Auto Focus (AF) module, a Fix Focus (FF) module, a wide angle image capturing module 121, a telephoto image capturing module, a color image capturing module 121, or a black-and-white image capturing module 121. Depending on the setting positions of the camera module 121 on the mobile terminal 100, the camera module 121 is generally divided into a front camera module and a rear camera module, where the front camera module is generally located on a side of the first circuit board 12 facing the display screen 11, and the rear camera module is generally located on a side of the first circuit board 12 facing the rear cover 3.

When the camera module 121 is located on the first circuit board 12, the camera module 121 and the electronic device 122 carried on the first circuit board 12 may be collectively referred to as a functional module on the first circuit board 12.

In order to carry the electronic functional devices 1 such as the circuit board, the battery 14, and the display 11 in the mobile terminal 100, a planar structure with a large area is often designed on the middle frame 2. These planar structures are generally located on the middle plate 21 of the middle frame 2, so that when the frame 22 is disposed around the peripheral edge of the middle plate 21, cavities can be formed on opposite sides of the middle plate 21 with respect to the middle plate 2, so as to facilitate the accommodation of the electronic functional devices 1 such as the circuit board, the battery 14, and the display 11 in the middle frame 2.

The cavity on the middle frame 2 for accommodating the first circuit board 12 may be referred to as a motherboard bin, the cavity on the middle frame 2 for accommodating the second circuit board 13 may be referred to as a small board bin, the cavity on the middle frame 2 for accommodating the battery 14 may be referred to as a battery bin, and the cavity on the middle frame 2 for accommodating the display screen 11 may be referred to as a display screen bin.

In order to realize specific functions, the large-area planar structure of the middle frame 2 often needs to be provided with screw holes, positioning posts, perforations for the flexible circuit board to pass through, and the like on the surface of the planar structure. In addition, auxiliary materials such as copper foil, foam and heat-conducting graphite sheet are required to be attached to the surface of the planar structure of the middle frame 2. This complicates the structural design and the processing of the intermediate frame 2.

When the mobile terminal 100 is a tablet computer, a notebook computer, an intelligent wearable device, etc., a base bottom shell of the tablet computer, a base bottom shell of the notebook computer, a middle frame 2 in a watch or a bracelet, a shell of AR glasses or VR glasses, etc., a large-area planar structure is required to be set, so as to facilitate carrying and accommodating of the electronic functional device 1 (such as the circuit board, the battery 14 or the display screen 11) in the mobile terminal 100.

It should be noted that the middle frame 2 of the mobile phone, the base bottom case of the tablet computer, the base bottom case of the notebook computer, the middle frame 2 of the watch or the bracelet, and the case of the AR glasses or the VR glasses may be referred to as structural members of the case assembly in the mobile terminal 100.

The following describes the structural components of the mobile terminal 100 in the related art, taking the middle frame 2 as an example.

Fig. 3 illustrates a schematic structure of the middle frame 2 assembled with the first circuit board 12 and the second circuit board 13 in the battery compartment 23 in the related art, and fig. 4 illustrates a cross-sectional view of fig. 3 in A-A direction to facilitate understanding of the structure of the middle frame 2 in the battery compartment 23.

Referring to fig. 3 and 4, currently, the battery compartment 23 in the middle frame 2 generally includes a battery compartment main body 231 and a partition strip 232, where the battery compartment main body 231 is a part of the middle plate 21, and the partition strip 232 is disposed on the battery compartment main body 231 and encloses the battery compartment 23 with the battery compartment main body 231.

As shown in fig. 4, the battery 14 is accommodated in the battery compartment 23 and adhered to the middle plate 21 by the adhesive backing 7. Since the first circuit board 12 and the second circuit board 13 are generally located at opposite sides of the battery 14, in order to facilitate connection of the first circuit board 12 and the second circuit board 13, the middle board 21 is provided with a first embedded groove 233 on a portion of the battery compartment body 231, the first embedded groove 233 is located between the first circuit board 12 and the second circuit board 13 in the battery compartment 23, and one flexible circuit board 6 in the mobile terminal 100 may be embedded in the first embedded groove 233 to electrically connect the first circuit board 12 and the second circuit board 13, thereby achieving conduction of the first circuit board 12 and the second circuit board 13.

Referring to fig. 3 and 4, since the display 11 is located at a side of the middle frame 2 facing away from the battery 14, in order to facilitate the first circuit board 12 to be electrically connected with the display 11, the middle plate 21 is provided with a second insertion groove 234 and a through hole 235 on the battery compartment body 231, the second insertion groove 234 is located at a side of the battery compartment 23 facing the first circuit board 12, and an end of the second insertion groove 234 extends to a middle of the battery compartment body 231 toward the second circuit board 13. The through hole 235 is located at an end of the second embedded groove 234 and is in communication with the second embedded groove 234, so that when another flexible circuit board 6 in the mobile terminal 100 is embedded in the second embedded groove 234, the through hole 235 can be penetrated to electrically connect the first circuit board 12 and the display screen 11, thereby realizing the conduction between the first circuit board 12 and the display screen 11.

In general, the battery compartment 23 of the middle frame 2 and the rest of the middle frame 2 are made of the same material, for example, the battery compartment 23 of the middle frame 2 may be made of a metal material such as a profile aluminum alloy, stainless steel, a die-cast aluminum alloy, or a die-cast magnesium alloy.

Fig. 5 is a schematic view showing the structure of the middle frame 2 equipped with the second circuit board 13 in the main board magazine 24 in the related art.

Referring to fig. 5, currently, the main board bin 24 in the middle frame 2 is generally required to carry the first circuit board 12, and some functional modules (such as a front camera module and a rear camera module) on the first circuit board 12. On this basis, the main board cabin 24 also has the functions of heat dissipation, electrical connection and the like, so that the middle board 21 is generally designed with complex structures such as screw bosses 241, screw holes 242, positioning columns 243, grounding positions 244, a clearance structure 245 and the like in the main board cabin 24.

Fig. 6 to 8 respectively illustrate the schematic structural views of fig. 5 at different positions to facilitate understanding of the structure of the main board bin 24. Referring to fig. 6, the screw holes 242 are formed in the planar structure of the middle board 21 in the main board compartment 24, and fasteners (not shown) may be inserted through the screw holes 242 to detachably connect the first circuit board 12 to the middle board 21 when the first circuit board 12 is accommodated in the main board compartment 24.

Referring to fig. 7, the positioning posts 243 are located on the planar structure of the middle board 21 in the motherboard compartment 24, so that the first circuit board 12 can be received in the motherboard compartment 24, and the positioning posts 243 can be disposed on the first circuit board 12 in a penetrating manner, so as to pre-fix the position of the first circuit board 12 in the motherboard compartment 24.

Referring to fig. 8, the screw boss 241 is positioned on the planar structure of the middle board 21 in the main board housing 24 so that a fastener (not shown) may be inserted into the fitting hole in the screw boss 241 when the first circuit board 12 is accommodated in the main board housing 24, so that the first circuit board 12 is detachably connected to the middle board 21 by the fastener.

Fig. 9 and 10 show the assembly of different functional modules on the circuit board at different positions in fig. 5, respectively. Referring to fig. 9 and 10, the void-avoiding structure 245 is generally used to avoid the camera module 121 or the electronic device 122 on the first circuit board 12, and the void-avoiding structure 245 may be a through hole located on the planar structure of the middle board 21 in the main board cabin 24. Thus, when the first circuit board 12 is accommodated in the main board bin 24, at least part of the structures of the camera module 121 or the electronic device 122 and the like can be embedded in the clearance structure 245, so as to reduce the thickness of the mobile terminal 100 at the camera module 121, the chip and the like, which is beneficial to realizing the light and thin of the mobile terminal 100.

To achieve the heat dissipation performance of the electronic device 122, the motherboard compartment 24 needs to have a heat dissipation function. Specifically, as shown in fig. 9, the middle board 21 may be attached with a copper foil 25 facing to one side of the display screen 11, where the copper foil 25 is opposite to the void structure 245 of the electronic device 122 in the main board compartment 24, so that the electronic device 122 is attached to the copper foil 25 through a heat-conducting gel, so as to achieve the heat dissipation performance of the electronic device 122 through the main board compartment 24 of the middle frame 2.

It should be noted that, in the related art, a liquid cooling (VC) heat pipe or other heat dissipation module may be used to replace the copper foil 25 and be attached to the middle board 21, so as to implement the heat dissipation function of the electronic device 122 on the first circuit board 12 in the main board bin 24 through the middle frame 2.

