CN219079683U - Auxiliary placement device for electroplating mold - Google Patents

Auxiliary placement device for electroplating mold Download PDF

Info

Publication number
CN219079683U
CN219079683U CN202223314197.5U CN202223314197U CN219079683U CN 219079683 U CN219079683 U CN 219079683U CN 202223314197 U CN202223314197 U CN 202223314197U CN 219079683 U CN219079683 U CN 219079683U
Authority
CN
China
Prior art keywords
lifting seat
supporting columns
columns
base frame
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202223314197.5U
Other languages
Chinese (zh)
Inventor
秦海平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanjing Haichuang Surface Treatment Technology Co ltd
Original Assignee
Nanjing Haichuang Surface Treatment Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanjing Haichuang Surface Treatment Technology Co ltd filed Critical Nanjing Haichuang Surface Treatment Technology Co ltd
Priority to CN202223314197.5U priority Critical patent/CN219079683U/en
Application granted granted Critical
Publication of CN219079683U publication Critical patent/CN219079683U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Electroplating Methods And Accessories (AREA)

Abstract

The utility model discloses an auxiliary placement device for mold electroplating, which comprises a base frame and a lifting seat, wherein a plurality of supporting columns are arranged on the base frame, first extending parts are arranged on the supporting columns, first supporting columns for supporting materials are arranged on the plurality of first extending parts, the lifting seat is arranged on the base frame in a sliding manner, a plurality of second supporting columns are arranged on the lifting seat, the plurality of first supporting columns and the plurality of second supporting columns are arranged in a staggered manner, and the lifting seat is driven to slide so that the second supporting columns support materials to move relative to the first supporting columns. According to the auxiliary placement device for electroplating the die, the lifting seat slides relative to the base frame to enable the second supporting column to support and lift the material, the lifting seat drives the die material to lift up and down in a reciprocating mode, so that the die material is respectively exposed in a circulating mode at the position where the die material contacts the first supporting column and the second supporting column for electroplating, and the problem that a coating is incomplete at the position where the die material contacts the base frame and the lifting seat because the coating is difficult to form is avoided.

