CN219163389U - Double-independent-cavity heat transfer structure with efficient forced convection - Google Patents
Double-independent-cavity heat transfer structure with efficient forced convection Download PDFInfo
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- CN219163389U CN219163389U CN202222958256.6U CN202222958256U CN219163389U CN 219163389 U CN219163389 U CN 219163389U CN 202222958256 U CN202222958256 U CN 202222958256U CN 219163389 U CN219163389 U CN 219163389U
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Abstract
The utility model relates to a double independent cavity heat transfer structure with high-efficiency forced convection, which comprises a temperature equalizing plate with a heat conducting cavity inside, and a heat conducting working medium in the heat conducting cavity, wherein a cavity partition plate is arranged in the heat conducting cavity, and the cavity partition plate enables the heat conducting cavity to be partitioned into a first cavity and a second cavity; the cavity division plate is provided with at least one concave part, and the concave part is pasted mutually with the bottom side wall surface of heat conduction cavity, makes the heat conduction material in first cavity, the second cavity can act on this bottom side wall surface simultaneously, arbitrary cavity is the liquid cooling cavity in first cavity and the second cavity, and the samming board upside is provided with the connector of two intercommunication this liquid cooling cavities. According to the double independent cavity heat transfer structure with high-efficiency forced convection, the temperature equalizing cavity and the liquid cooling cavity are connected in parallel, the chip can be simultaneously contacted with the wall surfaces of the temperature equalizing cavity and the liquid cooling cavity, the heat resistance is reduced, the advantage of liquid cooling is fully utilized, and the heat dissipation effect is improved.
Description
Technical Field
The utility model relates to the field of electronic chip heat conduction, in particular to a double-independent-cavity heat transfer structure with high-efficiency forced convection.
Background
For the electronic chip field, most of the existing data center servers transmit the heat of the chips to the room of the data center in an air cooling mode, and then the heat is discharged outdoors in an air conditioning mode, so that a large amount of power is consumed, as the power and the heat flux density of the chips in the future are rapidly increased, the chips with the power of more than 500W in the future are mainstream, the heat power consumption is doubled or even doubled, if the heat dissipation is carried out by adopting the air cooling and air conditioning refrigeration modes of the chips in the past, the consumed power is astronomical number, and the energy conservation and emission reduction requirements of the data center in the state are completely not met, and therefore, related manufacturers in the data center server field all begin to design the heat conduction and the heat dissipation in the liquid cooling mode to meet the high requirements of the state on energy conservation and emission reduction, and the data center is arranged in the state or region with lower environment temperature.
The conventional liquid cooling mode of the chip is that the bottom plate of the water cooling head is used for conducting the heat of the chip on the convection enhanced heat transfer fin group, under the pressure of the water pump, the mixed liquid and the convection enhanced heat transfer fin group of the water cooling head perform convection heat exchange, the heat transfer path is in a unidirectional serial mode, the heat can only perform heat exchange along the heat transfer path of the chip, the bottom plate of the water cooling head, the convection enhanced heat transfer fin group on the bottom plate and the mixed liquid, the heat resistance of the whole heat transfer path is formed by overlapping the self heat conduction resistance of each component and the contact heat resistance of the front component and the rear component, wherein the factor with great influence on the heat resistance is the self heat conduction resistance of the enhanced heat transfer fin group and the temperature uniformity of each component thereof, particularly when the size of the chip is small, and the self heat conduction resistance and the temperature difference of the enhanced heat transfer fin group are overlarge under the high power condition due to the serial mode, so that the heat resistance of the whole heat transfer path is affected.
Disclosure of Invention
In order to overcome the problems in the prior art, the utility model provides the double independent cavity heat transfer structure with high-efficiency forced convection, wherein the temperature equalizing cavity and the liquid cooling cavity are connected in parallel, the chip can be simultaneously contacted with the wall surfaces of the temperature equalizing cavity and the liquid cooling cavity, the heat resistance is reduced, the advantage of liquid cooling is fully utilized, and the heat dissipation effect is improved.
