CN219181743U - Shaft-penetrating flexible circuit board assembly, shaft-penetrating flexible circuit board and electronic equipment - Google Patents

Abstract

The application provides a wear axle flexible circuit board subassembly, wear axle flexible circuit board and electronic equipment, this scheme includes: dielectric substrate, two grounding straps, radio frequency band and reinforcement structure, wherein: the grounding strap and the RF strap are arranged in the same layer of the dielectric substrate, the RF strap is positioned between two adjacent grounding straps, the reinforcing structure is positioned on the dielectric substrate, and the area of the reinforcing structure opposite to the RF strap is made of nonmetal materials. Because the area opposite to the radio frequency band is made of non-metal materials, the non-metal materials basically do not participate in the radio frequency signal reflux path, so that the impedance does not need to be adjusted by adjusting the bandwidth of the radio frequency band, at the moment, the reinforced area and the non-reinforced area of the radio frequency band do not need to be in transition in a gradual change mode, namely the radio frequency band can always adopt the wiring mode of the coplanar waveguide, thereby reducing the radio frequency signal loss and improving the antenna experience performance.

Description

Shaft-penetrating flexible circuit board assembly, shaft-penetrating flexible circuit board and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a shaft-penetrating flexible circuit board assembly, a shaft-penetrating flexible circuit board and electronic equipment.

Background

At present, in a shaft-penetrating flexible circuit board (flexible printed circuit, FPC) for transmitting radio frequency signals, due to the shielding effect of steel reinforcement, the wiring form of the shaft-penetrating FPC cannot always adopt the wiring form of a coplanar waveguide, so that the phenomenon of discontinuous impedance can occur in a reinforcing area, the radio frequency signal loss is increased, and the antenna experience performance is finally affected.

Disclosure of Invention

In view of this, the application provides a flexible circuit board assembly, flexible circuit board and electronic equipment of wearing axle to solve the problem of flexible circuit board radio frequency signal loss of wearing axle.

In order to achieve the above purpose, the present application provides the following technical solutions:

the first aspect of the present application provides a through-shaft flexible circuit board assembly comprising: dielectric substrate, two grounding straps, radio frequency band and reinforcement structure, wherein: the grounding strap and the RF strap are arranged in the same layer of the dielectric substrate, the RF strap is positioned between two adjacent grounding straps, the reinforcing structure is positioned on the dielectric substrate, and the area of the reinforcing structure opposite to the RF strap is made of nonmetal materials. Because the area opposite to the radio frequency band is made of non-metal materials, the non-metal materials basically do not participate in the radio frequency signal reflux path, so that impedance does not need to be adjusted by adjusting the bandwidth of the radio frequency band, at the moment, the reinforced area and the non-reinforced area of the radio frequency band do not need to be transited in a gradual change mode, namely the radio frequency band can always adopt the wiring mode of the coplanar waveguide, thereby reducing radio frequency signal loss and improving antenna experience performance.

In one possible embodiment, the reinforcement structure is a composite reinforcement comprising two oppositely disposed steel reinforcements and a non-metallic reinforcement located between the steel reinforcements, the non-metallic reinforcement corresponding to the radio frequency band. Because the area of the composite reinforcement opposite to the radio frequency band is a nonmetal reinforcement body, the nonmetal reinforcement body basically does not participate in the radio frequency signal reflux path, so that impedance does not need to be adjusted by adjusting the bandwidth of the radio frequency band, at the moment, the reinforcement area and the non-reinforcement area of the radio frequency band do not need to be transited in a gradual change mode, namely, the radio frequency band can always adopt the wiring form of the coplanar waveguide, thereby reducing radio frequency signal loss and improving antenna experience performance.

In one possible embodiment, the dielectric substrate is provided with a grounding strap in the region close to the steel reinforcement.

In one possible embodiment, the steel reinforcement is connected to the non-metallic reinforcement with an adhesive.

In one possible embodiment, the steel reinforcement and the non-metallic reinforcement are joined by high temperature vacuum lamination.

In one possible embodiment, the nonmetallic reinforcing parts are ABF.

In one possible embodiment, the width of the non-metallic reinforcement is greater than the width of the radio frequency band.

