CN211018910U - Middle frame, rear cover and electronic equipment - Google Patents

Middle frame, rear cover and electronic equipment Download PDF

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Publication number
CN211018910U
CN211018910U CN201921523510.1U CN201921523510U CN211018910U CN 211018910 U CN211018910 U CN 211018910U CN 201921523510 U CN201921523510 U CN 201921523510U CN 211018910 U CN211018910 U CN 211018910U
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China
Prior art keywords
frame
ceramic
antenna
shell
rear cover
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CN201921523510.1U
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伍国平
马亮
王斯慰
朱广祥
郜成杰
杨育展
汪欢
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Abstract

The embodiment of the application provides a middle frame, a rear cover, a preparation method of the middle frame and the rear cover, and electronic equipment, wherein the electronic equipment can comprise a mobile phone, a tablet personal computer, a notebook computer, a super mobile personal computer (UMPC), a handheld computer, an interphone, a netbook, a POS machine, a Personal Digital Assistant (PDA), a driving recorder, wearable equipment, virtual reality equipment, a wireless USB flash disk, a Bluetooth sound/earphone, or a vehicle-mounted front-mounted terminal and other mobile or fixed terminals with frames or shells.

Description

Middle frame, rear cover and electronic equipment
Technical Field
The utility model discloses the application is waded terminal technical field, in particular to center, back lid and electronic equipment.
Background
The ceramic has beautiful appearance, jade-like luster and smooth hand feeling, so that the application of the ceramic in electronic equipment such as mobile phones, flat plates and the like is gradually pursued and favored by consumers, and meanwhile, the high hardness and the wear resistance of the ceramic can not be scratched or abraded when being used as a mobile phone shell, so that the mobile phone is ensured to be as new as long as possible, and the ceramic is environment-friendly and has higher ornamental value.
At present, when ceramic materials are applied to a mobile phone, the ceramic rear cover or the ceramic middle frame is mainly made of the ceramic materials, however, the weight of the whole mobile phone is increased due to the fact that the ceramic is heavy, and when the thickness of the ceramic rear cover or the ceramic middle frame is reduced to reduce the weight of the whole mobile phone, the strength of the ceramic rear cover or the ceramic middle frame cannot meet the requirement, so that when the ceramic rear cover or the ceramic middle frame is used, how to reduce the weight of the mobile phone under the condition of meeting the strength requirement is a problem which needs to be solved urgently by the industry.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a middle frame, a rear cover, a preparation method of the middle frame and electronic equipment, so that the thicknesses of a ceramic outer frame and a ceramic shell are reduced under the condition that the frame of the rear cover and the frame of the middle frame meet the requirement of strength, and the weight of the electronic equipment is reduced.
A first aspect of an embodiment of the present application provides a rear cover, including: the fiber-reinforced composite material comprises a ceramic outer shell and an inner shell made of a fiber-reinforced composite material, wherein the inner shell is arranged on the inner surface of the ceramic outer shell.
By the back cover comprising the ceramic outer shell and the inner shell made of the fiber reinforced composite material, on one hand, the thickness of the ceramic outer shell can be reduced, thereby realizing the weight reduction of the electronic equipment, on the other hand, the inner side of the rear cover is an inner shell made of fiber reinforced composite material, therefore, the inner shell made of the fiber reinforced composite material can provide strength support, so that the rear cover meets the strength requirement on the basis of reducing the thickness of the ceramic outer shell, and in addition, because the inner shell made of the fiber reinforced composite material has higher strength, therefore, the thickness of the inner shell can be designed to be thinner, so that the thickness of the rear cover is thinner, in addition, the inner side of the rear cover is made of the fiber reinforced composite material, the inner shell has certain toughness, therefore, the inner surface of the inner shell is easy to manufacture a complex internal structure design, thereby avoiding the problem of high manufacturing difficulty when manufacturing the internal structure design on the ceramic outer shell with high hardness. In the embodiment of the application, the outer side of the rear cover is the ceramic shell, so that the high quality feeling and high hardness of the shell in the electronic equipment are met.
In one possible implementation manner, the method further includes: the glue layer is positioned between the ceramic outer shell and the inner shell, and the ceramic outer shell, the glue layer and the inner shell are pressed to form the rear cover.
Through setting up the glue film, make ceramic package and inner shell together in advance fixed before the pressfitting on the one hand like this, conveniently carry out the pressfitting like this, on the other hand glue film makes closely the bonding together after ceramic package and the inner shell pressfitting, has increased the cohesion between ceramic package and the inner shell.
In one possible implementation, the fiber-reinforced composite material is a composite plate made of a plastic matrix and reinforcing fibers, the reinforcing fibers including: one or more of glass fibers, carbon fibers, boron nitride fibers, silicon carbide fibers, alumina fibers, boron fibers, zirconia fibers, aramid fibers or ultra-high molecular weight polyethylene fibers. This results in a stronger and thinner inner shell of fibre-reinforced composite material. In addition, the composite board has certain toughness due to the increase of the reinforced fibers, so that the inner shell is convenient to manufacture and is not easy to crack in the pressing process of the inner shell and the ceramic outer shell.
In a possible implementation manner, the fiber reinforced composite material is a glass fiber board made of a plastic matrix and glass fibers, and the inner shell is a shell made of the glass fiber board. The glass fiber plate has higher strength and thinner thickness, so that the inner shell made of the glass fiber plate has thinner thickness on the basis of meeting the strength requirement, the thickness of the rear cover is reduced, and the weight is lightened.
In one possible implementation, the wall thickness of the ceramic outer shell is 0.15-0.6mm and the wall thickness of the inner shell is 0.1-1 mm. Therefore, the wall thickness of the inner shell and the ceramic outer shell is reduced, and compared with a pure ceramic rear cover, the weight of the rear cover is reduced and the thickness of the rear cover is reduced.
In one possible implementation manner, the ceramic strength of the ceramic shell is 300-1700MPa, and the fracture toughness of the ceramic is 2-16MPa.m 1/2.
In one possible implementation, the material of the ceramic shell comprises zirconia, silicon carbide, silicon nitride, aluminum nitride, or an alumina ceramic.
In one possible implementation, the bending strength of the fiber reinforced composite material can be greater than or equal to 450MPa, and the bending modulus can be greater than or equal to 25 GPa.
In one possible implementation manner, the method further includes: at least one antenna, the antenna includes antenna radiation branch and with feed point and the ground point of antenna radiation branch electricity connection, the antenna radiation branch sets up between ceramic shell and the inner shell. Thus, the radiation branch of the antenna is positioned between the ceramic outer shell and the inner shell, so that the antenna radiation branch is loaded in the rear cover and hidden between the ceramic outer shell and the inner shell, and the antenna radiation branch is not visible on the rear cover.
In one possible implementation, the antenna headroom is less than 10 mm. Therefore, the interference of metal around the antenna on the antenna is reduced, and the radiation efficiency of the antenna is ensured.
In one possible implementation, the impedance of the antenna is less than or equal to 5 Ω. This results in an antenna with greater electrical conductivity and greater radiation capability.
In one possible implementation, the rear cover includes: the side frame surrounds the outer edge of the bottom shell. The rear cover is provided with a bottom shell and side frames, and when the rear cover is used in the electronic equipment, the side frames can be used as the outer frames of the electronic equipment.
In one possible implementation, the ceramic shell includes an outer bottom shell and an outer shell surrounding an outer edge of the outer bottom shell.
The inner shell comprises an inner bottom shell and an inner side shell arranged around the outer edge of the inner bottom shell, the outer bottom shell and the inner bottom shell form a bottom shell of the rear cover, and the outer side shell and the inner side shell form a side frame of the rear cover. Therefore, the whole outer side surface and the whole outer bottom surface of the rear cover are made of ceramic materials, and the whole inner side surface and the whole inner bottom surface are made of fiber reinforced composite materials. When the rear cover is applied to the electronic equipment, the outer frame of the electronic equipment and the outer surface of the bottom shell are both made of ceramic materials, so that the full ceramic setting of the outer surface of the electronic equipment is realized on the basis of reducing the weight of the rear cover.
A second aspect of the embodiments of the present application provides an electronic device, which at least includes: display screen with the aforesaid back lid, the display screen with the back lid encloses into the accommodation space that can supply components and parts to hold, perhaps, electronic equipment includes at least: the display screen and the rear cover are respectively positioned on two sides of the middle frame. Through including above-mentioned back lid, the weight of back lid has been reduced on the one hand like this for electronic equipment's weight reduces, and on the other hand has realized easily setting up complicated inner structure design on electronic equipment's inner shell, has avoided setting up inner structure design on the great ceramic package of hardness and has appeared setting up the great problem of the degree of difficulty.
A third aspect of the embodiments of the present application provides a middle frame, which at least includes: the metal middle plate and enclose the frame of establishing in metal middle plate outward flange.
The frame includes: the metal middle plate comprises an inner frame made of fiber reinforced composite materials and a ceramic outer frame arranged on the outer side face of the inner frame in a surrounding mode, wherein the inner side face of the inner frame is connected with the outer edge of the metal middle plate.
Through including interior frame and ceramic outline, make the thickness of ceramic outline to attenuate on the one hand like this for the weight reduction of frame realizes electronic equipment weight reduction's effect, and on the other hand can provide the intensity to support the ceramic outline because the inboard of frame is the fiber reinforced composite frame, and the frame satisfies the intensity requirement on the basis of ceramic outline thickness attenuate. In addition, the fiber reinforced composite material frame is arranged on the inner side of the frame, and a complex internal structural design is easy to manufacture on the fiber reinforced composite material frame, so that the problem of high manufacturing difficulty in manufacturing the internal structural design on the ceramic outer frame with high hardness is solved. In the embodiment of the application, the outer side of the frame of the electronic equipment is the ceramic frame, so that the high quality feeling and high hardness of the frame of the electronic equipment are met.
In one possible implementation manner, the method further includes: the glue layer is positioned between the ceramic outer frame and the inner frame, and the ceramic outer frame, the glue layer and the inner frame are pressed to form the frame.
Through setting up the glue film, make ceramic outline and interior frame in advance fixed together before the pressfitting on the one hand like this, conveniently carry out the pressfitting like this, on the other hand glue film makes closely the bonding together behind ceramic outline and the interior frame pressfitting, has increased the cohesion between ceramic outline and the interior frame.
In one possible implementation, the fiber-reinforced composite material is a composite plate made of a plastic matrix and reinforcing fibers, the reinforcing fibers including: one or more of glass fibers, carbon fibers, boron nitride fibers, silicon carbide fibers, alumina fibers, boron fibers, zirconia fibers, aramid fibers or ultra-high molecular weight polyethylene fibers. This allows the inner frame of fibre-reinforced composite material to be stronger and thinner. In addition, the composite board has certain toughness due to the increase of the reinforced fibers, so that the inner frame and the ceramic outer frame are convenient to manufacture and are not easy to crack in the pressing process.