The technical scheme adopted for solving the technical problems is as follows: the double independent cavity heat transfer structure comprises a temperature equalizing plate with a heat conducting cavity inside, and a heat conducting working medium in the heat conducting cavity, wherein a cavity partition plate is arranged in the heat conducting cavity, and the cavity partition plate enables the heat conducting cavity to be partitioned into a first cavity and a second cavity; the cavity partition plate is provided with at least one concave part, and the concave part is attached to the bottom side wall surface of the heat conduction cavity, so that heat conduction materials in the first cavity and the second cavity can act on the bottom side wall surface simultaneously; any one of the first cavity and the second cavity is a liquid cooling cavity, the other cavity is a temperature equalizing cavity, any one of the first cavity and the second cavity is a liquid cooling cavity, and two connecting ports for communicating the liquid cooling cavity are formed in the upper side of the temperature equalizing plate.
Preferably, the recess portion includes a plurality of first recess portions and second recess portions, the first recess portions and the second recess portions are arranged on the cavity partition plate, recess directions of the first recess portions and the second recess portions are opposite, and at least one first recess portion or one second recess portion is attached to a wall surface of the heat conducting cavity, so that the first cavity or the second cavity can contact the wall surface of the heat conducting cavity.
Preferably, the first concave portion and the second concave portion are respectively attached to two end wall surfaces of the heat conducting cavity, so that the first cavity and the second cavity can be respectively contacted with the upper end surface and the lower end surface of the heat conducting cavity.
Preferably, the temperature equalizing cavity is internally provided with a temperature equalizing working medium, and the liquid cooling cavity is internally provided with a liquid cooling working medium.
Preferably, the first concave portion and the second concave portion are arranged on the cavity partition plate, a transition interval is arranged between the first concave portion and the second concave portion, and the first cavity and the second cavity respectively form independent and communicated cavities.
Preferably, at least one surface of the upper wall surface and the lower wall surface of the temperature equalizing cavity is provided with a porous medium capillary structure.
Preferably, at least one support column is arranged in the first cavity and the second cavity respectively, one end of the support column is connected with the wall surface of the heat conduction cavity, and the other end of the support column is connected with the first concave part or the second concave part.
Preferably, a layer of porous medium capillary structure is sintered at the outer edge of the support column in the temperature equalizing cavity.
Preferably, a convection enhanced heat transfer fin set is arranged in the liquid cooling cavity, and the fin set guides the liquid flow direction from one connecting port to the other connecting port
The beneficial effects of the utility model are as follows: the utility model provides a high-efficient forced convection's two independent cavity heat transfer structures, samming chamber, liquid cooling chamber are parallelly connected, and the chip can contact samming chamber, the wall in liquid cooling chamber simultaneously, reduces thermal resistance, make full use of the advantage of liquid cooling, improves the radiating effect. When the chip heat generating source is attached to the bottom plate of the heat transfer structure in this embodiment, all heat passes through a part of the bottom plate, and then the heat reaching the intensified convection heat transfer fin set is split, a part of the heat still passes through the bottom plate to the intensified convection heat transfer fin set, and the other part of the heat passes through the temperature equalizing plate with higher heat conductivity and then reaches the intensified convection heat transfer fin set, wherein the heat of the heat and the heat of the heat are dynamically distributed by the performance of the temperature equalizing plate. The material of the reinforced convection heat transfer fin group is generally red copper, and the heat conductivity coefficient of the reinforced convection heat transfer fin group is about 380W/m.K, but the heat conductivity coefficient of the temperature equalizing plate can reach 10 times of copper, even more than 100 times of copper. In the case of such high power consumption, the parallel manner greatly reduces the thermal resistance of the entire heat transfer path.
Drawings
The utility model will be further described with reference to the drawings and examples.
FIG. 1 is a schematic diagram of the overall structure of a dual independent cavity heat transfer structure for efficient forced convection of embodiment 1 of the present utility model;
FIG. 2 is a schematic cross-sectional view of a dual independent cavity heat transfer structure with efficient forced convection according to embodiment 1 of the present utility model;
FIG. 3 is an exploded view of a dual independent cavity heat transfer structure of the high efficiency forced convection of example 1 of the present utility model;
FIG. 4 is a schematic cross-sectional view of a simplified structure of a dual independent cavity heat transfer structure of embodiment 2 of the present utility model;
fig. 5 is an exploded view of the overall structure of the dual independent cavity heat transfer structure of embodiment 3 of the present utility model.
