CN219068760U

CN219068760U - Processor heat radiation structure for monitoring equipment

Info

Publication number: CN219068760U
Application number: CN202223095848.6U
Authority: CN
Inventors: 李秋; 李雪; 李玲
Original assignee: Beijing Tianning Zhiyuan Technology Co ltd
Current assignee: Beijing Tianning Zhiyuan Technology Co ltd
Priority date: 2022-11-22
Filing date: 2022-11-22
Publication date: 2023-05-23
Anticipated expiration: 2032-11-22

Abstract

The utility model relates to the technical field of monitoring equipment tools and discloses a processor heat dissipation structure for monitoring equipment, which comprises two groups of support plates, wherein a support is fixedly connected between the two groups of support plates, a driving motor is fixedly connected to the surface of the support, a driving rod is fixedly connected to the power output end of the driving motor, a fixing piece is fixedly connected to one end of the driving rod, a heat dissipation blade is fixedly connected to the side wall of the fixing piece, a singlechip is fixedly connected to the side wall of the support plate, a bearing plate is fixedly connected to the top end of the support plate, grooves matched with the processor are formed in the surface of the bearing plate, heat conduction fins which are uniformly distributed are fixedly connected to the lower surface of the bearing plate, and a temperature sensor is embedded in the surface of the bearing plate; the utility model increases the heat dissipation area, accelerates the air flow and the temperature conduction to improve the heat dissipation efficiency, has good heat dissipation effect, is convenient for installing and detaching the processor or replacing the heat conduction silicone grease, and is convenient for use.

Description

Processor heat radiation structure for monitoring equipment

Technical Field

The utility model relates to the technical field of monitoring equipment tools, in particular to a heat dissipation structure of a processor for monitoring equipment.

Background

The monitoring equipment needs to be used in the use process, the traditional processor lacks a heat dissipation structure, heat cannot be dissipated to the processor, when the processor is used for a long time, the temperature of the processor is continuously increased, the temperature is too high, damage is caused to components in the processor, so that if the heat is not dissipated timely, the normal operation of the processor is positively influenced, the execution speed is reduced, and even the service life of the processor is influenced, and the heat dissipation structure is arranged for controlling the processor.

The utility model patent number CN217608208U discloses a heat dissipating device of a control processor for monitoring equipment, which comprises a processor body, wherein the top and the bottom of the processor body are fixedly connected with heat conducting plates, the top of the processor body is provided with a sealing cover, the bottom of the sealing cover is fixedly connected to the surface of the heat conducting plates, the bottom of the processor body is provided with a water tank, the top of the water tank is fixedly connected to the surface of the heat conducting plates, the top of the inner wall of the sealing cover is fixedly connected with a splitter plate, the input end of the splitter plate penetrates to the right side of the sealing cover, the input end of the splitter plate is communicated with a first water pump, and the output end of the first water pump is communicated to the bottom of an inner cavity of the water tank through a through pipe. The utility model has the advantage of good heat dissipation effect, solves the problems that the traditional control processor lacks a heat dissipation structure and cannot dissipate heat of the control processor, and when the temperature of the control processor reaches a certain value, the internal components of the control processor are damaged, so that the safety of the control processor is easily reduced.

The existing heat dissipation structure of the processor has the following defects: 1. the existing heat dissipation structure of the processor has single heat dissipation mode, so that the overall heat dissipation efficiency is poor, and the heat dissipation structure is started by manual control, so that the heat dissipation is not timely enough; 2. the existing heat radiation structure of the processor is not convenient enough for the installation and operation of the processor, and the operation is complicated when the processor is installed and disassembled or the heat-conducting silicone grease is replaced, so that the heat radiation structure of the processor is inconvenient to use.

Disclosure of Invention

The utility model aims to provide a heat dissipation structure of a processor for monitoring equipment, so as to solve the problems of poor heat dissipation effect and inconvenient installation and disassembly in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a treater heat radiation structure for supervisory equipment, includes the backup pad, the backup pad is fixedly connected with support between two sets of and the backup pad, and support surface fixedly connected with driving motor, driving motor power take off end fixedly connected with transfer line, transfer line one end fixedly connected with mounting, mounting lateral wall fixedly connected with radiator fin, backup pad lateral wall fixedly connected with singlechip, backup pad top fixedly connected with accept the board and accept the board surface and offered the recess that agrees with the treater, accept the even heat conduction fin of arranging of board lower surface fixedly connected with, accept the board surface and inlay there is temperature sensor.

