CN219144705U - Laser for laser radar, assembly, laser radar and carrier system - Google Patents

Abstract

The present disclosure relates to a laser for a lidar, a laser assembly, a lidar and a carrier system. The laser includes: at least one laser chip for emitting light; a driving circuit for driving the at least one laser chip; a cap having an inner cavity; the tube cap is abutted against the first surface of the tube cap, so that the tube cap and the tube cap jointly define an accommodating space for accommodating at least the driving circuit and the at least one laser chip, a plurality of through holes are formed in the tube cap at least partially surrounding the driving circuit, and a plurality of lead pins respectively penetrate through one through hole in the plurality of through holes to extend into the accommodating space and are electrically connected with the driving circuit. A simpler and more reliable packaging of the laser chip and the driving circuit can be achieved by embodiments of the present disclosure.

Description

Laser for laser radar, assembly, laser radar and carrier system

Technical Field

The present disclosure relates to the field of lidar packaging technology, and in particular, to a laser for a lidar, a laser assembly, a lidar, and a carrier system.

Background

The core device of the laser radar transmitting end is a laser chip. The laser chip cannot be directly applied and needs to be packaged into a component or a module to ensure that the laser chip achieves optimal working performance and reliability. At present, the laser radar industry is in a rapid development stage, the demand is larger and larger, the industry competition is also stronger, and the design of a packaging structure meeting the requirements of low cost and high reliability becomes the primary target of each laser radar manufacturer.

Disclosure of Invention

According to an aspect of the present disclosure, there is provided a laser for a lidar, including: at least one laser chip for emitting light; a driving circuit for driving the at least one laser chip; a cap having an inner cavity; a socket, the socket being abutted against a first surface of the socket such that the socket and the first surface together define a receiving space for receiving at least the driving circuit and the at least one laser chip, the at least one laser chip and the driving circuit being attached to the socket and being provided with a plurality of through holes on the socket at least partially surrounding the driving circuit, a plurality of lead pins penetrating one of the plurality of through holes to protrude into the receiving space, respectively, and being electrically connected with the driving circuit.

According to another aspect of the present disclosure, there is provided a laser assembly for a lidar, the laser assembly comprising: a circuit board; the aforementioned laser, which is electrically connected to a circuit board by attaching a lead pin of the laser to the circuit board; and a heat sink, wherein a portion of the circuit board where the laser is mounted is provided with a through groove through which the heat sink is attached on a second surface of the stem opposite to the first surface.

According to another aspect of the present disclosure, there is provided a lidar comprising the aforementioned laser or the aforementioned laser assembly.

According to another aspect of the present disclosure, there is provided a vehicle system comprising the aforementioned lidar.

According to some embodiments of the present disclosure, by providing a cap having an inner cavity and a cap for attaching a laser chip and a driving circuit and providing a plurality of through holes for threading a lead wire, it is possible to achieve a simpler and reliable packaging of the laser chip and the driving circuit in the accommodation space defined by the cap and the stem. Further, attaching the laser chip and the driving circuit to the stem can make the structure of the cap and the stem for attaching the laser chip and the driving circuit simpler to achieve manufacturing of the stem and the cap in a simpler manner (e.g., punching, etc.), thereby reducing manufacturing costs. In addition, a plurality of through holes for penetrating the lead pins are formed on the tube base around the driving circuit, so that devices related to the laser chip can be conveniently arranged in the accommodating space, and the lead pins and the driving circuit can be conveniently arranged close to each other, and therefore electric performance is improved.

These and other aspects of the disclosure will be apparent from and elucidated with reference to the embodiments described hereinafter.

Drawings

Further details, features and advantages of the present disclosure are disclosed in the following description of exemplary embodiments, with reference to the following drawings, wherein:

FIG. 1 is a schematic diagram illustrating a laser for a lidar according to some embodiments;

FIG. 2 is a schematic diagram illustrating a laser assembly for a lidar according to some embodiments; and

fig. 3 is a schematic diagram illustrating the laser assembly of fig. 2 from another angle.

Detailed Description

The present disclosure is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting of the utility model. In addition, for convenience of description, only a portion related to the related utility model is shown in the drawings.