Description

Auxiliary placement device for electroplating mold
Technical Field
The utility model relates to the technical field of placement devices, in particular to an auxiliary placement device for electroplating a die.
Background
In the electroplating process, materials are required to be immersed in the electrolyte for a period of time to be electroplated, so that auxiliary placement is often required to continuously and fixedly immerse the materials in the electrolyte, the most commonly used auxiliary placement device is a hanging frame, namely, the materials are hung on the hanging frame, the hanging frame is immersed in the electrolyte to be electroplated, and sometimes, the mold is electroplated in the mold processing process to increase the corrosion resistance and scratch resistance of the surface of the mold.
According to publication number CN105442026B, publication (bulletin) day: 2018.03.30 an electroplating hanger comprises a support and hanging pieces, wherein the hanging pieces are fixedly connected to the support, fixing pieces are arranged on the support, a plurality of groups of hanging pieces are arranged on the support in parallel, the hanging pieces in the same group of hanging pieces are arranged at intervals, and the hanging pieces in two adjacent groups of hanging pieces are arranged in a staggered mode. The electroplating hanger is used for fixing the fixing piece and the conductive rod of the electroplating bath body relatively, and the product to be electroplated can be placed on a plurality of groups of hanging pieces. Because the electroplating hanger is provided with the plurality of groups of hanging pieces at intervals, and the two adjacent groups of hanging pieces are arranged in a staggered manner, the number of products which can be electroplated each time is increased under the condition that the size of the electroplating bath is not changed, and the electroplated products can not be mutually shielded, so that the electroplating yield and the electroplating quality are improved. The electroplating hanger is suitable for electroplating sintered NdFeB permanent magnet material products, and plays an important role in improving the overall industry level of sintered NdFeB permanent magnet material electroplating in China.
Among the prior art including foretell patent, be provided with a plurality of pendants on the support, place the card solid on the pendant with the material that needs electroplate in order to fix, and because mould volume and weight are great when electroplating to the mould, consequently often use the bracket, the fixed principle of bracket and stores pylon is the same, both are contact fixed, because the bracket contacts each other with the material and leads to the surface that material and bracket contacted can be sheltered from, consequently be difficult to form the cladding material in the position that material and bracket contacted, and then lead to the contact position cladding material of material gapped, incomplete.
Disclosure of Invention
The utility model aims to provide an auxiliary placement device for mold electroplating, which is used for solving the problem that a plating layer is not complete at a contact position where a mold material is contacted with a bracket because the plating layer is difficult to form.
In order to achieve the above object, the present utility model provides the following technical solutions: the utility model provides a mould is electroplated with supplementary device of placing, includes bed frame and lifting seat, be provided with a plurality of support columns on the bed frame, be provided with first extension on the support column, a plurality of all be provided with on the first extension and be used for supporting the first support post that holds in the palm the material, the lifting seat slide set up in on the bed frame, be provided with a plurality of second on the lifting seat and support the post, a plurality of first support post with the second supports the crisscross setting of support post, the lifting seat is driven to slide so that the second supports the support post and supports the material for first support post motion.
Preferably, the lifting seat is provided with a plurality of sliding columns, the sliding columns are connected with each other through a mounting portion, the mounting portion is provided with second extending portions, the second supporting columns are arranged on the second extending portions, sliding holes coaxial with the second supporting columns are formed in the supporting columns, sliding grooves are formed in the supporting columns, and the sliding columns are arranged in the sliding holes in a sliding mode so that the mounting portions are arranged in the sliding grooves in a sliding mode.
Preferably, the support column is provided with a plurality of groups of first extending parts and first supporting columns which are distributed in a linear array, and the sliding column is provided with a plurality of groups of second extending parts and second supporting columns which are distributed in a linear array.
Preferably, the device further comprises an L-shaped abutting seat, wherein the abutting seats are fixedly connected to the first extending portion to form a rectangle, the top surface of each abutting seat is an inclined surface, and the inclined surfaces face the materials.
Preferably, a first handle is arranged on the first side surface of the base frame, a second handle is symmetrically arranged on the first side surface of the lifting seat, and an exposing groove is formed in the lifting seat to expose the first handle.
Preferably, the base frame is provided with a positioning part, and the positioning part is positioned at the centers of the first supporting columns.
Preferably, the surfaces of the base frame and the lifting seat are provided with resin protective layers.
In the technical scheme, the auxiliary placement device for die electroplating provided by the utility model has the following beneficial effects: the first supporting columns are arranged on the supporting columns of the base frame to support the die material, the second supporting columns are arranged on the lifting seat and are staggered with the first supporting columns, when the die material is placed on the first supporting columns, the second supporting columns are not in contact with the die material, the base frame, the lifting seat and the die material are integrally placed in electrolyte for electroplating, after one-time electroplating, a plating layer is not formed at the position where the die material is in contact with the first supporting columns, the lifting seat can slide relative to the base frame to enable the second supporting columns to support the material to lift, at the moment, the position where the material is in contact with the first supporting columns is exposed so that the position is electroplated to form a certain plating layer, the lifting seat drives the die material to lift in a reciprocating mode so that the die material is respectively circulated to expose the positions where the first supporting columns are in contact with the second supporting columns, and the incomplete plating layer is caused by difficulty in forming the plating layer at the contact position between the die material and the base frame.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic view of the overall structure provided by an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a base frame according to an embodiment of the present utility model;