Fig. 11 illustrates a schematic ground of the circuit board at B6 of fig. 5.

To achieve grounding of the first circuit board 12, the motherboard compartment 24 also needs to be electrically connected. Specifically, as shown in fig. 11, the middle plate 21 is provided with a plurality of grounding portions 244 in the main board housing 24, and the grounding portions 244 include a conductive layer 2441 provided on the surface of the main board housing 24. At present, the conductive layer 2441 is generally a copper layer formed by metal copper foil, so that when the first circuit board 12 is accommodated in the motherboard compartment 24, the first circuit board 12 can be grounded in the motherboard compartment 24 by abutting the elastic sheet 5 on the copper layer.

The main board bin 24 of the middle frame 2 and the rest of the middle frame 2 are made of the same material as the battery bin 23. For example, the battery compartment 23 of the middle frame 2 may be made of a metal material such as a profile aluminum alloy, stainless steel, a die-cast aluminum alloy, and a die-cast magnesium alloy.

Currently, the middle frame 2 is formed by machining, integral molding, or integral die casting. Among them, machining is generally performed by a numerical control machine (CNC), and machining integrated molding may also be referred to as CNC integrated molding.

The isolating bar 232, the first embedding groove 233, the second embedding groove 234 and the opening, and the screw boss 241, the screw hole 242, the positioning column 243, the grounding position 244, the clearance structure 245, and the like in the main board bin 24 in the battery compartment 23 are local fine structures on the middle frame 2, and the fine structures on the middle frame 2 are various and numerous in number.

Because of these fine structures, if the molding process of the middle frame 2 adopts CNC integrated molding, the process of CNC processing of the middle frame 2 is complicated and the processing time is long, which increases the processing cost of the middle frame 2.

If the molding process of the middle frame 2 adopts integrated die-casting molding, the fine structures on the battery compartment 23 and the main board compartment 24 are required to be processed on the die-casting mold, so that the design difficulty and the processing cost of the die-casting mold are increased, and due to the existence of the fine structures, the higher requirements are put on the fluidity of the die-casting raw material used in the integrated die-casting molding, the optional range of the die-casting raw material is limited, and the processing cost is increased.

In addition, the fine structure of the middle frame 2, such as the screw holes 242 of the main board housing 24, cannot be formed by one-time die casting, and requires a secondary CNC machining, which further increases the complexity of the existing machining scheme of the middle frame 2.

Therefore, how to reduce the complexity of the processing process of the structural member 4 of the mobile terminal 100 and reduce the processing cost have become a technical problem to be solved.

Fig. 12 is a schematic diagram illustrating a connection process of the internal structure in the structural member 4 according to the embodiment of the present application.

In view of this, referring to fig. 12, the present application provides a structural member 4 applied to a mobile terminal 100, by improving the structure of the structural member 4, dividing the structural member 4 into a structural member body 41 and a planar structural member 42, so that after the structural member body 41 and the planar structural member 42 are respectively processed, they are connected through a connection process to form the structural member 4, so that the structural member 4 replaces the existing structural member (such as a middle frame 2, etc.) adopted in the housing assembly of the mobile terminal 100, thus being capable of simplifying the processing process of the structural member 4, shortening the processing time of the structural member 4, and reducing the processing cost of the structural member 4.

The structure of the structural member 4 of the present application will be further elucidated with reference to the drawings and embodiments.

Fig. 13 shows a schematic structural view of a structural part 4 according to the present application.

Referring to fig. 13 in combination with fig. 12, the structural member 4 includes a structural member body 41 and a planar structural member 42, with the structural member body 41 having a connection region 411 thereon. The planar structural member 42 is connected to the connection region 411 to form a housing cavity for accommodating the electronic functional device 1 in the mobile terminal 100, so as to facilitate housing of the electronic functional device 1 in the mobile terminal 100 in the housing cavity. By way of example, the electronic functional device 1 may include, but is not limited to, a first circuit board 12, a second circuit board 13, and a battery 14 in the mobile terminal 100. In the present application, the electronic function device 1 accommodated in the accommodating chamber of the structural member 4 is not further limited.

Referring to fig. 13, the surface of the planar structural member 42 facing away from the structural member body 41 has a planar surface adapted to the structure of the electronic function device 1, and the planar structural member 42 has at least one of a relief portion 421 and a connection portion 422. At least part of the relief portion 421 and the connection portion 422 are located on a plane. Wherein the relief portion 421 is configured to relieve the electronic function device 1, and the connection portion 422 is configured to connect the electronic function device 1 to the planar structural member 42.

This allows the structural body 41 and the planar structural member 42 to form a complete structural member 4 by joining the structural body 41 and the planar structural member 42, ensuring the structural integrity of the structural member 4. At the same time, due to the planar surface of the planar structural member 42 and the arrangement of the relief portion 421 and the connection portion 422 on the planar surface, some specific functions of the planar structural member 42 can be realized. For example, the connection of the planar structural member 42 to at least one of the structural member 4 and the electronic functional device 1 can be facilitated by the provision of the connection portion 422 on the planar structural member 42. For example, by the arrangement of the avoidance portion 421 on the planar structural member 42, when the electronic functional device 1 is accommodated in the accommodating cavity, the electronic functional device 1 can be avoided by the avoidance portion 421, so that the assembly height of the electronic functional device 1 in the structural member 4 can be hidden by the thickness of the planar structural member 42 while the electronic functional device 1 is accommodated in the structural member 4, and the thickness of the mobile terminal 100 can be reduced.

At the same time, by providing the structural member body 41 and the planar structural member 42, the structural member 4 can be divided into different structures, so that the structural member body 41 and the planar structural member 42 can be processed separately. Compared with the CNC integrated molding process of the conventional structural member 4 (such as the middle frame 2) adopted in the mobile terminal 100, the CNC processing procedure of the structural member 4 is reduced due to the separate processing of the structural member body 41 and the planar structural member 42, the processing process of the structural member 4 is simplified, the processing time is shortened, the processing cost is reduced, and meanwhile, the thicknesses of raw materials required by the structural member body 41 and the planar structural member 42 are reduced, so that waste generated in the processing process of the structural member 4 can be reduced.

Because the required mould in the time of the injection molding of planar structure 42 can design alone, compare in mobile terminal 100 and adopt the die casting integrated into one piece technology of current center 2 like this, can also simplify the design of the die casting mould that uses in the die casting process such as structural component 4 die casting mould, reduce the processing degree of difficulty of die casting mould to reduce processing cost.

In some embodiments, the structural member 4 replaces the center of the cell phone when the structural member 4 is applied to the cell phone. The structural member body 41 may be regarded as a middle frame body, and the structure of the middle frame body is adapted to the structure of the middle frame 2. That is, the middle frame body also includes a middle plate 21 and a rim 22, and the rim 22 is provided around the peripheral edge of the middle plate 21. The planar structural member 42 may be regarded as a planar structure on the middle frame 2, and may be connected to the structural member body 41 to form a receiving cavity for receiving the first circuit board 12, the second circuit board 13, or the battery 14.

In some embodiments, the structural member 4 may also be applied to a tablet computer. At this time, the structural member 4 may replace the base bottom case or the middle frame 2 of the tablet pc to accommodate and carry the circuit board or the battery 14 in the tablet pc.

In some embodiments, the structure 4 may also be applied to a notebook computer. At this time, the structural member 4 may replace the base bottom case of the notebook computer or the housing carrying the screen 11 of the screen side of the notebook computer.

Alternatively, in some embodiments, the structural member 4 may also be applied to a wearable device. For example, the structural member 4 may replace the middle frame 2 in a wristwatch or bracelet to carry one or some electronic functions 1 in the wristwatch or bracelet. For example, the structure 4 may also replace an existing housing employed by AR or VR glasses to carry one or some of the electronic functions 1 in the AR or VR glasses.

The structure of the structural member 4 of the present application will be further described below by taking the middle frame 2 of the mobile phone as an example.

The planar structural member 42 may be manufactured by a single manufacturing process or a combination of manufacturing processes. By way of example, the processing of the planar structural member 42 may include, but is not limited to, CNC processing, stamping, three-dimensional (3D) printing, hot bending, sintering, injection molding, compression molding, transfer molding, sheet molding process (SMC molding process for short), hand lay-up molding.

