CN219145583U - Loudspeaker module - Google Patents
Loudspeaker module Download PDFInfo
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- CN219145583U CN219145583U CN202223058329.2U CN202223058329U CN219145583U CN 219145583 U CN219145583 U CN 219145583U CN 202223058329 U CN202223058329 U CN 202223058329U CN 219145583 U CN219145583 U CN 219145583U
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Abstract
The utility model discloses a loudspeaker module, which comprises a module shell, wherein the module shell comprises a module upper shell and a module lower shell which are connected, and a circuit board and a loudspeaker monomer are arranged in the module shell; the module comprises a module shell, a module structure and a resonance-prone structure, wherein the resonance-prone structure is formed in the module shell, and the distance between the resonance-prone structure and the inner surface of the module shell in the thickness direction of the module shell is smaller than or equal to 0.03mm; the opening is arranged on the module shell and corresponds to the structure easy to resonate; and the sealing piece is arranged at the opening and is connected with the easy-resonance structure. Through set up the opening in the region that the module shell corresponds easy resonance structure to use sealing member to seal the opening part, with the gas tightness of guarantee product, and sealing member is connected with easy resonance structure, can make easy resonance structure and module shell link as an organic wholely, thereby avoid resonance effectively.
Description
Technical Field
The utility model relates to the technical field of electroacoustic products, in particular to a loudspeaker module.
Background
At present, in order to meet consumer demands, some electronic devices are thinner and thinner, so that the space reserved for the speaker module in the electronic device is smaller and smaller, and accordingly, the speaker module is thinned, and the distance between the module upper shell and the module lower shell is reduced due to the thinning of the speaker module, so that the positioning column of the module lower shell or some welding spots on the FPC board and the like resonate with the module upper shell in the BOX vibration process, and further consumer experience is affected.
Disclosure of Invention
The technical problems to be solved by the utility model are as follows: a speaker module capable of improving resonance phenomenon is provided.
In order to solve the technical problems, the utility model adopts the following technical scheme: a loudspeaker module comprises
The module comprises a module shell, a loudspeaker and a circuit board, wherein the module shell comprises a module upper shell and a module lower shell which are connected with each other, and the module shell is internally provided with the circuit board and the loudspeaker monomer;
the module comprises a module shell, a module structure and a resonance-prone structure, wherein the resonance-prone structure is formed in the module shell, and the distance between the resonance-prone structure and the inner surface of the module shell in the thickness direction of the module shell is smaller than or equal to 0.03mm;
the opening is arranged on the module shell and corresponds to the structure easy to resonate;
and the sealing piece is arranged at the opening and is connected with the easy-resonance structure.
Further, the easy-to-resonate structure comprises a welding spot on the circuit board.
Further, the easy-to-resonate structure includes a positioning post connected to the module housing.
Further, the number of the openings is one or more, and the number of the easy-to-resonate structures is one or more.
Further, the openings are arranged in one-to-one correspondence with the easy-to-resonate structures.
Further, when the number of the easy-to-resonate structures is plural, at least two easy-to-resonate structures are disposed corresponding to the same opening.
Further, the opening includes a first portion and a second portion that are in communication, the first portion being in communication with an exterior of the module housing, and the second portion being in communication with an interior of the module housing.
Further, the first part is in a truncated cone shape; the second portion is cylindrical.
Further, the sealing element is sealant.
Further, the sealing element is fixedly connected with the easy-to-resonate structure.
The utility model has the beneficial effects that: the opening is formed in the area, corresponding to the easy-to-resonate structure, of the module shell, and the sealing piece is used for sealing the opening to ensure the air tightness of the product, and the sealing piece is connected with the easy-to-resonate structure, so that the easy-to-resonate structure and the module shell are connected into a whole, and resonance is avoided; the loudspeaker module is simple to manufacture and low in production cost, and effectively improves the resonance phenomenon of the loudspeaker module.
Drawings
Fig. 1 is a schematic structural diagram of a speaker module according to a first embodiment of the present utility model;
FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1;
FIG. 3 is an enlarged detail view at C in FIG. 2;
FIG. 4 is a cross-sectional view taken along line B-B of FIG. 1;
fig. 5 is an enlarged detail view at D in fig. 4.
Description of the reference numerals:
1. a module upper case; 11. positioning columns;
2. a module lower case;
3. a circuit board; 31. welding spots;
4. an opening; 41. a first section; 42. a second portion.
Detailed Description
In order to describe the technical contents, the achieved objects and effects of the present utility model in detail, the following description will be made with reference to the embodiments in conjunction with the accompanying drawings.
