CN219181872U - Rainproof power supply structure - Google Patents
Rainproof power supply structure Download PDFInfo
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- CN219181872U CN219181872U CN202222896263.8U CN202222896263U CN219181872U CN 219181872 U CN219181872 U CN 219181872U CN 202222896263 U CN202222896263 U CN 202222896263U CN 219181872 U CN219181872 U CN 219181872U
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- Prior art keywords
- circuit board
- power supply
- glue
- lower casing
- supply structure
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/14—Extreme weather resilient electric power supply systems, e.g. strengthening power lines or underground power cables
Abstract
The utility model relates to the field of power structures, and discloses a rainproof power structure which comprises a lower casing and a cover body which are detachably arranged, wherein a circuit board is arranged on the lower casing, a gap is formed between the circuit board and the end face of the lower casing, and an opening for glue filling is formed in the circuit board; the surfaces of the circuit board and the lower shell are covered with an adhesive layer. The waterproof glue can flow into the bottom through the gap between the circuit board and the lower shell, and can flow into the bottom through the opening of the circuit board. The glue filling speed is higher in the mode that the glue flows into the bottom of the lower casing through the opening on the circuit board, and the glue layer formed by the glue filling mode is diffused from the middle to the periphery, so that the glue filling time of the waterproof glue is reduced, and the manual waste of the glue filling for a plurality of times is avoided. Meanwhile, the contact area between the electronic components and the waterproof glue on the circuit board is larger, so that the heat dissipation of the switching power supply is facilitated, and the service life of the rainproof power supply structure is prolonged.
Description
Technical Field
The utility model relates to the field of power supply structures, in particular to a rainproof power supply structure.
Background
At present, the rain-proof power supply only needs to be half-filled to prevent rainwater from penetrating into the switch power supply through the inner wall of the shell, the switch power supply is filled with glue at present, the glue can only flow into the bottom of the switch power supply through a gap between the switch power supply and the shell, and then the bottom space is slowly filled until the half-filling of the rain-proof power supply is completed. The glue filling mode is low in glue filling speed, and when the glue flows into the bottom, glue filling non-uniformity is easy to exist due to mutual shielding of bottom components, multiple glue filling conditions exist, so that production benefits are low, and labor cost is wasted.
The rainproof power supply cover box comprises an outer box and a bottom plate arranged in the outer box, wherein the bottom plate is used for fixing a rainproof power supply in the outer box and is used for matching rainproof power supplies of various types; the outer box is a cuboid with an opening and is used for placing the bottom plate and the rainproof power supply; the outer box further comprises at least four protruding strips and at least four screw holes; the protruding strips are arranged at the upper end and the lower end of the bottom surface of the outer box, are perpendicular to the bottom surface and are used for fixing the bottom plate; screw holes are arranged at four corners of the bottom surface and are used for fixing the rainproof power supply cover box on a building by using screws. The outer box and the bottom plate of the utility model can be matched with various rainproof power supplies, but the glue waste exists when the switch power supply is filled with glue.
Disclosure of Invention
The utility model provides a rainproof power supply structure, which aims to overcome the defects of glue waste and inconvenient glue filling of the switch power supply structure in the prior art.
In order to solve the technical problems, the technical scheme of the utility model is as follows:
the rainproof power supply structure comprises a lower casing and a cover body which are detachably arranged, wherein a circuit board is arranged on the lower casing, a gap is formed between the circuit board and the end face of the lower casing, and an opening for glue filling is formed in the circuit board; the surfaces of the circuit board and the lower shell are covered with an adhesive layer.
Through the design of the technical scheme, the holes are reserved in advance when the circuit board is wired, so that the holes are prevented from being drilled in the later wiring process. According to the technical scheme, through the structure with the holes on the circuit board, when the power supply structure is filled with glue, waterproof glue can flow into the bottom through the gaps between the circuit board and the lower shell, and can flow into the bottom through the holes of the circuit board. The glue filling speed is higher in the mode that the glue flows into the bottom of the lower casing through the opening on the circuit board, and the glue is diffused from the middle to the periphery, so that the glue filling mode is more uniform, the time for glue filling of waterproof glue is reduced, and the labor waste of glue filling for multiple times is avoided. The adhesive layer is a waterproof adhesive layer which covers the surfaces of the circuit board and the motor shell after the adhesive is filled by the method.
Meanwhile, the contact area between the electronic components and the waterproof glue on the circuit board is larger, so that the heat dissipation of the switching power supply is facilitated, and the service life of the rainproof power supply structure is prolonged.
Further, the opening of the circuit board avoids the wiring position of the components on the circuit board.
