CN113727472A

CN113727472A - 5G base station heat dissipation system for realizing cellular network relocation

Info

Publication number: CN113727472A
Application number: CN202111071692.5A
Authority: CN
Inventors: 张政; 雷蕾; 耿凯峰
Original assignee: Nanyang Institute of Technology
Current assignee: Nanyang Institute of Technology
Priority date: 2021-09-14
Filing date: 2021-09-14
Publication date: 2021-11-30

Abstract

The invention relates to a 5G base station heat dissipation system for realizing cellular network relocation. The AAU equipment is divided into a plurality of L-shaped heat dissipation channels which are reasonably arranged through heat insulation plates, and each heating element is arranged in each heat dissipation channel, so that the uniform heat dissipation of each heating element is realized; the double-layer heat insulation structure is arranged on one adjacent side face of the box body, so that the side face is opposite to the direction with larger solar radiation heat, and the influence of solar irradiation on the temperature rise in the box body is reduced as much as possible; the refrigeration module with the semiconductor refrigeration piece as the core generates cold air, and the cold air is blown into the heat dissipation channel through the air inlet fans in one-to-one correspondence with the heat dissipation channel so as to realize the purpose of quickly cooling the heating element, and the heat can be discharged in time. Therefore, this application accessible improves AAU equipment box structure and inside electronic components's arranging to increase refrigeration module, realize high-efficient heat dissipation, effective thermal-insulated, the even heat dissipation to AAU equipment.

Description

5G base station heat dissipation system for realizing cellular network relocation

Technical Field

The invention relates to a 5G base station heat dissipation system for realizing cellular network relocation.

Background

With the vigorous development of applications such as 4K/8K, VR/AR, automatic driving, robots, video monitoring and the like, the world of 5G-based omnibus data has come, and the premise of massive data is higher energy consumption, wherein the power consumption is mainly given as the main power, compared with a 4G base station, the power of the 5G base station is about 3-4 times that of the 4G base station, and the power consumption of the 5G base station is 9-10 times that of the 4G base station in the same coverage range due to the small coverage range of the 5G base station. Thus, there is a forecast by experts that by 2025, the communications industry will consume 20% of the electricity worldwide. Such a large power consumption tends to generate a large amount of heat.

At present, the main energy consumption of the 5G base station is concentrated in four parts of the base station, transmission, a power supply and a machine room air conditioner, and the electricity charge expenditure of the base station accounts for more than 80% of the energy consumption of the whole network. A base station, i.e., a common mobile communication base station, is a type of radio station, and refers to a radio transceiver station that performs information transfer with a mobile phone terminal through a mobile communication switching center in a certain radio coverage area. The main function of a base station is to provide wireless coverage, i.e. to enable wireless signal transmission between a wired communication network and a wireless terminal.

As shown in fig. 1, the 5G base station mainly includes a base station cabinet 02 (including BBU03< baseband processing device > and transmission unit 04< connection to core network >), a power supply 05, a storage battery 06, an air conditioner 07, a monitor 08, and the like, which are arranged in a machine room 01, and further includes an AAU device 011 arranged on an iron tower 010. Base station power consumption is divided into three major types: transmission power consumption, computational power consumption, and extra power consumption. In the energy consumption of the base station, the power consumption of a baseband unit (BBU) responsible for processing signal coding and decoding is relatively small, and a radio frequency unit (AAU) is a main source of the power consumption.

At present, mobile communication base station machine rooms are all totally closed machine rooms, and power supply equipment, transmitting equipment, transmission equipment and the like in the machine rooms are large heating bodies. In order to keep a certain working environment temperature of a machine room (the base station temperature is 18-28 ℃ specified by the base station environment standard GB 50174-93) for a long time, the air conditioner is mainly used for realizing the purpose that the equipment is operated at a constant temperature, and a refrigeration system is required to continuously cool the base station without shutdown due to overhigh temperature.

