CN209002154U - Microphone assembly and earphone - Google Patents
Microphone assembly and earphone Download PDFInfo
- Publication number
- CN209002154U CN209002154U CN201821491953.2U CN201821491953U CN209002154U CN 209002154 U CN209002154 U CN 209002154U CN 201821491953 U CN201821491953 U CN 201821491953U CN 209002154 U CN209002154 U CN 209002154U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- accommodation groove
- microphone
- sound hole
- microphone assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000004308 accommodation Effects 0.000 claims abstract description 65
- 239000003292 glue Substances 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 125000004122 cyclic group Chemical group 0.000 claims description 4
- 239000012943 hotmelt Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000012812 sealant material Substances 0.000 claims 1
- 238000003283 slot draw process Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 12
- 239000000565 sealant Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- 241000209140 Triticum Species 0.000 description 2
- 235000021307 Triticum Nutrition 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- -1 timber Substances 0.000 description 1
Landscapes
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
This application discloses microphone assembly and earphones, and wherein microphone assembly includes shell, microphone, circuit board and filled layer.Shell offers accommodation groove.Microphone is fixed on circuit board, and circuit board is placed in accommodation groove and outer shell phase is fixed and microphone is located at circuit board away from accommodation groove side.Filled layer is set between circuit board and shell.Glue application region is formed between circuit board and accommodation groove, glue application region is for accommodating sealing colloidal materials to connect circuit board and accommodation groove, to be fixed to circuit board and be sealed between circuit board and accommodation groove.By the above-mentioned means, the application can enhance the structural stability of microphone assembly, while microphone assembly sealing performance can be improved.
Description
Technical field
This application involves Audiotechnica fields, more particularly to microphone assembly and earphone.
Background technique
Nowadays, more and more electronic products use microphone, and microphone is also used in addition to traditional call function
ANC, uplink noise reduction, voice wake-up, human-computer dialogue etc., the miniaturized design of microphone is increasingly becoming trend, and user is for Mike
The performance requirement of wind is also higher and higher.
Present inventor has found that the structure microphone of existing microphone seals in the research process to the prior art
Imprecision and exist and be easy the problems such as loosening, the problems such as microphone is easy to appear damage, further will affect product yield and
Production capacity.
Utility model content
The application improves the leakproofness of microphone structure mainly solving the technical problems that offer microphone assembly and earphone
Energy.
In order to solve the above technical problems, the technical solution that the application uses is: providing a kind of microphone assembly, the wheat
Gram wind component includes: shell, offers accommodation groove；Microphone and circuit board, microphone are fixed on circuit board, circuit board accommodating
It is fixed in accommodation groove and with outer shell phase, and microphone is located at circuit board away from accommodation groove side；Filled layer, filled layer, which is located at, to be held
It sets in slot, and is set between circuit board and shell；Wherein, glue application region is formed between circuit board and accommodation groove, glue application region is used
In accommodating sealing colloidal materials to connect circuit board and accommodation groove, to be further fixed to circuit board and to circuit board and appearance
It sets and is sealed between slot.
In order to solve the above technical problems, another technical solution that the application uses is: providing a kind of earphone, earphone includes
At least one loudspeaker assembly and microphone assembly provided by the present application as above.
Compared with prior art, the beneficial effect of the application is: by the way that the circuit board for being fixedly connected with microphone to be placed in
It is fixed in accommodation groove and with outer shell phase, filled layer is filled between circuit board and shell, is formed between circuit board and accommodation groove
Glue application region, glue application region seal colloidal materials for accommodating to connect circuit board and accommodation groove, while to the appearance of circuit board and shell
It sets slot to be sealed, can so enhance the structural stability of microphone assembly, while microphone assembly leakproofness can be improved
Energy.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the application microphone assembly；
Fig. 2 is the structural exploded view of one embodiment of the application microphone assembly；
Fig. 3 is the schematic cross-sectional view obtained using III-III as cutting line in Fig. 1；
Fig. 4 a is the partial enlargement diagram of region M in Fig. 3；
Fig. 4 b is the another schematic diagram of partial enlargement of region M in Fig. 3；
Fig. 4 c is another schematic diagram of partial enlargement of region M in Fig. 3；
Fig. 5 is the shell mechanism schematic diagram of the application microphone assembly embodiment；
Fig. 6 is the hot melt portion structural schematic diagram of the positioning column of one embodiment of the application microphone assembly；
Fig. 7 is the application earphone example structure schematic diagram.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiment of the application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall in the protection scope of this application.