FIG. 3 is a schematic view of a lifting seat according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of an interference seat according to an embodiment of the present utility model.
Reference numerals illustrate:
1. a base frame; 11. a support column; 12. a sliding hole; 13. a sliding groove; 14. a first protruding portion; 15. a first supporting column; 16. a positioning part; 17. a first handle; 2. lifting the seat; 21. a sliding column; 22. a mounting part; 23. a second protruding portion; 24. a second supporting column; 25. exposing the groove; 26. a second handle; 3. the supporting seat is arranged.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
As shown in fig. 1-4, an auxiliary placement device for electroplating a mold comprises a base frame 1 and a lifting seat 2, wherein a plurality of support columns 11 are arranged on the base frame 1, first extension parts 14 are arranged on the support columns 11, first supporting columns 15 for supporting materials are arranged on the plurality of first extension parts 14, the lifting seat 2 is arranged on the base frame 1 in a sliding manner, a plurality of second supporting columns 24 are arranged on the lifting seat 2, the plurality of first supporting columns 15 and the second supporting columns 24 are arranged in a staggered manner, and the lifting seat 2 is driven to slide so that the second supporting columns 24 support the materials to move relative to the first supporting columns 15.
Specifically, as shown in fig. 1, four support columns 11 are disposed on the base frame 1, a first protruding portion 14 is disposed on the support columns 11, a first supporting column 15 protruding upward is disposed on the first protruding portion 14, the lifting seat 2 is slidably disposed on the base frame 1, a plurality of second supporting columns 24 protruding upward are disposed on the lifting seat 2, the plurality of first supporting columns 15 and the plurality of second supporting columns 24 are disposed in a staggered manner, the protruding length of the second supporting columns 24 is smaller than that of the first supporting columns 15, when the mold material is disposed on the first supporting columns 15, the second supporting columns 24 are not in contact with the mold material, at this time, the base frame 1, the lifting seat 2 and the mold material are integrally disposed in the electrolyte for electroplating, after one-end time electroplating, the contact position of the mold material and the first supporting columns 15 is not formed, the lifting seat 2 can slide relative to the base frame 1 to enable the second supporting column 24 to support the die material to lift, at the moment, the contact position of the die material and the first supporting column 15 is exposed so as to be convenient for electroplating at the position to form a certain plating layer, after one-time electroplating, the lifting seat 2 slides down to enable the die material to be supported by the first supporting column 15 again and not contact with the second supporting column 24, the lifting seat 2 drives the die material to lift reciprocally so as to enable the die material to be circularly exposed at the contact position of the first supporting column 15 and the second supporting column 24 for electroplating, the problem that the plating layer is incomplete at the position where the die material is difficult to form at the contact position of the die material and the base frame 1 is avoided, and then the die material is supported on the base frame 1 by utilizing the first supporting column 15 and the second supporting column 24 so as to ensure stable supporting of the die material.
In the above technical solution, the plurality of first protruding portions 14 on the supporting columns 11 of the base frame 1 are utilized, the plurality of first supporting columns 15 are arranged on the first protruding portions to support the die material, the plurality of second supporting columns 24 which are staggered with the first supporting columns 15 are arranged on the lifting seat 2, when the die material is placed on the first supporting columns 15, the second supporting columns 24 are not contacted with the die material, at this time, the base frame 1, the lifting seat 2 and the die material are integrally placed in the electrolyte for electroplating, after one-end time electroplating, no plating layer is formed at the position where the die material contacts with the first supporting columns 15, the lifting seat 2 can slide relative to the base frame 1 to enable the second supporting columns 24 to support the die material to lift, at this time, the position where the die material contacts with the first supporting columns 15 is exposed so as to be electroplated at the position, the position where the die material is driven by the lifting seat 2 to drive the die material to reciprocate to enable the die material to be respectively and circularly exposed to be electroplated at the positions where the first supporting columns 15 and the second supporting columns 24 are contacted with the die material, and the position where the die material is not completely plated is difficult to form a plating layer at the position where the die material contacts with the base frame 1 and the lifting seat 2 are contacted with the first supporting columns 15.
As an embodiment of the present utility model, a plurality of sliding columns 21 are provided on the lifting seat 2, the sliding columns 21 are connected with each other through a mounting portion 22, a second extending portion 23 is provided on the mounting portion 22, a second supporting column 24 is provided on the second extending portion 23, a sliding hole 12 coaxial with the second extending portion is provided in the supporting column 11, a sliding groove 13 is provided in the supporting column 11, and the sliding columns 21 are slidably provided in the sliding hole 12 so that the mounting portion 22 is slidably provided in the sliding groove 13.
Specifically, as shown in fig. 2, a sliding hole 12 coaxial with the supporting column 11 is formed in the supporting column 11, as shown in fig. 3, a plurality of sliding columns 21 are arranged on the lifting seat 2, the sliding columns 21 are connected with each other through mounting portions 22, the sliding columns 21 are slidably arranged in the sliding holes 12 so that the mounting portions 22 are slidably arranged in the sliding grooves 13, the sliding columns 21 are slidably utilized to drive the mounting portions 22, the second protruding portions 23 and the second supporting columns 24 on the sliding columns to slide, the first supporting columns 15 and the second supporting columns 24 alternately support the bottoms of the mold materials, the integrity of the plating layers of the mold materials is guaranteed, and the sliding stability of the lifting seat 2 is increased by utilizing the sliding columns 21 and the sliding holes 12.
