CN219163130U - Buried transformer - Google Patents
Buried transformer Download PDFInfo
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- CN219163130U CN219163130U CN202223120822.2U CN202223120822U CN219163130U CN 219163130 U CN219163130 U CN 219163130U CN 202223120822 U CN202223120822 U CN 202223120822U CN 219163130 U CN219163130 U CN 219163130U
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- heat
- transformer
- semiconductor refrigerating
- heat dissipation
- conducting plate
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Abstract
The utility model provides a buried transformer, which comprises a transformer base cabin and a transformer body arranged in the transformer base cabin, wherein a heat conducting plate is arranged in the transformer base cabin, the transformer body is arranged in a placing box and is tightly attached to the heat conducting plate, a semiconductor refrigerating device is arranged on the heat conducting plate, a heat absorbing end of the semiconductor refrigerating device is arranged on the heat conducting plate, a heat releasing end of the semiconductor refrigerating device is arranged outside the ground surface, and a heat releasing end of the semiconductor refrigerating device is arranged outside the ground surface.
Description
Technical Field
The utility model relates to the technical field of transformers, in particular to a buried transformer.
Background
Conventional transformers are mostly installed in high-rise or special transformer rooms, and the installation mode enables the transformers to be directly in the air, so that long-term sun and rain can reduce the service life of the transformers. In cities, people are dense, the land is used in tension, and one transformer makes the cities more messy and unattractive, so that the buried transformer is generated.
The buried transformer is buried in the ground, so that the heat dissipation capacity is worse than that of the buried transformer when the buried transformer is installed on the ground, and the traditional mode of arranging the heat dissipation holes is not suitable for the buried transformer, and the heat dissipation effect is poor due to the plugging of soil, so that the conventional buried transformer is provided with the ventilation holes which are communicated to the ground surface for heat dissipation. However, this method has problems that dust is easily accumulated in the transformer due to long-time ventilation and heat dissipation, the dust accumulation can affect the heat dissipation resistance of the equipment to increase, so that the equipment is not smooth and is heated and overloaded, and the buried transformer is more difficult to maintain and clean.
Disclosure of Invention
The utility model provides an underground transformer, which aims to: the transformer base cabin which is relatively closed is arranged, heat is dissipated in a heat transfer mode, and dust is prevented from entering the transformer.
The embodiment of the utility model is realized by the following technical scheme:
the utility model provides a buried transformer, includes the transformer base cabin and installs the transformer body in the inside of transformer base cabin, install the heat-conducting plate in the transformer base cabin, the transformer body is installed and is being placed the inside of case and hugging closely the heat-conducting plate, install semiconductor refrigerating plant on the heat-conducting plate, semiconductor refrigerating plant's heat absorption end is installed on the heat-conducting plate, semiconductor refrigerating plant's heat release end is installed outside the earth's surface.
Further, the heat conducting plate is made of a good heat conductor.
Further, the good conductor of heat is an iron plate.
Further, the heat conduction channel and the heat dissipation cavity are arranged at the upper end of the transformer base cabin, the semiconductor material of the semiconductor refrigerating device is located in the heat conduction channel, the heat dissipation end of the semiconductor refrigerating device is located in the heat dissipation cavity, the heat dissipation cavity is internally provided with the heat dissipation fan, and the two sides of the heat dissipation cavity are provided with the shutter ventilation holes.
Furthermore, a high-low voltage switch cabinet is arranged on the heat dissipation cavity, and the high-low voltage switch cabinet is connected with the transformer.
Further, the two sides of the high-low voltage switch cabinet are hinged with media plates, and the media plates are supported by the positioning stay bars.
Further, the semiconductor refrigerating device is connected with a power supply through a wire, and a time relay is arranged on the wire.
The technical scheme of the embodiment of the utility model has at least the following advantages and beneficial effects:
by arranging the transformer base cabin as a relatively closed space, dust cannot enter from the outside, and heat generated by the transformer is led out in a heat transfer mode through the semiconductor refrigerating device, so that heat dissipation of the transformer is completed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
fig. 2 is a schematic cross-sectional structure of the present utility model.