Term " first ", " second " in the application are used for description purposes only, and are not understood to indicate or imply opposite
Importance or the quantity for implicitly indicating indicated technical characteristic.Define " first " as a result, the feature of " second " can be bright
Show or implicitly include at least one this feature.In the description of the present application, the meaning of " plurality " is at least two, such as two
It is a, three etc., unless otherwise specifically defined.The directional instruction of institute in the embodiment of the present application (such as upper and lower, left,
It is right, forward and backward ...) be only used for explain under a certain particular pose (as shown in the picture) between each element relative positional relationship,
Motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.In addition, term
" comprising " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as contain series of steps
Or the process, method, system, product or equipment of element, it is not limited to listed step or element, but is optionally also wrapped
Include the step of not listing or element, or optionally further comprising other steps intrinsic for these process, methods, product or equipment
Rapid or element.
In the description of the present application, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection ", " be arranged exist ... on " shall be understood in a broad sense, for example, it may be being fixedly connected, be also possible to removably connect
It connects, or is integrally connected；It can be mechanical connection；It can be and be directly connected to, can also indirectly connected through an intermediary, it can
To be the connection inside two elements.For the ordinary skill in the art, concrete condition can be regarded and understand above-mentioned art
The concrete meaning of language in this application.
Refering to fig. 1, Fig. 2 and Fig. 3, the microphone assembly 1 that one embodiment of the application microphone assembly provides, comprising: shell
10, microphone 20, circuit board 30 and filled layer 40.
The material of the shell 10 can be plastics, timber, metal and other simple substance or composite material etc..Shell 10 is opened
Equipped with accommodation groove 11, for accommodating other components such as circuit board 30.Optionally, which can be by 10 protrusion one of shell
The part of side surrounds.
In the present embodiment, microphone 20 is fixed on circuit board 30.Wherein, microphone 20 can be electret type wheat
It is gram wind, MEMS (Micro-Electro-Mechanical System, Micro Electro Mechanical System) type microphone, moving-coil microphone, small
Vibrating diaphragm capacitance microphone, big vibrating diaphragm capacitance microphone, vacuum tube microphone, aluminium strip microphone and piezoelectric microphones etc..Circuit board
30 be, for example, pcb board (Printed Circuit Board, printed circuit board).Optionally, circuit board 30 and microphone 20 can be with
It is fixedly connected by modes such as SMT (Surface Mount Technology, surface installation technique).Circuit board 30 is placed in
It is fixed in accommodation groove 11 and with 10 phase of shell, for example, circuit board 30 can pass through the modes such as screw, bolt, buckle and 10 phase of shell
It is fixed, it is possible to reduce the influence that relative movement brings subsequent assembly occurs for circuit board 30 and shell 10.
In the present embodiment, filled layer 40 is located in accommodation groove 11, and is set between circuit board 30 and shell 10, that is, fills out
It fills between circuit board 30 and shell 10.Filled layer 40 can be by silica gel, TPE (Thermoplastic Elastomer, heat
Thermoplastic elastic), TPU (Thermoplastic Polyurethanes, thermoplastic polyurethane elastomer) or EVA
At least one of materials such as (Ethylene-vinyl Acetate copolymer, ethylene-vinyl acetate copolymers) or
It is a variety of and formed, buffer protection circuit board 30 and microphone 20 can be played the role of, while to a certain extent can also be with
Play sealing function.
In the present embodiment, glue application region 50 is formed between circuit board 30 and accommodation groove 11, the glue application region 50 is for accommodating
Colloidal materials, such as glue etc. are sealed, glue forms sealant layer 60 after molding or solidification, and sealant layer 60 is set to a little
Glue area 50 is so that circuit board 30 and accommodation groove 11 are bonded, such as carries out with the side wall of accommodation groove 11 be bonded, namely passes through sealing
Circuit board 30 can be carried out bonding with accommodation groove 11 and connected by the characteristic of glue-line 60, to be further fixed to circuit board 30,
Meanwhile sealant layer 60 can be sealed between circuit board 30 and accommodation groove 11.
The present embodiment pass through by the circuit board 30 for being fixedly connected with microphone 20 be placed in accommodation groove 11 and with 10 phase of shell
Fixed, filled layer 40 is filled between circuit board and shell 10, is formed with dispensing between circuit board 30 and the side wall of accommodation groove 11
Area 50, glue application region 50 form sealant layer 60 for accommodating sealing colloidal materials such as glue etc. with solidification, and sealant layer 60 is set
It sets and circuit board 30 and the bonding of shell 10 is further fixed in glue application region 50, while to circuit board 30 and shell 10
It is sealed between accommodation groove 11.The structural stability of microphone assembly 1 can so be enhanced, while microphone group can be improved
1 sealing performance of part, to optimize the pickup effect of microphone assembly 1.