The structural member body 41 may be manufactured by a single manufacturing process or by a combination of manufacturing processes. The machining process of the structural member body 41 may include, but is not limited to, CNC machining, die casting, stamping, 3D printing, hot bending, sintering, injection molding, compression molding, transfer molding, SMC molding process, hand lay-up molding.

The avoidance portion 421 forms at least part of the cavity wall of the accommodating cavity, so as to avoid the electronic functional device accommodated in the accommodating cavity. Part of the peripheral contour of the planar structural member 42 forms at least part of the cavity wall of the receiving cavity to form the receiving cavity.

The area of the plane on the plane structural member 42 is larger than the projection area of the electronic functional device 1 on the plane, so that the electronic functional device 1 can be completely accommodated in the accommodating cavity formed by the plane structural member 42, and the bearing of the plane structural member 42 to the electronic functional device 1 and the accommodating of the electronic functional device 1 in the accommodating cavity are realized.

Referring to fig. 12, the connection area 411 is a planar area on the surface of the structural member body 41, so that the planar structural member 42 has a better fitting effect in the connection area 411, so that the planar structural member 42 is better connected with the structural member body 41. Wherein the connection region 411 is arranged opposite the planar structural member 42 in order to achieve a connection of the planar structural member 42 to the structural member body 41.

The area of the connection area 411 is larger than the projection area of the planar structural member 42 on the structural member body 41, so that the planar structural member 42 can have a larger connection area on the structural member body 41 while the planar structural member 42 is not affected on the structural member body 41, so as to ensure the connection effect of the planar structural member 42 and the structural member body 41, simplify the processing technology of the structural member 4, simplify the design of the die casting mold, reduce the processing difficulty of the die casting mold and the processing cost of the structural member 4, and enhance the stability of the structure of the structural member 4.

The structure of the planar structural member 42 is different according to the electronic functional device 1 accommodated in the accommodating cavity, and accordingly, the position of the connection region 411 on the structural member body 41 is also different. In this application, the location of the connection region 411 on the structural member body 41 and the specific structure of the planar structural member 42 are not further limited.

Fig. 14 shows a schematic view of another construction of a structural element 4.

Referring to fig. 13 and 14, the planar structural member 42 may include at least one of a first planar structural member 423 and a second planar structural member 424. The first planar structural member 423 and the second planar structural member 424 have different shapes, and the connection areas 411 corresponding to the first planar structural member 423 and the second planar structural member 424 are respectively located at different positions on the same surface of the structural member body 41, so that different accommodating cavities are formed on the structural member 4 through the first planar structural member 423 and the second planar structural member 424, so that the structural member 4 accommodates different electronic functional devices 1 in the mobile terminal 100, the design requirement of the structural member 4 (such as a middle frame 2 of a mobile phone) on structures required in the different accommodating cavities is met, the processing technology of the structural member 4 can be simplified, the design of a die casting die is simplified, and the processing difficulty of the die casting die and the processing cost of the structural member 4 are reduced.

Referring to fig. 13, in some embodiments, the planar structural member 42 may include only the first planar structural member 423, where the first planar structural member 423 is connected to the structural member body 41 to form a complete structural member 4 (such as the middle frame 2 of the mobile terminal 100).

Alternatively, referring to fig. 14, in some embodiments, the planar structural member 42 may include only the second planar structural member 424, with the second planar structural member 424 being joined to the structural member body 41 to form a complete structural member 4.

Alternatively, in some embodiments, under the condition that the structural strength of the structural member 4 is ensured to meet the design requirement of the mobile terminal 100, the planar structural member 42 may further include a first planar structural member 423 and a second planar structural member 424, where the first planar structural member 423 and the second planar structural member 424 are disposed at different positions of the structural member body 41 and are connected with the structural member body 41 to form a complete structural member 4, so as to further simplify the processing technology of the structural member 4, simplify the design of the die-casting mold, and reduce the processing difficulty of the die-casting mold and the processing cost of the structural member 4.

Referring to fig. 13 and 14, the first planar structural member 423 and the second planar structural member 424 are rigidly connected to the structural member body 41, so that the first planar structural member 423 or the second planar structural member 424 and the structural member body 41 are respectively processed, the processing technology of the structural member 4 is simplified, the design of a die casting die used in die casting of the structural member 4 is simplified, the processing difficulty of the die casting die and the processing difficulty of the structural member 4 are reduced, the processing cost is reduced, and meanwhile, the first planar structural member 423 and the second planar structural member 424 can be stably connected with the structural member body 41, so that the stability of the structural member 4 is enhanced.

The rigid connection may include, but is not limited to, welding, bonding, screw locking, riveting, hot melt connection, interference fit, mechanical snap-lock, and the like. The mechanical latch may include, but is not limited to, a mechanical snap-fit.

It should be noted that, when the first planar structural member 423 or the second planar structural member 424 is rigidly connected to the structural member body 41, one or more of the above-mentioned rigid connection methods may be used to assemble and connect the first planar structural member 423 or the second planar structural member 424 to the structural member body 41, thereby forming a complete structural member 4.

Alternatively, in some embodiments, the first planar structural member 423 and the second planar structural member 424 may also be connected to the structural member body 41 in a non-rigid manner, so as to satisfy the application scenario of the relative motion of the first planar structural member 423 or the second planar structural member 424 with respect to the structural member body 41 in the design of the mobile terminal 100.

The structure of the structural member 4 of the present application will be further described below by taking the rigid connection of the planar structural member 42 to the structural member body 41 as an example.

With continued reference to fig. 13 and 14, the first planar structural member 423 may define, with the structural member body 41, a first receiving cavity 43, and the second planar structural member 424 has a second receiving cavity 44 therein. The receiving cavity in the structural member 4 may include at least one of a first receiving cavity 43 and a second receiving cavity 44, where the first receiving cavity 43 and the second receiving cavity 44 are configured to receive different electronic functional devices, so as to implement the receiving of the structural member 4 for the different electronic functional devices, and further implement the assembling of the different electronic functional devices in the mobile terminal 100.

Referring to fig. 13, the electronic functional device 1 includes a circuit board, the first receiving cavity 43 is configured to receive the circuit board, and the first planar structural member 423 is electrically connected to the structural member body 41. The first receiving cavity 43 may be used as a circuit board compartment in the structural member 4. As shown in fig. 13, when the first planar structural member 423 is located on one side of the top end 412 of the structural member body 41, the first accommodating cavity 43 may be used as a motherboard compartment in the structural member 4 for accommodating the first circuit board 12 of the mobile terminal 100. Alternatively, in some embodiments, the first planar structural member 423 may be further located at a side of the bottom end 413 of the structural member body 41, where the first receiving cavity 43 may be used as a small board compartment in the structural member 4 for receiving the second circuit board 13 of the mobile terminal 100. The assembly of the circuit board (for example, the first circuit board 12 or the second circuit board 13) in the component 4 is thus achieved by the first receiving space 43.

In addition, when the circuit board bin is the main board bin 24, since the first planar structural member 423 is electrically connected with the structural member body 41, not only the grounding of the first circuit board 12 on the structural member 4 can be realized, but also the design requirement of the radio frequency function such as the antenna of the mobile terminal 100 on the structural member 4 can be met, so that the radio frequency function of the mobile terminal 100 can be realized.

The structure of the structural member 4 of the present application will be further described below by taking the first accommodating cavity 43 as an example of the main board bin 24.

With continued reference to fig. 13, in some embodiments, the first planar structural member 423 may include a first body 4231, where the first body 4231 is a planar plate-like structure having a direction of extension parallel to the connection region. The first body 4231 is electrically connected with the structural member body 41, so that a plane structure with a larger area is formed on the structural member 4 through the arrangement of the first body 4231, so that the grounding of the first circuit board 12 and the like on the structural member 4 can be met while the circuit board is carried, and the design requirement of the radio frequency function of the antenna and the like of the mobile terminal 100 on the structural member 4 is met.

Since the battery compartment 23 and the main board compartment 24 in the related art are made of the same metal material as the rest of the middle frame 2, the density of the metal material is high, which results in heavy weight of the mobile terminal 100 and increases the overall weight of the mobile terminal 100 when the mobile terminal 100 adopts the existing middle frame 2 and other structural members.

In addition, because the thermal performance and the electrical performance of the metal material are difficult to control and regulate in a large range, various heat conduction and electric conduction auxiliary materials are added on the middle frame 2 to assist the middle frame 2 to realize the functions of heat dissipation, radio frequency and the like. For example, as shown in fig. 11, a conductive layer 2441 is provided on the surface of the main board bin 24 of the middle frame 2 so as to achieve grounding of the first circuit board 12 at the main board bin 24.

