CN219130262U

CN219130262U - Cleaning tool for semiconductor round parts

Info

Publication number: CN219130262U
Application number: CN202222543853.2U
Authority: CN
Inventors: 丁鼎; 陈燕; 祝郑庆
Original assignee: Hangzhou Ruisheng Semiconductor Technology Co ltd
Current assignee: Hangzhou Ruisheng Semiconductor Technology Co ltd
Priority date: 2022-09-26
Filing date: 2022-09-26
Publication date: 2023-06-06
Anticipated expiration: 2032-09-26

Abstract

The utility model relates to the technical field of cleaning of semiconductor round parts, and discloses a cleaning tool for semiconductor round parts, which comprises two supporting frames which are symmetrically distributed, wherein a group of supporting rods and two groups of limiting rods are symmetrically arranged between the two supporting frames, and the number of the group of supporting rods is at least one. According to the utility model, the distance between the two limiting rods and the height of the limiting rods are adjusted through the distance adjusting unit, so that the two limiting rods are matched with the supporting rods to be used for placing semiconductor round parts with different sizes, compared with the existing semiconductor round part cleaning tool, one tool can only be used for placing semiconductor round parts with one size, the cost generated by purchasing the cleaning tool can be greatly reduced, meanwhile, as a plurality of round parts can be placed at the same time, frequent replacement of the cleaning tool due to different product sizes can be avoided, and therefore the cleaning efficiency of the semiconductor round parts is effectively improved.

Description

Cleaning tool for semiconductor round parts

Technical Field

The utility model relates to the technical field of cleaning of semiconductor round parts, in particular to a cleaning tool for semiconductor round parts.

Background

In the production process of semiconductor components, the surface of the semiconductor component needs to be cleaned to remove the oxide film formed on the surface of the semiconductor component, and a common cleaning method is to soak and rinse the semiconductor component by using a chemical reagent to remove the oxide film formed on the surface of the semiconductor component.

When the conventional semiconductor round part cleaning device cleans a semiconductor round part, the semiconductor round part is generally put into a cleaning tool, then the cleaning tool and the semiconductor round part are put into a cleaning box together so that the semiconductor round part is almost suspended in the cleaning box, then a proper amount of chemical reagent is injected into the cleaning box to soak the semiconductor round part inside, and the chemical reagent in the cleaning box is kept in a flowing state to wash the semiconductor round part, so that the semiconductor round part can be fully cleaned.

However, an existing cleaning tool for semiconductor round parts is often only used for placing semiconductor round parts with one size, and when cleaning for semiconductor round parts with different sizes is needed, the cleaning tool with corresponding sizes needs to be replaced, so that cleaning tools with various sizes are often needed to be equipped, and the cost required by the cleaning process is greatly increased.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides a cleaning tool for a semiconductor round part, which solves the problems that one tool can only be used for placing a semiconductor round part with one size, so that different cleaning tools are needed for round parts with different sizes, the cost needed by a cleaning procedure is greatly increased, the cleaning tools are needed to be frequently replaced when the round parts with different sizes are cleaned, and the cleaning efficiency is seriously reduced.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a cleaning fixture of circular part of semiconductor, includes two support frames of symmetric distribution, is equipped with a set of bracing piece and symmetry between two support frames and is equipped with two sets of gag lever posts, and a set of bracing piece quantity is at least one, and the bracing piece all contradicts with the outer peripheral face of the circular part of semiconductor, and two sets of gag lever posts are located the bracing piece top, a plurality of standing grooves have all been seted up along axial lead length direction equidistance on the outer peripheral face of bracing piece and gag lever post, and the standing groove on bracing piece and the gag lever post is aligned one by one, two the symmetry is equipped with two spacing adjustment units on the support frame in order to be used for adjusting the interval between two sets of gag lever posts.

In the above-mentioned cleaning tool for circular semiconductor component, the distance adjusting unit comprises two oblique through grooves symmetrically arranged on the supporting frames, and two groups of first bolts are connected in a sliding manner in the two oblique through grooves, the number of each group of first bolts is equal to that of each group of limiting rods and aligned one by one, and one ends of the two groups of first bolts are respectively inserted into the end parts of the two groups of limiting rods in a spiral manner so as to connect the limiting rods between the two supporting frames.

In the foregoing cleaning tool for a semiconductor circular component, diameters of front and rear ends of the placement groove gradually increase from the middle to the front and rear ends, and the front and rear ends of the placement groove are symmetrical to each other.

In the foregoing cleaning tool for semiconductor round parts, the distance adjusting unit further includes an auxiliary distance adjusting component to assist in accelerating the adjustment of the distance between the two sets of limiting rods.