In the present disclosure, the use of the terms "first," "second," and the like to describe various elements is not intended to limit the positional relationship, timing relationship, or importance relationship of the elements, unless otherwise indicated, and such terms are merely used to distinguish one element from another. In some examples, a first element and a second element may refer to the same instance of the element, and in some cases, they may also refer to different instances based on the description of the context.

The terminology used in the description of the various illustrated examples in this disclosure is for the purpose of describing particular examples only and is not intended to be limiting. Unless the context clearly indicates otherwise, the elements may be one or more if the number of the elements is not specifically limited. As used herein, the term "plurality" means two or more, and the term "based on" should be interpreted as "based at least in part on". Furthermore, the term "and/or" and "at least one of … …" encompasses any and all possible combinations of the listed items.

At present, the laser radar industry is in a rapid development stage, the demand is larger and larger, the industry competition is also stronger, and the design of a packaging structure meeting the requirements of low cost and high reliability becomes the primary target of each laser radar manufacturer. In addition, lidar is commonly used in the automotive or related industries, and thus, the packaging of laser chips also needs to meet the air tightness requirements in order to pass the vehicle gauge reliability test. However, the use of glue sealing alone is not satisfactory for reliability. In the related art, metal-to-metal welding, metal-to-glass sintering or welding, metal-to-ceramic sintering or welding are generally employed to achieve the gas tightness requirement.

Although the metal-to-ceramic sintering or soldering method, for example, the metal case and the ceramic-sintered package structure can satisfy the requirements of air tightness and electrical transmission, the ceramic needs to be subjected to multi-layer metallization treatment and sintered and molded, and the metal case has a deep groove for accommodating electronic devices such as a laser chip and the like, and needs to be formed by machining or the like. Therefore, the cost of the metal box and the ceramic sintered package structure is extremely high, which is disadvantageous for cost reduction in mass production. In addition, the metal-to-glass sintering or soldering method, for example, the metal case and the glass-sintered package structure, has a significantly lower cost than the ceramic package, but the structure has fewer external leads and is therefore only suitable for packages having fewer external leads (only positive and negative electrodes). For packages with a large number of leads, such as a driving chip and a thermoelectric cooler, the method needs to add an adapter wire inside, so that the process structure is complex. In addition, a package design of a circular coaxial package (TO, transistor Outline) may be adopted, but this design is generally used for a coaxial single-channel type laser package, and cannot package an array type laser, and cannot package a driving circuit or the like in a structure.

In view of this, the present disclosure can achieve simpler and reliable packaging of the laser chip and the driving circuit in the accommodation space defined by the cap and the stem by providing the cap and the cap for attaching the laser chip and the driving circuit and providing the plurality of through holes for threading the lead pins. Further, attaching the laser chip and the driving circuit to the stem can make the structure of the cap and the stem for attaching the laser chip and the driving circuit simpler to achieve manufacturing of the stem and the cap in a simpler manner (e.g., punching, etc.), thereby reducing manufacturing and packaging costs. In addition, a plurality of through holes for penetrating the lead pins are formed on the tube base around the driving circuit, so that devices related to the laser chip can be conveniently arranged in the accommodating space, and the lead pins and the driving circuit can be conveniently arranged close to each other, and therefore electric performance is improved.

Exemplary embodiments of the present disclosure are described in detail below with reference to the attached drawings.

Fig. 1 is a schematic diagram illustrating a laser 100 for a lidar according to some embodiments. The lasers may be, for example, edge-emitting lasers (EELs), vertical Cavity Surface Emitting Lasers (VCSELs), etc. The laser 100 may include: at least one laser chip 110, a driver circuit 120, a cap 130, a stem 140, and a plurality of lead pins 150. Wherein at least one laser chip 110 is adapted to emit light, e.g. divergent light having a certain divergence angle. The driving circuit 120 is used for driving at least one laser chip 110. The cap 130 has an inner cavity 131, the cap 130 (specifically, an end surface of the cap 130 on a side where the inner cavity is open outward) is abutted against a first surface 141 of the stem 140, so that the cap 130 and the first surface 141 together define an accommodating space for accommodating at least the driving circuit 120 and the at least one laser chip 110, the driving circuit 120 and the at least one laser chip 110 are attached to the stem 140, and a plurality of through holes 142 are provided on the stem 140 at least partially surrounding the driving circuit 120. The plurality of lead pins 150 pass through the plurality of through holes 142 to protrude into the accommodating space, respectively, and are electrically connected (connection lines not shown) with the driving circuit 120.