For this reason, the density of the first body 4231 is smaller than that of the structural member body 41, so that the structural member 4 can be reduced in weight compared with the structural member 4 such as the middle frame 2 in the mobile terminal 100 in the related art on the basis of bearing the circuit board and ensuring the integrity of the structural member 4 and the required functions.

In some embodiments, the first body 4231 may be an organic polymer board. The organic polymer board can be prepared from organic polymer materials with lower density and modified materials thereof. Exemplary organic polymeric materials and their modifications include, but are not limited to, those that are Polycarbonates (PCs), polybutylene terephthalate (PBT), polyamides (PA), polyetheretherketones (Peek), polycarbonates (PCs), blends of at least two of PBT, PA, PEEK, and modified materials that incorporate inorganic fillers and other modifying components from polymeric alloys. The inorganic filler can include, but is not limited to, glass fiber, nanowhisker, carbon nanotube, montmorillonite, and talcum powder. Other modifying components may include, but are not limited to, antioxidants, antimicrobials, impact modifiers. Because the organic polymer material has a smaller density than the metal material, the weight of the structural member 4 can be reduced through the arrangement of the organic polymer plate.

Depending on the design requirements of the mobile terminal 100 for the structural member 4, the structural member 4 may be required to perform heat conduction, electrical conduction, thermal storage, electromagnetic shielding, etc. functions at the planar structural member 42. Because the modification range of the organic polymer material is wider, when the first body 4231 is an organic polymer board, the first body 4231 can also have the characteristic of larger modification space, so that the density, the rigidity, the strength, the electric conduction performance, the heat conduction performance and other performances of the organic polymer material can be adjusted in a large range by modifying the organic polymer material, and specific functions (such as heat conduction, electric conduction, heat storage and electromagnetic shielding) are added to the modified organic polymer material on the basis of the original organic polymer material. Thus, the modified organic polymer material is used for preparing the organic polymer board, so that other auxiliary materials (such as VC heat pipes, graphite sheets, copper foils and conductive foam cotton) are reduced or even not required to be added on the structural member 4, and specific functions (such as electric conduction, heat storage and electromagnetic shielding) of the first plane structural member 423 can be endowed.

The modification process of the organic polymer material can include, but is not limited to, copolymerization modification of raw materials and blending modification of raw materials.

In some embodiments, the first body 4231 may also be a fiber composite board. By way of example, fiber composite boards may include, but are not limited to, carbon fiber composite boards, fiberglass composite boards, aramid fiber composite boards, and flat panel-like structures made from composite materials woven from a mixture of a plurality of fibers. In the present application, the kind of the fiber composite board is not further limited. Because the fiber has a smaller density than the metal material, the weight of the structural member 4 can be reduced through the arrangement of the fiber composite board.

When the first body 4231 is a fiber composite board, the modification of the fiber composite board may be achieved by a process of blending and modifying raw materials, adding a surface coating or a plating layer, etc., so that specific functions (such as electric conduction, heat storage and electromagnetic shielding) of the first planar structural member 423 may be given.

Alternatively, in some embodiments, the first body 4231 may also be a flat plate-like structure formed of a foaming material, a polymeric aerogel, and the like. Because the density of the foaming material and the polymer aerogel is lower than that of the metal material, the weight of the structural member 4 can be reduced when the first body 4231 is prepared by adopting the foaming material and the polymer aerogel.

The structure of the structural member 4 of the present application will be further described below using the first body 4231 as an example of a fiber composite board.

In some embodiments, the structural member body 41 may be a metallic structure made of a metallic material. The metallic material from which the structural member body 41 is made may include, but is not limited to, stainless steel, aluminum alloy, magnesium alloy, or titanium alloy.

On this basis, to further reduce the weight of the structural member 4, in some embodiments, the structural member body 41 may also be a fiber composite board or an organic polymer board. When the structural member body 41 is a fiber composite board or an organic polymer board, the structural member body 41 and the first body 4231 may be made of the same or different materials. When the structural member body 41 and the first body 4231 are made of different materials, the structural member body 41 may be made of a material having a lower density. The type of the fiber composite board of the structural member body 41 and the organic polymer material used can be referred to the description of the first body 4231, and will not be further described herein.

Fig. 15 and 16 illustrate the connection between the first planar structural member 423 and the structural member body 41 at C1 and C2 of fig. 13, respectively, to facilitate better understanding of the structure of the structural member 4.

Referring to fig. 15 and 16, the first planar structural member 423 may further include a conductive plating 4232, where the conductive plating 4232 is coated on the surface of the fiber composite board and is electrically connected to the structural member body 41. On the basis of achieving the purpose of reducing weight of the structural member 4, modification of the fiber composite board can be achieved through the arrangement of the conductive coating 4232, so that the first planar structural member 423 has a conductive function without adding auxiliary materials (such as copper foil 25) on the structural member 4, and the first circuit board 12 can be grounded when being accommodated in the first accommodating cavity 43, and meanwhile, the conductive connection between the first planar structural member 423 and the structural member body 41 can be achieved, so that the design requirement of the radio frequency functions such as an antenna of the mobile terminal 100 on the structural member 4 is met.

In addition, since the auxiliary material (such as the conductive layer 2441) forming the ground position does not need to be additionally disposed on the surface of the first planar structural member 423, the structural member 4 can be further thinned by disposing the conductive plating layer 4232.

The conductive plating 4232 may be a metal plating. Alternatively, in some embodiments, the conductive coating 4232 may also be a coating made of other conductive nonmetallic materials. In this embodiment, the conductive plating 4232 is a metal plating so that the conductivity of the metal plating is used to realize the conductive function of the conductive plating 4232. By way of example, the conductive plating 4232 may include, but is not limited to, a nickel layer or a copper layer. In this application, the type of the conductive plating 4232 is not further limited.

With continued reference to fig. 13, the surface of the first planar structural member 423 has relief portions 421 and connection portions 422. Dodging portion 421 and the function module on the circuit board set up relatively to be configured to dodge the function module on the circuit board, make first plane structure 423 can dodge the function module on the circuit board that bears, so that the mobile terminal 100 is thinned or the heat dissipation of the function module is realized.

Wherein the connection portion 422 is configured to connect the first planar structural member 423 with a circuit board. By providing the connection portion 422 in this way, not only the connection of the first planar structural member 423 with the structural member body 41 but also the connection of the first planar structural member 423 with a circuit board (such as the first circuit board 12) can be facilitated.

As shown in fig. 13, the avoidance portion 421 may be an avoidance hole 4211, so that when the circuit board (such as the first circuit board 12) is carried on the first planar structural member 423, avoidance of the functional module on the first circuit board 12 can be achieved through the avoidance hole 4211. The avoidance hole 4211 is disposed opposite to the functional module on the first circuit board 12, and the shape of the avoidance hole is matched with the functional module.

Illustratively, the functional modules on the first circuit board 12 may include, but are not limited to, a camera module 121 and electronics 122 on the first circuit board 12. The camera module 121 may include, but is not limited to, a tele camera module or a main camera module in the mobile terminal 100. When the mobile terminal 100 has a plurality of camera modules 121, the main camera modules are different according to the arrangement of the camera modules 121 on the mobile terminal 100. Therefore, in the present application, the type of the main camera module in the mobile terminal 100 is not further limited.

Fig. 17 illustrates a connection of the first planar structural member 423 with the structural member body 41 at C3 of fig. 13. The connection part 422 may include at least one of a first connection hole 4221 and a connection boss, and the first connection hole 4221 may include, but is not limited to, a screw hole. The first planar structural member 423 is connected to a circuit board (not shown) by providing the first connecting holes 4221 and the connecting bosses such that connecting members (e.g., screws or bolts) having different lengths are inserted into the first connecting holes 4221 and the connecting bosses.

In some embodiments, the first planar structural member 423 may also be locked to the structural member body 41 to provide a rigid connection of the first planar structural member 423 to the structural member body 41. Specifically, referring to fig. 17, the first connection hole 4221 of the planar structural member 423 may extend toward the structural member body 41 to form the second connection hole 4233. The second connection hole 4233 may include, but is not limited to, a screw hole. The fastener 8 may then be inserted through the second connecting hole 4233 and through the first planar structural member 423 to connect the circuit board to both the first planar structural member 423 and the structural member body 41.