In one possible embodiment, the steel reinforcement comprises a support and a connector, wherein: the connector extends outwards from the middle of the support body and is embedded into the nonmetal reinforcing body to form the composite reinforcement.

In one possible embodiment, the reinforcing structure is a ceramic reinforcement. Because the ceramic reinforcement can not participate in the radio frequency signal reflux path, the impedance does not need to be adjusted by adjusting the bandwidth of the radio frequency band, at the moment, the reinforced area and the non-reinforced area of the radio frequency band do not need to be in transition in a gradual change mode, namely the radio frequency band can always adopt the wiring mode of the coplanar waveguide, thereby reducing the radio frequency signal loss and improving the antenna experience performance.

In one possible embodiment, the ceramic reinforcement is fabricated from aluminum oxide, zirconium oxide, and silicon nitride.

In one possible embodiment, the through-shaft flexible circuit board is one or more layers.

A second aspect of the present application provides a through-shaft flexible circuit board comprising at least the through-shaft flexible circuit board assembly.

A third aspect of the present application provides an electronic device comprising at least one through-shaft flexible circuit board as defined in any one of the preceding claims.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present application, and that other drawings may be obtained according to the provided drawings without inventive effort to a person skilled in the art.

Fig. 1a is a schematic diagram of an application scenario of an antenna provided in the prior art;

fig. 1b is a schematic diagram of another application scenario of an antenna provided in the prior art;

FIG. 2a is a schematic top view of a through-shaft flexible circuit board assembly in an ideal state as provided by the prior art;

FIG. 2b is a schematic cross-sectional view of section A-A of FIG. 2 a;

FIG. 2c is a schematic cross-sectional view of section B-B of FIG. 2 a;

FIG. 3a is a schematic top view of a conventional through-shaft flexible circuit board assembly;

FIG. 3b is a schematic cross-sectional view of section D-D of FIG. 3 a;

FIG. 3c is a schematic cross-sectional view of section E-E of FIG. 3 a;

FIG. 3d is a schematic top view of the stealth reinforcement of FIG. 3 a;

fig. 4a is a schematic top view of a through-shaft flexible circuit board assembly according to an embodiment of the present disclosure;

FIG. 4b is a schematic cross-sectional view of section G-G of FIG. 4 a;

FIG. 4c is a schematic cross-sectional view of section H-H of FIG. 4 a;

FIG. 4d is a schematic top view of the hidden composite reinforcement of FIG. 4 a;

FIG. 5a is a schematic top view of a composite reinforcement provided in an embodiment of the present application;

FIG. 5b is a schematic cross-sectional view of section J-J of FIG. 5 a;

FIG. 5c is a schematic process diagram of the composite reinforcement provided in the embodiments of the present application;

FIGS. 6 a-6 c are schematic top views of three types of composite reinforcements provided in embodiments of the present application;

fig. 7a is a schematic top view of a through-shaft flexible circuit board assembly according to an embodiment of the present disclosure;

FIG. 7b is a schematic cross-sectional view of the section K-L of FIG. 7 a;

FIG. 7c is a schematic cross-sectional view of section M-M of FIG. 7 a;

FIG. 7d is a schematic top view of the fugitive ceramic reinforcement of FIG. 7 a;

fig. 8 is a schematic hardware structure of an electronic device according to an embodiment of the present application.

Detailed Description

The terms first, second, third and the like in the description and in the claims and drawings are used for distinguishing between different objects and not for limiting the specified sequence.

In the embodiments of the present application, words such as "exemplary" or "such as" are used to mean serving as examples, illustrations, or descriptions. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.