Optionally, as shown in Fig. 3 and Fig. 4 a- Fig. 4 c, glue application region 50 is further formed in circuit board 30 and accommodation groove 11
Side wall between, the side wall of accommodation groove 11 on the direction at the top of accommodation groove 11 to the bottom of accommodation groove 11 successively include top surface
113, the first medial surface 111 and the second medial surface 112 intersected with top surface 113, the intersection of the first medial surface 111 and top surface 113
The distance H for locating 112 place face of the 114 to the second medial surface is greater than 0.The shape of accommodation groove 11 can be rectangular, round or oval
Shape etc., so that the second medial surface 112 can also be plane, cambered surface or other types of male and fomale(M&F) etc. accordingly.Such as when
When two medial surfaces 112 are planes, 112 place face of the second medial surface is 112 place plane of the second medial surface, and intersection 114 is arrived
The distance H of second medial surface, 112 place plane is on intersection 114 o'clock to the vertical of 112 place plane of the second medial surface
Distance H.Such as when the second medial surface 112 is cambered surface, 112 place face of the second medial surface is 112 place arc of the second medial surface
Face is somebody's turn to do when the line of the corresponding points in the 112 place cambered surface of point and the second medial surface on intersection 114 passes through perpendicular to place
The section of corresponding points, then the distance of the line is H.In the present embodiment, the second medial surface 112 is compared to the first medial surface 111
Closer to the inside of accommodation groove 11, as shown in Fig. 4 a- Fig. 4 c.In other embodiments, the first medial surface 111 and the second medial surface
112 there are also other forms, are not limited to situation shown in Fig. 4 a- Fig. 4 c, such as the first medial surface 111 and the second medial surface 112 can
With other shapes such as wavy or concave-convexes.Fig. 4 a- Fig. 4 c is the partial enlarged view of M in Fig. 3, Fig. 4 a- Fig. 4 c show with
Lower three kinds of examples:
As shown in fig. 4 a, the part at the neighbouring top 113 of the side wall of accommodation groove 11 forms corner cut to the first situation, such as through
It is big that the first planar medial surface 111a, the distance between the first medial surface 111a and 30 side of circuit board R1 is formed after corner cut
In the distance between the second medial surface 112 and 30 side of circuit board D1.Optionally, distance D1 can be 0 namely circuit board
30 side directly contacts the second medial surface 112.
Second situation is as shown in Figure 4 b, and the part at the neighbouring top of the side wall of accommodation groove 11 forms corner cut, such as through cutting
Curved first medial surface 111b is formed behind angle, the distance between the first medial surface 111b and 30 side of circuit board R2 are greater than
The distance between second medial surface 112 and 30 side of circuit board D2.Optionally, distance D2 can be 0.
As illustrated in fig. 4 c, the part at the neighbouring top of the side wall of accommodation groove 11 is formed with corner cut, such as directly to the third situation
Angle corner cut, to form the first medial surface 111c, the distance between the first medial surface 111c and 30 side of circuit board R3 are greater than the
The distance between two medial surfaces 112 and 30 side of circuit board D3.Optionally distance D3 may be 0 namely circuit board 30
Side directly contacts the second medial surface 112.
Optionally, as shown in Fig. 4 a and Fig. 4 c, the first medial surface 111 and the second medial surface 112 can all be planes, or
Person is as shown in Figure 4 b, and the first medial surface 111 is curved surface, and the second medial surface 112 is plane, naturally it is also possible to be other curved surfaces with
The combination etc. in the face of the combination of curved surface or other concave-convex types.First medial surface 111 is oppositely arranged with circuit board 30, and and circuit
Region between plate 30 forms glue application region 50.
Optionally, on the direction at 11 top of accommodation groove to 11 bottom of accommodation groove, the first medial surface 111 arrives circuit board 30
Between the width of glue application region 50 that is formed be gradually reduced.Such as Fig. 4 a and as shown in Figure 4 b, the size edge of width R1 and width R2
Accommodation groove is gradually reduced on 11 top to the direction of 11 bottom of accommodation groove.Aforesaid way can in order to the formation of sealant layer 60,
The material for saving sealant layer 60 simultaneously, may further guarantee the fixed effect and sealing effect of circuit board 30.
Optionally, as shown in Figure 1, glue application region 50 is circumferentially formed between the side wall of accommodation groove 11 and circuit board 30.Tool
Body, glue application region 50 is circumferentially formed between the side wall of accommodation groove 11 and circuit board 30 along circuit board 30.Sealant layer 60 is along point
Glue area 50, which is formed by, to be circumferentially set on glue application region 50, and which can make sealant layer 60 enter 30 surrounding of circuit board,
To keep circuit board 30 and accommodation groove 11 sufficiently fixed and sealing, fixation and sealing of the circuit board 30 in accommodation groove 11 are promoted
Effect.