As a further provided embodiment of the present utility model, the support column 11 is provided with a plurality of groups of first protruding portions 14 and first supporting columns 15 distributed in a linear array, and the sliding column 21 is provided with a plurality of groups of second protruding portions 23 and second supporting columns 24 distributed in a linear array.
Specifically, as shown in fig. 2, the support column 11 is provided with a plurality of groups of first protruding portions 14 and first supporting columns 15 distributed in a linear array, as shown in fig. 3, the sliding column 21 is provided with a plurality of groups of second protruding portions 23 and second supporting columns 24 distributed in a linear array, that is, a plurality of groups of first supporting columns 15 and second supporting columns 24 are utilized to enable a plurality of mold materials to be placed on the base frame 1 at the same time for electroplating, so that the electroplating efficiency is increased.
As the embodiment that the utility model further provides, still including being the conflict seat 3 of L type, the top face of a plurality of conflict seats 3 is the inclined plane, and the inclined plane is towards the material.
Specifically, as shown in fig. 4, the abutting seat 3 is L-shaped and the top surface is an inclined surface inclined towards the material, as shown in fig. 1, the abutting seats 3 are fixedly connected to the first extending portion 14 to form a rectangle, when the size of the mold material is larger than the inner rectangle formed by the abutting seats 3, when the mold material is placed on the base frame 1, four edges of the mold material abut against the inclined surface of the abutting seats 3, at this time, the mold material does not contact the first supporting column 15 any more, and when the size of the mold material is smaller than the inner rectangle formed by the abutting seats 3, the mold material is supported by the first supporting column 15, the abutting seats 3 are utilized to place mold materials with different sizes on the base frame 1, so that the applicability of the base frame 1 is increased, and secondly, if the mold material slides due to shaking of the base frame 1 during electroplating, the abutting seats 3 surround the outer side of the mold material, so that the mold material can be prevented from falling from the base frame 1 due to shaking.
As a further provided embodiment of the present utility model, the first side of the base frame 1 is provided with a first handle 17, the first side of the lifting seat 2 is symmetrically provided with a second handle 26, and the lifting seat 2 is provided with an exposing groove 25 to expose the first handle 17.
Specifically, as shown in fig. 2, the top surface of the base frame 1 is a first side surface, on which a first handle 17 is disposed, the top surface of the lifting seat 2 is a first side surface, on which second handles 26 are symmetrically disposed, and the top of the lifting seat 2 is further provided with an exposing groove 25 to expose the first handle 17, when electroplating is performed, the first handle 17 can be held to take the whole device for moving, so that the device and the mold material can be placed in the electrolyte tank, and then two second handles 26 can be held by two hands to enable the lifting seat 2 to slide relative to the base frame 1, and the second handles 26 are utilized to facilitate the sliding of the driving lifting seat 2.
As a further provided embodiment of the present utility model, the base frame 1 is provided with a positioning portion 16, and the positioning portion 16 is located at the center of the plurality of first supporting columns 15.
Specifically, as shown in fig. 2, the base frame 1 is provided with a positioning portion 16, the positioning portion 16 is located at the center of the plurality of first supporting columns 15, when the mold material is placed on the first supporting columns 15 of the base frame 1, the position of the positioning portion 16 can be taken to place the mold material at the center of the base frame 1, so that the placement of the mold material is facilitated.
As a further provided embodiment of the present utility model, the surfaces of the base frame 1 and the lifting seat 2 are both provided with a resin protection layer.
Specifically, the surfaces of the base frame 1 and the lifting seat 2 are provided with resin protection layers so as to prevent the base frame 1 and the lifting seat 2 from being placed in electrolyte to form a coating thereon.
Working principle: firstly, placing a mold material, when the size of the mold material is larger than the inner rectangle formed by a plurality of abutting seats 3, when the mold material is placed on a base frame 1, four side lines of the mold material are abutted against the inclined surface of the abutting seats 3, at this time, the mold material is not contacted with a first supporting column 15 any more, when the size of the mold material is smaller than the inner rectangle formed by a plurality of abutting seats 3, the mold material is supported by the first supporting column 15, a second supporting column 24 is not contacted with the mold material, at this time, the base frame 1, a lifting seat 2 and the mold material are integrally placed in electrolyte for electroplating, after one-time electroplating, no plating layer is formed at the position where the mold material is contacted with the first supporting column 15, the lifting seat 2 can slide relative to the base frame 1 to enable the second supporting column 24 to support the mold material to be lifted, at this time, the position where the mold material is contacted with the first supporting column 15 is exposed so as to be electroplated, after one-time electroplating is carried out, the lifting seat 2 slides down to enable the mold material to be supported by the first supporting column 15 again, and the second supporting column 24 is not contacted with the second supporting column 24 to be driven to be lifted by the first supporting column 24, and the position where the mold material is contacted with the first supporting column is lifted by the first supporting column and the second supporting column is reciprocally lifted; if the mold material slides due to shaking of the base frame 1 during electroplating, the abutting seat 3 surrounds the outer side of the mold material, so that the mold material can be prevented from falling from the base frame 1 due to shaking.
While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.