Taking a mobile phone as an example, as shown in fig. 1a, in a non-folding screen mobile phone, an antenna 12 (only one antenna 12 in the non-folding mobile phone is identified in fig. 1a for simplicity of identification) is disposed on one center 11 to transmit and receive radio frequency signals. In order to improve the antenna performance experience of the folding screen mobile phone, as shown in fig. 1b, the antennas are arranged on different middle frames to transmit and receive radio frequency signals. Taking a certain middle frame of the folding screen mobile phone as a main frame 21, arranging most of antennas 22 on the main frame 21 (also for simplicity of identification, only one antenna 22 and one antenna 24 in the folding screen mobile phone are identified in fig. 1 b); the other middle frame is a sub frame 23, and a part of antennas 24 are arranged on the sub frame 23 and are used for receiving and transmitting radio frequency signals, so that the radio frequency signals are required to be transmitted from the main frame 21 side to the sub frame 23 side. Because the folding screen mobile phone frequently folds/expands the screen in the use process, if the coaxial line is used for transmitting radio frequency signals between the main frame and the auxiliary frame, the coaxial line is frequently bent, and the reliability cannot be ensured. For this purpose, a through-shaft flexible circuit board (flexible printed circuit, FPC) 25' is used to transmit radio frequency signals between the main frame 21 and the sub-frame 23. At present, the shaft-penetrating FPC is positioned and fixed by adopting a steel reinforcement 26'.

In order to reduce radio frequency signal loss when radio frequency signals between the main frame 21 and the sub frame 23 are transmitted using the through-axis FPC25, it is preferable to use a wiring form in which radio frequency signal lines are coplanar waveguides, the radio frequency band and the ground strap are both disposed in the same layer of the dielectric substrate 251, and the radio frequency band is located between two adjacent ground straps. Taking three layers of the through-axis FPC as an example, the through-axis FPC assembly 25 of the through-axis FPC shown in fig. 2a, 2b and 2C adopts a coplanar waveguide mode to perform a down-wiring schematic, where the through-axis FPC assembly 25 includes a dielectric substrate 251, a first grounding strap 252a, a second grounding strap 252b and a radio frequency strap 253, where the first grounding strap 252a, the second grounding strap 252b and the radio frequency strap are all disposed in the same layer C of the dielectric substrate 251, and the radio frequency strap 253 is located between the first grounding strap 252a and the second grounding strap 252 b. As described above, the through-shaft FPC assembly 25 employs the steel reinforcement 26 to position it over the dielectric substrate 251, the steel reinforcement 26 being located over the dielectric substrate 251, as shown in fig. 3a, 3b, 3c and 3d, the through-shaft PFC assembly 25 being illustrated as including the dielectric substrate 251, the first grounding strap 252a, the second grounding strap 252b and the radio frequency strap 253, wherein the first grounding strap 252a, the second grounding strap 252b and the radio frequency strap 253 are all disposed in the same layer F of the dielectric substrate 251, the region of the radio frequency strap 253 between the first grounding strap 252a and the second grounding strap 252b opposite the steel reinforcement 26 being the reinforcing region 253a, the remaining region being the non-reinforcing region 253b, and the region of the dielectric substrate 251 corresponding to the steel reinforcement 26 requiring the provision of the third grounding strap 252c. Since the steel reinforcement 26 is a conductor, the steel reinforcement 26 is a backflow path of the radio frequency signal, and since the backflow path of the reference becomes, in order to ensure the impedance of the radio frequency band 253, the actual wiring and the theoretical wiring of the through-shaft FPC assembly 25 are different, the reinforcement region 253a of the radio frequency band 253 opposite to the steel reinforcement 26 is usually in a microstrip line or strip line type, the line width of the reinforcement region 253a is different from that of the non-reinforcement region 253b, and a gradual transition line type is usually adopted, so that the impedance discontinuity phenomenon can occur in the gradual transition region, the radio frequency signal loss is increased, and the antenna experience performance is finally affected.

Therefore, the application provides a through-shaft PFC assembly so as to radically solve the problem of loss of the through-shaft PFC radio frequency signals.

In the application, the shaft penetrating PFC can be one layer, the shaft penetrating PFC can also be multiple layers, and each layer is provided with a wire belt with a corresponding function according to the requirement; the through-shaft PFC assembly is disposed in one or more layers in the through-shaft PFC. In this application, the shaft PFC is described by taking three layers as examples:

in some examples of the present application, as shown in fig. 4a, 4b and 4c, the axial PFC assembly 35 in the drawings includes: the dielectric substrate 351, the first ground strap 352a, the second ground strap 352b, the third ground strap 352c, the radio frequency strap 353, and the composite reinforcement 36, wherein the first ground strap 352a, the second ground strap 352b, and the radio frequency strap 353 are all disposed in the same layer I of the dielectric substrate 351; wherein, the area of the composite reinforcement 36 opposite to the radio frequency band 353 is a nonmetallic reinforcement 362, and the rest area is a steel reinforcement 361; the third grounding strap 352c is disposed on a layer of the dielectric substrate 351 that is adjacent to the steel reinforcement 361; the radio frequency band 353 takes the form of a coplanar waveguide trace.