In the foregoing cleaning tool for the semiconductor round component, the auxiliary distance adjusting component comprises at least one cross rod, the number of the cross rods is equal to that of each group of limiting rods, two limiting through grooves are symmetrically formed in the side faces of the cross rods, two first bolts which are spirally inserted into the two limiting through grooves on the end parts of the two limiting rods which are symmetrical in the two groups of limiting rods are symmetrically connected to the corresponding side faces of the cross rods in a sliding mode, the first bolts penetrate through the limiting through grooves and the oblique through grooves in sequence and are spirally inserted into the end parts of the corresponding limiting rods, the auxiliary distance adjusting component further comprises a vertical plate connected to the supporting frame, vertical grooves are formed in the side faces of the vertical plate, rectangular sliding blocks are connected in the sliding mode, and the rectangular sliding blocks are connected with the side faces of the cross rods.

In the foregoing cleaning tool for a semiconductor circular component, the auxiliary distance adjusting assembly further comprises a second bolt screwed on the lateral surface of the cross rod, the end part of the second bolt penetrates through the cross rod and is rotationally connected to the lateral surface of the rectangular slide block, the bolt head of the second bolt is inserted with an inserting rod, and the inserting rod penetrates through the cross rod and is movably inserted on the lateral surface of the rectangular slide block.

In the foregoing cleaning tool for a semiconductor circular component, the front and rear sides of the cross bar are respectively attached to the bolt head side of the first bolt and the side of the support frame.

In the foregoing cleaning tool for a semiconductor circular component, the side surfaces of the vertical groove and the rectangular slider, which are close to each other, are roughened.

(III) beneficial effects

Compared with the prior art, the utility model provides a cleaning tool for a semiconductor round part, which has the following beneficial effects:

1. according to the utility model, the distance adjusting unit is arranged to adjust the distance and the height between the two groups of limiting rods, so that the tool can be used for placing round parts with different diameters, and therefore, a plurality of corresponding cleaning tools are not required to be arranged for the round parts with different diameters, the cleaning cost is greatly reduced, the time for replacing the tools is saved, and the cleaning efficiency is improved.

2. According to the auxiliary distance adjusting assembly, a worker only needs to screw the second bolt to reduce the pressure between the rectangular sliding block and the vertical groove, and then the transverse rod can be pushed up and down to move so as to drive the two groups of limiting rods to move up and down along the inclined through groove, so that the distance between the two groups of limiting rods and the height of the limiting rods can be adjusted conveniently, the tool can be used for limiting and placing a plurality of semiconductor round parts with different sizes, the difficulty in adjusting the height and the distance between the two groups of limiting rods can be effectively reduced, the adjustment operation is simplified, the adjustment time is shortened, and the efficiency of cleaning work is further improved.

Drawings

FIG. 1 is a first schematic diagram of the present utility model;

FIG. 2 is a second schematic diagram of the present utility model;

FIG. 3 is an enlarged schematic view of FIG. 2A;

FIG. 4 is a top cross-sectional view of the present utility model;

FIG. 5 is a side view of the present utility model;

FIG. 6 is an enlarged schematic view at B in FIG. 4;

fig. 7 is an enlarged schematic view at C in fig. 4.

In the figure: 1. a support frame; 2. a support rod; 3. a limit rod; 4. a placement groove; 5. a distance adjusting unit; 51. a slant through groove; 52. a first bolt; 53. an auxiliary distance adjusting component; 531. a cross bar; 532. limiting through grooves; 533. a riser; 534. a vertical groove; 535. a rectangular slide block; 6. pulling the hole.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1-7, the present utility model provides a technical solution: the utility model provides a cleaning tool of circular semiconductor part, including two support frames 1 of symmetric distribution, two carry the draw hole 6 have been seted up to two support frame 1 side upper portion symmetries, so carry the removal to this frock, be equipped with a set of bracing piece 2 and symmetry between two support frames 1 and be equipped with two sets of gag lever posts 3, and a set of bracing piece 2 quantity is at least one, and bracing piece 2 all contradicts with the outer peripheral face of circular semiconductor part, and two sets of gag lever posts 3 are located bracing piece 2 top, preferably, every set of bracing piece 2 and every set of quantity of gag lever post 3 are one, and bracing piece 2 sets of numbers are a set of, a plurality of standing grooves 4 have all been seted up along axial lead length direction equidistance on the outer peripheral face of bracing piece 2 and gag lever post 3, and standing groove 4 one-to-one on bracing piece 2 and the gag lever post 3 is aligned, the symmetry is equipped with two spacing adjustment units 5 on two support frames 1 in order to be used for adjusting the interval between two gag lever posts 3.