Referring to FIGS. 1 to 5, a speaker module includes
The module comprises a module shell, wherein the module shell comprises a module upper shell 1 and a module lower shell 2 which are connected, and a circuit board 3 and a loudspeaker monomer are arranged in the module shell;
the module comprises a module shell, a module structure and a resonance-prone structure, wherein the resonance-prone structure is formed in the module shell, and the distance between the resonance-prone structure and the inner surface of the module shell in the thickness direction of the module shell is smaller than or equal to 0.03mm;
an opening 4, wherein the opening 4 is arranged on the module shell, and the opening 4 is arranged corresponding to the easy-to-resonate structure;
and the sealing piece is arranged at the opening 4 and is connected with the easy-to-resonate structure.
From the above description, the beneficial effects of the utility model are as follows: the opening 4 is arranged in the area of the module shell corresponding to the easy-to-resonate structure, and the sealing piece is used for sealing the opening 4 to ensure the air tightness of the product, and the sealing piece is connected with the easy-to-resonate structure, so that the easy-to-resonate structure and the module shell are connected into a whole, and resonance is avoided; the loudspeaker module is simple to manufacture and low in production cost, and effectively improves the resonance phenomenon of the loudspeaker module.
Further, the structure easy to resonate includes a solder joint 31 on the circuit board 3.
As can be seen from the above description, the larger solder points 31 on the circuit board 3 are too close to the module housing, and the BOX easily resonates with the module housing when vibrating.
Further, the easy-to-resonate structure includes a positioning post 11 connected to the module housing.
As can be seen from the above description, the positioning posts 11 for positioning the circuit board 3 are also likely to resonate with the module housing because the current speaker module is made too thin.
Further, the number of the openings 4 is one or more, and the number of the easy-to-resonate structures is one or more.
Further, the openings 4 are arranged in one-to-one correspondence with the easy-to-resonate structures.
Further, when the number of the easy-to-resonate structures is plural, at least two of the easy-to-resonate structures are disposed corresponding to the same opening 4.
As can be seen from the above description, if two or more of the easy-to-resonate structures are closer, one opening 4 can be shared, which is beneficial to reducing the processing difficulty.
Further, the first portion 41 is in a truncated cone shape; the second portion 42 is cylindrical.
Further, the opening 4 includes a first portion 41 and a second portion 42 that are in communication, the first portion 41 being in communication with the outside of the module case, and the second portion 42 being in communication with the inside of the module case.
Further, the sealing element is sealant.
From the above description, the sealing element adopts sealant, so that the manufacturing cost can be reduced while the purpose is achieved.
Further, the sealing element is fixedly connected with the easy-to-resonate structure.
From the above description, it is evident that the fixed connection of the seal to the resonant structure is advantageous in reducing the risk of the seal being disconnected from the resonant structure again.
Example 1
Referring to fig. 1 to 5, a first embodiment of the present utility model is as follows: a loudspeaker module comprises
The module comprises a module shell, wherein the module shell comprises a module upper shell 1 and a module lower shell 2 which are connected, and a circuit board 3 and a loudspeaker monomer are arranged in the module shell;
the module comprises a module shell, a module structure and a resonance-prone structure, wherein the resonance-prone structure is formed in the module shell, and the distance between the resonance-prone structure and the inner surface of the module shell in the thickness direction of the module shell is smaller than or equal to 0.03mm;
an opening 4, wherein the opening 4 is arranged on the module shell, and the opening 4 is arranged corresponding to the easy-to-resonate structure;
and the sealing piece is arranged at the opening 4 and is connected with the easy-to-resonate structure.
Specifically, the sealing element is sealant, and the sealing element is fixedly connected with the easy-resonance structure. In this embodiment, the sealant is selected from the shadowless glue, and the shadowless glue has advantages of fast curing speed, high efficiency, high bonding strength, etc., so the shadowless glue is selected to make the easy-to-resonate structure and the module housing more firmly connected, thereby being beneficial to reducing the risk of the easy-to-resonate structure and the module housing breaking again.
Referring to fig. 1 to 5, the structure easy to resonate includes a solder joint 31 on the circuit board 3, and the structure easy to resonate includes a positioning post 11 connected to the module housing. It is easy to understand that many solder joints 31 are generated when the solder joints on the circuit board 3 are bridged, the larger the solder joints 31 are, the smaller the distance between the solder joints 31 and the module housing is, and when the distance between the solder joints 31 and the inner surface of the module housing is less than or equal to 0.03mm, the solder joints 31 are easy to resonate with the module housing, thereby affecting the acoustic performance of the speaker.
