CN212487055U

CN212487055U - Heat abstractor based on 5G communication base station

Info

Publication number: CN212487055U
Application number: CN202021343843.9U
Authority: CN
Inventors: 党睿; 杨康; 张庆; 张子龙
Original assignee: Linxia Branch Of China Tower Co ltd
Current assignee: Linxia Branch Of China Tower Co ltd
Priority date: 2020-07-10
Filing date: 2020-07-10
Publication date: 2021-02-05
Anticipated expiration: 2030-07-10

Abstract

The utility model discloses a heat dissipation device based on a 5G communication base station, which relates to the technical field of 5G communication and comprises a support frame, an outer shell and a circuit element, wherein the outer shell is fixed at the upper end of the support frame, the lower end of the support frame is fixed on the ground, the circuit element is fixed in a central clamping groove and is electrically connected with a ground terminal, the heat dissipation device also comprises a cover plate, electric putter, first dust screen and temperature sensor have first vent on the lateral wall of shell body, and first dust screen is fixed in first vent department, and an electric putter is fixed respectively to the both sides of first vent, and electric putter's expansion end is fixed in one side of apron, and the apron is located the outside of first dust screen, and electric putter is connected with ground terminal electricity, is equipped with first recess on the lateral wall of central draw-in groove, and temperature sensor is fixed in the first recess, and temperature sensor is connected with ground terminal electricity. The utility model discloses can decide the switch of apron according to the height of the inside temperature of shell body to the ventilation cooling of control shell body.

Description

Heat abstractor based on 5G communication base station

Technical Field

The utility model relates to a 5G communication technology field especially relates to a heat abstractor based on 5G communication basic station.

Background

The 5G is short for the fifth generation mobile communication technology, the latest generation cellular mobile communication technology, and is an extension behind 4G, 3G, and 2G systems, and the performance goal of the 5G is high data rate, delay reduction, energy saving, cost reduction, system capacity improvement, and large-scale device connection.

The development of 5G also comes from the increasing demand for mobile data, and with the development of mobile internet, more and more devices are connected to a mobile network, and new services and applications emerge endlessly, and for better development and application of a 5G network, the construction of a communication base station is not left, and the number of circuit elements in the 5G communication base station is large, so that more heat can be generated during operation, and the communication base station is generally constructed at a higher height, and when the temperature is high in summer, the internal temperature is higher, which easily damages the circuit elements, so that a heat dissipation device is needed to dissipate heat, and the base station is ensured to work normally.

The existing heat dissipation device has poor heat dissipation effect, can not change the air circulation rate in the base station, causes heat not to be discharged in time, and affects the working efficiency of the base station.

In a waterproof heat dissipation type base station device based on 5G communication as disclosed in patent No. CN109257913B, the structure is relatively closed, and heat dissipation effect is achieved by a large number of electrical components, which is costly and unable to prevent dust from entering.

Therefore, there is a need for a new heat dissipation device for a 5G communication base station in the market to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a heat abstractor based on 5G communication base station for solve the technical problem that exists among the above-mentioned prior art, improve the radiating effect, and effectively prevent that external dust from getting into.

In order to achieve the above object, the utility model provides a following scheme:

the utility model discloses a heat dissipation device based on a 5G communication base station, which comprises a support frame, an outer shell and a circuit element, wherein the outer shell is fixed at the upper end of the support frame, the lower end of the support frame is fixed on the ground, a central clamping groove is arranged in the outer shell, the circuit element is fixed in the central clamping groove, the circuit element is electrically connected with a ground terminal, the heat dissipation device also comprises a cover plate, an electric push rod, a first dust screen and a temperature sensor, a first vent is arranged on the side wall of the outer shell, the first dust screen is fixed at the first vent, one electric push rod is respectively fixed at each of the two sides of the first vent, the movable end of the electric push rod is fixed at one side of the cover plate, the cover plate is positioned at the outer side of the first dust screen, the area of the cover plate is larger than that of the first vent, and, the side wall of the central clamping groove is provided with a first groove, the temperature sensor is fixed in the first groove, and the temperature sensor is electrically connected with the ground terminal.