Detailed Description
The utility model will now be described in further detail with reference to the accompanying drawings. The drawings are simplified schematic representations which merely illustrate the basic structure of the utility model and therefore show only the structures which are relevant to the utility model.
Example 1
As shown in fig. 1, 2 and 3, the main body of the double independent cavity heat transfer structure with high-efficiency forced convection is a temperature equalization plate structure, a cavity separation plate 2 is arranged in a heat conduction cavity of the temperature equalization plate 1, and the heat conduction cavity is separated by the cavity separation plate 2 to form a first cavity 3 and a second cavity 4; the cavity division plate 2 is provided with at least one concave part, and the concave part is attached to the wall surface of the heat conduction cavity, so that the heat conduction materials in the first cavity 3 and the second cavity 4 can act on the wall surface at the same time.
Here, referring to fig. 3, the temperature-equalizing plate 1 is composed of an upper temperature-equalizing plate housing 11 and a lower temperature-equalizing plate housing 12.
In this embodiment, a concave portion is disposed in the middle of the cavity partition plate 2, and is attached to the bottom side wall surface of the heat conducting cavity, and when the heat transfer structure in this embodiment is applied, the area of the concave portion is smaller than the area of the heat source 10, and when the heat source is attached to the bottom panel of the heat transfer structure, the heat source can be attached to the first cavity 3 and the second cavity 4 of the temperature equalizing plate 1 at the same time, and the heat conducting working medium in the first cavity 3 and the second cavity 4 perform temperature equalization and heat conduction respectively.
Different heat conducting working media are respectively arranged in the first cavity 3 and the second cavity 4.
The first cavity 3 is a heat conducting cavity and is positioned at the upper part, the porous medium capillary structure 8 is sintered on the side wall of the first cavity 3, and the heat conducting working medium in the first cavity 3 is deionized water. The second cavity 4 is the liquid cooling cavity, and samming board 1 upper portion has two connector 6 intercommunication to the liquid cooling cavity, and connector 6 penetrates samming board 1's top panel, penetrates cavity division board 2 again. The connection ports 6 are respectively connected with an external water-cooling driving device to form a liquid-cooling convection enhanced heat transfer channel.
The middle part of the concave part is provided with a support column 5, and the upper end and the lower end of the support column 5 are contacted with the upper temperature equalizing plate shell 11 and the middle part of the concave part of the cavity division plate 2.
A convection enhanced heat transfer fin set 7 is arranged in the liquid cooling cavity, and the fin set 7 guides the liquid flow direction from one connecting port 6 to the other connecting port 6. The fin group 7 is formed by a plurality of fins welded on the cavity separation plate 2 and the liquid cooling cavity, or a convection enhanced heat transfer fin group can be formed by forming a relieved tooth on the bottom plate and then welded between the cavity separation plate 2 and the liquid cooling cavity.
The temperature equalization plate in the embodiment utilizes the combination of the temperature equalization function and the liquid cooling function, and is suitable for heat conduction of chips with large size and high power consumption.
When the heating source is attached to the bottom plate of the heat transfer structure in this embodiment, all heat passes through the part contacted with the heating source, and then all heat is split along the parallel heat conduction path, one part still passes through the end face of a part of convection enhanced heat transfer fin set contacted with the bottom plate, and the other part passes through the temperature equalizing plate with higher heat conduction coefficient and then reaches the other end face of the convection enhanced heat transfer fin set, and the heat of the two parts is dynamically distributed by the heat conduction property of the temperature equalizing plate. The convection enhanced heat transfer fin group is made of red copper, the heat conductivity coefficient of the convection enhanced heat transfer fin group is about 380W/m.K, but the heat conductivity coefficient of the temperature equalizing plate can reach 10 times and even more than 100 times of copper, so that the heat resistance of the whole heat transfer path is greatly reduced by a parallel heat transfer path mode under the condition of high power consumption.
Example 2
As shown in fig. 5, the main body of the double independent cavity heat transfer structure with high-efficiency forced convection is a temperature equalization plate structure, a cavity separation plate 2 is arranged in a heat conduction cavity of the temperature equalization plate 1, and the heat conduction cavity is separated by the cavity separation plate 2 to form a first cavity 3 and a second cavity 4; the cavity division plate 2 is provided with at least one concave part, and the concave part is attached to the wall surface of the heat conduction cavity, so that the heat conduction materials in the first cavity 3 and the second cavity 4 can act on the wall surface at the same time.