Optionally, refering to Fig. 2 and Fig. 3, shell 10 further comprises that the ring-type that substrate 13 and protrusion substrate 13 are arranged is enclosed
Wall portion 14, cyclic annular enclosure wall portion 14 and substrate 13, which enclose, is set as accommodation groove 11, and cyclic annular enclosure wall portion 14 and substrate 13 are integrally formed.The accommodating
11 shape of slot can be round or rectangle etc., can be designed as the case may be, it is not limited here.The present embodiment is logical
It crosses substrate 13 and cyclic annular enclosure wall portion 14 encloses and is set as accommodation groove 11 and can facilitate accommodating circuit board 30 and microphone 20 etc., while energy
Enough so that fixed effect and sealing effect are more preferable, further such that the pickup effect of microphone 20 is more preferable.
Certainly in other embodiments, as shown in figure 5, shell 10 can also form accommodation groove 11 by way of indent.
Which can reduce the volume of microphone 20, convenient for assembling in the small product in space.
Optionally, refering to fig. 1, Fig. 3 and Fig. 6, microphone assembly 1 further comprises that protrusion is arranged in 11 bottom of accommodation groove
At least one positioning column 15, at least one positioning column 15 can be integrally formed with shell 10, quantity can be 2,4 or
6 etc..At least one positioning column 15 can be distributed in 20 side of microphone simultaneously, or a part is located at the one of microphone 20
Side, another part are located at the other side of microphone 20, and certain positioning column 15 can also be configured around microphone 20.Filling
Layer 40 and circuit board 30 are sheathed on respectively on positioning column 15, to position to filled layer 40 and circuit board 30.For example, filled layer
40 and circuit board 30 be successively sheathed on positioning column 15.The part that wherein positioning column 15 exposes circuit board 30 is formed with hot melt portion
151, such as be state when not heating shown in Fig. 3, it is the state after hot melt as shown in Figure 6.Aforesaid way can be by circuit board
30 is fixed, and the influence that relative movement is brought occurs for the accommodation groove 11 for reducing circuit board 30 and shell 10, right convenient for sealant layer 60
The fixation and sealing of glue application region 50.
Optionally, as shown in figure 3, can offer extraneous first with accommodation groove 11 of connection on shell 10 draws sound hole 12, the
One draws part of the sound hole 12 in shell 10 as the bottom of accommodation groove 11, with the connection external world and accommodation groove 11.First draws sound
The shape in hole 12 can be round or ellipse or rectangle etc., and shape is it is not limited here.Circuit board 30 can be offered and be passed through
It wears the second of circuit board 30 and draws sound hole 31, microphone 20 draws sound hole 31 with sound inlet 21, second and sound inlet 21 is specific outer
Depending on shape and size can be according to situations, it is not limited here.Second draws sound hole 31 is connected to sound inlet 21.Filled layer 40 offers
Draw sound hole 41 through the third of filled layer 40, third draws the specific shape of sound hole 41 and size is decided as circumstances require, and does not do herein
It limits.Third draws the connection of sound hole 41 first and draws sound hole 12 and second and draw the sound inlet 21 of sound hole 31 namely microphone 20, shell 10
First draw sound hole 12, circuit board 30 second draws sound hole 31 and draws sound hole 41 with the third of filled layer 40 and be connected, so can shape
Extraneous sound is introduced in microphone 20 by the channel Cheng Jinyin.Optionally, the diameter that third draws sound hole 41 is greater than first and draws
Sound hole 12 and second draws sound hole 31.Which is conducive to reception of the microphone 20 to sound, so that the pickup of microphone assembly 11
Effect is more preferable.Further, first draw sound hole 12, second draw sound hole 31, third draws sound hole 41 and sound inlet 21 is coaxially disposed, can
So that sound enters without hindrance, interference of reduction by 1 body structure of microphone assembly to sound.
Optionally, first draws dustproof filter screen (not shown go out) is arranged on sound hole 12, prevents dust, bulky grain foreign matter etc. from entering
Microphone assembly 1 into sound channel, the pickup of microphone 20 is impacted.
Refering to Fig. 7, the application earphone embodiment, including the Mike according to above-mentioned the application microphone assembly embodiment
Wind component 1 and at least one loudspeaker assembly 70.Particular content about microphone assembly 1 can refer to retouching for above-described embodiment
It states, details are not described herein.In addition to riding position of the microphone assembly 1 shown in Fig. 7 in earphone, microphone assembly 1 can also position
In (not shown) in earphone, particular content can refer to the description of above-described embodiment, and details are not described herein.