Icon: the transformer comprises a 1-transformer base cabin, a 2-transformer body, a 3-heat-conducting plate, a 4-semiconductor refrigerating device, a 41-heat-radiating end, 42-semiconductor materials, a 43-heat-radiating end, a 5-access door, a 6-heat-conducting channel, a 7-heat-radiating cavity, an 8-heat-radiating fan, a 9-shutter heat-radiating hole, a 10-time relay, an 11-positioning support rod, a 12-positioning support rod and a 13-media layout.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. The components of the embodiments of the present utility model generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Example 1
The utility model provides a buried transformer, includes square form's transformer base cabin 1, the inside fixed mounting of transformer base cabin 1 has heat-conducting plate 3, heat-conducting plate 3 and transformer base cabin 1 form a relatively airtight space, install transformer body 2 in this airtight space, install access door 5 on transformer base cabin 1, the upper end intercommunication of transformer base cabin 1 has heat conduction passageway 6, and this heat conduction passageway 6 is located outside the sealed space, heat dissipation chamber 7 is installed on the one end that heat conduction passageway 6 kept away from transformer base cabin 1, heat dissipation chamber 7 is the barrel that the level was placed, and this heat dissipation chamber 7 is installed subaerial, install radiator fan 8 in the heat dissipation chamber 7 to install the shutter ventilation hole in the both sides of heat dissipation chamber 7. The semiconductor refrigerating device 4 is installed on the heat conducting plate 3, the semiconductor refrigerating device 4 comprises a heat absorbing end 43, a heat releasing end 41 and a semiconductor material 42, the heat absorbing end 43 is installed on the heat conducting plate 3, the heat releasing end 41 is installed in the heat radiating cavity 7, the semiconductor material 42 is installed in the heat conducting channel 6, and the semiconductor material 42 is connected with the heat absorbing end 43 and the heat releasing end 41. The transformer can continuously release heat in operation, heat gathers on the transformer body 2, because the iron plate is closely attached to the transformer body 2, the iron plate is a good conductor of heat, the heat can be intensively transferred to the iron plate, the semiconductor material 42 is electrified to enable the semiconductor material 42 to generate heat transfer, the heat absorbing end 43 absorbs the heat, the heat is transferred to the heat releasing end 41, the heat at the heat releasing end 41 is transferred to the outside through the cooling fan, the transformer body 2 is also made of metal, the heat conductivity is high, and after the heat at one side is transferred, the whole heat can be transferred to the side with low heat. The heat of the transformer is dissipated in a heat transfer mode, and the relatively airtight space formed by the placement box and the sealing cover can prevent dust from entering.
The transformer body 2 is connected with a line and a power supply which need to change alternating voltage through wires, and the semiconductor refrigeration device 4 is also connected with the power supply through the line. Since the semiconductor refrigeration device 4 has high heat dissipation efficiency and the transformer body 2 has insufficient heat generation speed, the semiconductor refrigeration device 4 always works to cause excessive power consumption, and the time relay 10 is arranged to connect one end of the circuit of the semiconductor refrigeration device 4 for a period of time and disconnect the circuit for a period of time, so that the consumption of electric energy is reduced.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (7)
1. The utility model provides a buried transformer, includes transformer base cabin (1) and installs at inside transformer body (2) of transformer base cabin (1), its characterized in that: install heat-conducting plate (3) in transformer base cabin (1), transformer body (2) are installed and are being placed the inside of case and hugging closely heat-conducting plate (3), install semiconductor refrigerating plant (4) on heat-conducting plate (3), heat-absorbing end (43) of semiconductor refrigerating plant (4) are installed on heat-conducting plate (3), heat-releasing end (41) of semiconductor refrigerating plant (4) are installed outside the earth's surface.
2. A buried transformer according to claim 1, characterized in that: the heat conducting plate (3) is made of a good conductor of heat.
3. A buried transformer according to claim 2, characterized in that: the good conductor of heat is iron plate.
4. A buried transformer according to claim 1, characterized in that: the transformer is characterized in that a heat conduction channel (6) and a heat dissipation cavity (7) are arranged at the upper end of the transformer base cabin (1), a semiconductor material (42) of the semiconductor refrigerating device (4) is located in the heat conduction channel (6), a heat dissipation end (41) of the semiconductor refrigerating device (4) is located in the heat dissipation cavity (7), a heat dissipation fan (8) is arranged in the heat dissipation cavity (7), and louver ventilation holes are arranged on two sides of the heat dissipation cavity (7).
5. The buried transformer according to claim 4, wherein: and the heat dissipation cavity (7) is provided with a high-low voltage switch cabinet, and the high-low voltage switch cabinet is connected with the transformer.
6. The buried transformer according to claim 5, wherein: and two sides of the high-low voltage switch cabinet are hinged with media plates (13), and the media plates (13) are supported by positioning supporting rods.
7. A buried transformer according to claim 1, characterized in that: the semiconductor refrigerating device (4) is connected with a power supply through a wire, and a time relay (10) is arranged on the wire.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202223120822.2U CN219163130U (en) | 2022-11-23 | 2022-11-23 | Buried transformer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202223120822.2U CN219163130U (en) | 2022-11-23 | 2022-11-23 | Buried transformer |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219163130U true CN219163130U (en) | 2023-06-09 |
Family
ID=86616257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202223120822.2U Active CN219163130U (en) | 2022-11-23 | 2022-11-23 | Buried transformer |
Country Status (1)
Country | Link |
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CN (1) | CN219163130U (en) |
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2022
- 2022-11-23 CN CN202223120822.2U patent/CN219163130U/en active Active
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