In fig. 4a, the composite reinforcement 36 covers the dielectric substrate 351 in the width direction, and in fig. 4b and 4c, the composite reinforcement 36 is located on the dielectric substrate 351, and as shown in fig. 4d, the area of the rf band 353 opposite to the composite reinforcement 36 is a reinforced area 353a, and the remaining area is a non-reinforced area 353b. Because the area of the composite reinforcement 36 opposite to the radio frequency band 353 is the nonmetal reinforcement 362, the nonmetal reinforcement 362 does not participate in the rf signal return path basically, so the impedance does not need to be adjusted by adjusting the bandwidth of the radio frequency band 353, at this time, the reinforcement area 353a and the non-reinforcement area 353b of the radio frequency band 353 do not need to be transited in a gradual transition manner, i.e. the radio frequency band 353 can always adopt the routing manner of the coplanar waveguide, thereby reducing the rf signal loss and improving the antenna experience performance.

As shown in fig. 5a and 5b, the composite reinforcement 36 in the drawings includes two steel reinforcements 361 and a nonmetallic reinforcement 362 located between the two steel reinforcements 361, wherein the steel reinforcements 361 include a support body 361a and a connecting body 361b, and the connecting body 361b extends outward from a middle portion of the support body 361a and is embedded into the nonmetallic reinforcement 362 to form the composite reinforcement 36.

The steel reinforcement 361 and the non-metal reinforcement 362 may be fixedly connected by bonding, for example, an adhesive is provided at a portion where the connecting body 361b of the steel reinforcement 361 and the supporting body 361a are bonded to the non-metal reinforcement 362 to bond the steel reinforcement 361 and the non-metal reinforcement 362 together.

The steel reinforcement 361 and the nonmetallic reinforcement 362 may also be fixedly connected by vacuum lamination, as shown in fig. 5c, and more than two steel reinforcements 361 are selected; arranging two steel reinforcements 361 on the carrier 40, the two steel reinforcements 361 being spaced apart by a certain distance to form a filling cavity; pressing the nonmetal reinforcing body 362 in a high-temperature environment (150-180 ℃) into a filling cavity, standing and solidifying to form a semi-finished product; the blank is cut and ground off of the carrier 40 to form the finished composite reinforcement 36.

In order to improve the connection strength of the composite reinforcement 36, the portion where the steel reinforcement 361 and the non-metal reinforcement 362 are joined is a straight line type, a triangular tooth type (as shown in fig. 6 a), a rectangular tooth type (as shown in fig. 6 b), a wavy type (as shown in fig. 6 c), or the like. The linear type is preferred, and has the characteristic of convenient processing.

In addition, the material of the non-metal reinforcement member 362 is a thin Film composite material, such as silicon, molding compound, BT, polyimide or ABF, preferably, ABF (Ajinomoto Build-Up Film) is selected as an insulating material of a high performance semiconductor (CPU), so as to eliminate yield loss caused by bubbles and printing irregularities in the liquid resin coating process. The solvent does not volatilize, the working environment is not reduced, the surface smoothness is excellent, and the film thickness is easy to control. Modulus of elasticity: tensile strength of 4-9 GPa: elongation of 90-120 MPa: 1.7 to 5 percent.

In some examples of the present application, the width of the non-metallic reinforcement 362 is greater than the width of the rf band 353 in order to further reduce rf signal loss.

In other examples of the present application, as shown in fig. 7a, 7b and 7c, the axial PFC assembly 35 includes: the dielectric substrate 351, the first ground strap 352a, the second ground strap 352b, the radio frequency strap 353, and the ceramic reinforcement 37, wherein the first ground strap 352a, the second ground strap 352b, and the radio frequency strap 353 are all disposed in the same layer M of the dielectric substrate 351; wherein the ceramic reinforcement 37 is located on a dielectric substrate 351, the rf strip takes the form of a coplanar waveguide trace.

