CN219125215U - High-pressure air-assisted semiconductor refrigeration program-controlled cooling instrument - Google Patents
High-pressure air-assisted semiconductor refrigeration program-controlled cooling instrument Download PDFInfo
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- CN219125215U CN219125215U CN202320114768.6U CN202320114768U CN219125215U CN 219125215 U CN219125215 U CN 219125215U CN 202320114768 U CN202320114768 U CN 202320114768U CN 219125215 U CN219125215 U CN 219125215U
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Abstract
The utility model relates to cell cryopreservation equipment, in particular to a high-pressure air-assisted semiconductor refrigeration program-controlled temperature reducing instrument, which comprises a shell, wherein an opening for placing a cryopreservation tube is arranged above the shell, a support and a vortex tube are arranged in the shell, an air inlet and a hot air port of the vortex tube are arranged on a shell body of the shell, at least one group of pipe racks are arranged on the support, the upper ends of the pipe racks face the opening on the shell, and a heat preservation cover is arranged on the pipe racks; one side of the pipe support is provided with a plurality of semiconductor refrigerating sheets and air cavities layer by layer from inside to outside, and a cold air port of the vortex tube is communicated with the air cavities through a hose. The device uses the semiconductor for refrigeration and uses high-pressure air for assistance, thereby realizing rapid refrigeration and meeting the requirements of cell freezing storage.
Description
Technical Field
The utility model relates to cell cryopreservation equipment, in particular to a high-pressure air-assisted semiconductor refrigeration program-controlled temperature reducing instrument.
Background
The cell freezing and recovering technology is widely applied to the cell culture process, and the cell freezing and recovering technology is to reduce the temperature of the cultured cells to-80 ℃ by step cooling through slow freezing technology so that the cells enter a dormant state for convenient storage. Cell resuscitation is the use of frozen cells by rapid thawing techniques, which are rapidly heated to 37 ℃.
However, the cell freezing equipment currently existing in the market adopts liquid nitrogen freezing, a liquid nitrogen tank is usually required to be equipped, liquid nitrogen is consumed, the cost is high, and the existing cell freezing equipment is generally heavy and has no re-warming function.
Disclosure of Invention
In order to solve the problems, the utility model provides a high-pressure air-assisted semiconductor refrigeration program-controlled temperature reducing instrument, which adopts a semiconductor for refrigeration and is assisted by high-pressure air to realize rapid refrigeration, thereby meeting the requirements of cell freezing and preserving, and adopts the following technical scheme:
the high-pressure air-assisted semiconductor refrigeration program-controlled cooling instrument comprises a shell, wherein an opening for placing a freezing tube is formed in the upper side of the shell, a support and a vortex tube are arranged in the shell, an air inlet and a hot air port of the vortex tube are formed in a shell body of the shell, at least one group of tube frames are mounted on the support, the upper end of each tube frame faces the opening on the shell, and a heat preservation cover is arranged on each tube frame;
one side of the pipe support is provided with a plurality of semiconductor refrigerating sheets and air cavities layer by layer from inside to outside, and a cold air port of the vortex tube is communicated with the air cavities through a hose.
The semiconductor refrigeration program-controlled cooling instrument assisted by high-pressure air is characterized in that an electric heating type heating sheet is arranged on the other side of the pipe support.
The high-pressure air-assisted semiconductor refrigeration program-controlled cooling instrument is characterized in that the shell is provided with a vent hole.
The semiconductor refrigeration program-controlled cooling instrument assisted by the high-pressure air is characterized in that the outer layer of the air cavity is provided with cooling fins.
The beneficial effects of the utility model are as follows: the pipe rack is provided with semiconductor refrigeration and high-pressure air refrigeration, so that the refrigerating efficiency is good, the cost is low, and the operation is easy. Meanwhile, the heating plate is arranged on the pipe frame, so that the freezing pipe can be directly rewarmed without being transferred to other equipment, and the freezing pipe is very convenient.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the internal structure of the present utility model (for more intuitively expressing the structure of the pipe rack, the pipe rack is shown in a partial 90-degree cut-away view);
FIG. 3 is a schematic diagram of the structure of the tube rack and semiconductor refrigeration vortex tube of the present utility model;
FIG. 4 is a schematic diagram of the structure of the tube rack and semiconductor refrigeration according to the present utility model;
fig. 5 is a schematic diagram of a structure of the pipe rack and semiconductor refrigeration according to the present utility model in a cut-away top view.
In the figure: the heat insulation pipe comprises a shell 1, a pipe support 2, a temperature probe 3, a support 4, a heat insulation cover 5, a heating plate 6, a radiating plate 7, a semiconductor refrigerating plate 8, a vortex tube 9, a hose 10, a vent hole 11, an air cavity 12 and a freezing tube 13.