In a possible implementation manner, the fiber reinforced composite material is a glass fiber board made of a plastic matrix and glass fibers, and the inner frame is a frame made of the glass fiber board. The glass fiber board has higher strength and thinner thickness, so that the inner frame made of the glass fiber board has thinner thickness on the basis of meeting the strength requirement, the thickness of the middle frame is thinner, and the weight is lightened.
In one possible implementation, the wall thickness of the ceramic outer frame is 0.15-0.6mm, and the wall thickness of the inner frame is 0.1-1 mm. The wall thickness attenuate of interior frame and ceramic outline like this, compare with pure ceramic frame, the weight reduction and the thickness attenuate of center.
In a possible implementation manner, the ceramic strength of the ceramic outer frame is 300-1700Mpa, and the fracture toughness of the ceramic is 2-16mpa.m 1/2.
In one possible implementation, the bending strength of the fiber reinforced composite material can be greater than or equal to 450MPa, and the bending modulus can be greater than or equal to 25 GPa.
In one possible implementation manner, the method further includes: the antenna comprises an antenna radiation branch section, and a feed point and a grounding point which are electrically connected with the antenna radiation branch section, wherein the antenna radiation branch section is arranged between the ceramic outer frame and the inner frame. Therefore, the radiation branch of the antenna is positioned between the outer ceramic frame and the inner frame, so that the antenna radiation branch is loaded inside the middle frame and hidden between the outer ceramic frame and the inner frame, and the antenna radiation branch is invisible on the frame.
In one possible implementation, the antenna headroom is less than 10 mm. Therefore, the interference of metal around the antenna on the antenna is reduced, and the radiation efficiency of the antenna is ensured.
In one possible implementation, the impedance of the antenna is less than or equal to 5 Ω. This results in an antenna with greater electrical conductivity and greater radiation capability.
In a possible implementation manner, the ceramic outer frame is a seamless ceramic frame, or the ceramic outer frame includes a plurality of ceramic sub-frames, and the ceramic sub-frames are connected to form an annular ceramic outer frame.
A fourth aspect of the embodiments of the present application provides an electronic device, including at least: display screen, back lid and the above-mentioned center, the display screen with the back lid is located respectively the both sides of center, perhaps, electronic equipment includes at least: the display screen, the rear cover and the middle frame are respectively positioned on two sides of the middle frame.
Through including above-mentioned center, reduced the weight of center on the one hand like this for electronic equipment's weight reduces, and on the other hand has realized easily setting up complicated inner structure design on electronic equipment's inner frame, has avoided setting up inner structure design and appearing setting up the great problem of the degree of difficulty on the great ceramic outline of hardness.
A fifth aspect of embodiments of the present application provides a method for manufacturing a rear cover, where the method includes:
an outer ceramic shell and an inner shell of a fiber-reinforced composite material are provided.
And forming a glue layer between the ceramic outer shell and the inner shell.
And pressing the ceramic outer shell, the adhesive layer and the inner shell to form the rear cover.
The rear cover is formed by pressing the outer shell, the adhesive layer and the inner shell, so that on one hand, the weight of the manufactured rear cover is reduced, on the other hand, the ceramic outer shell and the inner shell are fixed together in the pressing process to form the rear cover with a double-layer structure, the outer surface of the rear cover is made of ceramic, and the inner surface of the rear cover is made of fiber reinforced composite materials.
In a possible implementation manner, before forming the glue layer between the outer shell and the inner shell, the method further includes:
and a radiation branch of the antenna is arranged between the ceramic outer shell and the inner shell.
Like this at the pressfitting in-process, set up antenna radiation branch knot between ceramic shell and inner shell, realized the inside setting of antenna radiation branch knot back lid.
A sixth aspect of the embodiments of the present application provides a method for manufacturing an intermediate frame, where the method includes:
and providing a ceramic outer frame, an inner frame made of fiber reinforced composite material and a metal middle plate.
And forming a glue layer between the ceramic outer frame and the inner frame.
And pressing the ceramic outer frame, the adhesive layer and the inner frame to form a frame.
And connecting the frame with the outer edge of the metal middle plate to form a middle frame.
Through inciting somebody to action the pottery outline the glue film with interior frame carries out the pressfitting and forms the frame, makes the frame weight that makes so on the one hand reduce, and on the other hand is together fixed with pottery outline and interior frame in the pressfitting process, forms the surface for pottery, the internal surface is fiber reinforced composite's bilayer structure's frame, and preparation simple process and reliable.
In a possible implementation manner, before forming the glue layer between the ceramic outer frame and the inner frame, the method further includes:
and a radiation branch of the antenna is arranged between the ceramic outer frame and the inner frame.
Like this at the pressfitting in-process, set up antenna radiation minor matters between outer frame of pottery and interior frame, realized the inside setting of antenna radiation minor matters at the frame.
Drawings
Fig. 1 is a schematic perspective view of an electronic device according to an embodiment of the present disclosure;
fig. 2 is an exploded schematic view of an electronic device according to an embodiment of the present disclosure;
fig. 3 is an exploded schematic view of a middle frame of an electronic device according to an embodiment of the present disclosure;
fig. 4 is a schematic diagram illustrating a disassembled structure of a rear cover of an electronic device according to an embodiment of the present application;
fig. 5 is a schematic view of a split cross-sectional structure of a ceramic outer frame and an inner frame and an antenna radiation branch in an electronic device according to an embodiment of the present disclosure;
fig. 6 is a schematic circuit diagram of a ceramic outer frame and an inner frame and an antenna in an electronic device according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a ceramic outer frame in an electronic device according to an embodiment of the present disclosure;
fig. 8 is a schematic structural diagram of a ceramic outer frame and an inner frame and an antenna radiation branch in an electronic device according to an embodiment of the present disclosure;
fig. 9 is a schematic diagram illustrating a disassembled structure of the antenna radiation branches and the ceramic outer shell and the ceramic inner shell in the electronic device according to an embodiment of the present disclosure;
fig. 10 is a schematic perspective view of an electronic device according to an embodiment of the present application;
fig. 11 is an exploded view of an electronic device according to an embodiment of the present disclosure;
fig. 12 is an exploded schematic view of a battery cover of an electronic device according to an embodiment of the present disclosure;
fig. 13 is a schematic cross-sectional view illustrating a battery cover of an electronic device according to an embodiment of the disclosure;
fig. 14 is a schematic partial cross-sectional view illustrating a battery cover and an antenna radiation branch of an electronic device according to an embodiment of the disclosure;
fig. 15 is a schematic cross-sectional view of another part of a battery cover and an antenna radiation branch of an electronic device according to an embodiment of the present application.
Description of reference numerals:
100. 200-mobile phone; 10. 210-a display screen; 20-middle frame; 21-metal middle plate; 22-a frame; 221-ceramic outer frame;
2211-a first ceramic sub-frame; 2212-a second ceramic sub-frame; 2213-a third ceramic sub-frame;
2214-fourth ceramic sub-frame; 2215-fifth ceramic sub-frame; 2216-sixth ceramic sub-frame;
2217-seventh ceramic sub-frame; 2218-eighth ceramic sub-frame; 222-inner border; 30. 230-a circuit board;
40. 240-a battery; 50-rear cover; 61-a first antenna radiating branch; 62-a second antenna radiating stub;
63-a third antenna radiating stub; 64-a fourth antenna radiating branch; 65-a fifth antenna radiating branch;
66-a sixth antenna radiating stub; 601-a first antenna; 602-a second antenna; 603-a third antenna;
604-a fourth antenna; 605-a fifth antenna; 606-a sixth antenna;
a1, a2, A3, a4, a5, a6, b1, b2, b3, b4, b5, b 6-corner; a1 — first feeding point;
a 2-second feeding point; a 3-third feeding point; a 4-fourth feeding point; a 5-fifth feeding point;
a 6-sixth feeding point; b1 — first feed; b2 — second feed; b3 — third feed; b4-fourth feed;
b5-fifth feed; b6 — sixth feed; c1 — a first ground point; c 2-second ground point; c 3-third ground point;
c 4-fourth ground, c 5-fifth ground, c 6-sixth ground; 220-middle plate; 250-a battery cover;
52. 251-a ceramic housing; 2511-outer case; 2512-outer bottom shell; 51. 252-an inner shell;
2521-the inboard casing; 2522-inner base shell; 260-antenna radiation branch.
Detailed Description
The terminology used in the description of the embodiments of the present application is for the purpose of describing particular embodiments of the present application only and is not intended to be limiting of the application, as the embodiments of the present application will be described in detail below with reference to the accompanying drawings.
The embodiment of the present application provides an electronic device, including but not limited to a mobile or fixed terminal having a frame or a housing, such as a mobile phone, a tablet computer, a notebook computer, an ultra-mobile personal computer (UMPC), a handheld computer, an intercom, a netbook, a POS machine, a Personal Digital Assistant (PDA), a car recorder, a wearable device, a virtual reality device, a wireless usb disk, a bluetooth sound/earphone, or a vehicle-mounted front-end device.
In the embodiment of the present application, the mobile phone 100 is taken as the above-mentioned electronic device for example to explain, wherein a scene that the middle frame of the mobile phone 100 adopts the ceramic outer frame and the ceramic inner frame is set as the scene one, a scene that the antenna radiation branch is arranged between the ceramic outer frame and the ceramic inner frame of the mobile phone 100 is set as the scene two, and a scene that the battery cover of the mobile phone 100 adopts the ceramic outer shell and the inner shell is set as the scene three.
Next, the structure of the mobile phone 100 is described for a scene one, a scene two, and a scene three, respectively.
Scene one
In the embodiment of the present application, referring to fig. 1 and fig. 2, the mobile phone 100 may include: the display screen 10 and the rear cover 50, and the middle frame 20, the circuit board 30 and the battery 40 may be disposed between the display screen 10 and the rear cover 50. Wherein, the circuit board 30 and the battery 40 can be disposed on the middle frame 20, for example, the circuit board 30 and the battery 40 are disposed on one side of the middle frame 20 facing the rear cover 50; or the circuit board 30 and the battery 40 may be disposed on a side of the middle frame 20 facing the display screen 10. When the circuit board 30 is disposed on the middle frame 20, the middle frame 20 may be provided with an opening for placing components on the circuit board 30 at the opening of the middle frame 20.
When the battery 40 is disposed on the middle frame 20, for example, a battery compartment may be disposed on a surface of the rear cover 50 facing the middle frame 20, and the battery 40 is mounted in the battery compartment (as shown by a dashed box in fig. 2). In this embodiment, the battery 40 may be connected to the charging management module and the circuit board 30 through a power management module, and the power management module receives input from the battery 40 and/or the charging management module and supplies power to the processor, the internal memory, the external memory, the display screen 10, the camera, the communication module, and the like. The power management module may also be used to monitor parameters such as battery 40 capacity, battery 40 cycle count, battery 40 state of health (leakage, impedance), etc. In other embodiments, the power management module may also be disposed in the processor of the circuit board 30. In other embodiments, the power management module and the charging management module may be disposed in the same device.
The Display screen 10 may be an Organic light-Emitting Diode (O L ED) Display screen or a liquid Crystal Display (L acquired Crystal Display, L CD), it should be understood that the Display screen 10 may include a Display and a touch device, the Display is used for outputting Display content to a user, and the touch device is used for receiving a touch event input by the user on the Display screen 10.