It should be noted herein that at least one laser chip 110 may comprise one laser chip, or comprise a plurality of laser chips (e.g., an array of laser chips). In the case of having a plurality of laser chips, the plurality of laser chips may be disposed side by side at the same position, may be disposed separately at different positions, or may be disposed partially side by side at the same position while being partially dispersed at different positions, and the present disclosure is not limited thereto.

It should also be noted that "attached" herein may refer to directly attached without an intermediate connector, or may also refer to indirectly attached through an intermediate connector. Specifically, the attachment of the driving circuit 120 and the at least one laser chip 110 to the stem 140 may refer to the direct attachment (without an intermediate connection) of the driving circuit 120 and the at least one laser chip 110 to the stem 140, or may refer to the attachment of at least one of the driving circuit 120 and the at least one laser chip 110 to the stem 140 through an intermediate connection, for example, the attachment of the driving circuit 120 to the stem 140 through the refrigerator 160, and the attachment of the at least one laser chip 110 to the driving circuit 120.

The above embodiment can achieve a simpler and more reliable packaging of the laser chip and the driving circuit in the accommodation space defined by the cap and the socket. Further, the structure of the cap and the stem for attaching the laser chip and the driving circuit can be made simpler to achieve the manufacture of the stem and the cap in a simpler manner (e.g., punching, etc.), thereby reducing the manufacturing cost. In addition, devices related to the laser chip can be conveniently arranged in the accommodating space, and the lead guide pins and the driving circuit are conveniently arranged close to each other, so that the electrical performance is improved.

In some embodiments, the plurality of lead pins 150 and the plurality of vias 142 may be hermetically connected by glass solder or ceramic solder. The glass and ceramic have low water absorbability, are not easy to age, and have long-term reliability, so that the embodiment can meet the requirement of airtight packaging. It should be understood herein that other materials, such as glue, etc., may also be used by the present disclosure to seal the lead pins with the through holes, and the present disclosure is not limited thereto.

In some embodiments, the lead pins 150 may be cylindrical, square, etc. In addition, the lead wire guide 150 may be a gold-plated metal guide or the like. The lead wire 150 is connected to an external power source to transmit electric power to the driving circuit 120, and the driving circuit 120 supplies an electric signal to the laser chip 110 to drive the laser chip 110 to emit light.

In some embodiments, the driving circuit 120 may include electronic components that drive, switch, filter, and control the temperature of the laser chip 110, e.g., the driving chip 121, the circuit lines 122, etc. In some examples, the laser chip 110 may be opposite to the driving chip 121 and disposed on the circuit line 122 of the driving circuit 120 such that positive and negative electrodes thereof are electrically connected with the positive and negative circuit lines of the driving circuit.

In some embodiments, the plurality of through holes 142 on the stem 140 may be disposed near the driving circuit 120, in particular, around the circumference of the driving circuit 120, so that the distance of the lead pins 150 passing through the through holes 142 from the driving circuit 120 may be made short. In some examples, the wire leads are bonded to the circuit lines of the drive circuit, such as by gold wires. The lead wire guide pin and the driving circuit are arranged close to each other, so that the gold wire bonding length is shorter, and the electrical performance is improved. Further, as shown in fig. 1, a plurality of through holes 142 are provided on both sides of the driving circuit, alternatively, a plurality of through holes may be provided around the driving circuit, and the present disclosure is not limited thereto. The embodiment can facilitate penetrating the plurality of lead pins into the accommodating space, thereby being convenient for arranging the electronic elements related to the laser chip in the accommodating space, being convenient for reasonably setting the placement position and the wiring mode of the internal electronic elements, and enabling the packaging structure of the laser to have high mass productivity and reliability.

