CN219057899U

CN219057899U - Semiconductor device outer frame with strong compression resistance

Info

Publication number: CN219057899U
Application number: CN202223271456.0U
Authority: CN
Inventors: 谈敏立; 张红华; 徐逸冰; 徐剑
Original assignee: Changzhou Sirui Intelligent Technology Co ltd
Current assignee: Changzhou Sirui Intelligent Technology Co ltd
Priority date: 2022-12-07
Filing date: 2022-12-07
Publication date: 2023-05-23
Anticipated expiration: 2032-12-07

Abstract

The utility model discloses an outer frame of semiconductor equipment with high compression resistance, which relates to the field of semiconductors and comprises a frame body, wherein a chute is formed in the frame body, a material frame is arranged in the chute, the width dimension of the material frame is the same as that of the chute, the material frame is in sliding connection with the chute, one end of the material frame is connected with a baffle, the outer wall of one side of the baffle is provided with a connecting plate, a first L-shaped connecting shaft is connected to the connecting plate, and one end of the first L-shaped connecting shaft, which is far away from the connecting plate, is connected with a second L-shaped connecting shaft through a first coupling. According to the utility model, through arranging the material frame, the baffle plate, the connecting plate, the first L-shaped connecting shaft, the first coupler, the second L-shaped connecting shaft, the second coupler, the telescopic rod and the driving hydraulic cylinder, automatic feeding and discharging are realized, and the operation steps of processing personnel are simplified; through setting up spring, spliced pole, U-shaped guard plate and curb plate, improved compressive capacity.

Description

Semiconductor device outer frame with strong compression resistance

Technical Field

The utility model relates to the field of semiconductors, in particular to an outer frame of semiconductor equipment with high compression resistance.

Background

Such as the patent: a material rack (publication number: CN 209491746U) for a semiconductor production workshop comprises a material rack body, wherein the material rack body comprises a frame and a bottom frame, a pulling device is arranged at the front end of the material rack body, the pulling device comprises a top pulley and a bottom pulley, a pull rod is arranged below the top pulley, a pull rope is arranged at the tail end of the pull rod, the tail end of the pull rope is sequentially connected with the top pulley and the bottom pulley in a sliding manner, a stop device is arranged at the bottom end of the material rack body, the stop device comprises a shell, a sliding seat and a stop block, and the material rack for the semiconductor production workshop is arranged at the bottom end of the material rack body.

The existing material rack for the semiconductor production workshop is not easy to automatically feed and discharge although the movement of the material rack body is effectively prevented, and when the material rack is impacted, the semiconductor equipment is damaged in the impact process, so that the failure of transferring the semiconductor equipment is caused, and the material rack is inconvenient to use. Therefore, it is necessary to invent an outer frame of a semiconductor device having a high compression resistance to solve the above-mentioned problems.

Disclosure of Invention

The utility model aims to provide an outer frame of semiconductor equipment with strong pressure resistance, which solves the problems that the automatic loading and unloading are difficult to realize, the semiconductor equipment is damaged in impact when the impact is encountered, the transfer of the semiconductor equipment is failed, and the use is inconvenient.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor equipment outer frame that compressive capacity is strong, includes the framework, the spout has been seted up on the framework, be provided with the work or material rest in the spout, the width dimension of work or material rest is the same with the width dimension of spout, work or material rest and spout sliding connection, the one end of work or material rest is connected with the baffle, one side outer wall of baffle is provided with the connecting plate, be connected with first L shape connecting axle on the connecting plate, first L shape connecting axle is kept away from the one end of connecting plate has the second L shape connecting axle through first coupling joint, the second L shape connecting axle is kept away from the one end of first L shape connecting axle is connected with the telescopic link through the second coupling, the one end of telescopic link is installed on the drive pneumatic cylinder, wherein the telescopic link is connected with baffle and work or material rest fixed connection under the connection of second L shape connecting axle and first L shape connecting axle, opens the drive pneumatic cylinder, and the telescopic link can drive the semiconductor equipment on work or material rest to the standing groove in motion, realizes automatic feeding out, has simplified processing personnel's operation step.

Preferably, the bottom of the frame body is provided with a plurality of groups of springs, the plurality of groups of springs are symmetrically distributed on the frame body, one end, away from the frame body, of each group of springs is provided with a supporting plate, and the springs have a buffering effect on the frame body when the frame body is collided.

Preferably, the top of backup pad is provided with the brace table, the top of brace table is provided with the limiting plate, and wherein the limiting plate has spacing effect to the framework that receives the little range motion after the striking.