However, in the prior art, only the conventional natural heat dissipation can be adopted for the AAU with a larger heat generation amount due to the limitation of the installation position, the AAU generally includes a metal box body, and a radio frequency unit, an antenna and a processing unit which are located in the metal box body, and in the 5G era, the AAU supporting the Massive MIMO (large-scale multiple input multiple output) technology becomes the mainstream, that is, the AAU supports the Massive MIMO technology. However, this type of AAU is generally installed on a rented iron tower at present, the installation position of the AAU is high, the heat productivity of the radio frequency unit in the box body is large, the heat cannot be dissipated or the dissipation is slow, so that the temperature in the box body rises, the normal work of internal electronic components is affected, and the service life of the electronic components is reduced. In addition, in high-temperature areas such as northwest, the temperature of the box body can be rapidly raised by solar irradiation, and the heat can be transferred to the electronic components inside the box body, so that the loss and damage probability of the electronic components are further increased. On the other hand, there is also a solution to accelerate the discharge of heat inside the box by blowing air into the box and utilizing the air flow, but because the number of the radio frequency units inside the AAU is large and the arrangement is dense, and the fan is generally arranged at one position, the internal air flow only flows on the nearest channel, and the heating element far away from the air flow channel or hidden in the corner area cannot be quickly and effectively cooled, that is, the heat dissipation inside the box is not uniform, and the AAU still has a risk of damage.

Therefore, a new technology and a new structure for performing efficient heat dissipation, effective heat insulation and uniform heat dissipation on the AAU in the 5G base station are needed to solve the heat dissipation problem of the large number of AAUs.

Disclosure of Invention

The invention aims to provide a 5G base station heat dissipation system which can perform efficient heat dissipation, effective heat insulation and uniform heat dissipation on an AAU and realize cellular network relocation.

The technical scheme of the invention is as follows: the 5G base station heat dissipation system for realizing the cellular network relocation comprises AAU equipment, wherein the AAU equipment comprises:

the box body is rectangular and comprises a first side plate, a second side plate, a third side plate, a fourth side plate, a bottom plate and a cover plate, wherein the first side plate, the second side plate, the third side plate and the fourth side plate are sequentially connected end to end;

the AAU device further includes:

the heat insulation plates are made of heat insulation materials and are L-shaped, any two adjacent heat insulation plates enclose an L-shaped heat dissipation channel, the inlet of each heat dissipation channel is positioned on the third side plate, and the outlet of each heat dissipation channel is positioned on the fourth side plate;

the refrigeration module comprises a rectangular shell installed on the third side plate and semiconductor refrigeration sheets arranged in the rectangular shell, the semiconductor refrigeration sheets divide the rectangular shell into a hot cavity and a cold cavity, each semiconductor refrigeration sheet comprises a hot end located in the hot cavity and a cold end located in the cold cavity, the cold ends are arranged towards inlets of the heat dissipation channels, and air inlet fans are arranged at the inlets of the heat dissipation channels to suck cold air in the cold cavities into the heat dissipation channels; the hot cavity is provided with a hot end air inlet and a hot end air outlet, and the cold cavity is provided with a cold end air inlet and a cold end air outlet;

and the electronic components are uniformly arranged on the two side plate surfaces of the heat insulation plate and positioned in the heat dissipation channel, and any two adjacent electronic components are arranged at intervals.

Furthermore, the heat insulation plate comprises a first partition plate parallel to the first side plate and a second partition plate parallel to the second side plate, projections of all electronic components on the same first partition plate on the first partition plate are not overlapped, and projections of all electronic components on the same second partition plate on the second partition plate are not overlapped.

Furthermore, a heat exhaust fan is arranged at the air outlet of the hot end.

Further, the hot end air outlet is arranged towards one side of the fourth side plate.

Further, the hot end air outlet is arranged at one end close to the joint of the third side plate and the fourth side plate.

Further, the hot end air inlet and the cold end air inlet are arranged towards one side of the third side plate.

Further, the hot end air inlet and/or the cold end air inlet are/is arranged at one end close to the joint of the second side plate and the third side plate.

Furthermore, a louver is arranged on the fourth side plate corresponding to an outlet of the heat dissipation channel, the louver is obliquely arranged, and one end of each louver, which is positioned outside the box body, is lower than one end of each louver, which is positioned inside the box body.

Furthermore, a cold end fin is arranged at the cold end of the semiconductor refrigeration sheet, and a hot end fin is arranged at the hot end of the semiconductor refrigeration sheet.