In some embodiments, the stem 140 is provided with a boss 143 on the first surface 141, the shape of the boss 143 matching the shape of the interior cavity 131 such that the sidewall of the interior cavity 131 abuts against the sidewall of the boss 143. Providing the boss 143 on the first surface 141 of the stem 140 may facilitate positioning of the cap 130 on the stem 140, thereby facilitating assembly of the stem 140 and the cap 130. In the case where the cross-sectional shape of the inner cavity 131 is a square shape, the cross-sectional shape of the boss 143 may be matched with the shape of the inner cavity 131 or may be set to a square shape.

In some embodiments, the end surface of cap 130 that abuts first surface 141 and first surface 141 of stem 140 are joined together by resistance welding. For example, a flange 132 surrounding the inner cavity 131 is provided on the periphery of the cap 130 against the first surface 141, and the flange 132 and the first surface 141 of the stem 140 are connected together by resistance welding. The above-described sealing of the stem 140 and cap 130 using resistance welding (e.g., conventional TO capping process) may enable the packaged laser 100 TO meet hermetically sealed vehicle requirements. In addition, by providing the flange 132, the contact area of the cap 130 and the first surface 141 of the stem 140 can be increased, thereby increasing the connection firmness and sealing property of the two.

In some embodiments, cap 130 and stem 140 are substantially square in shape. Specifically, the cross-sections of the inner cavity 131 of the cap and the stem 140 are square in shape. The square shape may allow for a more compact arrangement of components in space, such as the laser chip 110 and the driving circuit 120, than a circular TO package, without wasting space. In addition, the square shape may also facilitate positioning of the laser chip 110, the driver circuit 120, the lens 180, etc. on the header 140, as well as positioning of the light window 133 (described in detail below) on the cap 130. In some other embodiments, the cross-sections of the stem 140 and the interior cavity 131 may be other shapes such as circular, pentagonal, hexagonal, etc., and the present disclosure is not limited thereto.

In some embodiments, the stem 140 and the cap 130 having the above-described structure may be formed by punching or the like, thereby reducing manufacturing costs.

In some embodiments, corners of the stem 140 and cap 130 may be provided with rounded structures to facilitate the design of the mold used to manufacture the stem 140 and cap 130.

In some embodiments, cap 130 and stem 140 may be made of the same type of metal or may be made of different types of metal. For example, the stem 140 and/or the cap 130 may be made of a highly thermally conductive metallic material (e.g., copper, aluminum, iron, etc.) to facilitate heat transfer.

In some embodiments, the laser 100 may also include a refrigerator 160, such as a thermoelectric refrigerator TEC. The refrigerator 160 is used to moderate and dissipate heat from the laser chip 110, the driving circuit 120, and the like. A refrigerator 160 is also provided in the accommodating space. Specifically, the heat dissipating surface of the refrigerator 160 is abutted against the first surface 141, and the driving circuit 120 is disposed on the cold surface of the refrigerator 160 opposite to the heat dissipating surface. Thus, heat generated by the driving circuit 120 and the like can be transferred to the tube seat 140 through the refrigerator 160, so that direct heat dissipation from top to bottom is realized, a heat dissipation path is reduced, and heat dissipation efficiency is improved. In addition, the tube holder 140, which is a heat transfer member, has a larger area than a refrigerator provided thereon, thereby facilitating heat transfer and improving heat dissipation efficiency.

In some embodiments, the refrigerator 160 may be adhered to the first surface 141 of the stem 140 by a heat-conductive adhesive to facilitate heat transfer away through the stem 140.

In some embodiments, where the drive circuit 120 is disposed on the refrigerator 160, the plurality of through holes 142 may be disposed around the periphery of the refrigerator 160, for example, on two opposite sides of the refrigerator 160 (as shown in fig. 1), or on the periphery of the refrigerator 160, etc. Thereby allowing the lead pins 150 passing through the through holes 142 to access the driving circuit 120 on the refrigerator 160, reducing the length of electrical connection wires (e.g., gold wire bonding) of the driving circuit 120 and the lead pins 150, thereby improving electrical performance.