Preferably, the shell body is made of asbestos, and a heat insulation film is arranged on the outer side of the shell body.

Preferably, the upper end of the outer case has a water collection groove.

Preferably, the semiconductor refrigerator is further included, a second groove is formed in the outer shell, the second groove is located above the central clamping groove, the semiconductor refrigerator is fixed in the second groove, a heat dissipation surface of the semiconductor refrigerator is located above the heat dissipation surface, a cold dissipation surface of the semiconductor refrigerator is located below the heat dissipation surface, and the semiconductor refrigerator is electrically connected with the ground terminal.

Preferably, the ground terminal comprises a heat radiation fan and a flow equalizing plate, wherein a plurality of through holes are arranged on the flow equalizing plate at intervals, the flow equalizing plate is fixed at the lower end of the central clamping groove, the heat radiation fan is fixed below the flow equalizing plate, and the heat radiation fan is electrically connected with the ground terminal.

Preferably, still include radiator window and second dust screen, be equipped with the second ventilation opening on the lateral wall of shell body, the radiator window with the second dust screen all is fixed in second ventilation opening department, the radiator window is located the outside of second dust screen.

Preferably, the dustproof net further comprises absorbent cotton, and the absorbent cotton is fixed on the inner side of the second dustproof net.

Preferably, the first ventilation openings are two, the two first ventilation openings are symmetrically arranged on two sides of the outer shell, the outer shell is two, and the outer shell is symmetrically fixed on two sides of the upper end of the support frame.

The utility model discloses for prior art gain following technological effect:

1. the utility model discloses cross and set up apron, electric putter, dust screen two and temperature sensor, can detect circuit element's operating temperature to through the air flow rate in the temperature value change shell body, improve the radiating effect, guarantee circuit element normal work, can prevent simultaneously that the dust from getting into when ventilating, guarantee the inside cleanliness factor of basic station, excellent in use effect.

2. The utility model discloses a set up radiator fan, flow equalizing plate and semiconductor cooler, can make cold wind evenly upwards blow from the circuit component bottom, carry out the cooling through semiconductor cooler to the top of circuit component simultaneously, can make the inside heat dissipation cooling of shell body even, eliminate the injury of inside temperature difference to circuit component, improve the safety in utilization.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a heat dissipation device based on a 5G communication base station in the present embodiment;

fig. 2 is a schematic view of an internal structure of an outer housing of the heat dissipation device based on the 5G communication base station in this embodiment;

fig. 3 is a top view of an outer housing of the heat dissipation device based on the 5G communication base station in the embodiment;

in the figure: 1. a support frame; 2. an outer housing; 3. a water collection tank; 4. a heat insulating film; 5. a semiconductor refrigerator; 6. absorbent cotton; 7. a second dust screen; 8. a heat dissipation window; 9. a cover plate; 10. an electric push rod; 11. a first dust screen; 12. a circuit element; 13. a heat radiation fan; 14. a flow equalizing plate; 15. a temperature sensor.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

In order to make the above objects, features and advantages of the present invention more comprehensible, the present invention is described in detail with reference to the accompanying drawings and the detailed description.