In the above-mentioned cleaning tool for semiconductor circular components, the distance adjusting unit 5 includes two oblique through grooves 51 symmetrically formed on the support frame 1, and two first bolts 52 are slidably connected in the two oblique through grooves 51, and one ends of the two first bolts 52 are respectively screwed into the end portions of the two limit rods 3 to connect the limit rods 3 between the two support frames 1, so that a worker can tightly prop the bolt heads on the support frame 1 or separate the bolt heads from the support frame 1 by screwing the first bolts 52, thus not only can fix or automatically slide the limit rods 3 on the oblique through grooves 51, but also can conveniently and rapidly adjust the space between the two limit rods 3 by controlling the two limit rods 3 to place and limit the circular components with different diameters, and the practicability of the tool is improved.

In the foregoing cleaning tool for semiconductor round parts, diameters of front and rear ends of the placement groove 4 are gradually increased from the middle to the front and rear ends, and the front and rear ends of the placement groove 4 are mutually symmetrical, so that the placement groove 4 can be used for placing and limiting round parts with different thicknesses.

In the foregoing cleaning tool for semiconductor round parts, the distance adjusting unit 5 further comprises an auxiliary distance adjusting component 53 to assist in accelerating the adjustment of the distance between the two limit rods 3, so that the distance adjustment between the two limit rods 3 becomes more convenient, the efficiency of cleaning is improved, and the reliability and convenience of the tool are also improved.

In the foregoing cleaning tool for a semiconductor circular component, the auxiliary distance adjusting component 53 includes the cross bar 531, two limit through grooves 532 are symmetrically provided on the side surface of the cross bar 531, and two first bolts 52 are symmetrically and slidingly connected to the two limit through grooves 532 on the side surface of the corresponding cross bar 531, and the first bolts 52 penetrate through the limit through grooves 532 and the oblique through grooves 51 in sequence and are spirally inserted into the end parts of the corresponding limit rods 3, the auxiliary distance adjusting component 53 further includes a vertical plate 533 connected to the support frame 1, a vertical groove 534 is provided on the side surface of the vertical plate 533, and a rectangular slider 535 is slidingly connected to the vertical groove 534, so that a worker only needs to screw the first bolts 52 to be far away from the support frame 1, and then can drive the two limit rods 3 to synchronously move up and down under the cooperation of the cross bar 531 and the limit through grooves 532, so that the two limit rods 3 can be always positioned on the same horizontal line in the height adjusting process, the placing and limiting work of the circular component can be smoothly performed, and the height adjusting efficiency of the limit rods 3 is also improved.

In the foregoing cleaning tool for a semiconductor circular component, the auxiliary distance adjusting component 53 further includes a second bolt 536 screwed on the lateral surface of the cross bar 531, the end portion of the second bolt 536 penetrates through the cross bar 531 and is rotationally connected on the lateral surface of the rectangular slider 535, the bolt head of the second bolt 536 is inserted with an inserting rod, and the inserting rod penetrates through the cross bar 531 and is movably inserted on the lateral surface of the rectangular slider 535, so that a worker only needs to screw the second bolt 536 to enable the cross bar 531 to be in a freely up-down moving state or a fixed state, and the height adjusting work of the limiting rod 3 becomes simple and convenient.

In the foregoing cleaning tool for a semiconductor circular component, the front and rear sides of the cross bar 531 are respectively attached to the side face of the bolt head of the first bolt 52 and the side face of the support frame 1, so that the tightening degree of the first bolt 52 does not affect the up-and-down movement of the stop lever 3, and the height adjustment of the stop lever 3 is ensured to be performed smoothly.

In the foregoing cleaning tool for a semiconductor circular component, the side surfaces of the vertical groove 534 and the rectangular slider 535, which are close to each other, are subjected to rough treatment, so that the friction between the joint surfaces of the vertical groove 534 and the rectangular slider 535 can be increased, and when the second bolt 536 is screwed down, the rectangular slider 535 cannot slide in the vertical groove 534, so that the stop lever 3 cannot be displaced, and further, the circular component can be stably placed on the tool, and smooth cleaning work is ensured.