In some embodiments, where the laser 100 further includes a refrigerator 160, the circuit lines 120 of the drive circuit 120 are formed by metal patterning onto the cold side of the refrigerator 160. This allows the driving circuit 120 to directly contact the refrigerator 160, thereby reducing a heat dissipation path and improving heat dissipation efficiency.

In some embodiments, the driving circuit 120 is formed by metal patterning to a surface of an additional substrate (not shown) that is attached to the cold side of the refrigerator 160 by a thermally conductive adhesive. Thereby reducing the manufacturing cost of the driving circuit without affecting the heat transfer of the driving circuit 120.

In some embodiments, at least one laser chip 110 is affixed to the drive circuit 120 (specifically, circuit line 120) by eutectic bonding or conductive glue. Thus, a large amount of heat generated by the laser chip 110 can be transferred to the stem 140 via the refrigerator 160 without affecting the electrical connection of the laser chip 110 and the driving circuit 120, thereby realizing a short heat dissipation path and a large heat dissipation area of the heat transfer element stem to improve heat dissipation efficiency.

In some embodiments, the cathode surface of at least one laser chip 110 is against the drive circuit 120. Herein, the cathode surface of the laser chip refers to the surface of the laser chip having a cathode electrode (i.e., a negative electrode). Accordingly, the laser chip also has an anode surface (e.g., opposite the cathode surface), i.e., the surface of the laser chip having an anode electrode (i.e., positive electrode). In comparison with the manner in which the laser chip 110 is disposed upright (the cathode surface of the laser chip is perpendicular to the surface to which it is attached), the abutment of the cathode surface of the laser chip 110 against the driving circuit 120 can make it easy for the laser chip to be electrically connected to the driving circuit on the one hand, shorten the path of the electrical connection, improve the electrical performance, and on the other hand, the cathode surface of the laser chip 110 has a larger area, so that the heat dissipation area of the laser chip 110 is larger and the heat transfer path is shorter, thereby improving the heat dissipation efficiency. In some examples, the anode surface of the laser chip is bonded to the drive circuit by gold wires with the cathode surface of the laser chip abutting the drive circuit. Alternatively, the anode surface of the laser chip may be abutted against the driving circuit, and the cathode surface of the laser chip and the driving circuit are bonded by a gold wire, and the present disclosure is not limited thereto.

In some embodiments, laser 100 may also include a lens 180 and a mirror 170. The lens 180 and the reflecting mirror 170 are also accommodated in the accommodating space. The lens 180 and the mirror 170 are disposed on the first surface 141, and the lens 180 is disposed between the mirror 170 and the at least one laser chip 110 such that light emitted by the at least one laser chip 110 is reflected via the mirror 170 after passing through the lens 180 (e.g., after being collimated or converged by the lens 180). In some examples, where multiple laser chips 110 are arranged in different locations, multiple lenses may be provided accordingly to process light rays emitted by the laser chips in the different locations, respectively. In this case, only one mirror may be provided to reflect the light emitted through the plurality of lenses, or a plurality of mirrors may be provided to reflect the light emitted through the plurality of lenses, respectively.

In some embodiments, the laser 100 may further include an optical window 133, the optical window 133 being disposed on a bottom wall of the cavity 131 and configured to oppose the mirror 170 such that light reflected by the mirror 170 exits through the optical window 133. Specifically, after the laser chip 110 is powered by the driving circuit 120, it emits divergent light with a certain divergence angle, and the divergent light passes through the lens 180 to be collimated light or divergent light with a smaller divergence angle, and then is reflected by the reflecting mirror 170 and then is sent out from the optical window 133 to enter the laser radar rotating mirror system, so as to achieve the purpose of light emission.

In some embodiments, the light window 133 and the cap 130 are soldered together by glass solder such that they meet the air tightness level to meet the regulatory requirements.

According to yet another aspect of the present disclosure, a laser assembly 200 for a lidar is provided. As shown in fig. 2 and 3, the laser assembly 200 may include: a circuit board 210, a laser 100 as described in fig. 1, and a heat sink 220. The laser 100 makes electrical connection to the circuit board 210 by attaching (e.g., soldering) the lead pins 150 of the laser 100 to the circuit board 210. The portion of the circuit board 210 where the laser 100 is mounted is provided with a through groove 211, and the heat sink 220 is attached to a second surface of the stem 140 opposite to the first surface 141 through the through groove 211.

According to the laser 100 of the present disclosure, only the lead pins 150 may be soldered to the circuit board 210 in order to connect the laser 100 to the circuit board 210. In addition, the heat dissipation member such as a copper block may be directly attached to the second surface of the stem 140, so that the external heat transfer member may be directly and tightly connected to the heat dissipation surface of the stem 140, so as to effectively transfer heat.

In some examples, circuit board 210 is provided with through holes for routing wire leads 150 through to the back side of circuit board 210 (as shown in fig. 3). In this case, the size of the through groove 211 is smaller than the size of the stem of the laser 100 to leave a place where a through hole for passing the lead wire guide 150 is provided.

In some examples, a heat sink such as a copper block may be disposed at a position opposite the refrigerator and having an area larger than that of the refrigerator in order to efficiently transfer heat of the refrigerator.

In some embodiments, the through groove 211 may be a square groove, a circular groove, or the like, and the present disclosure is not limited thereto. Further, the area of the heat sink may be equal to or smaller than the area of the through groove 211, and the shape thereof may be the same as the shape of the through groove 211 or different from the shape of the through groove 211.

According to yet another aspect of the present disclosure, there is provided a lidar comprising the laser of any of the preceding embodiments or the laser assembly of any of the preceding embodiments.

According to another aspect of the present disclosure, there is provided a carrier system comprising the lidar of any of the embodiments described above. Vehicle systems include, but are not limited to, vehicles, aircraft, drones, watercraft, and the like.

Some exemplary aspects of the present disclosure are described below.

Scheme 1, a laser for a lidar, comprising:

at least one laser chip for emitting light;

a driving circuit for driving the at least one laser chip;

a cap having an inner cavity;

a socket, the socket being abutted against a first surface of the socket such that the socket and the first surface together define a receiving space for receiving at least the driving circuit and the at least one laser chip, the at least one laser chip and the driving circuit being attached to the socket and a plurality of through holes being provided on the socket at least partially surrounding the driving circuit,

and the plurality of lead pins respectively penetrate through one through hole among the plurality of through holes to extend into the accommodating space and are electrically connected with the driving circuit.

The laser according to claim 2, wherein the end face of the cap abutting the first surface and the first surface of the stem are connected together by resistance welding.

The laser according to claim 3 or 2, wherein the plurality of lead pins and the plurality of through holes are hermetically connected by glass solder or ceramic solder.

The laser according to any one of claims 1 to 3, wherein a boss is provided on the first surface of the stem, the boss having a shape matching the shape of the inner cavity such that a side wall of the inner cavity abuts against a side wall of the boss.

The laser according to any one of claims 1 to 4, wherein the stem and the cap are each square in shape.

The laser according to any one of claims 1 to 5, wherein the laser further comprises a refrigerator, a heat radiation surface of the refrigerator is abutted against the first surface, and the driving circuit is provided on a cold surface of the refrigerator opposite to the heat radiation surface.

The laser according to claim 7, wherein the driving circuit is formed on the cold surface of the refrigerator by metal patterning.

The laser according to claim 8, wherein the driving circuit is formed by metal patterning on a surface of an additional substrate attached to the cold face of the refrigerator by heat conductive adhesive.

The laser according to any one of claims 1 to 8, wherein the at least one laser chip is fixed on the driving circuit by eutectic soldering or conductive paste.

The laser according to claim 10, wherein a cathode surface of the at least one laser chip is abutted against the driving circuit.

The laser according to any one of claims 1 to 10, further comprising a lens and a mirror, the lens and the mirror being disposed on the first surface, and the lens being disposed between the mirror and the at least one laser chip such that light emitted by the at least one laser chip is reflected out through the mirror after passing through the lens.

The laser according to claim 12, characterized in that the laser further comprises a light window provided on a bottom wall of the inner cavity and arranged opposite to the reflecting mirror such that light reflected by the reflecting mirror exits through the light window.

The laser of claim 13, wherein the optical window and the cap are welded together by glass solder.