Preferably, the bottom of the supporting plate is provided with four groups of supporting columns, and the four groups of supporting columns are arranged at four corners of the supporting plate, wherein the supporting plate and the supporting columns have supporting effects on the frame body.

Preferably, the four groups of support posts are far away from one end of the supporting plate, a chassis is arranged on the chassis, and four groups of universal wheels are arranged on the chassis, wherein the universal wheels facilitate the transfer of semiconductor equipment on the material rack.

Preferably, the curb plate is installed at the top of framework, the curb plate passes through multiunit spliced pole and U-shaped guard plate fixed connection, multiunit the spliced pole is linear distribution on the curb plate, and wherein U-shaped guard plate distributes on the curb plate, and when meetting the striking, U-shaped guard plate collides with the object, avoids framework and curb plate direct collision, realizes.

Preferably, a placing groove is formed in the inner side of the side plate, wherein the placing groove is used for accommodating the semiconductor device, and the side plate has a protective effect on the semiconductor device.

The utility model has the technical effects and advantages that:

1. the material rack, the baffle plate, the connecting plate, the first L-shaped connecting shaft, the first coupling, the second L-shaped connecting shaft, the second coupling, the telescopic rod and the driving hydraulic cylinder are arranged, wherein the telescopic rod is fixedly connected with the baffle plate and the material rack under the connection of the second L-shaped connecting shaft and the first L-shaped connecting shaft, the driving hydraulic cylinder is opened, the telescopic rod can drive the material rack and semiconductor equipment on the material rack to move into the placing groove, automatic feeding and discharging are realized, and the operation steps of a processing staff are simplified;

2. through setting up spring, spliced pole, U-shaped guard plate and curb plate, meet the collision back when transporting, the U-shaped guard plate has the guard effect to framework and curb plate, avoids directly bumping and causes the damage to the semiconductor device in the standing groove on the curb plate, and the U-shaped guard plate is receiving the collision back, and the spring also has the buffer effect to the semiconductor device on framework and the work or material rest, has improved compressive capacity.

Drawings

Fig. 1 is a schematic view showing the overall structure of an outer frame of a semiconductor device having high compression resistance according to the present utility model.

Fig. 2 is a schematic view showing a bottom view of an outer frame of the semiconductor device with high compression resistance according to the present utility model.

Fig. 3 is a schematic side view of an outer frame of a semiconductor device with high compression resistance according to the present utility model.

Fig. 4 is a schematic top view of an outer frame of a semiconductor device with high compression resistance according to the present utility model.

In the figure: 1. a frame; 2. a chute; 3. a material rack; 4. a baffle; 5. a connecting plate; 6. a first L-shaped connecting shaft; 7. a first coupling; 8. a second L-shaped connecting shaft; 9. a second coupling; 10. a telescopic rod; 11. driving a hydraulic cylinder; 12. a spring; 13. a support plate; 14. a support table; 15. a limiting plate; 16. a support post; 17. a chassis; 18. a universal wheel; 19. a connecting column; 20. u-shaped protection plates; 21. a side plate; 22. and (5) placing a groove.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides an outer frame of semiconductor equipment with strong compressive capacity, as shown in fig. 1-4, which comprises a frame body 1, wherein a chute 2 is formed in the frame body 1, a material rack 3 is arranged in the chute 2, the width dimension of the material rack 3 is the same as that of the chute 2, the material rack 3 is connected with the chute 2 in a sliding way, one end of the material rack 3 is connected with a baffle plate 4, a connecting plate 5 is arranged on the outer wall of one side of the baffle plate 4, a first L-shaped connecting shaft 6 is connected to the connecting plate 5, one end of the first L-shaped connecting shaft 6, which is far away from the connecting plate 5, is connected with a second L-shaped connecting shaft 8 through a first coupler 7, one end of the second L-shaped connecting shaft 8, which is far away from the first L-shaped connecting shaft 6, is connected with a telescopic rod 10 through a second coupler 9, one end of the telescopic rod 10 is arranged on a driving hydraulic cylinder 11, wherein the telescopic rod 10 is fixedly connected with the baffle plate 4 and the material rack 3 under the connection of the second L-shaped connecting shaft 8 and the first L-shaped connecting shaft 6, the driving hydraulic cylinder 11 is opened, the telescopic rod 10 can drive the material rack 3 and the semiconductor equipment on the material rack 3 to move inwards to a placing groove 22, so that the automatic feeding and discharging steps are realized.

The bottom of the frame body 1 is provided with a plurality of groups of springs 12, the plurality of groups of springs 12 are symmetrically distributed on the frame body 1, one end, far away from the frame body 1, of each group of springs 12 is provided with a supporting plate 13, and the springs 12 have a buffering effect on the frame body 1 when the frame body 1 is collided.

The top of backup pad 13 is provided with supporting bench 14, and the top of supporting bench 14 is provided with limiting plate 15, and wherein limiting plate 15 has spacing effect to the framework 1 of small amplitude motion after the impact.

The bottom of the support plate 13 is provided with four groups of struts 16, and the four groups of struts 16 are arranged at four corners of the support plate 13, wherein the support plate 13 and the struts 16 have a supporting effect on the frame body 1.

The end of the four groups of support posts 16, which is far away from the support plate 13, is provided with a chassis 17, and four groups of universal wheels 18 are arranged on the chassis 17, wherein the universal wheels 18 facilitate the transportation of the semiconductor equipment on the material frame 3.

The top of framework 1 installs curb plate 21, and curb plate 21 passes through multiunit spliced pole 19 and U-shaped guard plate 20 fixed connection, and multiunit spliced pole 19 is linear distribution on curb plate 21, and wherein U-shaped guard plate 20 distributes on curb plate 21, when meetting the striking, U-shaped guard plate 20 collides with the object, avoids framework 1 and curb plate 21 direct collision, realizes.

The inner side of the side plate 21 is provided with a placement groove 22, wherein the placement groove 22 is used for accommodating the semiconductor device, and the side plate 21 also has a protective effect on the semiconductor device.

Working principle: firstly, a driving hydraulic cylinder 11 is opened, a telescopic rod 10 drives a material frame 3 and semiconductor equipment on the material frame 3 to move in the horizontal direction and shrink into a placing groove 22, at the moment, a U-shaped protection plate 20 can be held by hands, the semiconductor equipment on the frame 1 and the material frame 3 is pulled to transfer, and the semiconductor equipment on the frame 1 and the material frame 3 are driven by universal wheels 18 to move; in addition, when receiving the striking, U-shaped guard plate 20 has the guard effect to the semiconductor device on framework 1 and the work or material rest 3, avoids the semiconductor device direct collision on framework 1 and the work or material rest 3, and during the collision, spring 12 has the cushioning effect to the semiconductor device on framework 1 and the work or material rest 3, has improved compressive strength.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides a semiconductor device outer frame that compressive capacity is strong, includes framework (1), its characterized in that: the automatic feeding device is characterized in that a chute (2) is formed in the frame body (1), a work or material rest (3) is arranged in the chute (2), the width dimension of the work or material rest (3) is identical to that of the chute (2), the work or material rest (3) is connected with the chute (2) in a sliding mode, one end of the work or material rest (3) is connected with a baffle (4), a connecting plate (5) is arranged on the outer wall of one side of the baffle (4), a first L-shaped connecting shaft (6) is connected to the connecting plate (5), the first L-shaped connecting shaft (6) is far away from one end of the connecting plate (5) and is connected with a second L-shaped connecting shaft (8) through a first coupler (7), one end of the second L-shaped connecting shaft (8) is far away from one end of the first L-shaped connecting shaft (6) is connected with a telescopic rod (10) through a second coupler (9), and one end of the telescopic rod (10) is arranged on a driving hydraulic cylinder (11).

2. The high compression resistant semiconductor device outer frame of claim 1, wherein: the bottom of the frame body (1) is provided with a plurality of groups of springs (12), the plurality of groups of springs (12) are symmetrically distributed on the frame body (1), and one end, far away from the frame body (1), of each group of springs (12) is provided with a supporting plate (13).

3. The high compression resistant semiconductor device outer frame of claim 2, wherein: the top of backup pad (13) is provided with supporting bench (14), the top of supporting bench (14) is provided with limiting plate (15).

4. A high compression resistant semiconductor device outer frame as set forth in claim 3, wherein: four groups of struts (16) are arranged at the bottom of the supporting plate (13), and the four groups of struts (16) are arranged at four corners of the supporting plate (13).

5. The high compression resistant semiconductor device outer frame of claim 4, wherein: the one end that four groups pillar (16) keep away from backup pad (13) is provided with chassis (17), install four groups universal wheels (18) on chassis (17).

6. The high compression resistant semiconductor device outer frame of claim 5, wherein: the top of the frame body (1) is provided with a side plate (21), the side plate (21) is fixedly connected with the U-shaped protection plate (20) through a plurality of groups of connecting columns (19), and a plurality of groups of connecting columns (19) are linearly distributed on the side plate (21).

7. The high compression resistant semiconductor device outer frame of claim 6, wherein: a placing groove (22) is formed in the inner side of the side plate (21).