Alternatively, as shown with reference to fig. 17, in some embodiments, the second attachment holes 4233 may be used only to lock the first planar structural member 423 to the structural member body 41. That is, when the fastener 8 is inserted into the second connecting hole 4233, the first planar structural member 423 is locked to the structural member body 41, so that the first planar structural member 423 is rigidly connected to the structural member body 41. At the same time, the circuit board may be inserted into the connection boss only by another fastener to achieve connection of the circuit board with the first planar structural member 423.

The connection boss may include, but is not limited to, a screw boss so that connection of the first planar structural member 423 to a received circuit board can be achieved through the provision of the screw boss.

It should be noted that, the first planar structural member 423 may be provided with a plurality of connection bosses or a plurality of first connection holes 4221 so as to achieve stable connection between the first planar structural member 423 and at least one of the structural member body 41 and the circuit board. The plurality of connection bosses or the plurality of first connection holes 4221 may be distributed at different positions of the plane of the first planar structural member 423. The structure and the arrangement position of the connecting boss can be referred to in the above description of the screw boss in the middle frame 2, and are not further limited herein.

In some embodiments, the first planar structural member 423 also has a locating portion on a side facing away from the structural member body 41, which may include, but is not limited to, a locating post to locate the assembly of the circuit board within the first receiving cavity 43.

It should be noted that, when the first planar structural member 423 is not designed to avoid the functional module on the loaded circuit board, the first planar structural member 423 may not need to be provided with the avoiding portion 421.

With continued reference to fig. 15, the structural member 4 may further include a conductive adhesive layer 45, where the conductive adhesive layer 45 is connected between the first planar structural member 423 and the structural member body 41, so that when the first planar structural member 423 is electrically connected to the structural member body 41, the stability of connection between the first planar structural member 423 and the structural member body 41 can be further enhanced due to the arrangement of the conductive adhesive layer 45 on the basis that the first planar structural member 423 is locked to the structural member body 41 through the first connection hole 4221. Note that the conductive adhesive layer 45 is formed by curing a conductive adhesive.

The conductive paste in the present application may include all types of conductive paste that are currently available to meet the electrical connection and product reliability requirements of the structural body 41 and the fiber composite board. The conductive paste generally includes a main body resin and a conductive filler filled in the main body resin. By way of example, the host resin may include, but is not limited to, polyurethane, acrylate, modified acrylic, silicone, modified silane, epoxy, modified epoxy, polyimide, or phenolic resin. The conductive filler may include, but is not limited to, gold, silver particles of different sizes, gold/silver plated composite conductive fillers. Comprehensively considering the requirements of manufacturability, conductivity and reliability, the method can be used in the embodiment The volume resistivity of the conductive adhesive is 10 by using an organic silicon resin as a matrix and silver particles as conductive fillers ^-2 Ω·cm。

With continued reference to fig. 16, the structural member 4 may further include a first adhesive layer 46, where the first adhesive layer 46 and the conductive adhesive layer 45 are located at different positions between the first planar structural member 423 and the structural member body 41 to connect the first planar structural member 423 and the structural member body 41. The first adhesive layer 46 may be located at a peripheral edge of the first planar structural member 423. The first adhesive layer 46 may be a plurality of discrete adhesive structures, or the first adhesive layer 46 may be a continuous adhesive structure. Through the arrangement of the first bonding layer 46, on the basis that the conductive adhesive layer 45 and the first plane structural member 423 are locked and attached to the structural member body 41 through the first connecting hole 4221, stable connection between the first plane structural member 423 and the structural member body 41 can be achieved, and the reliability of conductive connection between the first plane structural member 423 and the structural member body 41 is further enhanced.

The first adhesive layer 46 is formed by curing a structural adhesive. The structural adhesive in the present application may include all types of existing glues that can meet the requirements of bonding reliability and product reliability. The host resin in the structural adhesive may include, but is not limited to, polyurethane, acrylate, modified acrylic, silicone, modified silane, epoxy, modified epoxy, polyimide, phenolic. In consideration of factors such as cost, curing conditions, process difficulty, curing speed and the like, the existing bi-component acrylic structural adhesive can be selected as an adhesive material, and the mixing ratio of the two components in the bi-component acrylic structural adhesive is 10:1.

Fig. 18 shows a schematic view of the assembly of the electronic functional device 1 on the structural part 4 in fig. 14.

Referring to fig. 18 in combination with fig. 14, the electronic functional device 1 comprises a battery 14, the second housing cavity 44 being configured to house the battery 14 in order to achieve an assembly of the battery 14 within the structural member 4. Accordingly, the second receiving cavity 44 may be referred to as a battery compartment in the structural member 4.

Referring to fig. 18 in combination with fig. 14, in some embodiments, the second planar structural member 424 may include a second body (not labeled in the drawings) having a planar portion 4241 and a partition portion 4242, the surface of the planar portion 4241 having a plane, and the extending direction of the planar portion 4241 being parallel to the connection region 411, so that a planar structure of a larger area can be formed on the second planar structural member 424 by the arrangement of the planar portion 4241, so that the second planar structural member 424 carries the battery 14.

With continued reference to fig. 18, the partition portion 4242 is provided around a peripheral edge of the flat portion 4241 on a side facing away from the structural member body 41, and forms a second flat structural member 424 together with the flat portion 4241. By way of example, the partitions 4242 may include, but are not limited to, partition ribs or bars 232. By providing the partition portion 4242 in this way, not only the second planar structural member 424 having the second accommodating cavity can be formed with the planar portion 4241, but also the partition portion 4242 can enclose the first accommodating cavity 43 together with the structural member body 41 and the first planar structural member 423, so as to facilitate assembly of the circuit board (e.g., the first circuit board 12) in the structural member 4.

In some embodiments, the density of the second body may be less than that of the structural member body 41, so that the weight of the structural member 4 can be reduced as compared with the existing structural member such as the middle frame 2 while carrying the circuit board.

In some embodiments, the second body may be a woven fabric or an organic polymer sheet. The fiber woven body and the organic polymer board are three-dimensional structures with a planar portion 4241 and a partition portion 4242, so that the weight of the structural member 4 is reduced, meanwhile, the preparation material (such as an organic polymer material) of the second body has the characteristic of a larger modification space, so that the second body is prepared by modifying the organic polymer material, and other auxiliary materials (such as a VC heat pipe and a copper foil 25) are reduced or even not required to be added on the structural member 4, so that the second planar structural member 424 has specific functions (such as heat conduction and electromagnetic shielding).

Wherein, the fiber braid can be prepared from fiber materials and matrix resin through the existing process. The fibrous material forming the fibrous braid may include, but is not limited to, a composite material woven from carbon fiber material, glass fiber, aramid fiber, and a mixture of a plurality of fibers.

The organic polymer plate can be prepared from organic polymer materials with lower density and modified materials thereof by injection molding, mould pressing and other processes. The organic polymer material and the modified material thereof for preparing the second body, and the modification process for the organic polymer material can refer to the related description of the first body 4231 in the above description, and will not be further described herein.

In some embodiments, the second body may also be a three-dimensional structure formed of a foaming material, a polymeric aerogel, and the like.

When the structural member body 41 is a fiber composite board or an organic polymer board, the structural member body 41 and the second body may be made of the same or different materials. When the structural member body 41 and the first body 4231 are made of different materials, the structural member body 41 may be made of a material having a lower density.

The structure of the structural member 4 of the present application will be further described below using the second body as an example of a fiber composite board.

The second planar structural member 424 further includes a thermally conductive filler (not shown) that is filled within the fiber braid and forms an integral structure with the fiber braid. On the basis of achieving the purpose that the structural member 4 is reduced in weight, the fiber composite board can be modified through the arrangement of the heat conduction filling part, so that the heat conduction function of the second planar structural member 424 can be achieved under the condition that auxiliary materials (such as VC heat pipes and copper foils) are not added.

In addition, because no additional auxiliary materials (such as VC heat pipes and copper foils) are needed to be added on the structural member 4, the purpose of further thinning the structural member 4 can be achieved through the arrangement of the heat conducting filling part.

In the present application, the heat conductive filler may be formed of a heat conductive filler filled in the dimensional braid. In some embodiments, the matrix resin and the thermally conductive filler may be blended to obtain a highly thermally conductive matrix resin, which is filled inside the fiber braid during the high pressure resin transfer molding process, thereby forming the second planar structural member 424 having an integrated structure.