As shown in fig. 1-3, the present embodiment provides a heat dissipation apparatus based on a 5G communication base station, including a support frame 1, an outer casing 2 and a circuit element 12, where the outer casing 2 is fixed at an upper end of the support frame 1 by screws, a lower end of the support frame 1 is fixed on the ground, and the support frame 1 provides a stable supporting function for the outer casing 2. The outer housing 2 has a central slot therein, and the circuit component 12 is fixed in the central slot, and the circuit component 12 is used for providing stable circuit operation for the base station, and the circuit component is electrically connected with the ground terminal. Further, still include apron 9, electric putter 10, first dust screen 11 and temperature sensor 15, have first vent on the lateral wall of shell body 2, first dust screen 11 nestification is fixed in first vent department, can prevent that the dust from getting into, guarantees the inside cleanliness factor of shell body 2, excellent in use effect. The two sides of the first ventilation opening are respectively provided with an electric push rod 10 fixed through screws, the electric push rods 10 can be purchased in the market, the movable end of each electric push rod 10 is fixed on one side of the corresponding cover plate 9, the cover plates 9 are located on the outer sides of the first dust-proof nets 11, the area of the cover plates 9 is larger than that of the first ventilation openings, the cover plates 9 can completely shield the first ventilation openings, the electric push rods 10 are electrically connected with the ground terminal, and the opening and closing effect of the cover plates 9 can be controlled manually and remotely through the ground terminal. Be equipped with first recess on the lateral wall of central draw-in groove, temperature sensor 15 is fixed in first recess in, and temperature sensor 15 is connected with ground terminal electricity, and the temperature that detects through temperature sensor 15 decides whether to open apron 9, and temperature sensor 15's model is PT100, and the temperature sensor 15 of other specifications can also be selected according to actual need to the technical staff in the field.

During the use, be connected circuit element 12 and ground terminal, monitor the adjustment through ground terminal, can record ambient temperature and wind direction velocity of flow through ground terminal, but when the high temperature in shell body 2, temperature sensor 15 gives ground terminal with data transmission, then staff control electric putter 10 opens apron 9, can improve ventilation effect, and first dust screen 11 can effectually avoid the entering of external dust.

When the heat is dissipated inside the outer shell 2, the outer shell 2 needs to be made to have an effective heat insulation effect. In this embodiment, the outer casing 2 is made of a heat insulating material, specifically, asbestos, and those skilled in the art may replace the outer casing with another material according to actual needs, as long as the technical effect of heat insulation is achieved. The outside of shell body 2 is equipped with thermal-insulated membrane 4, and thermal-insulated membrane 4 is prior art. The arrangement can effectively improve the heat insulation effect of the outer shell 2 and prevent the external overheat weather from being transmitted to the circuit element 12 inside the outer shell 2.

In order to further avoid the inside temperature of the outer casing 2 from being influenced by the hot weather in the outside world, in this embodiment, the upper end of the outer casing 2 is provided with the water collecting tank 3, and when it rains, the rainwater can be collected by the water collecting tank 3 and stored. When the weather is hot, the water in the water collecting tank 3 evaporates and absorbs heat to absorb the heat in the outer shell 2, so that the outer shell 2 is cooled.

In order to further reduce the temperature of the circuit component 12, the present embodiment further includes a semiconductor cooler 5, the outer housing 2 has a second recess therein, the second recess is located above the central slot, the semiconductor cooler 5 is fixed in the second recess, the heat dissipation surface of the semiconductor cooler 5 is located above, the heat dissipation surface of the semiconductor cooler 5 is located below, and the semiconductor cooler 5 is electrically connected to the ground terminal. When the cooling device is used, the cold dissipation surface of the semiconductor refrigerator 5 transfers cold air to the central clamping groove below, so that the circuit element 12 is cooled, and the heat dissipation surface above can dissipate heat through the water collection groove 3.

In this embodiment, the heat dissipation device further includes a heat dissipation fan 13 and a current equalizing plate 14, the heat dissipation fan 13 and the current equalizing plate 14 are fixed inside the outer casing 2 by screws, a plurality of through holes are formed in the current equalizing plate 14 at intervals, a person skilled in the art can set the number, shape and distribution distance of the through holes according to actual needs, the current equalizing plate 14 is fixed at the lower end of the central slot, the heat dissipation fan 13 is fixed below the current equalizing plate 14, and the heat dissipation fan 13 is electrically connected to the ground terminal. The cooling fan 13 blows out cold air, and the cold air is uniformly guided to the circuit elements 12 located above through the flow equalizing plate 14, so that the circuit elements 12 can be uniformly cooled.