Further, the length and width dimensions of the first side plate, the second side plate, the third side plate and the fourth side plate are the same.

The invention has the beneficial effects that: when the 5G base station heat dissipation system for realizing cellular network relocation is used, the first side plate and the second side plate face to the direction where the heat generated by solar irradiation is the largest, for example, in the northwest region of China, the first side plate can face to the south and the second side plate faces to the west, so that the heat generated by the solar irradiation on the box body is reduced as much as possible by utilizing the heat insulation performance of the first side plate and the second side plate, the heat is transmitted to electronic components in the box body, the electronic components generally refer to heating components such as radio frequency units and the like, the third side plate faces to the north and the fourth side plate faces to the east, after the equipment is installed, the refrigeration module can be electrified, so that cold energy and hot end heat are generated at the cold end, the cold energy at the cold end refrigerates the air in the cold cavity, after the air inlet fans at the inlets of the heat dissipation channels are started, the cold air in the cold cavity can respectively enter the heat dissipation channels, cold air flows through each electronic components's surface in proper order to in time take away the heat that electronic components sent, make electronic components cool down, carry the heat and the hot-air that heaies up gradually continues to flow along heat dissipation channel, and flow from heat dissipation channel's exit, discharge outside the box behind the shutter on the fourth curb plate afterwards. When raining, rainwater falls on the louver, most rainwater flows outwards along with the louver and flows out of the box body, a small amount of airflow blown out by the louver is pushed out, less rainwater splashes into the box body, and the rainwater is evaporated into water vapor by passing hot air and is taken out of the box body, so that a good rainproof effect is achieved. The method has the following specific advantages:

the method comprises the following steps that 1, (the matched installation method is directional), because the south side and the west side are the directions with higher sun irradiation temperature, a double-layer structure is adopted, heat insulation filler is filled inside the double-layer structure, the air inlet is designed at the north side, because the north side is generally a shady surface and the temperature near the north side is lower, the temperature of the gas pumped into the box body is lower, the temperature reduction in the box body is facilitated, the power consumption of a refrigerating device is also facilitated to be reduced, the air outlet is arranged at the east side, and the characteristic that more wind exists in the west and north under natural conditions is utilized, and the high-temperature gas is facilitated to flow in the direction far away from the box body quickly;

2. the arrangement of the heat dissipation channels ensures that cold air can be uniformly distributed to each heat dissipation channel, the whole box body is covered by heat dissipation airflow, the temperature reduction is more uniform, the arrangement mode of the heat dissipation plates is very compact, the space utilization rate is high, and a mounting plate for mounting a heating element is formed;

(the scheme is most suitable for the sizes of all heating elements, and the sizes of the heating elements are particularly different and can be additionally arranged for large sizes), the arrangement mode of the heating elements is changed, so that the heating elements are arranged on a heat insulation plate of a heat dissipation channel, cold air flow is ensured to be capable of passing through the surfaces of the heating elements inevitably, and the heating elements are ensured to be efficiently cooled;

4. when the heating elements are arranged on the heat insulation plate, certain intervals are formed, so that cold air can wrap all exposed surfaces of the heating elements, a better heat dissipation effect is achieved, and if the intervals of the heating elements are too close, heat is mutually influenced, natural heat dissipation is not facilitated, and cold air is not facilitated to enter between the heating elements and the heat insulation plate;

5. the heating elements are arranged on the two side surfaces of the heat insulation plate, and the mutual heat interference is not large due to the heat insulation property of the heat insulation plate, so that the arrangement space of the heating elements is greatly saved, the space utilization rate is improved, and the size of the box body is reduced as much as possible;

6. the heating elements on the two sides of the heat insulation plate are not overlapped with each other when being installed, so that the problem of mutual interference of back routing can be avoided;

7. the air inlet fans are arranged in one-to-one correspondence with the heat dissipation channels, so that cold air can be obtained in each heat dissipation channel, the same amount of cold air can be obtained, and the influence on the uniformity of integral heat dissipation in the box body due to uneven air volume entering the heat dissipation channels is avoided;

