CN219144210U - LED packaging structure with large-angle light emitting function - Google Patents
LED packaging structure with large-angle light emitting function Download PDFInfo
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- CN219144210U CN219144210U CN202223602507.3U CN202223602507U CN219144210U CN 219144210 U CN219144210 U CN 219144210U CN 202223602507 U CN202223602507 U CN 202223602507U CN 219144210 U CN219144210 U CN 219144210U
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Abstract
The utility model relates to the technical field of semiconductor processing, and provides an LED packaging structure with large-angle light emission, which comprises a transparent support, a light emitting chip, a white glue reflecting layer, a transparent packaging layer and a plano-convex lens structure, wherein the light emitting chip is arranged on the transparent support, the white glue reflecting layer completely covers the upper surface of the light emitting chip so as to guide forward light emission of the light emitting chip into lateral light emission, the transparent packaging layer coats the light emitting chip and the white glue reflecting layer, and the plano-convex lens structure is arranged on the transparent packaging layer and the transparent support, wherein light rays can be in a scattering state after penetrating through the plano-convex lens structure. Through forming the white glue reflection layer above the light emitting chip, and forming the plano-convex lens structure above the white glue reflection layer, forward light emission of the light emitting chip is greatly reduced, the light quantity of the side face is enhanced, the light emitting angle is greatly increased, the effective light emitting angle of the LED packaging structure can be increased from 120 degrees to about 160 degrees, forward light emission is reduced, and the overall light emission is more uniform.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to an LED packaging structure with large-angle light emission.
Background
As shown in fig. 1, in the current process of manufacturing an LED light source, after fixing a light emitting chip and welding metal leads, silica gel is filled on a conventional substrate carrying the light emitting chip, so as to manufacture an LED package structure. As shown in fig. 2, the light emitting angle of the conventional LED package structure is generally about 120 °, the light type is strong in forward light emission and weak in lateral light emission, and the light type of the light type is unfavorable for the application of the LED light source on backlight products, especially for the application of obvious checkerboard spot light spots in backlight such as Mini POB, so that the phenomenon of over-strong single-spot light emission is caused, and the product performance is affected.
It should be noted that the information disclosed in this background section is only for the purpose of increasing the understanding of the general background of the utility model and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person of ordinary skill in the art.
Disclosure of Invention
The utility model provides a novel LED packaging structure with large-angle light emission, aiming at the problems in the prior art, by forming a white glue reflecting layer above a light emitting chip and forming a plane convex lens structure above the white glue reflecting layer, the forward light emission of the light emitting chip is greatly reduced, the light emitting quantity of the side face is enhanced, the light emitting angle is greatly increased, the effective light emitting angle of the LED packaging structure can be increased from 120 degrees to about 160 degrees, the forward light emission is reduced, and the overall light emission is more uniform.
An embodiment of the utility model provides an LED packaging structure, which comprises a transparent support, a light emitting chip, a white glue reflecting layer, a transparent packaging layer and a plano-convex lens structure.
The light emitting chip is arranged on the transparent support, the white glue reflecting layer completely covers the upper surface of the light emitting chip so as to guide forward light-emitting light of the light emitting chip into lateral light-emitting light, the transparent packaging layer coats the light emitting chip and the white glue reflecting layer, and the plano-convex lens structure is arranged on the transparent packaging layer and the transparent support, wherein light rays can be in a scattering state after penetrating through the plano-convex lens structure.
In some embodiments, the light exiting intensity of the LED package structure at an exit angle between 50 and 65 is greater than the light exiting intensity of the LED package structure at an exit angle of 0.
In some embodiments, the LED package structure has a relative light exit intensity of at least 90% at an exit angle between 50-65 °.
In some embodiments, the LED package structure has a relative light exit intensity of less than 70% at an exit angle of 0 °.
In some embodiments, the distance from the upper surface of the plano-convex lens structure to the upper surface of the transparent support is in the range of 0.25-0.55 mm.
In some embodiments, the plano-convex lens structure and the transparent encapsulation layer are integrally formed.
In some embodiments, the white glue reflective layer is formed from a blend of transparent silica gel and titanium dioxide.
In some embodiments, a focal plane is defined by the plano-convex lens structure, and the light emitting chip is located between the focal plane and the plano-convex lens structure.
In some embodiments, the LED package structure is applied to a backlight product.
In some embodiments, the light-emitting pattern of the LED package structure is a batwing pattern.
In summary, according to the LED package structure with large-angle light emission provided by the embodiment of the present utility model, the white glue reflective layer is formed above the light emitting chip, and the plano-convex lens structure is formed above the white glue reflective layer, so that forward light emission of the light emitting chip can be greatly reduced, the light quantity of the side surface light emission is enhanced, the light emission angle is greatly increased, the effective light emission angle of the LED package structure can be increased from 120 ° to about 160 °, forward light emission is reduced, and the overall light emission is more uniform.