Referring to fig. 18, in some embodiments, the structural member body 41 has a void region 414 on the connection region 411, and the second body is located in the void region 414 and bonded to the structural member body 41. By providing the clearance area 414 in this way, not only the connection of the second planar structural member 424 to the structural member body 41 can be facilitated, but also the thinning and weight reduction of the structural member 4 can be further realized.

Fig. 19 illustrates a schematic connection of the second planar structure to the structural body 41.

Referring to fig. 19, the structural member body 41 has a first overlap 415 at the edge of the void region 414 and a second overlap 4243 at the corner of the second body. The second overlap 4243 is overlapped on the first overlap 415 and is adhered to the first overlap 415 so that the connection of the second body with the structural member body 41 can be achieved by the arrangement of the first overlap 415 and the second overlap 4243 while further thinning and weight reduction of the structural member 4 are achieved, so that structural integrity of the structural member 4 is ensured.

Specifically, with continued reference to fig. 19, the structural member 4 may further include a second adhesive layer 47, and the second adhesive layer 47 may be located between the first overlap portion 415 and the second overlap portion 4243 to achieve connection of the second body to the structural member body 41. Wherein the second adhesive layer 47 is formed by curing the structural adhesive. The structural adhesive forming the second adhesive layer 47 of the present application may include all types of existing glues that can meet the requirements of adhesion reliability and product reliability. The bulk resin in the structural adhesive of the second adhesive layer 47 may be referred to in the first adhesive layer 46 as described herein without further limitation. In consideration of factors such as cost, reliability, limitation of subsequent dispensing and the like, the conventional single-component epoxy thermosetting adhesive can be selected as an adhesive material in the embodiment.

Referring to fig. 18 in combination with fig. 14, the surface of the planar portion 4241 has a relief portion 421, and the relief portion 421 is configured to accommodate the flexible circuit board 6 in the mobile terminal 100 to relieve the battery 14 accommodated in the second accommodating cavity 44. The battery 14 is the electronic functional device 1 accommodated in the second accommodating cavity 44, and the battery 14 may be adhered to the planar portion 4241 through the back adhesive 7. By providing the avoiding portion 421 in this way, the flexible circuit board 6 can be conveniently embedded in the second planar structural member 424 without affecting the accommodation of the battery 14 in the second accommodating cavity 44, so that the first circuit board 12 and the second circuit board 13 or the first circuit board 12 and the display screen 11 are electrically connected through the flexible circuit board 6.

With continued reference to fig. 18 and in conjunction with fig. 14, the relief 421 may include at least one relief groove 4213 to facilitate embedding of the flexible circuit board 6 within the second planar structural member 424. The relief portion 421 may further include a through hole 4212, where the through hole 4212 is located at a side of one of the relief grooves 4213 and communicates with the relief groove 4213, so that an end portion of the flexible circuit board 6 passes through the planar portion 4241. Due to the provision of the penetration holes 4212, the flexible circuit board 6 embedded in the second planar structural member 424 can pass through the planar portion 4241 so as to achieve a connection function of the flexible circuit board 6 in the mobile terminal 100. For example, after the end portion of the flexible circuit board 6 passes through the plane portion 4241, the electrical connection of the first circuit board 12 and the display screen 11 may be achieved.

With continued reference to fig. 18 and in conjunction with fig. 14, in some embodiments, the relief portion 421 may include two relief grooves 4213, where one relief groove 4213 is used to embed the flexible circuit board 6 connecting the first circuit board 12 and the second circuit board 13, and the other relief groove 4213 is used to embed the flexible circuit board 6 connecting the first circuit board 12 and the display screen 11. The arrangement of the two relief grooves 4213 on the planar portion 4241 may be described with reference to the first and second embedded grooves 233 and 234, and is not further limited herein.

It should be noted that, in some embodiments, the planar portion 4241 of the second body may be directly adhered to the connection region 411 of the structural member body 41 without considering the thickness of the structural member 4, and the avoiding region 414 is not required to be provided in the connection region 411. The bonding method between the second planar structural member 424 and the structural member body 41 is not further limited in this application.

In some embodiments, the side of the structural member body 41 facing away from the planar structural member 42 also has a receiving cavity (not shown in the figures) configured to receive an electronic functional device (such as a display screen) other than within the receiving cavity. At this time, the structural member 4 may replace the middle frame 2. Because the second planar structural member 424 includes the heat-conducting filling portion, and the space-avoiding area 414 on the structural member body 41 is arranged, heat of the electronic functional device 1 (such as a display screen) in the accommodating cavity can be ensured to be conducted to the heat-conducting filling portion, so that the display screen 11 has better heat dissipation performance.

In order to achieve the grounding of the electronic functional device 1 in the accommodating cavity, the structural member 4 may further include a conductive structure, and the conductive structure may be attached to the cavity wall of the accommodating cavity, so as to achieve the grounding of the electronic functional device 1 in the accommodating cavity on the structural member 4.

On the basis of the above, the mobile terminal 100 according to the embodiment of the present application may further include a housing assembly, which may include the structural member 4 in any one of the above. When the types of the mobile terminals 100 are different, the structures included in the housing assembly are also different.

For example, when the mobile terminal 100 is a mobile phone, the structural member 4 may replace the middle frame 2, and the housing assembly may further include a rear cover 3, where the rear cover 3 covers one side of the first accommodating cavity 43 of the structural member 4 to form the housing assembly.

For example, when the mobile terminal 100 is a notebook computer, the housing assembly may further include a housing for carrying the display 11, and a portion of the housing except for a bottom housing of the housing. The housing carrying the screen 11 may be rotatably coupled to the housing to form a housing assembly. The structural member 4 may replace the chassis base or the housing carrying the display screen 11.

The setting of structure 4 in this application through mobile terminal 100 not only simplifies the processing technology of structure 4, shortens process time, reduces the processing cost, reduces the produced waste material of processing, but also can simplify the design and the processing degree of difficulty of the mould that uses in the die casting of structure 4, reduces the processing cost.

The preparation and assembly of the first planar structural member 423 and the structural member body 41 will be further described using a fiber composite board as an example.

Fig. 20 illustrates a schematic view of the manufacturing process of the structural member 4 of fig. 13.

Referring to fig. 20, in the process of manufacturing the structural member 4, after the structural member body 41 mainly manufactured by the first planar structural member 423 and the aluminum alloy substrate are respectively processed, the structural member body and the structural member body are attached by bonding and screw locking, and are electrically connected by locally dispensing conductive adhesive, so as to form the complete structural member 4.

Fig. 21 is a schematic view illustrating a manufacturing process of the structural member body 41 of fig. 20, and fig. 22 is a schematic view illustrating a manufacturing process of the first planar structural member of fig. 20.

With continued reference to fig. 20-23, the process for preparing the structural member 4 mainly comprises the steps of:

step one: the aluminum alloy substrate (substrate made of aluminum alloy material) is manufactured into the structural member body 41 through CNC processing, nano injection molding, anodic oxidation and other processes, and the structural member body 41 comprises a second accommodating cavity 44.

It should be noted that the model of the aluminum alloy is not further limited in this application, so as to meet the product design and reliability requirements. The specific process parameters of CNC processing, nano injection molding and anodic oxidation are based on meeting the product design and appearance requirements of the structural member 4. In the present application, the process parameters of CNC processing, nano injection molding, and anodic oxidation are not further limited. In particular, the processes of nano-injection molding and anodic oxidation refer to the related descriptions of the existing middle frame 2, and are not further limited herein.

Step two: the carbon fiber prepreg is formed into the first planar structural member 423 after being subjected to wet compression molding, local CNC processing, surface metallization and other processes, and at this time, the first body 4231 in the first planar structural member 423 is a fiber composite board.

In the carbon fiber prepreg, the number, size and knitting mode of the carbon fibers are not further limited, and specific process parameters of the wet compression molding process and the like of the resin of the carbon fibers are not limited, so that the carbon fiber prepreg can meet the design and reliability requirements of the first planar structural member 423. Wherein the wet compression molding process may be described with reference to the related art, and is not further limited herein. For example, the carbon fiber prepreg of the T800 grade pre-impregnated with epoxy resin can be selected as the carbon fiber prepreg. Among them, the carbon fiber of the T800 grade generally refers to a carbon fiber having a tensile strength of 800 ksi.