As the preferred scheme, bearing plate upper surface fixedly connected with riser, the spacing groove has been seted up to the riser lateral wall, and spacing groove inside wall sliding connection has the stopper, and the louvre of evenly arranging has been seted up on stopper one end fixedly connected with orifice plate and orifice plate surface, and fixedly connected with semiconductor refrigeration piece and semiconductor refrigeration piece's cold face down under the orifice plate.

As the preferred scheme, the movable groove has been seted up to riser lateral wall, and movable groove inside wall rotates to be connected with the threaded rod, and threaded rod surface threaded connection has the thread bush, and thread bush lateral wall fixedly connected with movable block, movable block one end links to each other with the orifice plate is fixed, and the riser top rotates to be connected with knob and knob one end links to each other with threaded rod one end is fixed.

As an optimal scheme, backup pad lateral wall fixedly connected with otic placode and otic placode are two sets of.

As a preferable scheme, bolt holes are formed in the surface of the lug plate.

As a preferred scheme, the semiconductor refrigerating sheet, the temperature sensor and the driving motor are electrically connected with an external power supply through the singlechip, and the signal output end of the temperature sensor is connected with the signal input end of the singlechip.

The utility model has the technical effects and advantages that:

1. through the combined use of temperature sensor and singlechip, realize automatically start driving motor and semiconductor refrigeration piece, through driving motor, the transfer line, the rotation of fin is realized to the mounting, hot blade rotates the acceleration air flow, air flow speed is fast, make the hot air of radiator fin department and outside normal atmospheric temperature air accelerate the replacement, the temperature gives off soon, thereby play the cooling effect, the cold face cooling when the semiconductor refrigeration piece operates, through the temperature conduction, make the treater surface cooling, the louvre of evenly arranging on the orifice plate is convenient for semiconductor refrigeration piece hot face heat dissipation, increase radiating efficiency through increasing the radiating area, accelerate air flow and temperature conduction, the radiating effect is good.

2. Through the combined use of knob, threaded rod, thread bush, movable block, realize the removal of the vertical direction of orifice plate, the orifice plate links to each other with the semiconductor refrigeration piece is fixed again, can realize the removal of the vertical direction of semiconductor refrigeration piece through the rotation of knob, and the semiconductor refrigeration piece can pressfitting play fixed action on the treater surface, and fixed easy operation is convenient for install and dismantle the treater or change heat conduction silicone grease, convenient to use.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model.

Fig. 2 is an enlarged view of the structure of fig. 1 a in accordance with the present utility model.

Fig. 3 is a schematic plan view of a driving motor according to the present utility model.

Fig. 4 is a block diagram of the working module of the present utility model.

In the figure: 1. a support plate; 2. a receiving plate; 3. a riser; 4. a heat conducting fin; 5. a temperature sensor; 6. a single chip microcomputer; 7. an orifice plate; 8. a semiconductor refrigeration sheet; 9. a heat radiation blade; 10. a limit groove; 11. a limiting block; 12. a bracket; 13. a driving motor; 14. a transmission rod; 15. a fixing member; 16. a movable groove; 17. a threaded rod; 18. a thread sleeve; 19. a movable block; 20. a knob; 21. ear plates; 22. bolt holes.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The present utility model provides a heat dissipation structure of a processor for monitoring equipment as shown in fig. 1-4, comprising; the device comprises a support plate 1, wherein two groups of support plates 1 are fixedly connected with a support 12, the surface of the support 12 is fixedly connected with a driving motor 13, the power output end of the driving motor 13 is fixedly connected with a transmission rod 14, one end of the transmission rod 14 is fixedly connected with a fixing piece 15, the side wall of the fixing piece 15 is fixedly connected with a cooling blade 9, the side wall of the support plate 1 is fixedly connected with a singlechip 6, the top end of the support plate 1 is fixedly connected with a bearing plate 2, the surface of the bearing plate 2 is provided with a groove matched with a processor, the lower surface of the bearing plate 2 is fixedly connected with uniformly distributed heat conduction fins 4, and the surface of the bearing plate 2 is embedded with a temperature sensor 5; the heat that gives off of treater can outwards give off through heat conduction fin 4, heat conduction fin 4 that evenly arranges can effectively increase heat radiating area to increase radiating efficiency, singlechip 6 control driving motor 13 operation, driving motor 13 power take off end rotates and drives transfer line 14 rotation, transfer line 14 rotates and drives mounting 15 rotation, mounting 15 rotates and drives radiator blade 9 rotation, radiator blade 9 rotates and accelerates the air flow, the air flow is fast, make the hot air of radiator fin department and outside normal atmospheric temperature air be with higher speed the replacement, the temperature gives off soon, thereby play the cooling effect.