The rear cover 50 may be a metal rear cover, a glass rear cover, a plastic rear cover, or a ceramic rear cover, and in this embodiment, the material of the rear cover 50 is not limited.
It is to be understood that the illustrated structure of the embodiment of the present application does not specifically limit the mobile phone 100. In other embodiments of the present application, the handset 100 may include more or fewer components than shown, or some components may be combined, some components may be separated, or a different arrangement of components may be used. For example, the handset 100 may also include a camera (e.g., front camera and rear camera) and a flash.
In the embodiment of the present application, as shown in fig. 2, the middle frame 20 may include a metal middle plate 21 and a frame 22, and the frame 22 is disposed along the periphery of the metal middle plate 21 for one circle, for example, the frame 22 may include a top edge and a bottom edge disposed oppositely, and a left edge and a right edge disposed oppositely between the top edge and the bottom edge. The connection between the frame 22 and the metal middle plate 21 includes, but is not limited to, welding, clamping, and integral injection molding. The material of the metal middle plate 21 may be aluminum or an aluminum alloy, or the material of the metal middle plate 21 may be a stainless steel material. It should be noted that the material of the metal middle plate 21 includes, but is not limited to, the above materials.
Generally speaking, the frame 22 can be a metal frame, a glass frame, a plastic frame or a ceramic frame, but when the metal frame is adopted, the metal frame needs to form an antenna radiation branch through a broken seam, so that a broken seam exists on the metal frame, on one hand, the appearance of the metal frame is affected, and on the other hand, the metal frame is enabled to have the effect on the strength due to the broken seam and damage the integrity of the metal middle frame. When the glass frame is used, the mobile phone 100 is easily broken when dropped. When the plastic frame is adopted, the flatness of the plastic surface and the texture after surface treatment cannot meet the requirements of users on the appearance of the mobile phone 100. When the ceramic frame is adopted, the weight of the ceramic frame is 15-18g heavier than that of a glass frame with the same thickness, and when the thickness of the ceramic frame is reduced, the strength of the ceramic frame cannot meet the requirement. On the other hand, because the ceramic has high hardness, when the ceramic frame is adopted, the complex internal structure design is not easy to realize on the ceramic frame.
Based on the above description, in the embodiment of the present application, as shown in fig. 3, the frame 22 may include: the frame 22 comprises an inner frame 222 and a ceramic outer frame 221, wherein the inner frame 222 and the ceramic outer frame 221 are made of fiber reinforced composite materials, and the ceramic outer frame 221 can surround the outer side surface of the inner frame 222 to form a double-layer structure comprising the inner frame 222 and the outer frame. When the ceramic outer frame 221 and the inner frame 222 are disposed, the ceramic outer frame 221 and the inner frame 222 can be sleeved together, the ceramic outer frame 221 is located at the outer side, the inner frame 222 is located at the inner side, and the ceramic outer frame 221, the inner frame 222 and the metal middle plate 21 form the middle frame 20 of the electronic device.
In the embodiment of the present application, the inner frame 222 may be a frame made of Fiber Reinforced Polymer (FRP). The fiber-reinforced composite material may be, for example, a composite plate formed by molding a Matrix material (Matrix) and reinforcing fibers (i.e., Reinforcement).
The reinforcing fiber may include, but is not limited to, glass fiber, carbon fiber, boron nitride fiber, silicon carbide fiber, alumina fiber, boron fiber, zirconia fiber, aramid fiber, or ultra-high molecular weight polyethylene fiber. Wherein, the reinforced fiber can be short fiber with the length of 0.1-2mm, or the reinforced fiber can be long fiber with the length of more than 2 mm. The matrix material may be a plastic matrix. For example, the fiber-reinforced composite material may be a glass fiber board made of glass fibers (e.g., long fibers) and a plastic material (e.g., plastic), or the fiber-reinforced composite material may be a carbon fiber board made of carbon fibers and a plastic material, such that the inner frame 222 may be a frame made of a glass fiber board or a carbon fiber board. Therefore, in the embodiment of the present application, the frame 22 is a two-layer frame composed of the ceramic outer frame 221 and the inner frame 222 made of the fiber reinforced composite material, and the inner frame 222 made of the fiber reinforced composite material contains the reinforced fiber, so the inner frame 222 made of the fiber reinforced composite material has a relatively high strength and a certain toughness, so the inner frame 222 made of the fiber reinforced composite material can provide strength support, so the thickness of the ceramic outer frame 221 can be reduced, and thus the weight of the frame 22 composed of the ceramic outer frame 221 and the inner frame 222 made of the fiber reinforced composite material can be greatly reduced and the strength requirement of the frame 22 can be met.
In the embodiment of the present application, it should be noted that, when the ceramic outer frame 221 and the inner frame 222 form the frame 22, the inner frame 222 may be disposed around the inner sidewall of the ceramic outer frame 221, so that the inner frame 222 may cover the entire inner sidewall of the ceramic outer frame 221.
Through detection, the weight of the middle frame 20 consisting of the metal middle plate 21, the inner frame 222 made of the fiber reinforced composite material and the ceramic outer frame 221 is reduced by 5-20g compared with the weight of the middle frame consisting of the pure ceramic outer frame and the metal middle plate with the same size. The weight of the middle frame 20 composed of the metal middle plate 21, the inner frame 222 made of the fiber reinforced composite material and the ceramic outer frame 221 is close to that of the metal middle frame with the same size.
Therefore, the electronic device that this application provided, include the interior frame 222 that ceramic outline 221 and fiber reinforcement combined material made through frame 22, make the thickness of ceramic outline 221 attenuate like this on the one hand, thereby realize electronic device's weight reduction, on the other hand because the inboard of frame 22 is the interior frame 222 that fiber reinforcement combined material made, interior frame 222 can provide the intensity support to ceramic outline 221 like this, make frame 22 satisfy the intensity requirement on the basis of ceramic outline 221 thickness attenuate. In addition, the inner side of the frame 22 is the inner frame 222 made of the fiber reinforced composite material, so that the inner frame 222 has certain toughness, and a complex inner structure design is easily manufactured on the inner frame 222, thereby avoiding the problem of difficult manufacture when manufacturing the inner structure design on the ceramic outer frame 221 with high hardness. In the embodiment of the present application, since the outer side of the frame 22 of the electronic device is the ceramic outer frame 221, the high quality feeling and the high hardness of the frame 22 in the electronic device are also satisfied.
In one possible implementation, as shown in fig. 3, the ceramic outer frame 221 may be a seamless ring structure, for example, the ceramic outer frame 221 is a square ring structure, and the square ring structure may be a continuous ring structure. Alternatively, the ceramic outer frame 221 may be a ring structure formed by splicing a plurality of frames (see fig. 7 described below). The inner frame 222 made of the fiber reinforced composite material may be a ring-shaped structure disposed along an inner sidewall of the ceramic outer frame 221.
In a possible implementation manner, as shown in fig. 3, the ceramic outer frame 221 has four corners, which are a corner a1, a corner a2, a corner A3, and a corner a4, in order to ensure that the four corners are not easily damaged when the mobile phone is dropped, the thicknesses of the side walls of the ceramic outer frame 221 at the four corners may be greater than the thicknesses of the side walls of the ceramic outer frame 221 at the non-corners, so that the strength of the corners of the ceramic outer frame 221 is ensured to be greater, and the four corners of the electronic device are not easily damaged when the mobile phone is dropped.
In a possible implementation manner, when the ceramic outer frame 221 is made of a ceramic material, the strength of the ceramic material may be 300-1700MPa, for example, the ceramic strength of the ceramic outer frame 221 may be 1100MPa, or the ceramic strength of the ceramic outer frame 221 may be 1200 MPa. The ceramic fracture toughness of the ceramic outer frame 221 may be 2-16mpa.m1/2, for example, the ceramic fracture toughness of the ceramic outer frame 221 may be 8mpa.m1/2, or the ceramic fracture toughness of the ceramic outer frame 221 may be 10mpa.m 1/2.
In one possible implementation, when the inner frame 222 is made of a fiber-reinforced composite material, the bending strength of the fiber-reinforced composite material may be greater than or equal to 450MPa, for example, the bending strength of the fiber-reinforced composite material may be 600MPa, or the bending strength of the fiber-reinforced composite material may be 1000 MPa. The flexural modulus of the fiber-reinforced composite material may be ≧ 25GPa, for example, the flexural modulus of the fiber-reinforced composite material may be 30GPa, or the flexural modulus of the fiber-reinforced composite material may be 40 GPa. Therefore, the inner frame 222 made of the fiber reinforced composite material is not easy to break in the pressing process of the ceramic outer frame 221, and the inner frame 222 is ensured to have higher strength and bending performance.
In one possible implementation, the material of the ceramic outer frame 221 may include, but is not limited to, a ceramic material such as zirconia, silicon carbide, silicon nitride, aluminum nitride, or aluminum oxide, for example, the material of the ceramic outer frame 221 may be a zirconia ceramic plate, or the material of the ceramic outer frame 221 may also be an alumina ceramic plate. It should be understood that when the material of the ceramic outer frame 221 is zirconia, silicon carbide, silicon nitride, aluminum nitride or aluminum oxide, it mainly means that when the ceramic outer frame 221 is made of a ceramic material, the main raw material of the ceramic material is zirconia, silicon carbide, silicon nitride, aluminum nitride or aluminum oxide.
In one possible implementation, the wall thickness of ceramic outer rim 221 may be 0.15-0.6mm, for example the wall thickness of ceramic outer rim 221 may be 0.2mm, or the wall thickness of ceramic outer rim 221 may be 0.45 mm. The wall thickness of the inner rim 222 of fibre reinforced composite material may be 0.1-1mm, for example the wall thickness of the inner rim 222 of fibre reinforced composite material may be 0.15mm, or the wall thickness of the inner rim 222 of fibre reinforced composite material may be 0.3 mm. Therefore, the thickness of the frame 22 formed by the ceramic outer frame 221 and the inner frame 222 made of the fiber reinforced composite material may be 0.25-1.6mm, for example, the thickness of the frame 22 may be 0.45mm, or the thickness of the frame 22 may be 1.2 mm.
In a possible implementation manner, when the ceramic outer frame 221, the inner frame 222 made of the fiber reinforced composite material, and the metal middle plate 21 are assembled together, the ceramic outer frame 221 and the inner frame 222 may be formed into an integral frame structure by pressing, and the frame structure formed by the ceramic outer frame 221 and the inner frame 222 is connected to the outer edge of the metal middle plate 21 to form the middle frame 20, for example, the frame structure formed by the ceramic outer frame 221 and the inner frame 222 may be fixed to the outer edge of the metal middle plate 21 by means of clamping, welding, or bonding.
In some examples, a glue layer may be disposed between the ceramic outer frame 221 and the inner frame 222 made of fiber reinforced composite material, so that after the ceramic outer frame 221 and the inner frame 222 made of fiber reinforced composite material are pressed together, the ceramic outer frame 221 and the inner frame 222 made of fiber reinforced composite material are tightly combined together through the glue layer.