The carbon fiber prepreg is a blank obtained by wet compression molding, and the blank may be provided with a plurality of relief holes 4211, a plurality of connection portions 422 (such as first connection holes 4221 and connection bosses), and a plurality of positioning portions.

The specific process parameters of the local CNC machining are not further limited in the present application, so as to meet the design and reliability requirements of the first planar structural member 423. In this application, through local CNC processing can be through carrying out the processing such as local repair, trompil, deflashing to the blank that obtains through wet compression molding to form first body 4231, compare in the CNC integrated processing of center 2, can reduce the produced waste material of first plane structure 423 and structure 4 when producing.

Wherein the surface metallization may include, but is not limited to, sputtering, electroless plating, pad printing, physical deposition, etc. processes such that a conductive plating 4232 (such as a nickel layer) may be formed on the first body 4231 by the surface metallization to form the first planar structural member 423. In the present application, the specific process of surface metallization is not further limited, so long as the functional, performance and reliability requirements of the first planar structural member 423 are satisfied.

It should be noted that the dimensions of the first planar structural member 423 are not further limited in the present application, so as to meet the design requirements of the first planar structural member 423. In some embodiments, the outer dimensions of the first planar structural member 423 are as follows: the length is 63mm, the width is 55mm, and the thickness is 0.5mm. The directions of the length, width and thickness of the first planar structural member 423 are the X direction, the Y direction and the Z direction in fig. 20, respectively.

Step three: the two are connected through modes such as bonding, locking of a fastener 8 (such as a screw) and the like, and are electrically connected through partial conductive adhesive to form the complete structural member 4, so that the radio frequency requirement of the structural member 4 on the mobile terminal 100 can be met while the conductive connection of the first planar structural member 423 and the structural member body 41 is realized.

It should be noted that, the conductive adhesive may be locally dispensed at the connection area 411 of the structural member body 41, and then the structural adhesive may be locally dispensed at the connection area 411, so that when the first planar structural member 423 is assembled to the connection area 411, the first planar structural member 423 and the structural member body 41 may be bonded, and finally, the first planar structural member 423 is fastened to the structural member body 41 by penetrating the fastener 8 into the second connection hole 4233, so as to connect the first planar structural member 423 and the structural member body 41. The conductive paste layer 45 may be formed after the conductive paste is cured, and the first adhesive layer 46 may be formed after the structural paste is cured.

The description of the conductive adhesive and the structural adhesive in the preparation method may refer to the description of the first planar structural member 423, which is not further described herein.

The dispensing equipment and the dispensing process for the conductive adhesive and the structural adhesive are not further limited in the application, so that the requirements of adhesion and product reliability of the structural member 4 are met. The dispensing process may include, but is not limited to, spray dispensing, contact dispensing, manual dispensing, and the like.

In consideration of factors such as dispensing precision and process control, when the organic silicon system conductive adhesive is used for dispensing, the contact type dispensing of the high-precision triaxial dispensing equipment in the prior art can be adopted, the triaxial dispensing equipment comprises a triaxial dispensing platform, and the triaxial dispensing platform is provided with a screw valve and a contact type dispensing device.

In consideration of factors such as dispensing precision, process control and the like, in the application, the two-component acrylate structural adhesive dispensing can adopt high-precision three-axis adhesive dispensing equipment in the prior art for contact type adhesive dispensing, and the three-axis adhesive dispensing equipment comprises a three-axis adhesive dispensing platform which is provided with a static mixer except a screw valve and a contact type adhesive dispensing device.

The assembly process of the first planar structural member 423 on the structural member body 41 in the present application is not further limited, so as to meet the assembly accuracy and reliability requirements of the structural member 4. The assembly process may include, but is not limited to, vision automated equipment assembly, jig assembly, and manual assembly. In view of assembly accuracy, efficiency, cost, etc., the first planar structural member 423 may be assembled to the structural member body 41 in a jig assembly manner.

It should be noted that, in the present application, the locking process of the first planar structural member 423 on the structural member body 41 is not further limited, so as to meet the design and reliability requirements of the structural member 4. The size, type, profile, torque, presence or absence of the fastening glue, etc. of the fastener 8 (e.g. screw) are not further limited in this application, so as to meet the product assembly and reliability requirements.

The preparation and assembly of the second planar structural member 424 and the structural member body 41 will be further described below using a woven fabric as an example.

Fig. 23 illustrates a schematic view of the production process of the structural member 4 of fig. 14, and fig. 24 illustrates a schematic view of the production process of the second planar structural member of fig. 23.

Referring to fig. 22 and 24, in the process of manufacturing the structural member 4, the structural member body 41 mainly manufactured by the second planar structural member 424 and the aluminum alloy base material is attached by bonding and screw locking after being processed, so as to form the complete structural member 4.

With continued reference to fig. 22, the process for preparing the structural member 4 mainly comprises the steps of:

step one: the content of the first step is the same, and the related description may be specifically omitted herein.

Step two: the matrix resin and the heat conductive filler are mixed to obtain high heat conduction matrix resin, the matrix resin and a fiber woven body which is formed by weaving carbon fibers in advance are put into a die together, and the second planar structural member 424 with a three-dimensional structure is obtained at one time through a high-pressure resin transfer molding process.

It should be noted that, in the present application, the kind of the matrix resin is not further limited, and specific matrix resins may include all matrix resins that can be used to prepare the carbon fiber composite material and meet the requirements of the subsequent transfer molding process, the design and the reliability of the structural member 4.

By way of example, the matrix resin may include, but is not limited to, a thermoplastic resin (such as PC, PEEK) or a thermosetting resin, which may include, but is not limited to, an epoxy resin, a phenolic resin, a bismaleimide resin, or a benzoxazine. In the present application, epoxy resin may be selected as the matrix resin and mixed with the heat conductive filler to form a high heat conductive matrix resin, and the high heat conductive matrix resin is filled in the fiber woven body to form the heat conductive filling portion in the second planar structural member 424.

In the present application, the kind of the heat conductive filler is not further limited, and may include all heat conductive materials that meet the blending modification process, the thermal performance and reliability requirements of the final structural member 4, and can be used to enhance the thermal conductivity of the resin. For example, the heat conducting filler can be a single heat conducting filler such as graphite, graphene, alumina, boron nitride, diamond and the like, and a filler formed by compounding different heat conducting fillers according to a certain proportion. In the application, boron nitride can be selected as a heat conducting filler, and the high heat conducting matrix resin is obtained after the boron nitride is blended with epoxy resin.

In the application, the blending process is not further limited, and the blending process is used as a modification process to meet the requirements of uniform dispersion of filler, thermal performance and other physical and chemical properties. Blending includes, but is not limited to, autoclave dispersion, high speed dispersion, twin screw blending, banburying, open mill and other blending processes. In the application, the liquid epoxy resin and the boron nitride filler can be blended in a reaction kettle through a stirring paddle and a high-speed disperser to obtain the high-heat-conductivity matrix resin.

When the carbon fiber is selected, the brand, size, physical and chemical properties and the like of the carbon fiber are selected to meet the design and reliability requirements of the structural member 4, and in the application, the brand, size, physical and chemical properties of the carbon fiber are not further limited. In the application, the T800-grade carbon fiber can be selected for subsequent weaving process.

In the application, the knitting process is not further limited, so that the requirements of product design and reliability can be met. The process of weaving may include, but is not limited to, bi-directional plain weave, tri-directional plain weave, multi-axial multi-layer warp knitting, three-dimensional weave, three-dimensional orthogonal weave, and angle interlock weave. In the scheme, three-dimensional braiding can be selected so that a fiber braiding body with a three-dimensional structure can be formed at one time in a subsequent process.

In the present application, the process parameters of the high pressure resin transfer molding process (HP-RTM) are not further limited, so as to meet the product design and reliability requirements. The process parameters of the high pressure resin transfer molding process (HP-RTM) may include, but are not limited to, injection pressure, in-mold pressure, injection speed, dwell time, mold temperature, and the like. Specifically, the method and the parameter setting of the high-pressure resin transfer molding process can be referred to the description in the related art, and will not be further described herein.

Since the second planar structural member 424 is formed by the high-pressure resin transfer molding process, the structural member body 41 is only required to be subjected to the mold design when the structural member body 41 is die-cast, and thus the mold design of the structural member body 41 can be simplified and the processing difficulty of the mold can be reduced compared with the mold required for the integral die-casting molding of the middle frame 2 in the related art.