In the present embodiment, earphone can be wired earphone, or wireless headset, e.g. bluetooth headset.
The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this
Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field similarly includes in the scope of patent protection of the application.
Claims (10)
1. a kind of microphone assembly characterized by comprising
Shell offers accommodation groove；
Microphone and circuit board, the microphone are fixed on the circuit board, and the circuit board is placed in the accommodation groove
And it is fixed with the outer shell phase, and the microphone is located at the circuit board away from the accommodation groove side；
Filled layer, the filled layer is located in the accommodation groove, and is set between the circuit board and the shell；
Wherein, glue application region is formed between the circuit board and the accommodation groove, the glue application region is for accommodating sealant material
Material is to connect the circuit board and the accommodation groove, so that the circuit board be fixed and to the circuit board and the appearance
It sets and is sealed between slot.
2. microphone assembly according to claim 1, which is characterized in that the glue application region is further formed in the circuit board
Between the side wall of the accommodation groove, the side wall of the accommodation groove is at the top of the accommodation groove to the bottom of the accommodation groove
Successively include the first medial surface and the second medial surface of top surface, the setting of the neighbouring top surface on direction, first medial surface with
The distance in face is greater than 0 where the intersection of the top surface to second medial surface, wherein first medial surface and the electricity
Road plate is oppositely arranged, and forms the glue application region between first medial surface and the circuit board.
3. microphone assembly according to claim 2, which is characterized in that at the top of the accommodation groove to the accommodation groove
On the direction of bottom, the width of first medial surface to the glue application region formed between the circuit board is gradually reduced.
4. microphone assembly according to claim 1, which is characterized in that the glue application region is circumferentially formed in the accommodation groove
Side wall and the circuit board between.
5. microphone assembly according to claim 1, which is characterized in that the shell is recessed the accommodation groove.
6. microphone assembly according to claim 1, which is characterized in that the shell further comprises described in substrate and protrusion
The cyclic annular enclosure wall portion of substrate setting, the ring-type enclosure wall portion and the substrate enclose and are set as the accommodation groove, the ring-type enclosure wall portion
It is integrally formed with the substrate.
7. microphone assembly according to claim 1, which is characterized in that the microphone assembly further comprises in the appearance
Set at least one positioning column being arranged on trench bottom, the filled layer and the circuit board are sheathed on that described at least one is fixed respectively
On the column of position, to be positioned to the filled layer and the circuit board, wherein at least one described positioning column exposes the electricity
The part of road plate is formed with hot melt portion, and the circuit board and the filled layer are fixed with the shell.
8. microphone assembly according to claim 1, which is characterized in that the shell offers the connection external world and the accommodating
The first of slot draws sound hole, and the circuit board, which is offered, draws sound hole through the second of the circuit board, and the microphone has into sound
Hole, described second draws sound hole is connected to the sound inlet, and the filled layer offers the third through the filled layer and draws sound hole,
The third draws sound hole connection described first and draws sound hole and described second and draw sound hole；
Wherein, the diameter that the third draws sound hole draws sound hole and described second greater than described first and draws sound hole.
9. microphone assembly according to claim 8, which is characterized in that described first draw sound hole, second draw sound hole, third is drawn
Sound hole and sound inlet coaxial arrangement.
10. a kind of earphone, which is characterized in that including such as described in any item microphone assemblies of claim 1-9 and at least one
Loudspeaker assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821491953.2U CN209002154U (en) | 2018-09-12 | 2018-09-12 | Microphone assembly and earphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821491953.2U CN209002154U (en) | 2018-09-12 | 2018-09-12 | Microphone assembly and earphone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209002154U true CN209002154U (en) | 2019-06-18 |
Family
ID=66800192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821491953.2U Expired - Fee Related CN209002154U (en) | 2018-09-12 | 2018-09-12 | Microphone assembly and earphone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209002154U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114786397A (en) * | 2022-06-20 | 2022-07-22 | 龙旗电子(惠州)有限公司 | Microphone sealing structure and electronic equipment |
-
2018
- 2018-09-12 CN CN201821491953.2U patent/CN209002154U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114786397A (en) * | 2022-06-20 | 2022-07-22 | 龙旗电子(惠州)有限公司 | Microphone sealing structure and electronic equipment |
| CN114786397B (en) * | 2022-06-20 | 2022-09-16 | 龙旗电子(惠州)有限公司 | Microphone sealing structure and electronic equipment |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190618 |
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| CF01 | Termination of patent right due to non-payment of annual fee |