Additional features and advantages of the utility model will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model. The objects and other advantages of the utility model may be realized and obtained by means of the instrumentalities particularly pointed out in the specification and the like.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, a brief description will be given below of the drawings required for the embodiments or the prior art descriptions, and it is obvious that some of the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of a conventional LED package structure;
fig. 2 is a schematic view of an emergent light type of a conventional LED package structure;
fig. 3 is a schematic structural diagram of an LED package structure according to an embodiment of the present utility model;
fig. 4 is a schematic view of an LED package structure according to an embodiment of the utility model.
Reference numerals:
12-a transparent support; 122-a transparent substrate; 124-annular transparent wall; 14-a light emitting chip; 16-white glue reflecting layer; 18-a transparent encapsulation layer; 20-plano-convex lens structure; l-distance; s-focal plane.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model; the technical features designed in the different embodiments of the utility model described below can be combined with each other as long as they do not conflict with each other; all other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present utility model and simplify the description, and do not indicate or imply that the devices or components referred to must have a specific orientation or be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more. In addition, the term "comprising" and any variations thereof are meant to be "at least inclusive".
In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between the two components. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Referring to fig. 3 and fig. 4, fig. 3 is a schematic structural diagram of an LED package structure according to an embodiment of the utility model, and fig. 4 is a schematic light emitting type of the LED package structure according to an embodiment of the utility model. To achieve at least one of the advantages and other advantages, an embodiment of the utility model provides an LED package structure with a large-angle light emission, which is mainly applied to backlight products. As shown in the drawing, the LED package structure with large-angle light emission includes a transparent support 12, a light emitting chip 14, a white glue reflective layer 16, a transparent package layer 18, and a plano-convex lens structure 20.
The transparent support 12 may include a transparent substrate 122 and an annular transparent wall 124, where the annular transparent wall 124 is disposed around the periphery of the transparent substrate 122, and a space formed therein is used to accommodate the subsequent light emitting chip 14, white glue reflective layer 16, transparent encapsulation layer 18, and so on.
The light emitting chip 14 is disposed on the transparent support 12. The light emitting chip 14 is disposed on the transparent substrate 122 and is disposed in the annular transparent wall 124. The light emitting chip 14 may be electrically connected to the electrode by gold wires or by die bonding pads. The light emitting chip 14 may employ an LED chip.
The white glue reflecting layer 16 completely covers the upper surface of the light emitting chip 14, and the white glue reflecting layer 16 is used for guiding forward light output from the light emitting chip 14 into lateral light output. The white glue reflecting layer 16 can shade and reflect the forward light emitted by part of the light emitting chip 14, so that the forward light emitted by the light emitting chip 14 is greatly reduced, the light type with the middle relative light intensity lower than 70% in fig. 4 is achieved, the side light emitting quantity is enhanced, and the light emitting angle is increased. In some embodiments, the white glue reflective layer 16 is formed by mixing transparent silica gel and titanium dioxide, which better directs the forward light-emitting light of the light-emitting chip 14 to the side light-emitting.
The transparent encapsulation layer 18 encapsulates the light emitting chip 14 and the white glue reflective layer 16, which can allow light to penetrate therethrough and has an encapsulation protection effect.
The plano-convex lens structure 20 is disposed on the transparent encapsulation layer 18 and the transparent support 12, and light emitted by the light emitting chip 14 will be scattered after penetrating through the plano-convex lens structure 20. Specifically, the light emitted by the light emitting chip 14 is refracted by the plano-convex lens structure 20 formed above and diverges to the periphery, so that the effective light emitting angle of the LED package structure can be increased from 120 ° to about 160 °, and the overall light emission is more uniform. The plano-convex lens structure 20 is flat, and the effect of scattering light is better.
A focal plane S is defined by the plano-convex lens structure 20, which focal plane S may be determined by illuminating the plano-convex lens structure 20 with parallel light sources. When the light emitting chip 14 is located between the focal plane and the plano-convex lens structure 20, light can be emitted in a scattering state through the spherical surface of the plano-convex lens structure 20. If the light emitting chip 14 is just located on the focal plane S, the light is converted into parallel direct light through the plano-convex lens structure 20 and emitted, so that the effects of reducing forward light emission, enhancing side light emission and increasing the light emitting angle cannot be achieved. If the light emitting chip 14 is just below the focal plane S, the light rays are focused through the plano-convex lens structure 20 and are concentrated to a point, which cannot achieve the effects of reducing forward light emission, enhancing side light emission and increasing the light emitting angle. Preferably, the distance L from the upper surface of the plano-convex lens structure 20 to the upper surface of the transparent support 12 is in the range of 0.25 to 0.55mm, and the effect of scattering out light is more excellent. In some embodiments, the plano-convex lens structure 20 and the transparent encapsulation layer 18 may be integrally formed, which can simplify the process and reduce the production cost.