In one possible implementation manner, the outward side of the ceramic outer frame 221 in the electronic device may be a vertical side, for example, the outward side of the ceramic outer frame 221 may be perpendicular to the display screen 10. Or, the outward surface of the ceramic outer frame 221 of the electronic device may be an arc surface protruding outward, so that on one hand, a user can hold the ceramic outer frame 221 of the electronic device conveniently, on the other hand, the appearance of the ceramic outer frame 221 is more attractive, and the ceramic outer frame 221 has a lighter weight under the same thickness.
In the embodiment of the present application, the middle frame 20 of the electronic device may be manufactured by the following steps:
step A): a metal midplane 21, a ceramic outer frame 221, and an inner frame 222 of fiber-reinforced composite material are provided.
The metal middle plate 21 may be an aluminum or aluminum alloy plate, or the metal middle plate 21 may also be a stainless steel plate. The ceramic outer frame 221 may be a seamless ceramic frame, for example, the ceramic outer frame 221 is a continuous annular structure, so that on one hand, it is ensured that no gap exists on the ceramic outer frame 221, and the integrity of the ceramic outer frame 221 is ensured, so that the appearance structure of the frame 22 is more beautiful, and on the other hand, when the continuous ceramic outer frame 221 is adopted, the ceramic outer frame 221 and the inner frame 222 made of the fiber reinforced composite material may be assembled by one-time pressing. Of course, the ceramic outer frame 221 may also be formed by splicing a plurality of ceramic outer frames 221. The inner frame 222 may be a continuous annular structure, or may be formed by splicing multiple inner frames 222.
When the metal middle plate 21 is provided, the metal middle plate 21 may be formed by stamping or machining with a Computer Numerical Control (CNC), an opening and a battery compartment for the battery 40 are formed on the metal middle plate 21, and a notch structure or a meshing structure is formed on an outer edge of the metal middle plate 21.
When the ceramic outer frame 221 is provided, the ceramic outer frame 221 may be obtained by rough machining and surface treatment of a ceramic blank, wherein during rough machining of the ceramic blank, for example, by CNC or laser machining, the edge and bottom remnants of the inner cavity of the ceramic blank may be removed, and the frame may be trimmed. After the rough machining, surface treatment may be performed, for example, by polishing both surfaces of the frame body with a polishing machine to a desired thickness.
When the inner frame 222 made of the fiber-reinforced composite material is provided, for example, the fiber-reinforced composite material may be made into a plate, and the fiber-reinforced composite plate is subjected to rough machining and surface treatment to obtain the inner frame 222. During rough machining of the fiber reinforced composite board, for example, the residues on the inner cavity edge and the bottom of the fiber reinforced composite board can be removed in a CNC or laser machining mode, and the frame body is trimmed.
Step B): a glue layer is provided between the ceramic outer frame 221 and the inner frame 222 made of the fiber reinforced composite material.
When the adhesive layer is disposed, the adhesive layer may be disposed on the inner side surface of the ceramic outer frame 221 (i.e., the surface of the ceramic outer frame 221 facing the inner frame 222), or the adhesive layer may be disposed on the outer side surface of the inner frame 222 (i.e., the surface of the inner frame 222 facing the ceramic outer frame 221). The glue film can be resin glue, wherein, the thickness of glue film can set up according to actual demand. The ceramic outer frame 221 and the inner frame 222 may be pre-fixed together by a glue layer before lamination. In addition, the glue layer enables the ceramic outer frame 221 and the inner frame 222 to be tightly combined together after being pressed.
Step C): and performing pressing treatment on the ceramic outer frame 221, the adhesive layer and the inner frame 222 to form the frame 22.
Wherein, during interior frame 222 and ceramic outline 221 pressfitting, for example, can adopt the high temperature hot pressing mode to carry out the pressfitting, in the hot pressing process, interior frame 222 that fibre reinforced composite made is in close combination with ceramic outline 221 together, interior frame 222 and ceramic outline 221 constitute the frame 22 that includes pottery and fibre reinforced composite, because including interior frame 222 that fibre reinforced composite made, institute can provide the intensity support by interior frame 222, the thickness of ceramic outline 221 can attenuate like this, make interior frame 222 and ceramic outline 221 constitute compound frame 22 than the frame of pure pottery under the same weight greatly reduced of thickness, the middle frame 20 weight reduction that forms like this, when this middle frame 20 is used in electronic equipment, electronic equipment's weight reduction.
Step D): the frame 22 is connected to the outer edge of the metal middle plate 21 to form the middle frame 20.
When the frame 22 is connected to the outer edge of the middle metal plate 21, for example, the frame 22 and the outer edge of the middle metal plate 21 may be fixedly connected by snapping, welding or bonding. When the outer edge of the metal middle plate 21 is connected to the frame 22, for example, the outer edge of the metal middle plate 21 may be connected to the inner side surface of the inner frame 222 in the frame 22.
Wherein, in this embodiment of the application, in order to increase the binding force between the outer frame 221 and the inner frame 222, before the outer frame 221 and the inner frame 222 are pressed together, the method further includes: the inner side wall of the ceramic outer frame 221 and/or the outer side wall of the inner frame 222 are roughened, for example, the ceramic outer frame 221 can be positioned on a fixture by using a positioning pin, and the inner side wall of the ceramic outer frame 221 is automatically processed by using a probe tool to perform a program after the cylinder is tightened, so that a concave-convex structure is formed. When the glue layer is disposed on the inner side of the ceramic outer frame 221 or the outer side wall of the inner frame 222, the contact area between the ceramic outer frame 221 and the inner frame 222 is increased through the glue layer, and after the pressing, the bonding force between the inner frame 222 and the ceramic outer frame 221 is larger.
In a possible implementation manner, before the pressing of the ceramic outer frame 221 and the inner frame 222 made of the fiber reinforced composite material, the method further includes: at least one antenna radiation branch is arranged on the inner side surface of the ceramic outer frame 221, so that the antenna radiation branch is pressed between the ceramic outer frame 221 and the inner frame 222 in the injection molding process.
In the embodiment of the present application, after step D), the method further includes: carry out inner chamber CNC finish machining with center 20, for example embolia iron inner chamber tool with center 20 in, can use UV glue bonding fixed, use the fixed machine of going up of magnet tool to fix a position, use the detecting head to carry out accurate location processing.
Wherein, after the finish machining of inner chamber CNC, still include: the contour of the ceramic outer frame 221 is subjected to CNC machining, for example, positioning and fixing the center 20 after CNC finish machining, and the contour of the ceramic outer frame 221 is machined to obtain a desired contour.
Wherein, after the CNC processing of ceramic outline 221 appearance, still include: rough polishing, grinding, side hole processing, fine polishing of the ceramic outer frame 221 and surface treatment of the ceramic outer frame 221. For example, the ceramic outer frame 221 is first rough polished (for example, rough polishing of the long side R corner and rough polishing of the short side R corner), after the rough polishing, the side surfaces of the ceramic outer frame 221 and the inner frame 222 made of the fiber reinforced composite material are punched, the holes are machined by using CNC, after the punching, the ceramic outer frame 221 is finish polished (for example, 3D surface finish polishing), and after the finish polishing, the ceramic outer frame 221 is surface-treated, for example, a coating layer may be plated on the surface of the ceramic outer frame 221 by using an evaporation method, the coating layer may be an anti-fingerprint film (AF), and the coating layer makes the surface of the ceramic less prone to generate fingerprints, and has good wear resistance. Or a film layer can be deposited on the surface of the ceramic outer frame 221 by Physical Vapor Deposition (PVD), so that fingerprints are not easy to generate on the surface of the ceramic, and the wear resistance is good.
In one possible implementation, as shown in fig. 4, the rear cover 50 may include an inner shell 51 and a ceramic outer shell 52 made of a fiber reinforced composite material. The ceramic outer shell 52 and the inner shell 51 are bonded to each other to form the rear cover 50, the outer surface of the rear cover 50 is made of ceramic, and the inner surface of the rear cover is made of fiber reinforced composite material. Where the fiber-reinforced composite material may be referred to above, for example, the fiber-reinforced composite material may be a glass fiber board made of glass fibers and plastic such that the inner shell 51 is an inner shell made of a glass fiber board, or the fiber-reinforced composite material may be a carbon fiber board made of carbon fibers and plastic such that the inner shell 51 is an inner shell made of a carbon fiber board.
In the embodiment of the present application, the inner shell 51 made of the fiber reinforced composite material can provide strength support, so that the thickness of the ceramic outer shell 52 can be reduced, and compared with a pure ceramic rear cover, the weight of the rear cover 50 provided in the embodiment of the present application can be reduced, thereby ensuring the weight reduction of the electronic device. When the inner shell 51 and the ceramic outer shell 52 made of the fiber reinforced composite material are assembled, an adhesive layer may be disposed between the inner shell 51 and the ceramic outer shell 52, and the inner shell 51 and the ceramic outer shell 52 are bonded together by pressing. The rear cover 50 composed of the inner shell 51 and the ceramic outer shell 52 can be connected with the frame 22 in an adhesion or clamping manner to form an outer shell of the mobile phone, so that the outer surface of the outer shell of the mobile phone is made of a full ceramic material, and the electronic device is made of a full ceramic outer shell on the premise of reducing weight. Of course, in some examples, the rear cover 50 may include, but is not limited to, an inner shell 51 and a ceramic outer shell 52 made of a fiber-reinforced composite material.
Scene two
In the embodiment of the present application, in order to implement signal transmission and reception, at least one antenna is disposed in the electronic device, and the antenna includes an antenna radiation branch, and a feeding point and a grounding point electrically connected to the antenna radiation branch, wherein in the embodiment of the present application, as shown in fig. 5, the antenna radiation branch may be disposed between the ceramic outer frame 221 and the inner frame 222 made of the fiber reinforced composite material, for example, a plurality of antenna radiation branches may be disposed at intervals on a side wall of the ceramic outer frame 221 facing the inner frame 222. The plurality of antenna radiating branches may include a first antenna radiating branch 61, a second antenna radiating branch 62, a third antenna radiating branch 63, a fourth antenna radiating branch 64, a fifth antenna radiating branch 65, and a sixth antenna radiating branch 66. Alternatively, in the embodiment of the present application, the antenna radiation branch may be disposed on the side wall of the inner frame 222 made of the fiber reinforced composite material facing the ceramic outer frame 221. Or an antenna radiation branch may be disposed on a side wall of the inner frame 222 facing away from the ceramic outer frame 221.
Wherein, antenna radiation branch can realize setting through multiple mode when setting up between interior frame 222 that ceramic outline 221 and fiber reinforced composite made, in a possible implementation, can adopt electroplating or radium carving mode to form antenna radiation branch on ceramic outline 221's inside wall, in another possible implementation, can adopt the rendition mode, with silver thick liquid rendition in order to form antenna radiation branch on ceramic outline 221's the inside wall, ceramic outline 221 and metal medium plate 21 are when moulding plastics, ceramic outline 221 and the metal medium plate 21 that will be provided with antenna radiation branch are connected as an organic wholely through the mode of moulding plastics, antenna radiation branch moulds plastics between ceramic outline 221 and interior frame 222. In the embodiment of the present application, the material of each antenna radiation branch includes, but is not limited to, silver, gold, nickel, stainless steel, or graphite.