Claims (7)

1. The utility model provides a mould is electroplated with supplementary device of placing, its characterized in that includes bed frame (1) and lifting seat (2), be provided with a plurality of support columns (11) on bed frame (1), be provided with first extension (14) on support column (11), a plurality of all be provided with on first extension (14) and be used for supporting first support post (15) of material, lifting seat (2) slide set up in on bed frame (1), be provided with a plurality of second on lifting seat (2) and support post (24), a plurality of first support post (15) with the second supports and holds in the palm post (24) crisscross setting, lifting seat (2) are driven to slide so that second supports support post (24) support the material for first support post (15) motion.
2. The auxiliary placement device for mold electroplating according to claim 1, wherein a plurality of sliding columns (21) are arranged on the lifting seat (2), the sliding columns (21) are connected with each other through mounting portions (22), second protruding portions (23) are arranged on the mounting portions (22), second supporting columns (24) are arranged on the second protruding portions (23), sliding holes (12) coaxial with the second supporting columns are formed in the supporting columns (11), sliding grooves (13) are formed in the supporting columns (11), and the sliding columns (21) are arranged in the sliding holes (12) in a sliding mode so that the mounting portions (22) are arranged in the sliding grooves (13).
3. The auxiliary placement device for mold electroplating according to claim 2, wherein the support column (11) is provided with a plurality of groups of first protruding parts (14) and first supporting columns (15) distributed in a linear array, and the sliding column (21) is provided with a plurality of groups of second protruding parts (23) and second supporting columns (24) distributed in a linear array.
4. The auxiliary placement device for mold electroplating according to claim 1, further comprising an L-shaped abutting seat (3), wherein the abutting seats (3) are fixedly connected to the first protruding portion (14) to be rectangular, and a top surface of each abutting seat (3) is an inclined surface, and the inclined surface faces the material.
5. The auxiliary placement device for mold electroplating according to claim 1, wherein a first handle (17) is arranged on a first side surface of the base frame (1), second handles (26) are symmetrically arranged on the first side surface of the lifting seat (2), and an exposing groove (25) is formed in the lifting seat (2) to expose the first handle (17).
6. The auxiliary placement device for mold electroplating according to claim 1, wherein a positioning part (16) is arranged on the base frame (1), and the positioning part (16) is positioned at the center of a plurality of first supporting columns (15).
7. The auxiliary placement device for mold electroplating according to claim 1, wherein the surfaces of the base frame (1) and the lifting seat (2) are provided with resin protection layers.
CN202223314197.5U 2022-12-09 2022-12-09 Auxiliary placement device for electroplating mold Active CN219079683U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223314197.5U CN219079683U (en) 2022-12-09 2022-12-09 Auxiliary placement device for electroplating mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223314197.5U CN219079683U (en) 2022-12-09 2022-12-09 Auxiliary placement device for electroplating mold

Publications (1)

Publication Number Publication Date
CN219079683U true CN219079683U (en) 2023-05-26

Family

ID=86391450

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223314197.5U Active CN219079683U (en) 2022-12-09 2022-12-09 Auxiliary placement device for electroplating mold

Country Status (1)

Country Link
CN (1) CN219079683U (en)

Similar Documents

Publication Publication Date Title
US3658197A (en) Programmable apparatus for conveying articles through successive process steps
CN115116908B (en) Wafer groove corrosion device
CN219079683U (en) Auxiliary placement device for electroplating mold
US4351266A (en) Apparatus for dipping plating
KR101885989B1 (en) Plating rack
CN220265909U (en) Electroplating tool for manufacturing ceramic carrier plate
US5393395A (en) Method of surface-treating a half sliding bearing and apparatus for same
JPS6296223A (en) Device and method of automatically transporting and treatingarticle
CN214651248U (en) Suspension wire conductive structure
CN218860947U (en) Bell rod is electroplated with perpendicular continuous electroplating mechanism
CN214736179U (en) Oil-spraying electroplating treatment equipment for plate embedded stainless steel frame
JP2001335995A (en) Plating apparatus with plural rows of plating tanks, and high-speed product transferring apparatus in plating apparatus with one or plural rows of plating tanks
CN211858610U (en) Deplating clamp for semiconductor device
CN217077836U (en) Hang cage formula electroplating processing device
CN219490207U (en) Electroplating device in electroplating production line
CN212451677U (en) Metal material surface gold plating device
CN215366029U (en) Hanging die for electroplating automobile parts
CN219032434U (en) No trace rack plating device
CN217965686U (en) Plunger feeding mechanism for hardware assembly
CN218710843U (en) Vertical continuous chemical plating line
JP3222389B2 (en) Jig for plating
CN203715766U (en) Electroplating workpiece fixing mechanism
CN214991985U (en) Electroplating hanger for aircraft sheet metal parts
CN220155508U (en) Placement rack for wafer electrophoresis
CN209923466U (en) Limiting device on travelling crane

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant