CN219151879U

CN219151879U - Raw material slicing machine

Info

Publication number: CN219151879U
Application number: CN202222459100.3U
Authority: CN
Inventors: 王洪涛; 王向农; 陈雄光
Original assignee: Zhejiang New Technology Co ltd
Current assignee: Zhejiang New Technology Co ltd
Priority date: 2022-09-16
Filing date: 2022-09-16
Publication date: 2023-06-09
Anticipated expiration: 2032-09-16

Abstract

The utility model provides a raw material slicing machine, which comprises a shell, wherein a conveying groove is formed in the top surface of the shell, and a silicon wafer is arranged in the conveying groove; the mounting block is fixedly mounted on one side of the shell, a mounting groove is formed in the top surface of the mounting block, and a mechanical arm is fixedly mounted in the mounting groove; the laser cutting head is fixedly arranged at one end of the mechanical arm; the conveying assembly is arranged on one side of the inner portion of the conveying groove and is used for conveying the silicon wafers, the mechanical arm drives the laser cutting head to move when the conveying assembly is used, the laser cutting head performs slicing operation on the silicon wafers, the driving motor is arranged, the conveying belt is driven to rotate through the driving shaft of the driving motor, the silicon wafers on the fixed block are conveyed through the rotation of the conveying belt, the laser cutting head is convenient to cut and process the silicon wafers, reassembling is omitted after the silicon wafers are cut, time is saved, and working efficiency is improved.

Description

Raw material slicing machine

Technical Field

The utility model relates to the technical field of slicing machines, in particular to a raw material slicing machine.

Background

The chip is mainly composed of silicon. Silicon is an atomic crystal, insoluble in water or nicotinic acid, has metallic luster on the surface, and is a form of elemental silicon. When the melted elemental silicon solidifies under supercooling conditions, the silicon atoms are arranged in the form of diamond lattices into a plurality of crystal nuclei, and if the crystal nuclei grow into crystal grains with different crystal face orientations, the crystal grains combine to crystallize into polycrystalline silicon. In the process of processing the polycrystalline silicon wafer, the polycrystalline silicon raw material is required to be cut and molded

For example, chinese patent with publication number CN211840642U proposes a slicing machine for polycrystalline silicon wafer, this subassembly is in the during operation, place the silicon chip on the suction nozzle, this moment through control, make suction nozzle, the gas in the intercommunication chamber enter into the intake pipe through connecting pipe and honeycomb duct, place the case, the outlet duct, in the intake pipe, then through the exhaust plate discharge, make certain negative pressure in the placer, adsorb the silicon chip, and then fix, simultaneously in the during operation, the arm carries laser cutting head, cut, in the in-process of cutting, the air pump continuously carries out work, make the air in the working box pass through the suction plate, a hose, the intake pipe, place the case, the filter, the outlet duct, in the intake pipe, then discharge through the exhaust plate, carry out the heat dissipation treatment to controlling means, the dust that the cutting produced is in this moment is filtered in the filter through adsorbing and is discharged, reduce the pollution of air, and the in-process blowout gas dispels the heat to controlling means, reduce the use of fan, simplify the device, but in this scheme, need manual reassembling can carry out the slice after a cutting is accomplished, work time is low, therefore, a raw materials slicing machine is proposed for the silicon chip is cut.

Disclosure of Invention

The present utility model aims to provide a raw material slicing machine which overcomes the above problems or at least partially solves the above problems, so as to solve the problems of increased working time and low working efficiency caused by the need of manually reassembling a silicon wafer for slicing after the completion of slicing the silicon wafer.

In order to achieve the above purpose, the technical scheme of the utility model is specifically realized as follows:

the utility model provides a raw material slicing machine, which comprises the following components: the silicon wafer processing device comprises a shell, wherein a conveying groove is formed in the top surface of the shell, and a silicon wafer is arranged in the conveying groove; the mounting block is fixedly mounted on one side of the shell, a mounting groove is formed in the top surface of the mounting block, and a mechanical arm is fixedly mounted in the mounting groove; the laser cutting head is fixedly arranged at one end of the mechanical arm; and the conveying assembly is arranged on one side of the inner part of the conveying groove and is used for conveying the silicon wafers.

Through adopting above-mentioned technical scheme, through setting up the arm, when using, drive the laser cutting head through the arm and remove, make the laser cutting head carry out the section operation to the silicon chip, carry the position of silicon chip to laser cutting head through conveying assembly, once can process the section to a plurality of silicon chips, promote work efficiency.

As a further aspect of the present utility model, the conveying assembly includes: the fixed grooves are respectively arranged on two sides of the interior of the conveying groove, and a driving motor is fixedly arranged in the fixed grooves; the conveying belt is movably arranged at one end of the driving shaft of the driving motor, a fixed block is fixedly arranged on the top surface of the conveying belt, and the silicon wafer is movably arranged on the top surface of the fixed block.

Through adopting above-mentioned technical scheme, through setting up driving motor, drive the axle through driving motor and rotate and drive the conveyer belt and rotate, carry the silicon chip on the fixed block through the conveyer belt rotation, make things convenient for laser cutting head to cut processing to the silicon chip, need not cut reassemble after a silicon chip, save time, promote work efficiency.

As a further aspect of the present utility model, the conveying assembly further includes: the two air suction grooves are formed in the top surface of the fixed block, and suction discs are fixedly arranged in the air suction grooves; the two through holes are formed in one side of the fixed block, the through holes are communicated with the air suction groove, and an air pump is fixedly arranged in the through holes.

Through adopting above-mentioned technical scheme, through setting up the air pump, the staff adsorbs the silicon chip through the sucking disc through placing the silicon chip at the top surface of fixed block, through the inside gas of air pump extraction sucking disc, promotes fixed stability, moves when avoiding the silicon chip to process, influences processing.

As a further scheme of the utility model, the inside of the air pump is fixedly provided with a dust screen.

Through adopting above-mentioned technical scheme, through setting up the dust screen, the dust that produces is cut through the dust screen and is isolated, avoids the air pump to damage.

As a further scheme of the utility model, the top surface of the shell is provided with a dust collection groove, a suction pipe is fixedly arranged in the dust collection groove, and a fan is fixedly arranged at one end of the suction pipe.

Through adopting above-mentioned technical scheme, through setting up the fan, produce suction through the fan, place the straw in the cutting position for the straw adsorbs the dust that the cutting produced, avoids the dust to be full of operational environment, influences staff's health, promotes the security.

As a further scheme of the utility model, one side of the shell is fixedly provided with a PLC panel.

Through adopting above-mentioned technical scheme, through setting up the PLC panel, make things convenient for the operation of staff control slicer through the PLC panel, promote the convenience of use.

The utility model provides a raw material slicing machine, which has the beneficial effects that:

through setting up the arm, when using, drive the laser cutting head through the arm and remove, make the laser cutting head carry out the section operation to the silicon chip, through setting up driving motor, drive the axle through driving motor and rotate and drive the conveyer belt and rotate, carry the silicon chip on the fixed block through the conveyer belt rotation, make things convenient for the laser cutting head to carry out cutting process to the silicon chip, need not cut after a silicon chip and reassemble, save time, promote work efficiency.

Through setting up the air pump, the staff adsorbs the silicon chip through the sucking disc through placing the top surface at the fixed block to the silicon chip, through the inside gas of air pump extraction sucking disc, promote fixed stability, remove during avoiding the silicon chip processing, influence processing, through setting up the dust screen, it is isolated to the dust that produces the cutting through the dust screen, avoid the air pump to damage, through setting up the fan, produce suction through the fan, place the straw in the cutting position for the dust that the straw produced to the cutting adsorbs, avoids the dust to be full of operational environment, influences staff's health, promotes the security.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic perspective view of an embodiment of the present utility model;

FIG. 2 is a schematic view of a mounting block according to an embodiment of the present utility model;

FIG. 3 is a schematic view of a structure of a fixing slot according to an embodiment of the present utility model;

fig. 4 is a schematic structural diagram of a fixing block according to an embodiment of the present utility model.

In the figure: 1. a housing; 2. a conveying trough; 3. a mounting block; 4. a mounting groove; 5. a mechanical arm; 6. a laser cutting head; 7. a silicon wafer; 8. a fixing groove; 9. a driving motor; 10. a conveyor belt; 11. a fixed block; 12. an air suction groove; 13. a suction cup; 14. a through hole; 15. an air pump; 16. a dust screen; 17. a dust collection groove; 18. a suction pipe; 19. a PLC panel.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

Referring to fig. 1, fig. 2 and fig. 3, the raw material slicing machine provided by the embodiment of the utility model comprises a housing 1, a conveying groove 2 is formed in the top surface of the housing 1, a silicon wafer 7 is arranged in the conveying groove 2, a mounting block 3 is fixedly mounted on one side of the housing 1, a mounting groove 4 is formed in the top surface of the mounting block 3, a mechanical arm 5 is fixedly mounted in the mounting groove 4, a laser cutting head 6 is fixedly mounted at one end of the mechanical arm 5, a conveying component is arranged on one side of the interior of the conveying groove 2 and is used for conveying the silicon wafer 7, the mechanical arm 5 is arranged, when the raw material slicing machine is used, the mechanical arm 5 drives the laser cutting head 6 to move, the laser cutting head 6 performs slicing operation on the silicon wafer 7, the conveying component conveys the silicon wafer 7 to the position of the laser cutting head 6, a plurality of silicon wafers 7 can be processed and sliced at one time, the conveying component comprises a plurality of fixing grooves 8, the fixing grooves 8 are respectively formed in two sides of the interior of the conveying groove 2, a driving motor 9 is fixedly mounted in the fixing groove 8, a driving belt 10 is movably mounted at one end of a driving shaft of the driving motor 9, the top surface of the driving motor 10 is fixedly mounted on the fixing block 11, the top surface of the driving motor 11 is fixedly mounted on the driving shaft 11, the driving shaft 11 is rotatably drives the driving shaft 11 to rotate through the driving motor 11, and the driving shaft 11 is rotatably mounted on the driving shaft 7 to drive the driving shaft 10 to rotate, and the driving shaft 11 is convenient to rotate, and the driving belt is used for carrying and is driven to rotate.