Working principle: during operation, the distance between the two limiting rods 3 and the height of the limiting rods 3 are adjusted according to the diameter of the round part to be placed, during adjustment, the second bolt 536 is screwed to enable the pressure between the vertical groove 534 and the side surface of the rectangular sliding block 535 to be reduced, then the inserted rod penetrates through the bolt head of the second bolt 536 and the cross rod 531 and is inserted into the side surface of the rectangular sliding block 535, the cross rod 531 cannot rotate, then the cross rod 531 is pushed to drive the rectangular sliding block 535 to move up and down along the vertical groove 534, at the moment, the two limiting rods 3 move up and down along the oblique through groove 51, meanwhile, the distance between the two limiting rods 3 is increased or reduced until the two limiting rods 3 are matched with the supporting rod 2 to limit and fix the round part, then the second bolt 536 is reversely screwed until the rectangular sliding block 535 is tightly abutted against the inner side surface of the vertical groove 534, then the round part to be cleaned is sequentially clamped into the placing groove 4 on the limiting rods 3 and the supporting rod 2, the round part to be cleaned can be placed and limited, and then the tool is sent into the cleaning box through the lifting hole 6 to clean the round part.

The electrical components are all connected with an external main controller and 220V mains supply, and the main controller can be conventional known equipment for controlling a computer and the like.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a cleaning frock of circular part of semiconductor which characterized in that: including two support frames (1) of symmetric distribution, be equipped with a set of bracing piece (2) and symmetry between two support frames (1) and be equipped with two sets of gag lever posts (3), and a set of bracing piece (2) quantity is one at least, and bracing piece (2) all contradicts with the outer peripheral face of the circular part of semiconductor, and two sets of gag lever posts (3) are located bracing piece (2) top, a plurality of standing grooves (4) have all been seted up along axial lead length direction equidistance on the outer peripheral face of bracing piece (2) and gag lever post (3), and standing grooves (4) on bracing piece (2) and gag lever post (3) are aligned one by one, two the symmetry is equipped with two spacing adjustment units (5) on support frame (1) in order to be used for adjusting the interval between two sets of gag lever posts (3).

2. The cleaning tool for semiconductor round parts according to claim 1, wherein: the distance adjusting unit (5) comprises two oblique through grooves (51) symmetrically formed in the supporting frame (1), two groups of first bolts (52) are connected in a sliding mode in the two oblique through grooves (51), the number of each group of first bolts (52) is equal to that of each group of limiting rods (3) and aligned one by one, and one ends of the two groups of first bolts (52) are respectively inserted into the end portions of the two groups of limiting rods (3) in a threaded mode to connect the limiting rods (3) between the two supporting frames (1).

3. The cleaning tool for semiconductor round parts according to claim 2, wherein: the diameters of the front end and the rear end of the placing groove (4) are gradually increased from the middle to the front end and the rear end, and the front end and the rear end of the placing groove (4) are mutually symmetrical.

4. A cleaning tool for semiconductor round parts according to claim 3, wherein: the distance adjusting unit (5) further comprises an auxiliary distance adjusting component (53) to assist in accelerating the adjustment of the distance between the two groups of limiting rods (3).

5. The cleaning tool for semiconductor round parts according to claim 4, wherein: the auxiliary distance adjusting assembly (53) comprises at least one cross rod (531), the number of the cross rods (531) is equal to the number of the limit rods (3) in each group, two limit through grooves (532) are symmetrically formed in the side faces of the cross rods (531), two first bolts (52) which are spirally inserted into the two symmetrical limit rods (3) in the two groups of limit rods (3) are symmetrically connected to two limit through grooves (532) on the side faces of the corresponding cross rods (531) in a sliding mode, the first bolts (52) penetrate through the limit through grooves (532) and the oblique through grooves (51) in sequence and are spirally inserted into the corresponding limit rods (3) at the end portions, the auxiliary distance adjusting assembly (53) further comprises a vertical plate (533) connected to the support frame (1), vertical grooves (534) are formed in the side faces of the vertical plate (533), rectangular sliding blocks (535) are connected in a sliding mode, and the rectangular sliding blocks (535) are connected to the side faces of the cross rods (531).

6. The cleaning tool for semiconductor round parts according to claim 5, wherein: the auxiliary distance adjusting assembly (53) further comprises a second bolt (536) which is inserted into the side face of the cross rod (531) in a threaded mode, the end portion of the second bolt (536) penetrates through the cross rod (531) and is connected to the side face of the rectangular sliding block (535) in a rotating mode, an inserting rod is inserted into the bolt head of the second bolt (536), and the inserting rod penetrates through the cross rod (531) and is movably inserted into the side face of the rectangular sliding block (535).

7. The cleaning tool for semiconductor round parts according to claim 6, wherein: the front side and the rear side of the cross rod (531) are respectively attached to the side face of the bolt head of the first bolt (52) and the side face of the support frame (1).

8. The cleaning tool for semiconductor round parts according to claim 7, wherein: the side surfaces of the vertical groove (534) and the rectangular sliding block (535) which are close to each other are roughened.