CN219180513U

CN219180513U - Intelligent power module

Info

Publication number: CN219180513U
Application number: CN202223272534.9U
Authority: CN
Inventors: 谢景亮; 敖利波
Original assignee: Zhihao Microelectronics Huizhou Co ltd
Current assignee: Zhihao Microelectronics Huizhou Co ltd
Priority date: 2022-12-07
Filing date: 2022-12-07
Publication date: 2023-06-13
Anticipated expiration: 2032-12-07

Abstract

The utility model discloses an intelligent power module, which comprises a substrate and a lead frame, wherein a power chip is arranged on the substrate, a driving chip is arranged on the lead frame, the lead frame comprises a plurality of pin pairs, each pin pair comprises a first pin and a second pin, and the first pin and the second pin are respectively connected with bonding pads in the driving chip in a one-to-one correspondence manner; the driving circuit further comprises a connecting pin, wherein the connecting pin is positioned at one end of the first pin or the second pin, which is close to the driving chip, and the connecting pin is communicated with the first pin or the second pin and is vertical to the first pin or the second pin so as to form an L-shaped structure; the length of the connection pin is greater than the distance between the first pin and the second pin. The utility model ensures the sequential arrangement of leads between the pin pairs and the driving chip by virtue of the L-shaped structure formed by the connection pins, reduces the wiring difficulty of the leads, and further improves the quality of the intelligent power module.

Description

Intelligent power module

Technical Field

The utility model relates to the technical field of power modules, in particular to an intelligent power module.

Background

As the use of Intelligent Power Modules (IPMs) continues to expand, existing electrical appliance settings require that the volume of the intelligent power module must be maintained within a small range. In order to ensure that the whole volume of the intelligent power module is maintained in a smaller range, the RC-IGBT power chip is generally adopted to save space, but the manufacturing difficulty of the RC-IGBT power chip is higher, the cost of the whole intelligent power module is greatly increased, and the further application and popularization of the intelligent power module are limited. As shown in fig. 1, a BSD pad 21 is disposed above a conventional intelligent power module driving chip, and the volume of a substrate 2 needs to be kept within a small range, so that an RC-IGBT power chip 22 with high cost is required to be used below a driving chip 11.

The driver chip in the intelligent power module needs to be connected to the VB pin and the VS pin in the lead frame, the order of the VS bonding pad and the VB bonding pad on the driver chip of each model is different, but the order of the external pins must be kept consistent after the intelligent power module is made, so that the situation of lead wire crossing is possible, the wiring difficulty of the lead wire is increased by a lead wire crossing part, the signal short circuit is also possible to be caused, the product is invalid, and as shown in fig. 1, the bonding alloy wires 13 for connecting the driver chip 11 and the VB pin and the VS pin are mutually crossed.

Meanwhile, in the actual production process, the power chip is fixed in the substrate and is connected with the lead frame only through the bonding wire, and the power chip can shake when being vibrated, so that the bonding wire between the driving chip and the power chip can deform, and the bonding wire can be broken when serious, so that the product is invalid.

Disclosure of Invention

The present utility model is directed to solving, at least to some extent, one of the problems in the related art. Therefore, the utility model aims to provide an intelligent power module, which ensures the lead wire sequence arrangement between a pin pair and a driving chip by means of an L-shaped structure formed by connecting pins, reduces the lead wire wiring difficulty and further improves the quality of the intelligent power module.

In order to achieve the above purpose, the present application adopts the following technical scheme: the intelligent power module comprises a substrate and a lead frame, wherein a power chip is arranged on the substrate, a driving chip is arranged on the lead frame, the lead frame comprises a plurality of pin pairs, each pin pair comprises a first pin and a second pin, and the first pin and the second pin are respectively connected with bonding pads in the driving chip in a one-to-one correspondence manner;

the driving circuit further comprises a connecting pin, wherein the connecting pin is positioned at one end of the first pin or the second pin, which is close to the driving chip, and the connecting pin is communicated with the first pin or the second pin and is vertical to the first pin or the second pin so as to form an L-shaped structure; the length of the connection pin is greater than the distance between the first pin and the second pin.

Further, the lead frame further comprises a lead connecting rod, and the tail end of the lead connecting rod is positioned at the left side of the driving chip.