Through the design of the technical scheme, the positions of the electronic components on the circuit board and the electronic circuit wiring and the holes are considered when the holes are formed in the circuit board, the holes can be formed in the places avoiding the positions of the electronic components and the electronic circuit wiring, and the positions and the quantity of the holes are not fixed.
Furthermore, four openings are formed in the circuit board and are uniformly formed in four corners of the circuit board.
Further, an opening is arranged in the middle of the four openings.
Through above-mentioned technical scheme, this scheme is used for a type of circuit board, and four open trompils at circuit board corner and the trompil in the middle, when carrying out the encapsulating through the trompil, make the encapsulating more even, also accelerated the time of waterproof glue encapsulating. The openings on the circuit board are not limited to four openings, and the positions of the openings are selected at positions where the electronic components are not mounted on the circuit board.
Further, the circuit board is provided with three openings.
Through the technical scheme, the scheme is used for another type of circuit board, and the position of the opening is selected at the position where the electronic component is not mounted on the circuit board.
Further, gaps are reserved between the circuit board and the four edges of the lower shell.
Through above-mentioned technical scheme design, when the waterproof glue carries out the encapsulating, can flow into the bottom through the gap of circuit board and lower casing, let the injecting glue process faster.
Further, the whole lower casing is U-shaped, and two ends of the lower casing are opened.
Further, after the lower casing and the cover body are installed, a side plate is installed on one side.
Further, the cover body is provided with a heat dissipation hole.
Through the technical scheme design, the circuit board is used for radiating heat.
Further, after the stamping blanking of the lower shell and the cover body, the lower shell and the cover body are formed by one-time bending.
Through the design of the technical scheme, the processing procedures of the lower shell and the cover body are obviously reduced on the premise of ensuring the heat dissipation effect.
Compared with the prior art, the technical scheme of the utility model has the beneficial effects that:
the utility model discloses a rainproof power supply structure, which comprises a lower casing and a cover body which are detachably arranged, wherein a circuit board is arranged on the lower casing, a gap is formed between the circuit board and the end face of the lower casing, and an opening for glue filling is formed in the circuit board; the surfaces of the circuit board and the lower shell are covered with an adhesive layer.
According to the technical scheme, through the structure with the holes on the circuit board, when the power supply structure is filled with glue, waterproof glue can flow into the bottom through the gaps between the circuit board and the lower shell, and can flow into the bottom through the holes of the circuit board. The glue filling speed is higher in the mode that the glue flows into the bottom of the lower casing through the opening on the circuit board, and the glue is diffused from the middle to the periphery, so that the glue filling mode is more uniform, the time for glue filling of waterproof glue is reduced, and the labor waste of glue filling for multiple times is avoided. The adhesive layer is a waterproof adhesive layer which covers the surfaces of the circuit board and the motor shell after the adhesive is filled by the method. Meanwhile, the contact area between the electronic components and the waterproof glue on the circuit board is larger, the formed glue layer is more uniform and larger, heat dissipation of the switching power supply is facilitated, and the service life of the rainproof power supply structure is prolonged.
Drawings
Fig. 1 is a schematic diagram of a rainproof power supply structure.
Fig. 2 is a schematic view of the circuit board disposed on the lower housing.
Wherein: 1. a lower housing; 2. a cover body; 3. a circuit board; 301. opening holes; 4. a slit.
Detailed Description
For the purposes, technical solutions and advantages of the embodiments of the present application, the technical solutions of the present application will be clearly and completely described below with reference to the drawings of the embodiments of the present application. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present application. All other embodiments, based on the described embodiments, which a person of ordinary skill in the art would obtain without inventive faculty, are within the scope of protection of the present application.
Unless otherwise defined, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs. The terms "first," "second," and the like, as used herein, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
Example 1
As shown in fig. 1-2, the embodiment discloses a rainproof power supply structure, which comprises a lower casing 1 and a cover body 2 which are detachably installed, wherein a circuit board 3 is arranged on the lower casing 1, a gap 4 is arranged between the circuit board 3 and the end surface of the lower casing 1, and an opening 301 for glue filling is arranged on the circuit board 3; the surfaces of the circuit board 3 and the lower shell 1 are covered with glue layers.
In the implementation process, the opening 301 on the circuit board 3 avoids the wiring position of the component on the circuit board 3. Four openings 301 are formed in the circuit board 3, and the openings 301 are uniformly formed in four corners of the circuit board 3. An opening 301 is also provided in the middle of the four openings 301.
The lower casing 1 is integrally U-shaped, and two ends of the lower casing 1 are open. After the lower shell 1 and the cover body 2 are installed, a side plate is installed on one side.
The cover body 2 is provided with heat dissipation holes.