Referring to fig. 1, 2, 3 and 4, the delivery assembly further comprises: the two air suction grooves 12 are formed in the top surface of the fixed block 11, and suction discs 13 are fixedly arranged in the air suction grooves 12; the two through holes 14, two through holes 14 are offered in one side of fixed block 11, through hole 14 is linked together with suction groove 12, the inside fixed mounting of through hole 14 has air pump 15, through setting up air pump 15, the staff adsorbs silicon chip 7 through sucking disc 13 through placing silicon chip 7 at the top surface of fixed block 11, through the inside gas of air pump 15 extraction sucking disc 13, promote fixed stability, remove when avoiding silicon chip 7 to process, influence processing, the inside fixed mounting of air pump 15 has dust screen 16, through setting up dust screen 16, isolate the dust that cuts the production through dust screen 16, avoid air pump 15 to damage, dust absorption groove 17 has been offered to the top surface of shell 1, the inside fixed mounting of dust absorption groove 17 has straw 18, the one end fixed mounting of straw 18 has the fan, through setting up the fan, produce suction through the fan, through placing straw 18 in the cutting position, make straw 18 adsorb the dust that cuts the production, avoid the dust to be full of operational environment, influence staff's health, promote the security, one side fixed mounting of shell 1 has PLC panel 19, PLC panel 19 and arm 5, laser cutting head 6, driving motor 9, 15 are connected together through the air pump panel 19, the convenience of operation of PLC panel, PLC is convenient for the personnel through setting up the blade.

Working principle: please refer to fig. 1, fig. 2, fig. 3 and fig. 4, through setting up arm 5, when using, drive laser cutting head 6 through arm 5 and remove, make laser cutting head 6 carry out the section operation to silicon chip 7, through setting up driving motor 9, drive belt 10 rotation through driving motor 9 drive shaft, silicon chip 7 on fixed block 11 is carried through conveyer belt 10 rotation, make things convenient for laser cutting head 6 to cut processing to silicon chip 7, promote work efficiency, through setting up air pump 15, the staff is through placing silicon chip 7 at the top surface of fixed block 11, adsorb silicon chip 7 through sucking disc 13, extract the inside gas of sucking disc 13 through air pump 15, promote fixed stability, avoid silicon chip 7 to move, influence processing, through setting up dust screen 16, isolate through dust screen 16 to the dust that produces, avoid air pump 15 to damage, through setting up the fan, through placing suction pipe 18 in the cutting position, make dust that the dust that produces adsorb on cutting blade 18, avoid influencing staff's health, promote the security, through setting up panel 19, through lifting PLC's convenience of operation PLC of the convenient slicing machine of staff.

The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and changes may be made to the present application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc. which are within the spirit and principles of the present application are intended to be included within the scope of the claims of the present application.

Claims

1. A raw material slicer, comprising:

the silicon wafer cleaning device comprises a shell (1), wherein a conveying groove (2) is formed in the top surface of the shell (1), and a silicon wafer (7) is arranged in the conveying groove (2);

the mounting block (3), the mounting block (3) is fixedly mounted on one side of the shell (1), the top surface of the mounting block (3) is provided with a mounting groove (4), and a mechanical arm (5) is fixedly mounted in the mounting groove (4);

the laser cutting head (6) is fixedly arranged at one end of the mechanical arm (5);

and the conveying assembly is arranged on one side of the interior of the conveying groove (2) and is used for conveying the silicon wafers (7).

2. The feedstock slicer of claim 1, wherein the conveying assembly comprises:

the conveying device comprises a plurality of fixing grooves (8), wherein the fixing grooves (8) are respectively formed in two sides of the interior of the conveying groove (2), and a driving motor (9) is fixedly arranged in the fixing grooves (8);

the conveying belt (10), conveying belt (10) movable mounting is in the one end of driving shaft of driving motor (9), the top surface fixed mounting of conveying belt (10) has fixed block (11), the top surface movable mounting of fixed block (11) has silicon chip (7).

3. The feedstock slicer of claim 2, wherein the conveying assembly further comprises:

the two air suction grooves (12), the two air suction grooves (12) are formed in the top surface of the fixed block (11), and suction discs (13) are fixedly arranged in the air suction grooves (12);

the two through holes (14), two through holes (14) are arranged on one side of the fixed block (11), the through holes (14) are communicated with the air suction groove (12), and an air pump (15) is fixedly arranged in the through holes (14).

4. A raw material slicer according to claim 3, characterized in that the air pump (15) is internally fixedly mounted with a dust screen (16).

5. The raw material slicing machine according to claim 1, wherein a dust collection groove (17) is formed in the top surface of the housing (1), a suction pipe (18) is fixedly installed in the dust collection groove (17), and a fan is fixedly installed at one end of the suction pipe (18).

6. A raw material slicer according to claim 1, characterized in that a PLC panel (19) is fixedly mounted on one side of the housing (1).