CN219094867U - Ceramic jig for supporting semiconductor substrate - Google Patents

Abstract

The utility model relates to the technical field of semiconductor substrate jigs, in particular to a ceramic jig for supporting a semiconductor substrate, which comprises a base, wherein the base is a main supporting part of the ceramic jig, a motor is installed at the top of a supporting plate, a bidirectional screw rod is connected to the output end of the motor, a thread bush is meshed with and connected to two ends of the surface of the bidirectional screw rod, clamping plates are installed at the tops of the thread bushes, and silica gel mats are respectively attached to the surfaces of the clamping plates. The utility model overcomes the defects of the prior art, the motor, the bidirectional screw rod, the clamping plate and the silica gel pad are arranged, the bidirectional screw rod at the output end is driven by the motor to rotate, so that the threaded sleeves meshed with the two ends of the surface of the bidirectional screw rod reversely move, the clamping plate is driven to clamp the placed ceramic storage plate, and meanwhile, the silica gel pad on the surface can increase the contact area, so that the phenomenon that the ceramic storage plate moves due to the influence of the outside in the processing process is reduced.

Description

Ceramic jig for supporting semiconductor substrate

Technical Field

The utility model relates to the technical field of semiconductor substrate jigs, in particular to a ceramic jig for supporting a semiconductor substrate.

Background

In the packaging process of semiconductor devices such as ICs, the die bonding is an extremely important link, and the die bonding process is as follows: dispensing a semiconductor chip from a wafer by a dispensing mechanism (also called a dispensing module) on a die bonding station of a substrate, and then transferring the semiconductor chip to the die bonding station after dispensing by a die bonding swing arm of the die bonding mechanism; at present, before a semiconductor enters the die bonder, the metal jig damages the structural materials in the semiconductor, so that the semiconductor is required to be placed on the ceramic jig, and then the ceramic jig is placed in the die bonder, so that the die bonder performs die bonding operation on the semiconductor.

According to the prior patent publication No.: : the utility model provides a ceramic tool for supporting semiconductor substrate, includes the metal base, set up the standing groove on the metal base, the notch of standing groove sets up, the standing groove is embedded to be equipped with the pottery and put the thing board, the standing groove includes the dovetail, the shape size of pottery is put the thing board and the shape size of standing groove is mutually adapted, threaded connection has the clamping plate on the metal base, the standing groove forms between clamping plate and metal base, the clamping plate presss from both sides tight pottery and puts the thing board, in the semiconductor processing to pottery put thing board top, the device in the die bonder can cause the pottery to put the thing board and take place to remove to influence the degree of accuracy of semiconductor processing; and in the process of processing the semiconductor, impact force directly acts on the surface of the semiconductor, so that the semiconductor is easy to damage, and resources are wasted.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides a ceramic jig for supporting a semiconductor substrate, and aims to solve the problems that in the prior art, a device in a die bonder can cause the deviation of a ceramic placement plate so as to influence the accuracy of semiconductor processing, and impact force directly acts on the surface of a semiconductor to easily damage the semiconductor.

In order to solve the technical problems, the utility model provides the following technical scheme:

a ceramic jig for supporting a semiconductor substrate, comprising:

the base is a main supporting part of the ceramic jig, a supporting plate is arranged on one side of the surface of the base, and a motor is arranged at the top of the supporting plate;

the bidirectional screw rod is connected to the output end of the motor, and the directions of threads at the two ends of the bidirectional screw rod are opposite;

the thread sleeves are connected to two ends of the surface of the bidirectional screw in a meshed manner, and clamping plates are arranged at the tops of the thread sleeves;

the silica gel pads are respectively and closely arranged on the surface of the clamping plate;

the placement seats are arranged on two sides of the top of the base;

the through grooves are formed in the placing seat, a plurality of groups of buffer springs are arranged in the through grooves, and the tops of the buffer springs are connected with the pressing plate.

Preferably, the base further comprises:

the mounting plates are equidistantly arranged at the left end and the right end of the base;

and the mounting holes are formed in the middle end of the surface of the mounting plate.

Preferably, the base further comprises:

the control panel is arranged on the outer surface of the base and is electrically connected with the motor.

Preferably, the base further comprises:

and the fixing rod is arranged in the internal groove of the base and penetrates through the threaded sleeve.

Preferably, the placement base further comprises:

the placing grooves are formed in the inner sides of the placing seats;

and the ceramic storage plates are arranged at the top of the placing groove.

Preferably, the placement base further comprises:

and the buffer block is connected to the top of the placing seat and is contacted with the top of the pressing plate.

The embodiment of the utility model provides a ceramic jig for supporting a semiconductor substrate, which has the following beneficial effects:

1. through setting up motor, two-way screw rod, clamping plate and silica gel pad, drive the two-way screw rod of output through the drive of motor and rotate for the screw sleeve of two-way screw rod surface both ends meshing carries out reverse removal, and then drives the clamping plate and put the pottery that finishes and put the thing board and press from both sides tightly, and the silica gel pad on surface can increase area of contact simultaneously, thereby reduces and put the thing board emergence of phenomenon that removes because of receiving external influence to lead to pottery in the course of working, in order to improve the degree of accuracy of semiconductor processing.

2. Through setting up buffer spring, clamp plate and buffer block, when processing the semiconductor, the buffer block of bottom can move downwards when impact force acts on ceramic put thing board surface, extrudees the buffer spring of clamp plate bottom, and buffer spring receives impact force and can inwards shrink promptly to carry out certain buffering to impact force, thereby reduce the condition emergence that causes the damage to the semiconductor because of impact force directly acts on the semiconductor surface, reduce the waste of resource.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a schematic view of the clamping assembly of the present utility model;

FIG. 3 is a schematic view of the structure of the placement base of the present utility model;

fig. 4 is a schematic diagram of the front cross-section structure of the placement seat of the present utility model.