In the embodiment, a vertical plate 3 is fixedly connected to the upper surface of a receiving plate 2, a limit groove 10 is formed in the side wall of the vertical plate 3, a limit block 11 is slidably connected to the inner side wall of the limit groove 10, one end of the limit block 11 is fixedly connected with a pore plate 7, uniformly distributed heat dissipation holes are formed in the surface of the pore plate 7, a semiconductor refrigerating plate 8 is fixedly connected to the lower surface of the pore plate 7, and the cold surface of the semiconductor refrigerating plate 8 faces downwards; the limiting block 11 can only move in the limiting groove 10, the limiting block 11 is fixedly connected with the pore plate 7, the pore plate 7 can be limited to move in the vertical direction while the limiting block is fixedly used for fixing the pore plate 7, the pore plate 7 moves smoothly, certain structural strength is increased, the singlechip 6 controls the semiconductor refrigerating piece 8 to operate, the cold surface is cooled when the semiconductor refrigerating piece 8 operates, the surface of a processor is cooled through temperature conduction, and the heat dissipation holes uniformly distributed in the pore plate 7 facilitate heat dissipation of the hot surface of the semiconductor refrigerating piece 8.

In the embodiment, the side wall of the vertical plate 3 is provided with a movable groove 16, the inner side wall of the movable groove 16 is rotationally connected with a threaded rod 17, the surface of the threaded rod 17 is in threaded connection with a threaded sleeve 18, the outer side wall of the threaded sleeve 18 is fixedly connected with a movable block 19, one end of the movable block 19 is fixedly connected with the pore plate 7, the top end of the vertical plate 3 is rotationally connected with a knob 20, and one end of the knob 20 is fixedly connected with one end of the threaded rod 17; the knob 20 can be rotated, the knob 20 rotates to drive the threaded rod 17 to rotate, the threaded rod 17 rotates to drive the threaded sleeve 18 to move, the threaded sleeve 18 can only extend to move in the vertical direction under the limit of the movable block 19 and the movable groove 16, the threaded sleeve 18 moves to drive the movable block 19 to move, the movable block 19 moves to drive the pore plate 7 to move, the pore plate 7 moves to drive the semiconductor refrigerating sheet 8 to move, the movement of the vertical direction of the semiconductor refrigerating sheet 8 is realized through the rotation of the knob 20, the semiconductor refrigerating sheet 8 can be pressed on the surface of a processor to play a fixing effect, the fixing operation is simple and convenient, the processor is convenient to install and detach or the heat-conducting silicone grease is convenient to use.

In the embodiment, the side wall of the supporting plate 1 is fixedly connected with two groups of ear plates 21, bolt holes 22 are formed in the surfaces of the ear plates 21, the semiconductor refrigerating sheet 8, the temperature sensor 5 and the driving motor 13 are electrically connected with an external power supply through the single chip microcomputer 6, and the signal output end of the temperature sensor 5 is connected with the signal input end of the single chip microcomputer 6; the lug plate 21 can be fixed through the bolt holes 22 on the lug plate 21 and the external bolts, namely the whole heat dissipation mechanism is fixed, the fixed structure is stable, the temperature of the bearing plate 2 is sensed by the temperature sensor 5, the temperature signal is transmitted to the singlechip 6 through the temperature sensor 5, and when the set value is reached, the singlechip 6 controls the driving motor 13 and the semiconductor refrigerating sheet 8 to operate, so that timely heat dissipation is realized, and the degree of automation is high.