Referring to fig. 1 to 5, the number of the openings 4 is one or more, and the number of the easy-to-resonate structures is one or more; the openings 4 are arranged in one-to-one correspondence with the easy-to-resonate structures, and when the number of the easy-to-resonate structures is multiple, at least two easy-to-resonate structures are arranged corresponding to the same opening 4. In this embodiment, the size of the opening 4 is not different from the size of the easy-to-resonate structure corresponding to the opening 4, if the opening 4 is too large compared with the easy-to-resonate structure corresponding to the opening, not only waste of resources is caused, but also sealing of the opening 4 is not facilitated, if the opening 4 is too small compared with the easy-to-resonate structure corresponding to the opening, connection between the sealing element and the easy-to-resonate structure is unstable, and the sealing element is easy to break in the later stage, so that the size of the opening 4 is adapted to the size of the easy-to-resonate structure corresponding to the opening.
Referring to fig. 3 and 5, the opening 4 includes a first portion 41 and a second portion 42 that are in communication, the first portion 41 is in communication with the outside of the module housing, and the second portion 42 is in communication with the inside of the module housing. In this embodiment, the first portion 41 of the opening 4 corresponding to the positioning post 11 is in a circular truncated cone shape, the second portion 42 is in a cylindrical shape, one end of the circular truncated cone shape of the first portion 41 with a large cross-sectional area faces the outside, one end with a small cross-sectional area faces the inside, and the second portion 42 is connected to one end with a small cross-sectional area; the first portion 41 of the opening 4 corresponding to the welding point 31 is in a stepped shape, the second portion 42 is in a rectangular shape, one end of the stepped shape having a large cross-sectional area in the first portion 41 faces outward, one end having a small cross-sectional area faces inward, and the second portion 42 is connected to one end having a small cross-sectional area. In other embodiments, the shape of the opening 4 may be freely set according to the shape of the easy-to-resonate structure.
In summary, according to the speaker module provided by the utility model, the opening is formed in the module housing corresponding to the area of the easy-to-resonate structure, and the opening is sealed by the sealing element, so that the air tightness of the product is ensured, the sealing element is connected with the easy-to-resonate structure, and the easy-to-resonate structure and the module housing are connected into a whole, so that resonance is avoided, the number of the easy-to-resonate structure and the opening is not limited, the sealing element is made of the shadowless glue according to the resonance area of the product in actual production, the manufacturing cost is reduced, the opening is in a conical shape, the sealing effect of the shadowless glue is improved, and the sealing element has a drainage effect on the shadowless glue.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent changes made by the specification and drawings of the present utility model, or direct or indirect application in the relevant art, are included in the scope of the present utility model.
Claims (10)
1. A speaker module, characterized in that: comprising
The module comprises a module shell, a loudspeaker and a circuit board, wherein the module shell comprises a module upper shell and a module lower shell which are connected with each other, and the module shell is internally provided with the circuit board and the loudspeaker monomer;
the module comprises a module shell, a module structure and a resonance-prone structure, wherein the resonance-prone structure is formed in the module shell, and the distance between the resonance-prone structure and the inner surface of the module shell in the thickness direction of the module shell is smaller than or equal to 0.03mm;
the opening is arranged on the module shell and corresponds to the structure easy to resonate;
and the sealing piece is arranged at the opening and is connected with the easy-resonance structure.
2. A loudspeaker module according to claim 1, wherein: the easy-to-resonate structure comprises welding spots on the circuit board.
3. A loudspeaker module according to claim 1, wherein: the easy-to-resonate structure comprises a positioning column connected with the module shell.
4. A loudspeaker module according to claim 1, wherein: the number of the openings is one or more, and the number of the easy-to-resonate structures is one or more.
5. The speaker module as recited in claim 4, wherein: the openings are arranged in one-to-one correspondence with the easy-to-resonate structures.
6. The speaker module as recited in claim 4, wherein: when the number of the easy-to-resonate structures is plural, at least two easy-to-resonate structures are arranged corresponding to the same opening.
7. A loudspeaker module according to claim 1, wherein: the opening comprises a first part and a second part which are communicated, wherein the first part is communicated with the outside of the module shell, and the second part is communicated with the inside of the module shell.
8. The speaker module as recited in claim 7, wherein: the first part is in a truncated cone shape; the second portion is cylindrical.
9. A loudspeaker module according to claim 1, wherein: the sealing element is sealant.
10. A loudspeaker module according to claim 9, wherein: the sealing element is fixedly connected with the easy-to-resonate structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223058329.2U CN219145583U (en) | 2022-11-17 | 2022-11-17 | Loudspeaker module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223058329.2U CN219145583U (en) | 2022-11-17 | 2022-11-17 | Loudspeaker module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219145583U true CN219145583U (en) | 2023-06-06 |
Family
ID=86602386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223058329.2U Active CN219145583U (en) | 2022-11-17 | 2022-11-17 | Loudspeaker module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219145583U (en) |
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2022
- 2022-11-17 CN CN202223058329.2U patent/CN219145583U/en active Active
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