Further, the first pin is a VB pin or a VS pin, and the second pin is a VS pin or a VB pin; and the VB pins and the VS pins in the same pin pair are arranged in a staggered manner at one end far away from the driving chip.

Further, a plurality of VB bonding pads and VS bonding pads are arranged in the driving chip, the VB bonding pads and the VS pins are connected in a one-to-one correspondence manner through leads, and the VS bonding pads and the VS pins are connected in a one-to-one correspondence manner through leads.

Further, the number of the pin pairs is three, and three groups of VB bonding pads and VS bonding pads are arranged in the driving chip, wherein the three groups of VB bonding pads and the VS bonding pads are sequentially and horizontally arranged at the top end of the driving chip; the pin pairs are positioned above the driving chip, and the three pin pairs are sequentially and horizontally arranged above the driving chip.

Further, the power chip is located at one side of the driving chip far away from the pin pair, and the driving chip comprises an IGBT chip and an FRD chip.

Further, the IGBT chip is located between the driving chip and the FRD chip, and the top end of the IGBT chip is connected to the driving chip through a bond alloy wire.

Further, the lead frame further comprises a third pin, the third pin is located at one side, far away from the driving chip, of the power chip, and the power chip is connected to the third pin through a bonding aluminum wire.

Further, opposite ends of the substrate are respectively connected to the lead frame through fixed connecting rods.

Further, the substrate and the lead frame are encapsulated by plastic package materials.

Compared with the prior art, the technical scheme provided by the embodiment of the application has the following advantages: the connecting pin is positioned at one end of the first pin or the second pin, which is close to the driving chip, and is communicated with and vertical to the first pin or the second pin to form an L-shaped structure; the length of the connecting pin is larger than the distance between the first pin and the second pin; because first pin or second pin and connecting pin intercommunication for the pad in the drive chip can be connected to first pin or second pin through the optional position in the connecting pin, this wiring position that just makes the lead wire has multiple selectivity, only need carry out wiring in proper order according to the position of pad and first pin or second pin in the drive chip, the lead wire cross problem that the pin size is less causes among the prior art has been avoided, ensure the lead wire order between pin pair and the drive chip and arrange, reduce the lead wire wiring degree of difficulty, and then promote intelligent power module's quality.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.

In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to a person skilled in the art that other drawings can be obtained from these drawings without inventive effort.

In the accompanying drawings:

FIG. 1 is a schematic diagram of a prior art intelligent power module;

FIG. 2 is a schematic diagram of the structure of the intelligent power module in the present application;

reference numerals: 11. a driving chip; 12. a connection pin; 13. bonding a gold wire; 14. plastic packaging material; 15. a fixed connecting rod; 16. an IGBT chip; 17. an FRD chip; 18. bonding an aluminum wire; 2. a substrate; 21. BSD pads; 22. RC-IGBT power chip; 23. and (5) a lead connecting rod.

Detailed Description

For a clearer understanding of technical features, objects and effects of the present utility model, a detailed description of embodiments of the present utility model will be made with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "transverse", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, and are merely for convenience of describing the present utility model, not to indicate that the mechanism or element referred to must have specific directions, and thus should not be construed as limiting the present utility model.

It should also be noted that unless explicitly stated or limited otherwise, terms such as "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or one or more intervening elements may also be present. The terms "first," "second," "third," and the like are used merely for convenience in describing the present utility model and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," "third," etc. may explicitly or implicitly include one or more such features. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present utility model. It will be apparent, however, to one skilled in the art that the present utility model may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the present utility model with unnecessary detail.

Example 1

Referring to fig. 2, the intelligent power module provided by the application comprises a substrate 2 and a lead frame, wherein a power chip is arranged on the substrate 2, a driving chip 11 is arranged on the lead frame, the lead frame comprises a plurality of pin pairs, each pin pair comprises a first pin and a second pin, and the first pin and the second pin are respectively connected with bonding pads in the driving chip 11 in a one-to-one correspondence manner;

the application also comprises a connecting pin 12, wherein the connecting pin 12 is positioned at one end of the first pin or the second pin, which is close to the driving chip 11, and the connecting pin 12 is communicated with the first pin or the second pin and is vertical to the first pin or the second pin so as to form an L-shaped structure; the length of the connection pin 12 is greater than the distance between the first pin and the second pin. That is, the first pin or the second pin and the connection pin 12 form an L shape, and the other pin in the same pin pair is located above the connection pin 12.