As shown in fig. 4, the abscissa of fig. 4 is the light-emitting angle, and the ordinate is the relative light intensity, which is compared with the light intensities of other light-emitting angles. As shown in the figure, the light-emitting type of the LED packaging structure is a batwing type, namely a type of light emitting with high intensity at two ends and light emitting with low intensity in the middle. The light emergent intensity of the light emergent angle of the LED packaging structure is between 50 and 65 degrees and is stronger than that of the light emergent angle of the LED packaging structure at 0 degree. And the LED packaging structure has a relative emergent light intensity of at least 90% at an emergent light angle of 50-65 degrees. The LED package has a relative light exit intensity at an exit angle of 0 ° of less than 70%, preferably less than 60%, 50%, and in some cases the lower limit of the relative light exit intensity of the LED package at an exit angle of 0 ° is 10%.
As can be seen from comparing fig. 1 and fig. 4, the LED package structure according to the present disclosure forms the white glue reflective layer 16 above the light emitting chip 14 and forms the plano-convex lens structure 20 above the white glue reflective layer 16, so that forward light emission of the light emitting chip 14 can be greatly reduced, lateral light emission quantity can be enhanced, and light emission angle can be greatly increased, and effective light emission angle of the LED package structure can be increased from 120 ° to about 160 °, forward light emission can be reduced, and overall light emission can be more uniform.
In addition, it should be understood by those skilled in the art that although many problems exist in the prior art, each embodiment or technical solution of the present utility model may be modified in only one or several respects, without having to solve all technical problems listed in the prior art or the background art at the same time. Those skilled in the art will understand that nothing in one claim should be taken as a limitation on that claim.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.
Claims (9)
1. An LED packaging structure with large-angle light emission, which is characterized in that: the LED packaging structure comprises:
a transparent support;
the light-emitting chip is arranged on the transparent bracket;
the white glue reflecting layer completely covers the upper surface of the light-emitting chip so as to guide forward light-emitting light of the light-emitting chip into lateral light-emitting light;
the transparent packaging layer is used for coating the light-emitting chip and the white glue reflecting layer;
and the plano-convex lens structure is arranged on the transparent packaging layer and the transparent support, wherein light rays emitted by the light emitting chip can be in a scattering state after penetrating through the plano-convex lens structure.
2. The LED package structure with high angle light extraction of claim 1, wherein: the light-emitting intensity of the light-emitting angle of the LED packaging structure is stronger than that of the light-emitting angle of the LED packaging structure at 0 degrees.
3. The LED package structure with high angle light extraction of claim 2, wherein: the LED packaging structure has a relative emergent light intensity of at least 90% at an emergent light angle of 50-65 degrees.
4. The LED package structure with high angle light extraction of claim 2, wherein: the LED packaging structure has a relative light-out intensity lower than 70% at a light-out angle of 0 degrees.
5. The LED package structure with high angle light extraction of claim 1, wherein: the distance range from the upper surface of the plano-convex lens structure to the upper surface of the transparent support is 0.25-0.55 mm.
6. The LED package structure with high angle light extraction of claim 1, wherein: the plano-convex lens structure and the transparent packaging layer are integrally formed.
7. The LED package structure with high angle light extraction of claim 1, wherein: a focal plane is defined by the plano-convex lens structure, and the light emitting chip is located between the focal plane and the plano-convex lens structure.
8. The LED package structure with high angle light extraction of claim 1, wherein: the LED packaging structure is applied to backlight products.
9. The LED package structure with high angle light extraction of claim 1, wherein: the light-emitting type of the LED packaging structure is a batwing type.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202223602507.3U CN219144210U (en) | 2022-12-30 | 2022-12-30 | LED packaging structure with large-angle light emitting function |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202223602507.3U CN219144210U (en) | 2022-12-30 | 2022-12-30 | LED packaging structure with large-angle light emitting function |
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| CN219144210U true CN219144210U (en) | 2023-06-06 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116779744A (en) * | 2023-06-30 | 2023-09-19 | 淮安澳洋顺昌光电技术有限公司 | Chip-level LED packaging element |
| CN116825929A (en) * | 2023-06-30 | 2023-09-29 | 淮安澳洋顺昌光电技术有限公司 | Chip-level light-emitting diode package with large light-emitting angle |
-
2022
- 2022-12-30 CN CN202223602507.3U patent/CN219144210U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116779744A (en) * | 2023-06-30 | 2023-09-19 | 淮安澳洋顺昌光电技术有限公司 | Chip-level LED packaging element |
| CN116825929A (en) * | 2023-06-30 | 2023-09-29 | 淮安澳洋顺昌光电技术有限公司 | Chip-level light-emitting diode package with large light-emitting angle |
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