Exemplarily, as shown in fig. 6, 6 antennas are disposed in the electronic device, which are a first antenna 601, a second antenna 602, a third antenna 603, a fourth antenna 604, a fifth antenna 605, and a sixth antenna 606, where the first antenna 601 may include: a first antenna radiation stub 61, a first feeding point a1, a first grounding point c1 and a first feed B1. The second antenna 602 may include: a second antenna radiating stub 62, a second feed point a2, a second ground point c2, and a second feed B2. The third antenna 603 may include: a third antenna radiation branch 63, a third feeding point a3, a third grounding point c3 and a third feed B3. The fourth antenna 604 may include: a fourth antenna radiation branch 64, a fourth feeding point a4, a fourth grounding point c4 and a fourth feed B4. The fifth antenna 605 may include: a fifth antenna radiating stub 65, a fifth feed point a5, a fifth ground point c5 and a fifth feed B5. The sixth antenna 606 may include: a sixth antenna radiating stub 66, a sixth feed point a6, a sixth ground point c6, and a sixth feed B6. The antenna radiation branches are connected with the feed sources, and the feed sources can feed high-frequency current into the antenna radiation branches through the feed points, and the high-frequency current is emitted outwards on the antenna radiation branches in an electromagnetic wave mode. It should be noted that the installation positions of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605 and the sixth antenna 606 include but are not limited to the installation positions shown in fig. 6, and the installation positions of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605 and the sixth antenna 606 may be adjusted according to actual requirements.
Each feed point and each feed source can be positioned on the circuit board 30, each feed source can be electrically connected with the radio frequency chip or the main chip on the circuit board 30, each feed point is arranged close to the antenna radiation branch, and each feed point and the feed source can be electrically connected through a feed line. Since the metal middle plate 21 is electrically connected to the grounding point of the circuit board 30, in the embodiment of the present application, one end of each grounding point is electrically connected to the antenna radiation branch, and the other end of each grounding point may be connected to the metal middle plate 21 to achieve grounding, or may be connected to the grounding point of the circuit board 30 to achieve grounding.
In the embodiment of the present application, each feeding point and each antenna radiation branch may be electrically connected through a contact, for example, a feeding point structure is connected to the antenna radiation branch, for example, the feeding point structure may be connected to the antenna radiation branch through a connection manner such as thermal melting or welding, and the other end of the feeding point structure is electrically connected to a feeding point on the circuit board 30, and it should be noted that the material of the feeding point structure includes, but is not limited to, a copper sheet, an iron sheet, a nickel sheet, a screw, or a Printed Circuit Board (PCB). Or the feed point is electrically connected with the antenna radiation branch node in a non-contact way, and the feed point and the antenna radiation branch node realize the feeding of high-frequency current into the antenna radiation branch node in a coupling way.
It should be noted that, in the embodiment of the present application, the connection between each feeding point and each antenna radiation branch includes, but is not limited to, the connection manner shown in fig. 6, in other examples, the first antenna radiation branch 61, the second antenna radiation branch 62, and the third antenna radiation branch 63 may be fed with a high-frequency current through the second feeding point a2, the first antenna radiation branch 61 and the third antenna radiation branch 63 may serve as radiation branches of the second antenna 602, the second antenna 602 couples and excites the first antenna 601 and the third antenna 603, and the first antenna 601 and the third antenna 603 serve as parasitic antennas of the second antenna 602. In other examples, the number of feed points that each antenna includes, but is not limited to, one, e.g., the fifth antenna 605 may include two feed points that may be electrically connected to the second antenna radiating stub 62.
In the embodiment of the present application, as shown in fig. 6, the first antenna 601, the second antenna 602, and the third antenna 603 may be main antennas. For example, the second antenna 602 may be a low frequency antenna (700-. For example, the first antenna 601 may be a high frequency antenna (2.3-2.69GHz) and the third antenna 603 may be a medium-high frequency antenna, or the first antenna 601 may be a medium frequency antenna (1.71-2.2GHz) and the third antenna 603 may be a high frequency antenna (2.3-2.69 GHz).
It should be noted that the main antenna includes, but is not limited to, the first antenna 601, the second antenna 602, and the third antenna 603, for example, the main antenna may also be one or two of the first antenna 601, the second antenna 602, and the third antenna 603, or the main antenna may include the fourth antenna 604, the fifth antenna 605, and the sixth antenna 606. The main antenna specifically selects a corresponding antenna according to actual requirements. The first antenna 601, the second antenna 602, and the third antenna 603 may include, but are not limited to, a main antenna, and the frequency bands of the first antenna 601, the second antenna 602, and the third antenna 603 include, but are not limited to, low frequency (700-. The first antenna 601, the second antenna 602, and the third antenna 603 may be single-frequency antennas or multi-frequency antennas.
The low frequency bands of the main antenna may include, but are not limited to, the B5 band (824-894MHz), the B8 band (880-960MHz), and the B28 band (703-803MHz), the intermediate frequency band of the main antenna may include, but is not limited to, the B3 band (1710-1880MHz) and the B1 band (1920-2170MHz), and the high frequency band of the main antenna may include, but is not limited to, the B7 band (2500-2690 MHz).
Or, with the development of 5G technology, the operating frequency band of the main antenna may also cover the 5G frequency band, for example, the operating frequency band of the main antenna may also include the frequency bands of a 5G system, such as (3300-. It should be noted that the 5G frequency band of the main antenna may include, but is not limited to, a frequency band below 6GHz or above.
The fourth antenna 604 may be a WIFI antenna, where an operating frequency band of the WIFI antenna may be (2400-. Alternatively, the fourth antenna 604 may be a Global Positioning System (GPS) antenna, wherein an operating frequency band of the GPS antenna may be (1575 ± 100MHz), or the fourth antenna 604 may also be a bluetooth antenna, and an operating frequency band of the bluetooth antenna may be (2400-. It should be noted that the fourth antenna 604 includes, but is not limited to, a WIFI antenna or a GPS antenna, and the fourth antenna 604 may also be another antenna. The operating frequency band of the fourth antenna 604 includes, but is not limited to, 2400 + 2500MHz, (4900 + 5900MHz), or (1575 ± 100 MHz).
The fifth antenna 605 may be a diversity antenna, and the operating frequency bands of the diversity antenna may include, but are not limited to, a B5 frequency band (824-894MHz), a B8 frequency band (880-960MHz), a B28 frequency band (703-803MHz), a B3 frequency band (1710-1880MHz), a B7 frequency band (2500-2690MHz), and a B1 frequency band (1920-2170 MHz). It should be noted that, with the development of the 5G technology, the operating frequency band of the diversity antenna may also cover the 5G frequency band, for example, the operating frequency band of the diversity antenna may also include the frequency bands of the 5G system, such as (3300-. It should be noted that the 5G frequency band of the diversity antenna may include, but is not limited to, a frequency band below or above 6 GHz. The fifth antenna 605 includes, but is not limited to, a diversity antenna, and may also be other antennas, such as a WIFI antenna or a main antenna, and the operating frequency band of the fifth antenna 605 includes, but is not limited to, a low-medium high frequency band.
The sixth antenna 606 may be a diversity Multiple-Input Multiple-Output (MIMO) antenna, wherein the diversity MIMO antenna may cover medium and low frequency bands (e.g., low frequency is 700-960MHz, intermediate frequency is 1.71-2.2GHz, and high frequency is 2.3-2.7 GHz). It should be noted that, with the development of the 5G technology, the operating frequency band of the diversity MIMO antenna may also cover the 5G frequency band, for example, the operating frequency band of the diversity MIMO antenna may also include the frequency bands of the 5G system, such as (3300-. It should be noted that the 5G frequency band of the diversity MIMO antenna may include, but is not limited to, a frequency band below 6GHz or above. In this embodiment of the present application, the sixth antenna 606 may also be a WIFI antenna.
It should be noted that the categories of the fourth antenna 604, the fifth antenna 605 and the sixth antenna 606 include, but are not limited to, the above various antennas, and in practical applications, the positions of the WIFI antenna, the diversity antenna and the MIMO antenna may be adjusted according to actual needs.
In a possible implementation manner, the material impedance of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605 and the sixth antenna 606 is not higher than 5 Ω, and it should be understood that in this embodiment of the present application, the material impedance of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605 and the sixth antenna 606 specifically refers to the material impedance of the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65 and the sixth antenna radiation branch 66. In the embodiment of the present application, impedances of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605, and the sixth antenna 606 may be 1 Ω. Alternatively, the impedances of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605, and the sixth antenna 606 may be 3 Ω. The impedances of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605 and the sixth antenna 606 may be the same or different. By setting the material impedance of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605, and the sixth antenna 606 to be within 5 Ω, the electrical conductivity of the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65, and the sixth antenna radiation branch 66 is relatively high, and the radiation efficiency of the antenna is relatively high during radiation, so that the performance of the antenna is improved.
In one possible implementation, the clearance of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605 and the sixth antenna 606 may be less than 10mm, and it is understood that the clearance of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605 and the sixth antenna 606 refers to the distance between the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65 and the sixth antenna radiation branch 66 and the metal material (e.g., the metal midplane 21 or the circuit board 30). For example, the headroom of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605, and the sixth antenna 606 may be 1mm, or the headroom of the first antenna 601, the second antenna 602, the third antenna 603, the fourth antenna 604, the fifth antenna 605, and the sixth antenna 606 may be 5 mm.
It should be noted that when the first antenna 601, the second antenna 602, and the third antenna 603 are used as main antennas, the headroom of the first antenna 601, the second antenna 602, and the third antenna 603 may be greater than the headroom of the fourth antenna 604, the fifth antenna 605, and the sixth antenna 606.
In one possible implementation, when the antenna radiation branches are disposed between the ceramic outer frame 221 and the inner frame 222, the ceramic outer frame 221 may be a seamless annular ceramic outer frame surrounding the outer side of the inner frame 222 as shown in fig. 5. Alternatively, the ceramic outer frame may be a plurality of ceramic segments disposed on the outer side of the inner frame 222, for example, as shown in fig. 7, the ceramic outer frame 221 may include a plurality of ceramic sub-frames, the plurality of ceramic sub-frames may form a ceramic outer frame with an annular structure by splicing, and the ceramic outer frame 221 is a discontinuous annular structure.
Illustratively, as shown in fig. 7, the ceramic outer frame 221 may include 8 ceramic sub-frames, for example, a first ceramic sub-frame 2211, a second ceramic sub-frame 2212, a third ceramic sub-frame 2213, a fourth ceramic sub-frame 2214, a fifth ceramic sub-frame 2215, a sixth ceramic sub-frame 2216, a seventh ceramic sub-frame 2217 and an eighth ceramic sub-frame 2218, wherein the 8 ceramic sub-frames 22 are sequentially connected to form the annular ceramic outer frame 221. It should be noted that, the number of the ceramic sub-frames 22 in the ceramic outer frame 221 includes, but is not limited to, 8, and the number of the ceramic sub-frames 22 may be set according to actual requirements.