The connecting pin 12 is positioned at one end of the first pin or the second pin, which is close to the driving chip 11, and the connecting pin 12 is communicated with and vertical to the first pin or the second pin to form an L-shaped structure; the length of the connection pin 12 is greater than the distance between the first pin and the second pin; because the first pin or the second pin is communicated with the connecting pin 12, the bonding pad in the driving chip 11 can be connected to the first pin or the second pin through any position in the connecting pin 12, so that the wiring position of the lead wire has multiple selectivities, and the lead wire crossing problem caused by smaller pin size in the prior art is avoided only by sequentially wiring according to the positions of the bonding pad and the first pin or the second pin in the driving chip 11, the lead wire sequential arrangement between the pin pair and the driving chip 11 is ensured, the lead wire wiring difficulty is reduced, and the quality of the intelligent power module is further improved.

Example 2

The intelligent power module comprises a substrate 2 and a lead frame, wherein a power chip is arranged on the substrate 2, a driving chip 11 is arranged on the lead frame, the lead frame comprises three pin pairs, each pin pair comprises a VB pin, a VS pin and a connecting pin 12, the connecting pin 12 is positioned at one end of the VB pin or the VS pin, which is close to the driving chip 11, and the connecting pin 12 is communicated with the VB pin or the VS pin and is vertical to the VB pin or the VS pin so as to form an L-shaped structure; the length of the connection pins 12 is greater than the distance between the VB pins and the VS pins.

That is, the VB or VS pin forms an L-shape with the connection pin 12, and the other pin in the same pin pair is located above the connection pin 12.

It should be noted that: in this embodiment, three pin pairs are included, and in the three pin pairs, the VB pin and the connection pin 12 may all form an L shape, or the VS pin and the connection pin 12 may form an L shape, or one of the pin pairs may form an L shape with the VB pin and the connection pin 12, and the other two pin pairs may form an L shape with the VS pin and the connection pin 12. As shown in fig. 1, the leftmost pin pair VB pin and connection pin 12 form an L-shaped structure, and the rightmost two pin pair VS pin and connection pin 12 form an L-shaped structure.

In the embodiment, three pin pairs are provided, and three groups of VB bonding pads and VS bonding pads are arranged in the driving chip 11, wherein the three groups of VB bonding pads and the VS bonding pads are sequentially and horizontally arranged at the top end of the driving chip 11; the pin pairs are located above the driving chip 11, and the three pin pairs are sequentially and horizontally arranged above the driving chip 11. VB bonding pads and VS pins are connected in one-to-one correspondence through bond alloy wires 13, and VS bonding pads and VS pins are connected in one-to-one correspondence through bond alloy wires 13.

Because VB bonding pad or VS bonding pad in this application forms L shape structure, the bonding pad in driver chip 11 can be connected to VB bonding pad or VS bonding pad through the optional position in connecting pin 12, this just makes the wiring position of lead wire have multiple selectivity, only need carry out wiring in proper order according to the position of bonding pad and VB bonding pad or VS bonding pad in driver chip 11, has avoided the lead wire cross problem that the pin size is less to cause among the prior art. As shown in fig. 2, pads in the driving chip 11 are sequentially distributed from left to right, VB pads and VS pads are sequentially distributed from left to right, and VB pins and connecting pins 12 in the left pin pair form an L-shaped structure, and VS pins and connecting pins 12 in the right pin pair form an L-shaped structure; in the actual collection of the connection lead wiring between the lead and the pad, the position of the bonding alloy wire 13 corresponding to the lead which does not form the L-shaped structure can be determined first, and the number of the positions of the lead which forms the L-shaped structure can be multiple because the length of the connection lead 12 is longer, so that no matter whether the positions of the pad and the lead correspond to each other in sequence, the bonding leads can be ensured not to cross and are arranged in sequence.

In the application, VB pins and VS pins in the same pin pair are arranged in a staggered manner at one end far away from the driving chip 11; as shown in fig. 2, in the lead frame, the top ends of the VB pins are higher than the top ends of the VS pins, and the three groups of pin pairs are sequentially and horizontally arranged to form the VB pins and the VS pins with staggered heights.