8. the hot end air inlet and the cold end air inlet of the refrigerating sheet are both arranged on the northwest side, and the characteristic of lower temperature of the back and the shade of the north side is utilized to reduce energy consumption; the hot end air outlet of the refrigeration piece is arranged at the northeast side so as to reduce the influence of the discharged heat on the temperatures near the cold end air inlet and the hot end air inlet of the refrigeration piece as much as possible and ensure that the temperatures near the hot end air inlet side and the cold end air inlet side are lower, and the discharged heat does not influence the temperature at the air inlet side as much as possible;

9. the arrangement of the louver and the arrangement mode that the window leaves of the louver are low on the outer side and high on the inner side ensure that high-temperature gas discharged from the heat dissipation channel can be smoothly discharged out of the box body, and rainwater is prevented from entering the box body;

10. the semiconductor refrigerating sheet is adopted as refrigerating equipment, and the refrigerating device has the advantages of no sliding part, no use of refrigerant which is easy to pollute, small volume, high reliability, suitability for the field with limited space, capability of ensuring that the AAU box body is small and exquisite as possible, and reduction of rent when the refrigerating device is used on an iron tower.

Drawings

FIG. 1 is a schematic diagram of the basic components of a 5G base station;

FIG. 2 is a schematic diagram of the internal structure of an AAU device in a 5G base station heat dissipation system for implementing cellular network relocation according to the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

FIG. 4 is an enlarged view of a portion of FIG. 2 at B;

FIG. 5 is an enlarged view of a portion of FIG. 4 at C;

FIG. 6 is a schematic view of the working principle of the semiconductor chilling plate;

in fig. 1: 01-machine room/shelter, 02-base station cabinet, 03-BBU, 04-transmission unit, 05-power supply, 06-storage battery, 07-air conditioner, 08-monitoring, 09-optical fiber, 010-iron tower/holding pole, and 011-AAU equipment;

in fig. 2-5, 1-box, 11-first side plate, 12-second side plate, 13-third side plate, 14-fourth side plate, 15-heat insulation filler, 16-louver, 2-heat insulation plate, 21-first partition plate, 22-second partition plate, 23-heat dissipation channel, 231-inlet, 232-outlet, 3-refrigeration module, 31-rectangular shell, 32-semiconductor refrigeration sheet, 33-hot chamber, 331-hot end air inlet, 332-hot end air outlet, 34-cold chamber, 341-cold end air inlet, 342-cold end air outlet, 35-hot end fin, 36-cold end fin, 4-air inlet fan, 5-heat exhausting fan, 6-electronic component (heating element).

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.

It is noted that relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The features and properties of the present invention are described in further detail below with reference to examples.

The invention discloses an implementation mode of a 5G base station heat dissipation system for realizing cellular network relocation, which comprises the following steps:

the 5G base station heat dissipation system for realizing the cellular network relocation comprises an air conditioning system for dissipating heat in a machine room and AAU equipment with functions of efficient heat dissipation and uniform heat dissipation, and the heat dissipation of the machine room is in the prior art and is not repeated. The AAU equipment comprises a box body 1, an insulating board 2, a radio frequency unit and other electronic components 6 which are arranged in the box body 1, and a refrigeration module 3 connected with the box body 1. Wherein:

as shown in fig. 2, the box body 1 is rectangular, and comprises a first side plate, a second side plate, a third side plate and a fourth side plate 14 which are sequentially connected end to end, and further comprises a bottom plate and a cover plate, wherein the width of each side plate is smaller than the length of the box body 1 so as to form a flat square, the first side plate 12 and the second side plate 12 are double-layer plates, heat-insulating filler 15 is arranged in an interlayer of each double-layer plate, the heat-insulating filler 15 can be made of materials such as alumina hollow spheres, wood fibers, glass fibers and sponges, and the side plates can be made of metal materials commonly used in the prior art.