For example, as shown in fig. 8, 8 ceramic sub-frames 22 are sequentially connected to the outer surface of the inner frame 222, and the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65 and the sixth antenna radiation branch 66 may be located between the inner frame 222 and the 8 ceramic sub-frames. During the preparation, can set up each antenna radiation branch on ceramic sub-frame, pass through pressfitting treatment with each ceramic sub-frame and interior frame 222, combine each ceramic sub-frame 22 and interior frame 222 together, each antenna radiation branch is fixed including between frame 222 and each ceramic sub-frame.
In a possible implementation manner, in the embodiment of the present application, when the rear cover 50 includes the inner shell 51 and the ceramic outer shell 52 made of the fiber reinforced composite material, the plurality of antennas may also be located on the inner shell 51 and the ceramic outer shell 52 made of the fiber reinforced composite material. For example, as shown in fig. 9, a first antenna radiation branch 61, a second antenna radiation branch 62, a third antenna radiation branch 63, a fourth antenna radiation branch 64, a fifth antenna radiation branch 65, and a sixth antenna radiation branch 66 may be provided on a surface of the ceramic outer shell 52 facing the inner shell 51 (i.e., an inner surface of the ceramic outer shell 52). Alternatively, the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65, and the sixth antenna radiation branch 66 may be provided on a surface of the inner case 51 facing the ceramic outer case 52 (i.e., an outer surface of the inner case 51). After the inner shell 51 and the ceramic outer shell 52 made of the fiber reinforced composite material are pressed, the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65 and the sixth antenna radiation branch 66 are pressed between the inner shell 51 and the ceramic outer shell 52.
It should be noted that, when the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65, and the sixth antenna radiation branch 66 are disposed between the inner shell 51 and the ceramic outer shell 52, the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65, and the sixth antenna radiation branch 66 may be disposed near the outer edge of the ceramic outer shell 52 or the inner shell 51.
Wherein, when the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65 and the sixth antenna radiation branch 66 are arranged between the inner shell 51 and the ceramic outer shell 52, the feeding point and the grounding point electrically connected with the first antenna radiation branch 61, the second antenna radiation branch 62, the third antenna radiation branch 63, the fourth antenna radiation branch 64, the fifth antenna radiation branch 65 and the sixth antenna radiation branch 66 respectively can refer to the above description, and in this embodiment of the present application, no further description is given.
In some examples, a portion of the antenna radiating branches may be disposed between the ceramic outer frame 221 and the inner frame 222 made of fiber reinforced composite material, and a portion of the antenna radiating branches may be disposed between the inner shell 51 made of fiber reinforced composite material and the ceramic outer shell 52. Or in other examples, the radiating stub of the antenna may also be provided at the corner position of the ceramic outer frame 221 and the inner surface of the ceramic housing 52. Or the radiating branches of the antenna may also be provided at the corner positions of the inner rim 222 and the outer surface of the inner shell 51.
Or in other examples, when the rear cover 50 is a glass rear cover, the radiation branches of the antenna may be disposed on a surface of the rear cover 50 facing the inside of the mobile phone 100. For example, the radiating branches of the multiple antennas may be disposed on the inner surface of the back cover 50 near the outer edge of the inner surface of the back cover 50. Alternatively, a portion of the radiating branches of the same antenna may be located between the ceramic outer frame 221 and the inner frame 222 made of fiber reinforced composite material, and the remaining radiating branches of the same antenna may also extend to the inner surface of the rear cover 50. In the embodiment of the present application, the positions of the radiation branches of the antenna on the frame 22 and the rear cover 50 include, but are not limited to, the above positions.
Scene three
In the embodiment of the present application, referring to fig. 10 and fig. 11, the mobile phone 200 may include: the display screen 210 and the battery cover 250, and the middle plate 220, the circuit board 230 and the battery 240 can be arranged between the display screen 210 and the battery cover 250. The circuit board 230 and the battery 240 may be disposed in a space surrounded by the battery cover 250 and the middle plate 220. In this embodiment, the periphery of the middle plate 220 may be connected to the battery cover 250, or in other examples, the mobile phone 200 may further include a front shell (not shown), where the front shell may be located between the display screen 210 and the middle plate 220, the middle plate 220 may be connected to the front shell to form an integral structure, and when the mobile phone is mounted, the structure formed by the middle plate 220 and the front shell is assembled with the battery cover 250. The middle plate 220 may be a metal plate, such as an aluminum plate or an aluminum alloy plate.
In the embodiment of the present application, the battery cover 250 is a rear cover or a rear housing of the electronic device, and the difference between the battery cover 250 and the rear cover 50 in the first scenario is as follows: in the present embodiment, the battery cover 250 has side frames (see the inner case 2521 and the outer case 2511 in fig. 13).
In this embodiment, the battery 240 may be connected to the charging management module and the circuit board 230 through a power management module, and the power management module receives input from the battery 240 and/or the charging management module and supplies power to the processor, the internal memory, the external memory, the display screen 210, the camera, the communication module, and the like. The power management module may also be used to monitor parameters such as battery 240 capacity, battery 240 cycle count, battery 240 state of health (leakage, impedance), etc. In other embodiments, the power management module may also be disposed in the processor of the circuit board 230. In other embodiments, the power management module and the charging management module may be packaged in the same device.
The Display screen 210 may be an Organic light-Emitting Diode (O L ED) Display screen 210 or a liquid Crystal Display screen 210 (L acquired Crystal Display, L CD), it should be understood that the Display screen 210 may include a Display and a touch device, the Display is used for outputting Display content to a user, and the touch device is used for receiving a touch event input by the user on the Display screen 210.
It is to be understood that the illustrated structure of the embodiment of the present application does not specifically limit the mobile phone 200. In other embodiments of the present application, handset 200 may include more or fewer components than shown, or some components may be combined, some components may be split, or a different arrangement of components. For example, the cell phone 200 may further include a camera (e.g., a front camera and a rear camera) and a flash.
Generally, the battery cover 250 may be a metal battery cover, a glass battery cover, a plastic battery cover, or a pure ceramic battery cover, but when the battery cover 250 is a metal battery cover, it shields an antenna in the electronic device, so the metal battery cover often needs to be slit or a three-section structure design (for example, the middle of the battery cover is metal, and the top end and the bottom end are made of plastic materials), so the metal battery cover is not a complete structure. When the glass battery cover is adopted, the glass battery cover is easy to crack when falling, and the maintenance cost is high. When the plastic battery cover is adopted, the shell texture of the electronic equipment cannot meet the requirements of users. When the ceramic battery cover is adopted, the weight of the ceramic battery cover is larger than that of a glass battery cover with the same thickness, so that the weight of the electronic equipment is heavier, and when the thickness of the ceramic battery cover is reduced, the strength of the ceramic battery cover cannot meet the requirement. On the other hand, when the ceramic battery cover is adopted, the complex internal structure design is not easy to realize on the ceramic battery cover due to the higher hardness of the ceramic.
Therefore, in the embodiment of the present application, as shown in fig. 12, the battery cover 250 may include a ceramic outer shell 251 and an inner shell 252 made of a fiber reinforced composite material, wherein the inner shell 252 made of a fiber reinforced composite material covers an inner surface of the ceramic outer shell 251 (i.e., a surface of the ceramic outer shell 251 facing the inside of the mobile phone). The ceramic outer case 251 and the inner case 252 are attached to each other to form the battery cover 250 of a double-layered structure composed of ceramic and fiber reinforced composite materials. In the embodiment of the present application, the ceramic outer casing 251 may be located on an outer surface of the mobile phone 200, and the inner casing 252 is located on an inner surface of the ceramic outer casing 251.
In the embodiment of the present application, the fiber-reinforced composite material may be, for example, a composite plate formed by a Matrix material (Matrix) and a reinforcing fiber (i.e., Reinforcement) through a molding process.
The reinforcing fiber may include, but is not limited to, glass fiber, carbon fiber, boron nitride fiber, silicon carbide fiber, alumina fiber, boron fiber, zirconia fiber, aramid fiber, or ultra-high molecular weight polyethylene fiber. Wherein, the reinforced fiber can be short fiber with the length of 0.1-2mm, or the reinforced fiber can be long fiber with the length of more than 2 mm. The matrix material may be a plastic matrix. For example, the fiber-reinforced composite material may be a glass fiber board made of glass fibers (e.g., long fibers) and a plastic material (e.g., plastic), or the fiber-reinforced composite material may be a carbon fiber board made of carbon fibers and a plastic material, such that the inner shell 252 may be a glass fiber board or a carbon fiber board.
Therefore, in the embodiment of the present application, the battery cover 250 includes the ceramic outer shell 251 and the inner shell 252 made of the fiber reinforced composite material, and the inner shell 252 made of the fiber reinforced composite material contains the reinforcing fibers, so the inner shell 252 made of the fiber reinforced composite material has a larger strength and a certain toughness, so the inner shell 252 made of the fiber reinforced composite material can provide a strength support, so the thickness of the ceramic outer shell 251 can be reduced, and compared with a pure ceramic rear cover, the weight of the battery cover 250 composed of the ceramic outer shell 251 and the inner shell 252 made of the fiber reinforced composite material in the embodiment of the present application can be greatly reduced and the strength requirement of the battery cover 250 can be satisfied.
On the other hand, because the inner surface of the battery cover 250 is the inner shell 252 made of the fiber reinforced composite material, and the fiber reinforced composite material has certain toughness, on one hand, a complex internal structure design can be easily arranged on the inner shell 252, so that the problem of great difficulty in arrangement when the complex internal structure design is arranged on the ceramic outer shell 251 with great hardness is avoided, and on the other hand, the inner shell 252 and the ceramic outer shell 251 are not easy to crack when being pressed and fixed.
Therefore, in the electronic device provided by the embodiment of the application, the battery cover 250 comprises the ceramic outer shell 251 and the inner shell 252 made of the fiber reinforced composite material, so that on one hand, the weight of the battery cover 250 is reduced, the weight of the electronic device is reduced, on the other hand, the complicated internal structure design is easily arranged on the inner shell 252 made of the fiber reinforced composite material, and the problem that the arrangement difficulty is high due to the fact that the internal structure design is arranged on the ceramic outer shell 251 with high hardness is solved.
In a possible implementation manner, as shown in fig. 12, the ceramic housing 251 has four corners, namely, a corner b1, a corner b2, a corner b3 and a corner b4, in order to ensure that the mobile phone is not easily damaged when the mobile phone is dropped, the thicknesses of the side walls of the ceramic housing 251 at the four corners are greater than the thicknesses of the side walls of the ceramic housing 251 at the non-corners, so that the strength of the corners of the electronic device is ensured to be greater, and the four corners of the electronic device are not easily damaged when the mobile phone is dropped. It should be noted that in the embodiment of the present application, the thickness of the sidewall at four corners of the inner shell 252 may be greater than the thickness of the sidewall at other portions of the inner shell 252. Thus, the thickness of the sidewall at four corners of the battery cover 250 composed of the ceramic outer case 251 and the ceramic inner case 252 is greater than the thickness of the sidewall at the non-corners of the battery cover 250. When the electronic device is dropped, the battery cover 250 is not easily broken at the four corners.