The lead frame in this application further includes a lead link 23, and the end of the lead link 23 is located on the left side of the driving chip 11, as shown in fig. 2.

Example 3

The BSD pad 21 in fig. 1 is removed in the present application, and the functions of the BSD chip are integrated in the driving chip 11, so that the driving chip 11 is directly connected to the VB pin and the VS pin, thus the occupied area above the driving chip 11 can be reduced, and sufficient space is left below the driving chip 11 to place the power chip, so that the present application can use the IGBT chip 16 and the FRD chip 17 with lower cost as the power chips.

On the basis of embodiment 2, the power chip in this embodiment is located on the side of the driving chip 11 away from the pin pair, and the driving chip 11 includes an IGBT chip 16 and an FRD chip 17. The IGBT chip 16 is located between the driving chip 11 and the FRD chip 17, and the top end of the IGBT chip 16 is connected to the driving chip 11 through the bond alloy wire 13.

As shown in fig. 2, the number of the driving chips 11 is 6, and are sequentially horizontally arranged in the substrate 2. The IGBT chip 16 is located below the driving chip 11, and the FRD chip 17 is located below the IGBT chip 16.

The lead frame further includes a third lead under the driving chip 11, and the driving chip 11 is connected to the third lead through a bonding aluminum wire 18.

In this application, the power chip is fixed in the substrate 2, the upper end of the power chip is connected with the driving chip 11 through the bond alloy wire 13, the lower end of the power chip is connected to the third pin through the bond aluminum wire 18, and the third pin is used for realizing the electrical connection of an external circuit. In order to avoid shaking of the power chip in the shaking process, the bonding alloy wire 13 may be broken in the shaking process due to the small size of the bonding alloy wire 13, so that a product is invalid.

The substrate 2 and the lead frame are encapsulated through the plastic package material 14, so that an integral encapsulation structure is realized.

It is to be understood that the above examples only represent preferred embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the utility model; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several variations and modifications can be made without departing from the scope of the utility model; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. The intelligent power module comprises a substrate and a lead frame, wherein a power chip is arranged on the substrate, a driving chip is arranged on the lead frame, the lead frame comprises a plurality of pin pairs, each pin pair comprises a first pin and a second pin, and the first pin and the second pin are respectively connected with bonding pads in the driving chip in a one-to-one correspondence manner; it is characterized in that the method comprises the steps of,

2. The intelligent power module according to claim 1, wherein the lead frame further comprises a lead link, and an end of the lead link is located at a left side of the driving chip.

3. The intelligent power module according to claim 1, wherein the first pin is a VB pin or a VS pin, and the second pin is a VS pin or a VB pin; and the VB pins and the VS pins in the same pin pair are arranged in a staggered manner at one end far away from the driving chip.

4. An intelligent power module according to claim 3, wherein a plurality of VB pads and VS pads are arranged in the driving chip, the VB pads and the VS pins are connected in a one-to-one correspondence through leads, and the VS pads and the VS pins are connected in a one-to-one correspondence through leads.

5. The intelligent power module according to claim 4, wherein the number of the pin pairs is three, and three groups of VB bonding pads and VS bonding pads are arranged in the driving chip, wherein the three groups of VB bonding pads and the VS bonding pads are sequentially and horizontally arranged at the top end of the driving chip; the pin pairs are positioned above the driving chip, and the three pin pairs are sequentially and horizontally arranged above the driving chip.

6. The intelligent power module according to claim 1, wherein the power chip is located on a side of the driver chip away from the pair of pins, the driver chip including an IGBT chip and an FRD chip.

7. The intelligent power module according to claim 6, wherein the IGBT chip is located between the driver chip and the FRD chip, and a top end of the IGBT chip is connected to the driver chip through a bond alloy wire.

8. The intelligent power module according to claim 7, wherein the lead frame further comprises a third lead, the third lead is located at a side of the power chip away from the driving chip, and the power chip is connected to the third lead through a bonding aluminum wire.

9. The intelligent power module according to claim 8, wherein the two ends of the substrate are connected to the lead frame through fixed links, respectively.

10. The intelligent power module according to claim 1, wherein the substrate and the lead frame are encapsulated by plastic.