In fig. 7a, the dielectric substrate 351 is covered with the ceramic reinforcement 37 in the width direction, and in fig. 7b and 7c, the ceramic reinforcement 37 is located on the dielectric substrate 351, and as shown in fig. 7d, the region of the rf band 353 opposite to the ceramic reinforcement 37 is a reinforced region 353a, and the remaining region is a non-reinforced region 353b. Since the ceramic reinforcement 37 does not participate in the rf signal return path, the impedance does not need to be adjusted by adjusting the bandwidth of the rf band 353, and at this time, the reinforced region 353a and the non-reinforced region 353b of the rf band 353 do not need to be transited in a gradual change manner, i.e. the rf band 353 can always adopt the routing manner of the coplanar waveguide, thereby reducing rf signal loss and improving the antenna experience performance.

The ceramic reinforcement 37 is a reinforcement made of a ceramic material such as alumina, zirconia, or silicon nitride.

It should be noted that, the composite reinforcement 36 and the ceramic reinforcement 37 in the above examples can be understood as reinforcement structures, and the through-shaft PFC assembly 35 is reinforced by providing the reinforcement structures, and in specific applications, the number and shape of the reinforcement structures can be adjusted according to the requirements of application scenarios.

Another embodiment of the present application further provides an electronic device, where the electronic device may be: mobile terminal devices with batteries, such as cell phones, tablet computers (portable android device, PAD), desktop, laptop, notebook, ultra-mobile personal computers (Ultra-mobile Personal Computer, UMPC), handheld computers, netbooks, personal digital assistants (Personal Digital Assistant, PDA), wearable electronics, and smart watches. The form of the electronic device in the embodiment of the present application is not particularly limited.

Referring to fig. 8, the electronic device may include: processor 110, external memory interface 120, internal memory 121, universal serial bus (universal serial bus, USB) interface 130, charge management module 140, power management module 141, battery 142, antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, audio module 170, speaker 170A, receiver 170B, microphone 170C, headset interface 170D, sensor module 180, keys 190, motor 191, micro motor 191A, indicator 192, camera 193, display 194 (flexible screen), and SIM card interface 195, etc. The sensor module 180 may include a pressure sensor, a gyroscope sensor, a barometric sensor, a magnetic sensor, an acceleration sensor, a distance sensor, a proximity sensor, a fingerprint sensor, a temperature sensor, a touch sensor, an ambient light sensor, a bone conduction sensor, and the like.

It should be understood that the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the electronic device. In other embodiments of the present application, the electronic device may include more or less components than illustrated, or certain components may be combined, or certain components may be split, or different arrangements of components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

The USB interface 130 is an interface conforming to the USB standard specification, and may specifically be a Mini USB interface, a Micro USB interface, or a USB Type C interface. The USB interface 130 may be used to connect to a charger to charge the electronic device, may be used to transfer data between the electronic device and a peripheral device, and may also be used to connect to a headset through which audio is played. Furthermore, the interface may also be used to connect other electronic devices, such as AR devices, etc.

The charge management module 140 is used to receive charge input from an external charger. The charging management module 140 may also supply power to the electronic device through the power management module 141 while charging the battery 142. The power management module 141 is used for connecting the battery 142, and the charge management module 140 and the processor 110. The power management module 141 receives input from the battery 142 and/or the charge management module 140, and provides power to the processor 110, the internal memory 121, the speaker 170A, the external memory, the motor 191, the flexible screen 194, the camera 193, the wireless communication module 160, and the like. The power management module 141 may also be configured to monitor battery capacity, battery cycle number, battery health (leakage, impedance) and other parameters. In other embodiments, the power management module 141 may also be provided in the processor 110. In other embodiments, the power management module 141 and the charge management module 140 may be disposed in the same device.