In one possible implementation, the inner shell 252 made of the fiber-reinforced composite material and the ceramic outer shell 251 may be bonded together by bonding or pressing, for example, a glue layer may be disposed between the inner shell 252 made of the fiber-reinforced composite material and the ceramic outer shell 251, and the inner shell 252 and the ceramic outer shell 251 are pressed to form the battery cover 250, so that the ceramic outer shell 251 and the inner shell 252 are connected, and on the other hand, the battery cover 250 with a double-layer structure may reduce the thickness of the ceramic outer shell 251.
In one possible implementation, as shown in fig. 13, the ceramic shell 251 may include an outer shell 2512 and an outer shell 2511, the outer shell 2511 is disposed around the outer circumference of the outer shell 2512, and the outer shell 2511 and the outer shell 2512 enclose a groove having a U-shaped cross section. Among them, the lateral case 2511 and the outer case 2512 may be integrally formed.
Referring to fig. 13, the inner case 252 made of a fiber reinforced composite material may include an inner bottom case 2522 and an inner side case 2521, wherein the inner side case 2521 is disposed around the outer circumference of the inner bottom case 2522, and the inner side case 2521 and the inner bottom case 2522 enclose a groove having a U-shaped cross-section. When assembled, the outer shell 2511 and the inner shell 2521 are attached to form a side frame of the battery cover 250, the outer bottom shell 2512 and the inner bottom shell 2522 are attached to form a bottom shell (e.g., the bottom surface of the battery cover 250) of the battery cover 250, the cross section of the battery cover 250 is U-shaped, and the U-shaped structure of the battery cover 250 may be provided with the circuit board 230, the battery 240 or other components.
In one possible implementation, the outer casing 2512 and the outer casing 2511 in the ceramic case 251 may be connected by welding, snap-fitting, or fasteners, or the outer casing 2512 and the outer casing 2511 may be integrally formed. The inner bottom shell 2522 and the inner side shell 2521 of the inner housing 252 may be coupled by welding, snap-fitting, or fastening, or the inner bottom shell 2522 and the inner side shell 2521 may be integrally formed.
In one possible implementation, the sum H2 of the thicknesses of the outer casing 2512 of the ceramic outer casing 251 and the inner casing 2522 of the inner casing 252 may be 0.25-1.6mm, for example, the sum H2 of the thicknesses of the outer casing 2512 and the inner casing 2522 may be 0.45mm, or the sum H2 of the thicknesses of the outer casing 2512 and the inner casing 2522 may be 1.0 mm. The sum H1 of the thicknesses of outer shell 2511 of ceramic outer shell 251 and inner shell 2521 of inner shell 252 may be 0.25-1.6mm, for example, the sum H1 of the thicknesses of outer shell 2511 and inner shell 2521 may be 0.6mm, or the sum H1 of the thicknesses of outer shell 2511 and inner shell 2521 may be 1.1 mm.
In one possible implementation, the wall thickness of the outer bottom shell 2512 of the ceramic outer shell 251 may be 0.15-0.6mm, and the wall thickness of the inner bottom shell 2522 of the inner shell 252 may be 0.1-1mm, for example, the wall thickness of the outer bottom shell 2512 of the ceramic outer shell 251 may be 0.3mm, the wall thickness of the inner bottom shell 2522 of the inner shell 252 may be 0.3mm, and the sum of the thicknesses H2 of the outer bottom shell 2512 and the inner bottom shell 2522 may be 0.6 mm. Therefore, in the embodiment of the present application, when the inner shell 252 is made of the fiber reinforced composite material, the wall thickness of the inner shell 252 may be thinner, and when the inner shell is made of plastic, the thickness of the inner shell is at least over 0.3mm, so the inner shell 252 made of the fiber reinforced composite material has a thinner thickness under the requirement of meeting the strength requirement.
Wherein, the wall thickness of the outer shell 2511 of the ceramic outer shell 251 can be 0.15-0.6mm, and the wall thickness of the inner shell 2521 of the inner shell 252 can be 0.1-1 mm. For example, the wall thickness of outer shell 2511 of ceramic outer shell 251 may be 0.2mm, the wall thickness of inner shell 2521 of inner shell 252 may be 0.25mm, and the sum of the thicknesses of outer shell 2511 and inner shell 2521, H1, may be 0.45 mm. It should be understood that the thickness is the maximum thickness of the bottom case and the side rim of the battery cover 250 since some wall thicknesses of the inner case 252 and the ceramic outer case 251 are not uniform.
In a possible implementation manner, when the ceramic housing 251 is made of a ceramic material, the strength of the ceramic material may be 300-. The ceramic fracture toughness of the ceramic case 251 may be 2 to 16mpa.m1/2, for example, the ceramic fracture toughness of the ceramic case 251 may be 8mpa.m1/2, or the ceramic fracture toughness of the ceramic case 251 may be 10mpa.m 1/2.
In one possible implementation, when the inner shell 252 is made of a fiber-reinforced composite material, the bending strength of the fiber-reinforced composite material may be greater than or equal to 450MPa, for example, the bending strength of the fiber-reinforced composite material may be 600MPa, or the bending strength of the fiber-reinforced composite material may be 1000 MPa. The flexural modulus of the fiber-reinforced composite material may be ≧ 25GPa, for example, the flexural modulus of the fiber-reinforced composite material may be 30GPa, or the flexural modulus of the fiber-reinforced composite material may be 40 GPa. Therefore, the inner shell 252 made of the fiber reinforced composite material is not easy to break in the pressing process of the ceramic outer shell 251, and the inner shell 252 is ensured to have higher strength and bending performance.
In one possible implementation, the material of the ceramic housing 251 may include, but is not limited to, zirconia, silicon carbide, silicon nitride, aluminum nitride, or alumina, for example, the material of the ceramic housing 251 may be a zirconia ceramic plate, or the material of the ceramic housing 251 may also be an alumina ceramic plate. It should be understood that when the material of the ceramic housing 251 is zirconia, silicon carbide, silicon nitride, aluminum nitride or alumina, it mainly means that when the ceramic housing 251 is made of a ceramic material, the main raw material of the ceramic material is zirconia, silicon carbide, silicon nitride, aluminum nitride or alumina.
In one possible implementation manner, the battery cover 250 provided in the embodiment of the present application is manufactured by the following steps:
step a): a ceramic outer shell 251 and an inner shell 252 of fibre-reinforced composite material are provided.
In this embodiment, the ceramic shell 251 may be obtained by performing rough machining and surface treatment on a ceramic blank, where during the rough machining of the ceramic blank, for example, the edge and the bottom residue of the inner cavity of the ceramic blank may be removed by CNC or laser machining, so as to trim the ceramic shell 251. After the rough machining, surface treatment is performed, and for example, the surface of the ceramic case 251 may be rough-ground using a grinding machine to a desired thickness.
In the case of providing the inner shell 252 made of the fiber-reinforced composite material, for example, the fiber-reinforced composite material may be made into a plate, and the fiber-reinforced composite plate is subjected to rough machining and surface treatment to obtain the inner shell 252. During rough machining of the fiber reinforced composite board, for example, the residues on the inner cavity edge and the bottom of the fiber reinforced composite board can be removed in a CNC or laser machining mode, and the frame body is trimmed.
Step b): a glue layer is provided between the ceramic outer shell 251 and the inner shell 252 of fibre-reinforced composite material.
The glue layer may be disposed on an inner side surface of the ceramic outer shell 251 (i.e., a surface of the ceramic outer shell 251 facing the inner shell 252), or may be disposed on an outer side surface of the inner shell 252 (i.e., a surface of the inner shell 252 facing the ceramic outer frame 221). The glue film can be resin glue, wherein, the thickness of glue film can set up according to actual demand. The ceramic outer shell 251 and the inner shell 252 may be pre-fixed together by a glue layer before being pressed. In addition, the glue layer enables the ceramic outer shell 251 and the inner shell 252 to be tightly combined together after being pressed.
Step c): the ceramic outer case 251, the gel layer, and the inner case 252 made of the fiber reinforced composite material are subjected to a press-fitting process to form the battery cover 250.
When the inner shell 252 and the ceramic outer shell 251 are pressed, for example, the inner shell 252 made of a fiber reinforced composite material and the ceramic outer shell 251 are tightly combined together in the hot pressing process, the inner shell 252 and the ceramic outer shell 251 form the battery cover 250 containing the ceramic and the fiber reinforced composite material, and the inner shell 252 includes the inner shell 252 made of the fiber reinforced composite material, so that the inner shell 252 can provide strength support, the thickness of the ceramic outer shell 251 can be reduced, the weight of the battery cover 250 formed by the inner shell 252 and the ceramic outer shell 251 is greatly reduced under the condition that the thickness is the same as that of the battery cover 250 made of pure ceramic, and the weight of the battery cover 250 formed in the way is reduced, and when the battery cover is applied to electronic equipment, the weight of the electronic. In addition, in the embodiment of the present application, the battery cover 250 can be formed by pressing the ceramic outer shell 251 and the inner shell 252, and the process is simple.
After the step c), the method further comprises the following steps: the manufactured battery cover 250 is subjected to inner cavity CNC finish machining, for example, the battery cover 250 is sleeved into an iron inner cavity jig, the battery cover can be fixed by UV glue in an adhering mode, a magnet jig is used for fixing the battery cover on a machine for positioning, and a probe is used for performing accurate positioning machining.
In the embodiment of the present application, in order to increase the bonding force between the ceramic outer shell 251 and the inner shell 252 made of the fiber reinforced composite material, before injection molding, the ceramic outer shell 251 further includes: the inner wall of the ceramic outer shell 251 or the outer wall of the inner shell 252 may be roughened, for example, by positioning the ceramic outer shell 251 on a jig using a positioning pin, and after clamping the cylinder, the inner surface of the ceramic outer shell 251 may be automatically processed using a probe tool to form a concave-convex structure. When the inner shell 252 and the ceramic outer shell 251 are pressed together, the contact area between the inner shell 252 and the ceramic outer shell 251 is larger through the glue layer, and the bonding force is larger.
Wherein, after the finish machining of inner chamber CNC, still include: the shape of the ceramic case 251 is subjected to CNC machining, for example, positioning and fixing the battery cover 250 after CNC finish machining, and the shape of the ceramic case 251 is machined to obtain a desired contour.
Wherein, after the CNC machining of the shape of the ceramic shell 251, the method further comprises the following steps: rough polishing of the ceramic shell 251, machining of a side hole, fine polishing of the ceramic shell 251 and surface treatment of the ceramic shell 251. For example, the ceramic housing 251 is first rough polished, after the rough polishing, holes are punched in the bottom case and the side frame of the battery cover 250 (for example, a power-on key hole, a camera assembly hole, etc.), the holes are processed by using a CNC, after the holes are punched, the ceramic housing 251 is finish polished, after the finish polishing, the surface of the ceramic housing 251 is surface-treated, for example, a coating is plated on the surface of the ceramic housing 251 by using an evaporation method, the coating may be an Anti-fingerprint film (AF), and the coating makes the ceramic surface not easy to generate fingerprints, and has good wear resistance. Or a film layer can be deposited on the surface of the ceramic shell 251 by Physical Vapor Deposition (PVD), so that fingerprints are not easy to generate on the surface of the ceramic, and the wear resistance is good.