It should be noted that the dimensions of the second planar structural member 424 are not further limited in this application, so as to meet the design requirements of the second planar structural member 424. In some embodiments, the outer dimensions of the second planar structural member 424 are as follows: the length is 65mm, the width is 50mm, and the thickness is 0.6mm. The directions of the length, width and thickness of the second planar structural member 424 are the X direction, the Y direction and the Z direction in fig. 20, respectively. The second planar structural member 424 includes additional attachment structures such as relief slots 4213, partitions 4242, and through holes 4212.

Because of the avoidance grooves 4213, the partition portions 4242, and the penetrating holes 4212, in the three-dimensional knitting process, the corresponding avoidance grooves 4213, partition portions 4242, and penetrating holes 4212 may be formed in the fiber woven body, and then in the high-pressure resin transfer molding process, the structure of the mold may be designed to avoid the high-thermal-conductivity matrix resin affecting the avoidance grooves 4213, partition portions 4242, and penetrating holes 4212 formed in the fiber woven body, thereby ensuring that the avoidance grooves 4213, partition portions 4242, and penetrating holes 4212 are formed in the second planar structural member 424.

Step three: the two components are connected through an adhesion process, so that the heat conduction function of the structural component 4 on the second planar structural component 424 can be met while the complete structural component 4 is formed, and heat dissipation of the battery 14 is realized.

It should be noted that, the structural adhesive may be dispensed at the connection area 411 of the structural member body 41, so that when the second planar structural member 424 is assembled to the connection area 411, the structural adhesive may form the second adhesive layer 47 after curing while the adhesion between the second planar structural member 424 and the structural member body 41 is achieved. The selection criteria and types of the structural adhesive in the preparation method may be referred to the related description in the second planar structural member 424, and will not be further described herein.

The dispensing equipment and the dispensing process for the structural adhesive are not further limited in the application, so that the requirements of adhesion of the structural member 4 and product reliability are met. The dispensing process may include, but is not limited to, spray dispensing, contact dispensing, manual dispensing, and the like. In consideration of precisely controlling the glue amount and avoiding the influence of glue overflow on assembly, the injection type glue dispensing process can be selected to dispense structural glue on the structural member body 41 in the application so as to achieve the bonding of the second planar structural member 424 and the structural member body 41.

The curing process of the structural adhesive is selected according to the type of the bonding material. In the application, the technological parameters of the curing process are not further limited, so that the requirements of bonding reliability and product reliability can be met. The curing process may include, but is not limited to, thermal curing, moisture curing, photo curing, two-component hybrid curing, solvent evaporation curing, hot melt cooling curing, and combinations of two or more curing means. Because the single-component epoxy thermosetting adhesive is selected as the bonding material, correspondingly, the curing process can be used for selecting thermosetting, the curing equipment can be a vertical curing furnace, the curing temperature is 80 ℃, and the curing time is 60 minutes.

In the present application, the process for assembling the second planar structural member 424 on the structural member body 41 is not further limited, so as to meet the requirements of assembling accuracy and reliability of the structural member 4. The assembly process may include, but is not limited to, vision automated equipment assembly, jig assembly, and manual assembly. In view of the safety concerns of the battery 14 associated with the assembly of the second planar structural member 424, the assembly of the second planar structural member 424 to the structural member body 41 may be accomplished in a visual automated equipment assembly manner herein.

In the description of the embodiments of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, indirectly connected through an intermediary, or may be in communication with each other between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.

The terms first, second, third, fourth and the like in the description and in the claims of embodiments of the application and in the above-described figures, if any, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order.

Claims (27)

1. The structural member is applied to the mobile terminal and is characterized by comprising a structural member body and a planar structural member, wherein the structural member body is provided with a connecting area; the plane structural member is connected to the connection area to form an accommodating cavity for accommodating electronic functional devices in the mobile terminal;

the surface of the planar structural member, which is away from the structural member body, is provided with a plane matched with the electronic function device structure, the planar structural member is provided with at least one of an avoidance part and a connecting part, and at least part of the avoidance part and the connecting part are positioned on the plane; wherein the avoidance portion is configured to avoid the electronic function device, and the connection portion is configured to connect the electronic function device to the planar structural member.

2. The structural member of claim 1 wherein the relief forms at least part of a cavity wall of the receiving cavity; alternatively, a portion of the peripheral contour of the planar structural member forms at least a portion of the cavity wall of the receiving cavity.

3. The structure of claim 1, wherein the area of the plane is greater than the projected area of the electronic functional device on the plane.

4. The structure of claim 1, wherein the connection region is a planar region on a surface of the structure body, the connection region having an area greater than a projected area of the planar structure on the structure body.

5. The structure of claim 1, wherein the planar structure comprises at least one of a first planar structure and a second planar structure, the first planar structure and the second planar structure having different shapes, and the connection regions corresponding to the first planar structure and the second planar structure being located at different positions on a same face of the structure body, respectively.

6. The structural member of claim 5 wherein the first planar structural member and the second planar structural member are both rigidly connected to the structural member body.

7. The structural member of claim 5 wherein the first planar structural member and the structural member body together define a first receiving cavity; the second plane structural member is internally provided with a second accommodating cavity;

the housing cavity includes at least one of the first housing cavity and the second housing cavity configured to house different ones of the electronic functional devices.

8. The structural member of claim 7 wherein the electronic function device includes a circuit board, the first receiving cavity being configured to receive the electronic function device circuit board, the first planar structural member being in conductive connection with the structural member body.

9. The structural member of claim 8 wherein the first planar structural member includes a first body that is a planar plate-like structure having the plane, the planar plate-like structure extending parallel to the connection region, the first body being conductively connected to the structural member body.

10. The structural member of claim 9 wherein the density of the first body is less than the density of the structural member body.

11. The structural member of claim 10 wherein the first body is a fiber composite board or an organic polymer board.

12. The structural member of claim 11 wherein the first planar structural member further comprises a conductive coating over the surface of the fiber composite panel and in conductive connection with the structural member body.

13. The structural member of claim 12 wherein the conductive coating is a metal coating.

14. The structure of any one of claims 8-13, wherein a surface of the first planar structure has the relief portion and the connection portion;

the avoiding part is arranged opposite to the functional module on the circuit board and is configured to avoid the functional module on the circuit board; the connection portion is configured to connect the first planar structural member with the circuit board.

15. The structural member of claim 14 wherein the relief portion is a relief hole and the connecting portion is at least one of a first connecting hole and a connecting boss.

16. The structural member of any one of claims 5 to 13 further comprising a conductive glue layer connected between the first planar structural member and the structural member body.

17. The structural member of claim 16 further comprising a first adhesive layer, the first adhesive layer and the conductive adhesive layer being located at different locations between the first planar structural member and the structural member body to connect the first planar structural member and the structural member body.

18. The structure of any one of claims 7-13, wherein the electronic functional device comprises a battery, and the second receiving cavity is configured to receive the battery.

19. The structural member of claim 18 wherein the second planar structural member comprises a second body having a planar portion and a partition portion, the planar portion having a surface with the plane and the planar portion extending in a direction parallel to the connection region;

the partition part is arranged on the peripheral edge of one side, away from the structural member body, of the planar part in a surrounding mode, and the partition part and the planar part form the second planar structural member together.

20. The structural member of claim 19 wherein the density of the second body is less than the density of the structural member body.

21. The structural member of claim 20 wherein the second body is a woven fiber body or an organic polymer sheet, the woven fiber body and the organic polymer sheet each being a three-dimensional structure having the planar portion and the partition portion.

22. The structural member of claim 21 wherein the second planar structural member further comprises a thermally conductive filler that fills the interior of the fiber braid and forms an integral structure with the fiber braid.

23. The structural member of claim 19 wherein said structural member body has a void region in said connection region, said second body being located in said void region and bonded to said structural member body.

24. The structural member of claim 23 wherein the structural member body has a first overlap at the edge of the void region and a second overlap at the corner of the second body, the second overlap being joined to and bonded with the first overlap.

25. The structure of claim 19, wherein a surface of the planar portion has the relief portion configured to receive a flexible circuit board in the mobile terminal to relieve the battery received in the second receiving cavity.

26. The structural member of claim 25 wherein the relief portion includes a through hole and at least one relief slot, the through hole being located laterally of one of the relief slots and in communication with the relief slot such that an end of the flexible circuit board passes through the planar portion.

27. A mobile terminal comprising a housing assembly comprising the structural member of any one of claims 1-26.

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