The working principle of the utility model is as follows: the utility model is a kind of heat-dissipating structure of processor used for monitoring equipment, sense the temperature of the joint plate 2 through the temperature pick-up 5, the temperature signal is transmitted to the single-chip microcomputer 6 through the temperature pick-up 5, when reaching the value set, the single-chip microcomputer 6 controls driving motor 13 and semiconductor refrigerating piece 8 to run, driving motor 13 runs, the power output end of driving motor 13 rotates and drives the transfer lever 14 to rotate, the transfer lever 14 rotates and drives the fixed part 15 to rotate, the fixed part 15 rotates and drives the radiating vane 9 to rotate, the radiating vane 9 rotates and accelerates the air flow, the air flow speed is fast, make the hot air of radiator fin replace with the outside normal temperature air, the temperature is dispersed fast, thus play the cooling effect, the single-chip microcomputer 6 controls the semiconductor refrigerating piece 8 to run, the cold face cools down when the semiconductor refrigerating piece 8 runs, through the temperature conduction, make the surface cooling of the processor, the evenly distributed radiating hole on the orifice plate 7 facilitate the semiconductor refrigerating piece 8 heat dissipation; the knob 20 can be rotated, the knob 20 rotates to drive the threaded rod 17 to rotate, the threaded rod 17 rotates to drive the threaded sleeve 18 to move, the threaded sleeve 18 can only move along the vertical direction under the limit of the movable block 19 and the movable groove 16, the threaded sleeve 18 moves to drive the movable block 19 to move, the movable block 19 moves to drive the pore plate 7 to move, the pore plate 7 moves to drive the semiconductor refrigerating sheet 8 to move, the movement of the semiconductor refrigerating sheet 8 in the vertical direction is realized through the rotation of the knob 20, and the semiconductor refrigerating sheet 8 can be pressed on the surface of a processor to play a role in fixing.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. The utility model provides a treater heat radiation structure for supervisory equipment, includes backup pad (1), its characterized in that: the two groups of support plates (1) are fixedly connected with the support frame (12), the surface of the support frame (12) is fixedly connected with the driving motor (13), the power output end of the driving motor (13) is fixedly connected with the transmission rod (14), one end of the transmission rod (14) is fixedly connected with the fixing piece (15), the side wall of the fixing piece (15) is fixedly connected with the radiating blade (9), the lateral wall fixedly connected with singlechip (6) of backup pad (1), backup pad (1) top fixedly connected with accept board (2) and accept board (2) surface and seted up the recess that agrees with the treater, accept board (2) lower surface fixedly connected with evenly distributed heat conduction fin (4), accept board (2) surface embedded have temperature sensor (5).

2. A heat dissipation structure for a processor of a monitoring device as defined in claim 1, wherein: bearing plate (2) upper surface fixedly connected with riser (3), limiting groove (10) have been seted up to riser (3) lateral wall, limiting groove (10) inside wall sliding connection has stopper (11), and the louvre of evenly arranging has been seted up on stopper (11) one end fixedly connected with orifice plate (7) and orifice plate (7) surface, and fixedly connected with semiconductor refrigeration piece (8) and the cold face of semiconductor refrigeration piece (8) down under orifice plate (7).

3. A heat dissipation structure for a processor for a monitoring device as defined in claim 2, wherein: the movable groove (16) has been seted up to riser (3) lateral wall, and movable groove (16) inside wall rotates and is connected with threaded rod (17), and threaded rod (17) surface threaded connection has thread bush (18), and thread bush (18) lateral wall fixedly connected with movable block (19), movable block (19) one end and orifice plate (7) are fixed to link to each other, and riser (3) top is rotated and is connected with knob (20) and knob (20) one end and threaded rod (17) one end are fixed to link to each other.

4. A heat dissipation structure for a processor of a monitoring device as defined in claim 1, wherein: the side wall of the supporting plate (1) is fixedly connected with the earplates (21), and the earplates (21) are in two groups.

5. The processor heat dissipation structure for a monitoring device of claim 4, wherein: bolt holes (22) are formed in the surface of the lug plate (21).

6. A heat dissipation structure for a processor for a monitoring device as defined in claim 2, wherein: the semiconductor refrigerating sheet (8), the temperature sensor (5) and the driving motor (13) are electrically connected with an external power supply through the singlechip (6), and the signal output end of the temperature sensor (5) is connected with the signal input end of the singlechip (6).