The battery cover 250 prepared by the above steps is found to have a weight reduced by 10-25g compared with the pure ceramic shell of the same size through detection. The weight of the battery cover 250 is made close to that of a metal battery cover of the same size.
Therefore, according to the electronic device provided by the embodiment of the application, the battery cover 250 comprises the ceramic outer shell 251 and the inner shell 252 made of the fiber reinforced composite material, so that on one hand, the thickness of the ceramic outer shell 251 can be reduced, and thus the weight of the electronic device is reduced, on the other hand, the inner shell 252 made of the fiber reinforced composite material is arranged on the inner side of the battery cover 250, so that the inner shell 252 can provide strength support for the ceramic outer shell 251, and the frame 22 can meet the strength requirement on the basis of reducing the thickness of the ceramic outer shell 251. In addition, the inner side of the battery cover 250 is an inner shell 252 made of a fiber reinforced composite material, and a complex internal structure design is easily manufactured on the inner shell 252, so that the problem that the internal structure design is not easy to manufacture when the ceramic outer shell 251 with high hardness is manufactured is solved. In the embodiment of the present application, the outer surface of the battery cover 250 is the ceramic shell 251, so that the electronic device realizes a full ceramic shell of the electronic device on the premise of reducing the weight, and the requirement of high quality feeling and high hardness of the battery cover 250 of the electronic device is met.
In one possible implementation, an antenna may be disposed in the electronic device, and in the embodiment of the present application, a radiation branch of the antenna may be disposed between the ceramic outer shell 251 and the inner shell 252, for example, as shown in fig. 14, at least one antenna radiation branch 260 may be disposed between the outer bottom shell 2512 of the ceramic outer shell 251 and the inner bottom shell 2522 of the inner shell 252. Alternatively, in some other examples, as shown in fig. 15, at least one antenna radiating branch 260 may be disposed between the outer shell 2511 of the ceramic outer shell 251 and the inner shell 2521 of the inner shell 252 made of fiber-reinforced composite material. Alternatively, at least one antenna radiation branch 260 may be disposed between the outer casing 2512 of the ceramic outer casing 251 and the inner casing 2522 of the inner casing 252 and between the outer casing 2511 of the ceramic outer casing 251 and the inner casing 2521 of the inner casing 252. Alternatively, the antenna radiating branches 260 may also be located between the ceramic outer shell 251 and the inner shell 252 at the corners of the inner surfaces of the outer and outer shells 2511 and 2512.
In the embodiment of the present application, the headroom of the antenna radiation branch 260 may be less than 10mm, for example, the headroom of the antenna radiation branch 260 may be 5 mm. The impedance of the antenna radiating stub 260 may be less than 5 Ω, for example, the impedance of the antenna radiating stub 260 may be 1 Ω. The number and the position of the antenna radiation branches 260 arranged between the inner shell 252 and the ceramic outer shell 251 may refer to the description in the above scenario two, in this embodiment, the number and the antenna type of the antenna radiation branches 260 arranged between the inner shell 252 and the ceramic outer shell 251 are not limited, for example, a main antenna, a MIMO antenna, a WIFI antenna, a bluetooth antenna, a GPS antenna, and a diversity antenna may be arranged. The working frequency band of each antenna may refer to the description in the above scenario two, and is not described in detail in this embodiment.
In the embodiment of the present application, when the antenna radiation branch 260 is disposed, when the battery cover 250 is manufactured, for example, before the ceramic outer shell 251 and the inner shell 252 are pressed, the method further includes: the antenna radiation branch 260 is disposed on an inner surface of the ceramic outer shell 251 (for example, on an inner surface of the outer bottom shell 2512, or on an inner surface of the outer bottom shell 2511), a glue layer is disposed on the inner surface of the ceramic outer shell 251 on which the antenna radiation branch 260 is disposed, the ceramic outer shell 251, the glue layer and the inner shell 252 are pressed, and the antenna radiation branch 260 is pressed between the ceramic outer shell 251 and the inner shell 252.
In the description of the embodiments of the present application, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the embodiments of the application and in the drawings described above, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the embodiments of the present application, and are not limited thereto; although the embodiments of the present application have been described in detail with reference to the foregoing embodiments, those skilled in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims (26)

1. A rear cover, comprising: the fiber-reinforced composite material comprises a ceramic outer shell and an inner shell made of a fiber-reinforced composite material, wherein the inner shell is arranged on the inner surface of the ceramic outer shell.
2. The rear cover according to claim 1, further comprising: the glue layer is positioned between the ceramic outer shell and the inner shell, and the ceramic outer shell, the glue layer and the inner shell are pressed to form the rear cover.
3. The rear cover according to claim 1 or 2, wherein the fiber-reinforced composite material is a composite board made of a plastic matrix and reinforcing fibers, the reinforcing fibers comprising: one or more of glass fibers, carbon fibers, boron nitride fibers, silicon carbide fibers, alumina fibers, boron fibers, zirconia fibers, aramid fibers or ultra-high molecular weight polyethylene fibers.
4. The rear cover according to claim 1, wherein the fiber reinforced composite material is a glass fiber board made of a plastic matrix and glass fibers, and the inner casing is a housing made of the glass fiber board.
5. The rear cover according to claim 1, wherein the wall thickness of the ceramic outer shell is 0.15-0.6mm and the wall thickness of the inner shell is 0.1-1 mm.
6. The rear cover as claimed in claim 1, wherein the ceramic strength of the ceramic shell is 300-1700Mpa, and the fracture toughness of the ceramic is 2-16mpa.m 1/2.
7. The rear cover according to claim 1, wherein the material of the ceramic shell comprises zirconia, silicon carbide, silicon nitride, aluminum nitride, or alumina ceramic.
8. The rear cover according to claim 1, wherein the fiber reinforced composite material has a flexural strength of 450MPa or more and a flexural modulus of 25GPa or more.
9. The rear cover according to claim 1, further comprising: at least one antenna, the antenna includes antenna radiation branch and with feed point and the ground point of antenna radiation branch electricity connection, the antenna radiation branch sets up between ceramic shell and the inner shell.
10. The rear cover as claimed in claim 9, wherein the clearance of the antenna is less than 10 mm.
11. The rear cover according to claim 9 or 10, wherein the impedance of the antenna is 5 Ω or less.
12. The rear cover according to claim 1, wherein the rear cover comprises: the side frame surrounds the outer edge of the bottom shell.
13. The rear cover according to claim 12, wherein the ceramic case includes an outer bottom case and an outer side case surrounding an outer edge of the outer bottom case;
the inner shell comprises an inner bottom shell and an inner side shell arranged around the outer edge of the inner bottom shell, the outer bottom shell and the inner bottom shell form a bottom shell of the rear cover, and the outer side shell and the inner side shell form a side frame of the rear cover.
14. An electronic device, characterized in that it comprises at least: a display and a rear cover as claimed in claim 12 or 13, or,
the electronic device includes at least: display screen, middle frame and back cover according to any of the preceding claims 1-11.
15. An intermediate frame, comprising at least: the metal middle plate and a frame arranged around the outer edge of the metal middle plate are arranged on the metal middle plate;
the frame includes: the metal middle plate comprises an inner frame made of fiber reinforced composite materials and a ceramic outer frame arranged on the outer side face of the inner frame in a surrounding mode, wherein the inner side face of the inner frame is connected with the outer edge of the metal middle plate.
16. The middle frame of claim 15, further comprising: the glue layer is positioned between the ceramic outer frame and the inner frame, and the ceramic outer frame, the glue layer and the inner frame are pressed to form the frame.
17. The middle frame according to claim 15 or 16, wherein the fiber-reinforced composite material is a composite board made of a plastic matrix and reinforcing fibers, the reinforcing fibers comprising: one or more of glass fibers, carbon fibers, boron nitride fibers, silicon carbide fibers, alumina fibers, boron fibers, zirconia fibers, aramid fibers or ultra-high molecular weight polyethylene fibers.
18. The middle frame of claim 17, wherein the fiber reinforced composite material is a glass fiber board made of a plastic matrix and glass fibers, and the inner frame is a frame made of the glass fiber board.
19. The middle frame according to claim 15, wherein the wall thickness of the ceramic outer frame is 0.15-0.6mm and the wall thickness of the inner frame is 0.1-1 mm.
20. The middle frame as claimed in claim 15, wherein the ceramic strength of the ceramic outer frame is 300-1700Mpa, and the ceramic fracture toughness is 2-16mpa.m 1/2.
21. The middle frame according to claim 15, wherein the fiber reinforced composite material has a flexural strength of 450MPa or more and a flexural modulus of 25GPa or more.
22. The middle frame of claim 15, further comprising: the antenna comprises an antenna radiation branch section, and a feed point and a grounding point which are electrically connected with the antenna radiation branch section, wherein the antenna radiation branch section is arranged between the ceramic outer frame and the inner frame.
23. The bezel of claim 22, wherein the antenna headroom is less than 10 mm.
24. The middle frame according to claim 22 or 23, wherein the impedance of the antenna is equal to or less than 5 Ω.
25. The middle frame according to claim 15, wherein the ceramic outer frame is a seamless ceramic frame, or comprises a plurality of ceramic sub-frames connected to form a ring-shaped ceramic outer frame.
26. An electronic device, characterized in that it comprises at least: a display screen, a rear cover and a middle frame as claimed in any one of the preceding claims 15 to 25, or,
the electronic device includes at least: a display screen, a rear cover as claimed in any one of claims 1 to 11 and a middle frame as claimed in any one of claims 15 to 25.
CN201921523510.1U 2019-09-12 2019-09-12 Middle frame, rear cover and electronic equipment Active CN211018910U (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110636158A (en) * 2019-09-12 2019-12-31 华为技术有限公司 Middle frame, rear cover, preparation method of middle frame and rear cover and electronic equipment
CN114686234A (en) * 2020-12-30 2022-07-01 伯恩光学(惠州)有限公司 Thinning agent for rear cover of glass mobile phone
WO2023015929A1 (en) * 2021-08-12 2023-02-16 荣耀终端有限公司 Electronic device rear cover and electronic device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110636158A (en) * 2019-09-12 2019-12-31 华为技术有限公司 Middle frame, rear cover, preparation method of middle frame and rear cover and electronic equipment
WO2021047659A1 (en) * 2019-09-12 2021-03-18 华为技术有限公司 Middle frame, rear cover and preparation method therefor, and electronic device
CN114686234A (en) * 2020-12-30 2022-07-01 伯恩光学(惠州)有限公司 Thinning agent for rear cover of glass mobile phone
WO2023015929A1 (en) * 2021-08-12 2023-02-16 荣耀终端有限公司 Electronic device rear cover and electronic device

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