The processor 110 may be an SoC in a device such as a mobile phone, a smart watch, or a central processor in a device such as a tablet computer, a notebook computer, etc.; which may in particular comprise one or more processing units, such as for example: the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processing unit, GPU), an image signal processor (image signal processor, ISP), a controller, a memory, a video codec, a digital signal processor (digital signal processor, DSP), a baseband processor, and/or a neural network processor (neural-network processing unit, NPU), etc. Wherein the different processing units may be separate devices or may be integrated in one or more processors. The controller can be a neural center and a command center of the electronic device. The controller can generate operation control signals according to the instruction operation codes and the time sequence signals to finish the control of instruction fetching and instruction execution.

A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. The memory may hold instructions or data that the processor 110 has just used or recycled. If the processor 110 needs to reuse the instruction or data, it may be called directly from memory. Repeated accesses are avoided and the latency of the processor 110 is reduced, thereby improving the efficiency of the system.

In some embodiments, the processor 110 may include one or more interfaces. The interfaces may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuit sound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous receiver transmitter (universal asynchronous receiver/transmitter, UART) interface, a mobile industry processor interface (mobile industry processor interface, MIPI), a general-purpose input/output (GPIO) interface, a subscriber identity module (subscriber identity module, SIM) interface, and/or a universal serial bus (universal serial bus, USB) interface, among others.

The wireless communication function of the electronic device may be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, a modem processor, a baseband processor, and the like. The antennas 1 and 2 are used for transmitting and receiving electromagnetic wave signals. The mobile communication module 150 may provide a solution for wireless communication including 2G/3G/4G/5G, etc. applied on an electronic device. The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (low noise amplifier, LNA), etc. The mobile communication module 150 may receive electromagnetic waves from the antenna 1, perform processes such as filtering, amplifying, and the like on the received electromagnetic waves, and transmit the processed electromagnetic waves to the modem processor for demodulation. The mobile communication module 150 can amplify the signal modulated by the modem processor, and convert the signal into electromagnetic waves through the antenna 1 to radiate. The modem processor may include a modulator and a demodulator.

The electronic device implements display functions through the GPU, the flexible screen 194, and the application processor, etc. The GPU is a microprocessor for image processing, connecting the flexible screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or change display information. In embodiments of the present application, a display and touch device (TP) may be included in the flexible screen 194. The display is used to output display content to a user and the touch device is used to receive touch events entered by the user on the flexible screen 194.

The electronic device may implement photographing functions through an ISP, a camera 193, a video codec, a GPU, a flexible screen 194, an application processor, and the like.

The internal memory 121 may be used to store computer-executable program code that includes instructions. The processor 110 executes various functional applications of the electronic device and data processing by executing instructions stored in the internal memory 121. The internal memory 121 may include a storage program area and a storage data area. The storage program area may store an application program (such as a sound playing function, an image playing function, etc.) required for at least one function of the operating system, etc. The storage data area may store data created during use of the electronic device (e.g., audio data, phonebook, etc.), and so forth. In addition, the internal memory 121 may include a high-speed random access memory, and may further include a nonvolatile memory such as at least one magnetic disk storage device, a flash memory device, a universal flash memory (universal flash storage, UFS), and the like.

The electronic device may implement audio functions through a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, an application processor, and the like. Such as music playing, recording, etc.

The speaker 170A, also referred to as a "horn," is used to convert audio electrical signals into sound signals. The electronic device may listen to music, or to hands-free conversations, through speaker 170A.

A receiver 170B, also referred to as a "earpiece", is used to convert the audio electrical signal into a sound signal. When the electronic device picks up a phone call or voice message, the voice can be picked up by placing the receiver 170B close to the human ear.

Microphone 170C, also referred to as a "microphone" or "microphone", is used to convert sound signals into electrical signals. When making a call or transmitting voice information, the user can sound near the microphone 170C through the mouth, inputting a sound signal to the microphone 170C. The electronic device may be provided with at least one microphone 170C.

The earphone interface 170D is used to connect a wired earphone. The headset interface 170D may be a USB interface 130 or a 3.5mm open mobile electronic device platform (open mobile terminal platform, OMTP) standard interface, a american cellular telecommunications industry association (cellular telecommunications industry association of the USA, CTIA) standard interface.