Referring to fig. 2, the AAU device further includes a heat insulating plate 2, the heat insulating plate 2 is made of a heat insulating material, such as glass fiber, asbestos, aerogel blanket, vacuum plate, etc., having certain hardness and insulating property, good heat insulating property and low cost, the heat insulating plate 2 is L-shaped, and the length of the heat insulating plate 2 increases as the heat insulating plate 2 extends from the lower left corner to the upper right corner, i.e. two ends of the heat insulating plate 2 are respectively connected to the third side plate 13 and the fourth side plate 14 of the box 1, any two adjacent heat insulating plates 2 enclose an L-shaped heat dissipating channel 23, the heat dissipating channels 23 are substantially sealed to prevent mutual influence of heat, an inlet 231 of each heat dissipating channel 23 is located on the third side plate 13, an outlet 232 of each heat dissipating channel 23 is located on the fourth side plate 14, the cross section of each heat dissipating channel 23 is rectangular, and is actually enclosed by the adjacent heat insulating plates 2 and the cover plate and the bottom plate, the widths of the heat dissipation channels 23 are basically the same, but if some electronic components 6 are large in size, the widths of the corresponding heat dissipation channels 23 can also be adaptively adjusted, but if some electronic components 6 are too large in size, the heat dissipation channels are not arranged on the heat dissipation channels 23, the heat dissipation channels can be arranged at the lower left corner in fig. 2, and when one part of the heat insulation board 2 at the lower left corner is removed, the heat insulation board 2 is not arranged to reserve a corresponding space, and at this time, corresponding inlets 231 and outlets 232 are also arranged in the part of the heat insulation board 2 to allow cold air to enter and hot air to be discharged. The heat shield 2 includes a first partition 21 parallel to the first side plate 11 and a second partition 22 parallel to the second side plate 12, and projections of the electronic components 6 on the same first partition 21 on the first partition 21 do not coincide, and projections of the electronic components 6 on the same second partition 22 on the second partition 22 do not coincide. The fourth side plate 14 is provided with a louver 16 corresponding to the outlet 232 of the heat dissipation channel 23, the louver 16 is disposed with its louver inclined, and one end of each louver located outside the box body 1 is lower than one end located inside the box body 1. The first side plate 11, the second side plate 12, the third side plate 13 and the fourth side plate 14 have the same length and width dimensions.

As shown in fig. 2, the refrigeration module 3 includes a rectangular case 31 attached to the third side plate 13, and a semiconductor refrigeration sheet 32 disposed in the rectangular case 31, and the rectangular case 31 is preferably made of a hard material such as a metal plate or a plastic plate having a certain heat insulating ability. The rectangular shell 31 is divided into a hot cavity 33 and a cold cavity 34 by the semiconductor refrigeration sheet 32, the semiconductor refrigeration sheet 32 comprises a hot end positioned in the hot cavity 33 and a cold end positioned in the cold cavity 34, the cold end is arranged towards the inlet 231 of the heat dissipation channels 23, and the inlet 231 of each heat dissipation channel 23 is provided with an air inlet fan 4 for pumping cold air in the cold cavity 34 into each heat dissipation channel 23; hot chamber 33 has a hot side inlet 331 and a hot side outlet 332 and cold chamber 34 has a cold side inlet 341 and a cold side outlet 342. A heat exhausting fan 5 is arranged at the hot end air outlet 332. Hot end air outlet 332 is disposed toward one side of fourth side panel 14 and hot end air outlet 332 is disposed at an end proximate to the junction of third side panel 13 and fourth side panel 14. The hot side inlet 331 and the cold side inlet 341 are disposed toward one side of the third side plate 13. And the hot end air inlet 331 and the cold end air inlet 341 are provided at one end near the junction of the second side plate 12 and the third side plate 13. The cold end of the semiconductor refrigeration sheet 32 is provided with a cold end fin 36, and the hot end is provided with a hot end fin 35.

Electronic components 6 (such as radio frequency power supply) are uniformly arranged on the two side plate surfaces of the heat insulation plate 2 and are positioned in the heat dissipation channel 23, and any two adjacent electronic components 6 are arranged at intervals.

As shown in fig. 6, when the power is turned on and the dc current flows from N-type to P-type, the copper connection pads at the 2 and 3 ends absorb heat, which is called cold end, and the copper connection pads at the 1 and 4 ends release heat, which is called hot end; if the current direction is reversed, the cold and hot ends are interchanged. Several pairs of thermocouples are connected to form a common thermopile, and with the help of various heat transfer devices, the hot end of the thermopile can fully dissipate heat and keep a certain temperature, and the cold end of the thermopile is placed in a working environment to realize heat absorption and temperature reduction.