In the figure: 1. a base; 2. a mounting plate; 3. a mounting hole; 4. a supporting plate; 5. a motor; 6. a control panel; 7. a placement seat; 8. a bidirectional screw; 9. a clamping plate; 10. a thread sleeve; 11. a silica gel pad; 12. a fixed rod; 13. a ceramic storage plate; 14. a placement groove; 15. a buffer block; 16. a pressing plate; 17. a buffer spring; 18. and (5) through grooves.

Detailed Description

The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.

Examples: as shown in fig. 1, a ceramic jig for supporting a semiconductor substrate is mounted on a base 1 by inserting a connector into a mounting hole 3 at the middle end of a mounting plate 2, a supporting plate 4 supports a motor 5, a person can operate the ceramic jig by using a control panel 6, and then a ceramic placing plate 13 is placed on a placing seat 7 so as to facilitate the subsequent processing of the semiconductor.

As shown in fig. 2, a ceramic jig for supporting a semiconductor substrate, a clamping assembly is composed of a motor 5, a bidirectional screw rod 8, a thread sleeve 10, a clamping plate 9, a silica gel pad 11 and a fixing rod 12, the motor 5 is started by a control panel 6, so that the bidirectional screw rod 8 rotates along with the driving of the motor 5, the thread directions of two ends of the bidirectional screw rod 8 are opposite, the thread sleeve 10 and the clamping plate 9 engaged with the two ends of the surface of the bidirectional screw rod 8 are driven to move, and meanwhile, the thread sleeve 10 at the other end of the clamping plate 9 moves along with the rotation of the bidirectional screw rod 8 on the surface of the fixing rod 12, so that the ceramic placing plate 13 is limited and fixed, and meanwhile, the silica gel pad 11 on the surface of the clamping plate 9 can reduce damage to the ceramic placing plate 13 in the clamping process.

As shown in fig. 3-4, a ceramic jig for supporting a semiconductor substrate is provided, in which a semiconductor is placed in a ceramic placing plate 13, and then the ceramic placing plate 13 is placed in a placing groove 14 inside a placing seat 7, and when the semiconductor is processed, impact force acts on the surface of the semiconductor while a buffer block 15 moves downwards, so that a pressing plate 16 is driven to press a buffer spring 17 at the bottom of a through groove 18, and a certain buffer is performed on the impact force, thereby reducing the damage to the semiconductor.

Working principle: the semiconductor is placed in the ceramic placing plate 13, then the ceramic placing plate 13 is placed in the placing groove 14 at the inner side of the placing seat 7, the bidirectional screw rod 8 at the output end is driven to rotate through the driving of the motor 5, so that the threaded sleeves 10 meshed with the two ends of the surface of the bidirectional screw rod 8 are reversely moved, the clamping plate 9 is driven to clamp the placed ceramic placing plate 13, meanwhile, the contact area of the silica gel pad 11 on the surface can be increased, the phenomenon that the ceramic placing plate 13 moves due to the influence of the outside in the processing process is reduced, in addition, when the semiconductor is processed, the impact force acts on the surface of the ceramic placing plate 13, the buffer block 15 at the bottom moves downwards, the buffer spring 17 at the bottom of the pressing plate 16 is compressed inwards due to the impact force, so that the impact force is buffered to a certain extent, and the situation that the semiconductor is damaged due to the direct action of the impact force on the surface of the semiconductor is reduced.

Claims (6)

1. A ceramic jig for supporting a semiconductor substrate, comprising:

the base (1) is a main supporting part of the ceramic jig, one side of the surface of the base is provided with a supporting plate (4), and the top of the supporting plate (4) is provided with a motor (5);

the bidirectional screw rod (8) is connected to the output end of the motor (5), and threads at two ends of the bidirectional screw rod (8) are opposite in trend;

the thread sleeves (10) are connected to two ends of the surface of the bidirectional screw rod (8) in a meshed mode, and clamping plates (9) are arranged at the tops of the thread sleeves (10);

the silica gel pads (11) are respectively attached to the surface of the clamping plate (9);

the placement seats (7) are arranged on two sides of the top of the base (1);

the through grooves (18) are formed in the placing seat (7), a plurality of groups of buffer springs (17) are arranged in the through grooves (18), and the tops of the buffer springs (17) are connected with the pressing plate (16).

2. The ceramic jig for supporting a semiconductor substrate according to claim 1, wherein the susceptor (1) further comprises:

the mounting plates (2) are equidistantly arranged at the left end and the right end of the base (1);

and the mounting holes (3) are formed in the middle ends of the surfaces of the mounting plates (2).

3. The ceramic jig for supporting a semiconductor substrate according to claim 1, wherein the susceptor (1) further comprises:

the control panel (6) is arranged on the outer surface of the base (1), and the control panel (6) is electrically connected with the motor (5).

4. The ceramic jig for supporting a semiconductor substrate according to claim 1, wherein the susceptor (1) further comprises:

and the fixing rod (12) is arranged in the internal groove of the base (1), and the fixing rod (12) penetrates through the threaded sleeve (10).

5. The ceramic jig for supporting a semiconductor substrate according to claim 1, wherein the placement base (7) further comprises:

the placing grooves (14) are formed in the inner side of the placing seat (7);

and ceramic storage plates (13) which are all placed on the top of the placement groove (14).

6. The ceramic jig for supporting a semiconductor substrate according to claim 1, wherein the placement base (7) further comprises:

and a buffer block (15) connected to the top of the placement seat (7) and contacting with the top of the pressing plate (16).

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