Detailed Description
The technical scheme of the utility model is described in detail below with reference to the accompanying drawings.
The embodiment is a semiconductor refrigeration program-controlled temperature reducing instrument assisted by high-pressure air, and has high refrigeration efficiency.
The temperature reducing instrument comprises a shell 1, wherein a vent hole 11 is formed in the side face of the shell 1, and an opening for placing a freezing storage tube 13 is formed in the upper portion of the shell.
The shell 1 is internally provided with a support 4 and a vortex tube 9, the support 4 is of a heat insulation structure, and an air inlet and a hot air port of the vortex tube 9 are arranged on the shell body of the shell 1. Two groups of side-by-side pipe frames 2 are arranged on the support 4, the upper end faces of the pipe frames 2 are aligned with the opening in the shell 1, and a heat preservation cover 5 is arranged on the pipe frames 2.
As shown in fig. 4 and 5, a plurality of semiconductor refrigerating sheets 8, air cavities 12 and radiating fins 7 are arranged on one side of the pipe support 2 layer by layer from inside to outside, and a cold air port of the vortex tube 9 is communicated with the air cavities 12 through a hose 10, so that the temperature in the pipe support 2 is further reduced, and accurate and stable freezing storage is realized.
The opposite side of pipe support 2 is equipped with semiconductor electricity heating type's heating plate 6, and this embodiment establishes heating plate 6 between two sets of pipe supports 2, still is equipped with temperature probe 3 on the pipe support 2 and is used for determining the real-time temperature of pipe support 2 department to transmit to singlechip control unit, have the instruction of predetermineeing in the singlechip control unit, can be according to the break-make state of this temperature regulation heating plate 6, semiconductor refrigeration piece 8 and vortex tube 9 etc. realize automatic control, the use of singlechip and the control principle to this cooling appearance are ripe prior art.
The working principle of the temperature reducing instrument is as follows: (1) in the freezing state, the freezing tube 13 is put into the tube rack 2 and is tightly covered by the heat preservation cover 5, then the vortex tube 9 is filled with high-pressure gas, the high-pressure gas can be cooled to minus tens of degrees through the refrigeration of the vortex tube 9, in the embodiment, the temperature of the cooling fin 7 is reduced by setting the cooling output of the vortex tube 9 to minus 46 ℃ into the air cavity 12, so that the temperature of the semiconductor cooling fin 8 is further reduced, the maximum temperature difference of the semiconductor cooling fin 8 can reach 65 ℃, and the temperature of the freezing tube 13 can be rapidly reduced to 80 ℃ through the double refrigeration mode. (2) In the melting state, the heating plate 6 is electrified and started, and the freezing tube 13 is quickly thawed to quickly heat up the frozen cells to the normal temperature state.
Claims (4)
1. The utility model provides a high-pressure air-assisted semiconductor refrigeration programme-controlled cooling appearance, includes shell (1), the top of shell (1) is equipped with the opening that is used for putting into the cryopreservation pipe, its characterized in that: a support (4) and a vortex tube (9) are arranged in the shell (1), an air inlet and a hot air port of the vortex tube (9) are formed in the shell of the shell (1), at least one group of pipe frames (2) are mounted on the support (4), the upper ends of the pipe frames (2) face the opening on the positive shell (1), and a heat preservation cover (5) is arranged on the pipe frames (2);
one side of the pipe support (2) is provided with a plurality of semiconductor refrigerating sheets (8) and an air cavity (12) layer by layer from inside to outside, and a cold air port of the vortex tube (9) is communicated with the air cavity (12) through a hose (10).
2. The high-pressure air-assisted semiconductor refrigeration programmable temperature reduction instrument according to claim 1, wherein: the other side of the pipe support (2) is provided with an electric heating type heating sheet (6).
3. The high-pressure air-assisted semiconductor refrigeration programmable temperature reduction instrument according to claim 1, wherein: the shell (1) is provided with a vent hole (11).
4. The high-pressure air-assisted semiconductor refrigeration programmable temperature reduction instrument according to claim 1, wherein: the outer layer of the air cavity (12) is provided with cooling fins (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320114768.6U CN219125215U (en) | 2023-01-17 | 2023-01-17 | High-pressure air-assisted semiconductor refrigeration program-controlled cooling instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320114768.6U CN219125215U (en) | 2023-01-17 | 2023-01-17 | High-pressure air-assisted semiconductor refrigeration program-controlled cooling instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219125215U true CN219125215U (en) | 2023-06-06 |
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ID=86599415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320114768.6U Active CN219125215U (en) | 2023-01-17 | 2023-01-17 | High-pressure air-assisted semiconductor refrigeration program-controlled cooling instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219125215U (en) |
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2023
- 2023-01-17 CN CN202320114768.6U patent/CN219125215U/en active Active
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