When the 5G base station heat dissipation system for realizing cellular network relocation of the invention is used, as shown in fig. 1, the first side plate 11 and the second side plate 12 are directed to the direction of the largest heat generated by solar irradiation, for example, in the northwest region of China, the first side plate 11 can be directed to the south, the second side plate 12 can be directed to the west, so that the heat generated by the solar irradiation on the box body 1 is reduced as much as possible by utilizing the heat insulating property of the first side plate 11 and the second side plate 12, and is transferred to the electronic component 6 in the box body 1, the electronic component 6 generally refers to a radio frequency unit and other heating components, the third side plate 13 is directed to the north, the fourth side plate 14 is directed to the east, after the equipment is installed, the refrigeration module 3 can be electrified, so that cold energy and hot end are generated at the cold end, the cold energy of the cold end refrigerates the air in the cold chamber 34, and after the air intake fan 4 at the inlet 231 of each heat dissipation channel 23 is started, cold air in the cold chamber 34 can enter into each heat dissipation channel 23 respectively, as shown in fig. 4, the cold air flows through the outer surface of each electronic component 6 in sequence, and takes away the heat emitted by the electronic component 6 in time, so that the electronic component 6 is cooled, the hot air carrying the heat and gradually increasing the temperature continuously flows along the heat dissipation channel 23, flows out from the outlet 232 of the heat dissipation channel 23, and is then discharged out of the box body 1 after passing through the louver 16 on the fourth side plate 14. When raining, the rainwater falls on the louver 16, most of the rainwater flows out of the box body 1 along with the louver 16 outwards and downwards, a small amount of airflow blown out by the louver 16 is pushed out, less part of rainwater splashes into the box body 1, and the rainwater is evaporated into water vapor by passing hot air and is taken out of the box body 1, so that a good rainproof effect is achieved. The method is characterized in that:

The above description is only a preferred embodiment of the present invention, and not intended to limit the present invention, the scope of the present invention is defined by the appended claims, and all structural changes that can be made by using the contents of the description and the drawings of the present invention are intended to be embraced therein.

Claims

1. The 5G base station heat dissipation system for realizing the cellular network relocation comprises AAU equipment, wherein the AAU equipment comprises:

the AAU device further includes:

2. The 5G base station heat dissipation system for realizing cellular network relocation as claimed in claim 1, wherein the heat insulation board comprises a first partition parallel to the first side board and a second partition parallel to the second side board, projections of the electronic components on the same first partition on the first partition do not coincide, and projections of the electronic components on the same second partition on the second partition do not coincide.

3. The 5G base station heat dissipation system for realizing cellular network relocation according to claim 1 or 2, wherein a heat exhausting fan is arranged at the hot end air outlet.

4. The 5G base station heat dissipation system for realizing cellular network relocation as claimed in claim 3, wherein the hot end air outlet is disposed towards one side of the fourth side plate.

5. The 5G base station heat dissipation system for realizing cellular network relocation as claimed in claim 4, wherein the hot side air outlet is disposed at an end close to the junction of the third side plate and the fourth side plate.

6. The 5G base station heat dissipation system for realizing cellular network relocation as claimed in claim 5, wherein the hot side air inlet and the cold side air inlet are disposed toward one side of the third side plate.

7. The 5G base station heat dissipation system for realizing cellular network relocation according to claim 6, wherein the hot end air inlet and/or the cold end air inlet is/are arranged at one end close to the connection position of the second side plate and the third side plate.

8. The system for cooling a 5G base station for realizing cellular network relocation according to claim 1, wherein a louver is disposed on the fourth side plate corresponding to the outlet of the cooling channel, the louver is disposed with its window inclined, and one end of each louver located outside the box is lower than one end located inside the box.

9. The 5G base station heat dissipation system for realizing cellular network relocation as claimed in claim 1, wherein a cold end fin is disposed at a cold end of the semiconductor chilling plate, and a hot end fin is disposed at a hot end of the semiconductor chilling plate.

10. The 5G base station heat dissipation system for realizing cellular network relocation according to claim 1, wherein the length and width dimensions of the first side plate, the second side plate, the third side plate and the fourth side plate are the same.