Aspect 14, a laser assembly for a lidar, comprising:

a circuit board;

the laser according to any one of claims 1 to 13, which realizes an electrical connection with a circuit board by attaching a lead of the laser to the circuit board; and

the heat dissipation element is provided with a heat dissipation element,

wherein a portion of the circuit board where the laser is mounted is provided with a through groove through which the heat sink is attached on a second surface of the stem opposite to the first surface.

Solution 15, a lidar comprising the laser according to any of claims 1 to 13 or the laser assembly according to solution 14.

Solution 16, a vehicle system comprising a lidar according to solution 15.

While the disclosure has been illustrated and described in detail in the drawings and foregoing description, such illustration and description are to be considered illustrative and schematic and not restrictive; the present disclosure is not limited to the disclosed embodiments. Variations to the disclosed embodiments can be understood and effected by those skilled in the art in practicing the claimed subject matter, from a study of the drawings, the disclosure, and the appended claims. In the claims, the word "comprising" does not exclude other elements or steps than those listed and the indefinite article "a" or "an" does not exclude a plurality, the term "a" or "an" means two or more, and the term "based on" is to be interpreted as "based at least in part on". The mere fact that certain measures are recited in mutually different dependent claims does not indicate that a combination of these measures cannot be used to advantage.

Claims (16)

1. A laser for a lidar, the laser comprising:

at least one laser chip for emitting light;

a driving circuit for driving the at least one laser chip;

a cap having an inner cavity;

a socket, the socket being abutted against a first surface of the socket such that the socket and the first surface together define a receiving space for receiving at least the driving circuit and the at least one laser chip, the at least one laser chip and the driving circuit being attached to the socket and a plurality of through holes being provided on the socket at least partially surrounding the driving circuit,

and the plurality of lead pins respectively penetrate through one through hole among the plurality of through holes to extend into the accommodating space and are electrically connected with the driving circuit.

2. The laser of claim 1, wherein the end face of the cap abutting the first surface is joined to the first surface of the stem by resistance welding.

3. The laser of claim 1, wherein the plurality of lead pins and the plurality of vias are hermetically connected by glass solder or ceramic solder.

4. A laser as claimed in any one of claims 1 to 3 wherein a boss is provided on the first surface of the stem, the boss being shaped to match the shape of the cavity so that the side wall of the cavity abuts against the side wall of the boss.

5. A laser as claimed in any one of claims 1 to 3 wherein the stem and cap are square in shape.

6. A laser as claimed in any one of claims 1 to 3 further comprising a refrigerator having a cooling surface against the first surface, the drive circuit being disposed on a cold surface of the refrigerator opposite the cooling surface.

7. The laser of claim 6, wherein the driver circuit is formed onto the cold face of the refrigerator by metal patterning.

8. The laser of claim 6, wherein the driver circuit is formed by metal patterning onto a surface of an additional substrate that is attached to the cold face of the refrigerator by thermally conductive adhesive.

9. The laser of claim 6, wherein the at least one laser chip is affixed to the drive circuit by eutectic bonding or conductive glue.

10. The laser of claim 9, wherein a cathode surface of the at least one laser chip is abutted against the drive circuit.

11. The laser of claim 6, further comprising a lens and a mirror disposed on the first surface, and the lens is disposed between the mirror and the at least one laser chip such that light emitted by the at least one laser chip is reflected off the mirror after passing through the lens.

12. The laser of claim 11, further comprising an optical window disposed on a bottom wall of the cavity and disposed opposite the mirror such that light reflected by the mirror exits through the optical window.

13. The laser of claim 12, wherein the optical window and the cap are welded together by glass solder.

14. A laser assembly for a lidar, the laser assembly comprising:

a circuit board;

the laser according to any one of claims 1 to 13, the laser making electrical connection with a circuit board by attaching a lead of the laser to the circuit board; and

the heat dissipation element is provided with a heat dissipation element,

wherein a portion of the circuit board where the laser is mounted is provided with a through groove through which the heat sink is attached on a second surface of the stem opposite to the first surface.

15. A lidar characterized in that it comprises a laser according to any of claims 1 to 13 or a laser assembly according to claim 14.

16. A vehicle system, characterized in that it comprises a lidar according to claim 15.

Images