The temperature equalizing plate 1 consists of an upper temperature equalizing plate shell 11 and a lower temperature equalizing plate shell 12.
In this embodiment, the recess portion includes a first recess portion 21 and a second recess portion 22, where the first recess portion 21 and the second recess portion 22 are alternately arranged on the cavity partition plate 2, the recess directions of the first recess portion 21 and the second recess portion 22 are opposite, and the first recess portion 21 and the second recess portion 22 are respectively attached to two end wall surfaces of the heat conducting cavity, so that the first cavity 3 and the second cavity 4 can be respectively contacted with the upper end surface and the lower end surface of the heat conducting cavity, see fig. 4.
The difference between the present embodiment and embodiment 1 is that the concave portions are composed of the first concave portions 21 and the second concave portions 22, which are arranged in a vertically and horizontally alternating manner.
In this embodiment, a transition interval is formed between the first recess portion 21 and the second recess portion 22, and the transition interval enables the first cavity 3 and the second cavity 4 to form independent and communicated cavities respectively.
In this embodiment, a plurality of support columns 5 are disposed in the heat conducting cavity of the temperature equalizing plate 1, one end of each support column 5 is connected to the wall surface of the heat conducting cavity, and the other end is connected to the first recess 21 or the second recess 22. Supporting force is provided for the upper and lower wall surfaces of the two cavities. In the embodiment, the first cavity 3 and the second cavity 4 are respectively provided with support columns 5, and the support columns 5 are uniformly distributed according to the actual structure of the temperature equalization plate 1; or within each of the first and second cavities 3, 4.
In this embodiment, different heat conducting working media are respectively arranged in the first cavity 3 and the second cavity 4. One cavity is of a closed phase-change heat-conducting temperature-equalizing structure, the other cavity is a liquid cooling cavity, and two connecting ports 6 communicated with the liquid cooling cavity are arranged on the outer side of the temperature equalizing plate 1. The connection ports 6 are respectively connected with an external water-cooling driving device to form a liquid-cooling convection enhanced heat transfer channel.
A convection enhanced heat transfer fin set 7 is arranged in the liquid cooling cavity, and the fin set 7 guides the liquid flow direction from one connecting port 6 to the other connecting port 6. The fin group 7 is formed by a plurality of fins welded on the cavity separation plate 2 and the liquid cooling cavity, or a convection enhanced heat transfer fin group can be formed by forming a relieved tooth on the bottom plate and then welded between the cavity separation plate 2 and the liquid cooling cavity.
In the temperature equalization plate in the embodiment, one cavity in the double cavities is a closed container, the internal working medium is subjected to phase change heat transfer, the other cavity is filled with mixed liquid, heat is taken away in a liquid cooling mode, and the temperature equalization plate is suitable for being applied to a large-size high-power-consumption chip or a multi-heat-source chip. On the one hand, the heat flux density of the chip can be rapidly reduced through the cavity of the closed phase-change heat transfer, compared with the mode that the liquid cooling is used for independently cooling the chip with large size and high power consumption, in the embodiment, heat conduction of the heat conduction fin group is achieved, not all heat is transferred from the bottom plate of the temperature equalization plate to the bottom of the fin group, then is transferred to the top of the fin group, the heat is subjected to intensified convection heat exchange with mixed liquid, but part of the heat is transferred to the bottom of the heat conduction fin group through the bottom plate of the temperature equalization plate, and part of the heat is transferred from the other phase-change cavity of the temperature equalization plate to the top of the fin heat conduction group, namely, the bottom and the top of the fin heat conduction group are simultaneously subjected to bidirectional heat transfer, so that the low thermal resistance and the temperature equalization property of the fin heat conduction group are maintained, and the advantage of the liquid cooling is fully utilized.