The lower shell 1 and the cover body 2 are formed by one-time bending after being stamped and blanked.
In the implementation process of this embodiment, the openings 301 are set aside in advance when the wiring board 3 is wired, so that the openings 301 are avoided in the later wiring process.
When the power supply structure is filled with glue, the waterproof glue can flow into the bottom through the gap 4 between the circuit board 3 and the lower casing 1, five openings 301 formed in the circuit board 3 can flow into the bottom, and after the waterproof glue covers the surfaces of the circuit board 3 and the motor casing, a waterproof glue layer is formed on the surfaces of the circuit board 3 and the motor casing after the waterproof glue is dried.
The glue filling speed is higher in the mode that the glue flows into the bottom of the lower shell 1 through the opening 301 on the circuit board 3, and the glue filling mode is diffused from the middle to the periphery, so that the glue filling mode is more uniform, the glue filling time of waterproof glue is reduced, and the labor waste of uneven repeated glue filling of glue filling is avoided. Meanwhile, the contact area between the electronic components and the waterproof glue on the circuit board 3 is larger, so that the heat dissipation of the switching power supply is facilitated, and the service life of the rainproof power supply structure is prolonged.
Example 2
As shown in fig. 1, this embodiment is different from embodiment 1 in that three openings are provided, and a rainproof power supply structure is disclosed, and includes a lower casing 1 and a cover 2 that are detachably mounted, a circuit board 3 is provided on the lower casing 1, a gap 4 is provided between the circuit board 3 and an end surface of the lower casing 1, and an opening 301 for glue filling is provided on the circuit board 3; the surfaces of the circuit board 3 and the lower shell 1 are covered with glue layers.
In the implementation process, the opening 301 on the circuit board 3 avoids the wiring position of the component on the circuit board 3. Three openings 301 are provided in the circuit board 3.
The lower casing 1 is integrally U-shaped, and two ends of the lower casing 1 are open. After the lower shell 1 and the cover body 2 are installed, a side plate is installed on one side.
The cover body 2 is provided with heat dissipation holes.
The lower shell 1 and the cover body 2 are formed by one-time bending after being stamped and blanked.
In the implementation process of this embodiment, three openings 301 are reserved in advance when the wiring board 3 is wired, so that the openings 301 are avoided in the later wiring process. The circuit board 3 is suitable for another circuit board 3 with different electronic component layouts.
It is to be understood that the above examples of the present utility model are provided by way of illustration only and not by way of limitation of the embodiments of the present utility model. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.
Claims (10)
1. The rainproof power supply structure comprises a lower casing (1) and a cover body (2) which are detachably arranged, and is characterized in that a circuit board (3) is arranged on the lower casing (1), a gap (4) is formed between the circuit board (3) and the end face of the lower casing (1), and an opening (301) for glue filling is formed in the circuit board (3); the surfaces of the circuit board (3) and the lower casing (1) are covered with glue layers.
2. The rainproof power supply structure according to claim 1, wherein the opening (301) on the circuit board (3) avoids the wiring position of the component on the circuit board (3).
3. The rainproof power supply structure according to claim 2, wherein four openings (301) are formed in the circuit board (3), and the openings (301) are uniformly formed in four corners of the circuit board (3).
4. A rain-proof power supply structure according to claim 3, characterized in that the middle of four of said openings (301) is further provided with an opening (301).
5. The rainproof power supply structure according to claim 2, wherein three openings (301) are formed in the circuit board (3).
6. The rainproof power supply structure according to claim 1, wherein gaps (4) are reserved between the circuit board (3) and the four edges of the lower casing (1).
7. The rainproof power supply structure according to claim 1, wherein the lower casing (1) is integrally U-shaped, and both ends of the lower casing (1) are opened.
8. The rainproof power supply structure according to claim 6, wherein a side plate is mounted on one side of the lower casing (1) and the cover body (2) after the lower casing and the cover body are mounted.
9. The rainproof power supply structure according to claim 1, wherein the cover body (2) is provided with a heat radiation hole.
10. The rainproof power supply structure according to claim 1, wherein the lower shell (1) and the cover body (2) are formed by one-time bending after stamping and blanking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222896263.8U CN219181872U (en) | 2022-11-01 | 2022-11-01 | Rainproof power supply structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222896263.8U CN219181872U (en) | 2022-11-01 | 2022-11-01 | Rainproof power supply structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219181872U true CN219181872U (en) | 2023-06-13 |
Family
ID=86667258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222896263.8U Active CN219181872U (en) | 2022-11-01 | 2022-11-01 | Rainproof power supply structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219181872U (en) |
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2022
- 2022-11-01 CN CN202222896263.8U patent/CN219181872U/en active Active
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