In the sensor module 180, the pressure sensor is used to sense a pressure signal, and the pressure signal may be converted into an electrical signal. The gyroscopic sensor may be used to determine a motion pose of the electronic device. The air pressure sensor is used for measuring air pressure. The magnetic sensor includes a hall sensor, a magnetometer, and the like. And a distance sensor for measuring the distance. The proximity light sensor may include, for example, a Light Emitting Diode (LED) and a light detector. The ambient light sensor is used for sensing ambient light brightness. The electronic device may also determine whether objects are occluded from the surroundings and the distance of the occluding object from the electronic device based on the perceived ambient light level. The fingerprint sensor is used for collecting fingerprints. The electronic equipment can utilize the collected fingerprint characteristics to realize fingerprint unlocking, access the application lock, fingerprint photographing, fingerprint incoming call answering and the like. The temperature sensor is used for detecting temperature. Touch sensors, also known as "touch panels". The bone conduction sensor may acquire a vibration signal.

The keys 190 include a power-on key, a volume key, etc. The electronic device may receive key inputs, generating key signal inputs related to user settings and function controls of the electronic device.

The motor 191 may generate a vibration cue.

The indicator 192 may be an indicator light, may be used to indicate a state of charge, a change in charge, a message indicating a missed call, a notification, etc.

The SIM card interface 195 is used to connect a SIM card. The electronic device may support 1 or N SIM card interfaces, N being a positive integer greater than 1. The same SIM card interface 195 may be used to insert multiple cards simultaneously. The electronic equipment interacts with the network through the SIM card, so that the functions of communication, data communication and the like are realized.

The foregoing is merely a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

In the electronic device, a flexible circuit board is generally used to realize electrical connection between corresponding contact pairs; taking a mobile phone as an example, not only between the metal layer of the screen 101 and the middle frame 102, at least one flexible circuit board needs to be added to realize the ground connection, but also between the SIM card slot and the middle frame, and similarly, at least one flexible circuit board can be used. Of course, the above-mentioned places are only some specific examples, and not limited thereto, and any place where electrical connection is required may be provided with the flexible circuit board according to the above-mentioned embodiment, which is within the protection scope of the present application, depending on the specific application environment.

The foregoing is merely a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (12)

1. A through-shaft flexible circuit board assembly, comprising: dielectric substrate, two grounding straps, radio frequency band and reinforcement structure, wherein: the grounding strips and the radio frequency strips are arranged in the same layer of the dielectric substrate, the radio frequency strips are positioned between two adjacent grounding strips, the reinforcing structure is positioned on the dielectric substrate, and the area, opposite to the radio frequency strips, of the reinforcing structure is made of nonmetal materials.

2. The through-shaft flexible circuit board assembly of claim 1, wherein the reinforcement structure is a composite reinforcement comprising two oppositely disposed steel reinforcements and a non-metallic reinforcement located between the steel reinforcements, the non-metallic reinforcement corresponding to the radio frequency band.

3. The through-shaft flexible circuit board assembly of claim 2, wherein the steel reinforcement is connected to the non-metallic reinforcement with an adhesive.

4. The through-shaft flexible circuit board assembly of claim 2, wherein the steel reinforcement and the non-metallic reinforcement are connected by high temperature vacuum lamination.

5. The through-shaft flexible circuit board assembly of claim 2, wherein the non-metallic reinforcement is ABF.

6. The through-shaft flexible circuit board assembly of claim 2, wherein the width of the non-metallic reinforcement is greater than the width of the radio frequency band.

7. The through-shaft flexible circuit board assembly of claim 2, wherein the steel reinforcement comprises a support and a connector, wherein: the connector extends outwards from the middle of the support body and is embedded into the nonmetal reinforcing body to form composite reinforcement.

8. The through-shaft flexible circuit board assembly of claim 1, wherein the reinforcement structure is a ceramic reinforcement.

9. The through-shaft flexible circuit board assembly of claim 8, wherein the ceramic reinforcement is fabricated from aluminum oxide, zirconium oxide, and silicon nitride.

10. The through-shaft flexible circuit board assembly of any one of claims 1 to 9, wherein the through-shaft flexible circuit board is one or more layers.

11. A through-shaft flexible circuit board comprising at least one through-shaft flexible circuit board assembly according to any one of claims 1-10.

12. An electronic device, comprising the through-shaft flexible circuit board 11.

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