When the heating source is attached to the bottom plate of the heat transfer structure in this embodiment, all heat passes through the part contacted with the heating source, and then all heat is split along the parallel heat conduction path, one part still passes through the end face of a part of convection enhanced heat transfer fin set contacted with the bottom plate, and the other part passes through the temperature equalizing plate with higher heat conduction coefficient and then reaches the other end face of the convection enhanced heat transfer fin set, and the heat of the two parts is dynamically distributed by the heat conduction property of the temperature equalizing plate. The convection enhanced heat transfer fin group is made of red copper, the heat conductivity coefficient of the convection enhanced heat transfer fin group is about 380W/m.K, but the heat conductivity coefficient of the temperature equalizing plate can reach 10 times and even more than 100 times of copper, so that the heat resistance of the whole heat transfer path is greatly reduced by a parallel heat transfer path mode under the condition of high power consumption.
With the above-described preferred embodiments according to the present utility model as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present utility model. The technical scope of the present utility model is not limited to the description, but must be determined according to the scope of claims.
Claims (9)
1. The utility model provides a two independent cavity heat transfer structures of high-efficient forced convection, includes the samming board that inside has the heat conduction cavity, heat conduction working medium, its characterized in that in the heat conduction cavity: a cavity division plate is arranged in the heat conduction cavity, and the cavity division plate divides the heat conduction cavity into a first cavity and a second cavity; the cavity partition plate is provided with at least one concave part, and the concave part is attached to the bottom side wall surface of the heat conduction cavity, so that heat conduction materials in the first cavity and the second cavity can act on the bottom side wall surface simultaneously; any one of the first cavity and the second cavity is a liquid cooling cavity, the other cavity is a temperature equalizing cavity, any one of the first cavity and the second cavity is a liquid cooling cavity, and two connecting ports for communicating the liquid cooling cavity are formed in the upper side of the temperature equalizing plate.
2. The dual independent cavity heat transfer structure of high efficiency forced convection of claim 1, wherein: the concave part comprises a plurality of first concave parts and second concave parts, the first concave parts and the second concave parts are arranged on the cavity partition plate, the concave directions of the first concave parts and the second concave parts are opposite, and at least one first concave part or one second concave part is attached to the wall surface of the heat conduction cavity, so that the first cavity or the second cavity can contact the wall surface of the heat conduction cavity.
3. A dual independent cavity heat transfer structure for efficient forced convection as set forth in claim 2, wherein: the first concave part and the second concave part are respectively attached to the wall surfaces of the two ends of the heat conduction cavity, so that the first cavity and the second cavity can be respectively contacted with the upper end surface and the lower end surface of the heat conduction cavity.
4. A dual independent cavity heat transfer structure for efficient forced convection according to claim 2 or 3, wherein: the temperature equalizing cavity is internally provided with a temperature equalizing working medium, and the liquid cooling cavity is internally provided with a liquid cooling working medium.
5. A dual independent cavity heat transfer structure for efficient forced convection according to claim 2 or 3, wherein: the first concave part and the second concave part are arranged on the cavity partition plate, a transition interval is arranged between the first concave part and the second concave part, and the transition interval enables the first cavity and the second cavity to form independent and communicated cavities respectively.
6. The dual independent cavity heat transfer structure of claim 5, wherein: at least one surface of the upper wall surface and the lower wall surface of the temperature equalizing cavity is provided with a porous medium capillary structure.
7. The dual independent cavity heat transfer structure of claim 6, wherein: at least one support column is arranged in the first cavity and the second cavity respectively, one end of the support column is connected with the wall surface of the heat conduction cavity, and the other end of the support column is connected with the first concave part or the second concave part.
8. The dual independent cavity heat transfer structure of claim 7, wherein: and a layer of porous medium capillary structure is sintered on the outer edges of the support columns in the temperature equalizing cavity.
9. The dual independent cavity heat transfer structure of claim 8, wherein: the liquid cooling cavity is internally provided with a convection enhanced heat transfer fin group, and the fin group guides the liquid flow direction from one connecting port to the other connecting port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222958256.6U CN219163389U (en) | 2022-11-04 | 2022-11-04 | Double-independent-cavity heat transfer structure with efficient forced convection |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222958256.6U CN219163389U (en) | 2022-11-04 | 2022-11-04 | Double-independent-cavity heat transfer structure with efficient forced convection |
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| CN219163389U true CN219163389U (en) | 2023-06-09 |
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| CN202222958256.6U Active CN219163389U (en) | 2022-11-04 | 2022-11-04 | Double-independent-cavity heat transfer structure with efficient forced convection |
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