The cover plate 9 is opened when the internal temperature is too hot, and in order to maintain the daily ventilation of the outer shell 2, the heat dissipation window 8 and the second dustproof net 7 are further included in the embodiment, the side wall of the outer shell 2 is provided with the second ventilation opening, the second ventilation opening is positioned above the first ventilation opening, the heat dissipation window 8 and the second dustproof net 7 are both fixed at the second ventilation opening, and the heat dissipation window 8 is positioned outside the second dustproof net 7, so that the dust can be effectively prevented from entering the heat dissipation window. Wherein the heat radiation window 8 and the outer shell 2 are integrally formed, and the second dustproof net 7 is nested on the heat radiation window 8.

Furthermore, the dustproof net further comprises absorbent cotton 6, and the absorbent cotton 6 is fixed on the inner side of the second dustproof net 7. The washing cotton can adsorb steam, avoids having steam to get into in the sleet weather, influences the use of basic station.

In this embodiment, first vent has two, and two first vent symmetries set up in the left and right sides of shell body 2, and two-way ventilation, ventilation effect is better. The outer shell 2 has two, and two outer shell 2 symmetries are fixed in the upper end both sides of support frame 1, make support frame 1 atress balanced like this, and stability is good.

The principle and the implementation mode of the present invention are explained by applying specific examples in the present specification, and the above descriptions of the examples are only used to help understanding the method and the core idea of the present invention; meanwhile, for the general technical personnel in the field, according to the idea of the present invention, there are changes in the concrete implementation and the application scope. In summary, the content of the present specification should not be construed as a limitation of the present invention.

Claims

1. The utility model provides a heat abstractor based on 5G communication base station, includes support frame, shell body and circuit element, the shell body is fixed in the upper end of support frame, the lower extreme of support frame is fixed in subaerially, central draw-in groove has in the shell body, circuit element is fixed in the central draw-in groove, circuit element is connected its characterized in that with ground terminal electricity: still include apron, electric putter, first dust screen and temperature sensor, first vent has on the lateral wall of shell body, first dust screen is fixed in first vent department, the both sides of first vent are fixed one respectively electric putter, electric putter's expansion end is fixed in one side of apron, the apron is located the outside of first dust screen, the apron area is greater than the area of first vent, electric putter with ground terminal electricity is connected, be equipped with first recess on the lateral wall of central draw-in groove, temperature sensor is fixed in the first recess, temperature sensor with ground terminal electricity is connected.

2. The heat dissipation device based on the 5G communication base station, according to claim 1, wherein: the shell body is made of asbestos, and a heat insulation film is arranged on the outer side of the shell body.

3. The heat dissipation device based on the 5G communication base station, according to claim 1, wherein: the upper end of the outer shell is provided with a water collecting tank.

4. The heat dissipation device based on the 5G communication base station, according to claim 1, wherein: the semiconductor refrigerator is characterized by further comprising a semiconductor refrigerator, a second groove is formed in the outer shell, the second groove is located above the central clamping groove, the semiconductor refrigerator is fixed in the second groove, the heat dissipation surface of the semiconductor refrigerator is located above, the cold dissipation surface of the semiconductor refrigerator is located below, and the semiconductor refrigerator is electrically connected with the ground terminal.

5. The heat dissipation device based on the 5G communication base station, according to claim 1, wherein: the heat dissipation device is characterized by further comprising a heat dissipation fan and a flow equalizing plate, wherein a plurality of through holes are formed in the flow equalizing plate at intervals, the flow equalizing plate is fixed to the lower end of the central clamping groove, the heat dissipation fan is fixed below the flow equalizing plate, and the heat dissipation fan is electrically connected with the ground terminal.

6. The heat dissipation device based on the 5G communication base station, according to claim 1, wherein: still include radiator window and second dust screen, be equipped with the second ventilation opening on the lateral wall of shell body, the radiator window with the second dust screen all is fixed in second ventilation opening department, the radiator window is located the outside of second dust screen.

7. The heat sink device based on the 5G communication base station as claimed in claim 6, wherein: still include the cotton that absorbs water, the cotton that absorbs water is fixed in the inboard of second dust screen.

8. The heat dissipation device based on the 5G communication base station, according to claim 1, wherein: the first ventilation openings are symmetrically arranged on two sides of the outer shell, and the outer shell is symmetrically fixed on two sides of the upper end of the support frame.