CN219042424U - Microcircuit module lead welding positioning structure - Google Patents

Abstract

The utility model discloses a microcircuit module lead welding positioning structure, which comprises a shell, a module PCB and leads, wherein: the lead comprises a bending part, and the bending part, the injection molding block and the side injection molding block are arranged correspondingly; one end of the bending part is connected with the pin part, and the other end of the bending part is connected with the welding part; at least one anti-loosening groove is formed in the bending part; the utility model enables the lead wire and the module PCB to be welded through the arrangement of the welding groove and the welding part, and reduces the area occupied by the lead wire in the microcircuit module while improving the welding stability of the pin, thereby being beneficial to improving the power density of the module.

Description

Microcircuit module lead welding positioning structure

Technical Field

The utility model belongs to the technical field of microcircuit module leads, and particularly relates to a microcircuit module lead welding positioning structure.

Background

The module lead wire is the adapting part for connecting the module PCB and the external application PCB, and the lead wire adopted on the current module is mostly in a cylindrical or square structure and is welded by opening holes with corresponding shapes on the PCB.

The current module lead wire arrangement causes that more module PCB space is occupied when lead wires are welded and positioned, which contradicts the realization of a high-power density microcircuit module, and the position of the module PCB is required to be fixed first and then the lead wire is required to be fixed, thus greatly increasing the manufacturing flow and lowering the production efficiency.

Disclosure of Invention

The utility model aims to provide a microcircuit module lead welding positioning structure so as to solve the problems of miniaturization of leads and fixation of the position of a module PCB.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a microcircuit module lead welding positioning structure comprises a shell, a module PCB and leads, wherein: the shell is internally provided with a mounting groove for accommodating the installation of a module PCB; the shell is internally provided with a plurality of wire outlet holes, and the lead parts are led out through the wire outlet holes and protrude out of the shell; an injection molding block is arranged at the wire outlet hole, and a side injection molding block is arranged on the inner side wall of the shell corresponding to the injection molding block; the lead comprises a bending part, and the bending part, the injection molding block and the side injection molding block are arranged correspondingly; one end of the bending part is connected with the pin part, and the other end of the bending part is connected with the welding part; at least one anti-loosening groove is formed in the bending part; the module PCB lateral wall is equipped with a plurality of welding grooves, welding groove and welding portion correspond each other and set up, just the welding groove carries out horizontal spacing to the welding portion.

Preferably, the transverse width of the welding part is smaller than that of the bending part, so that the welding part and the bending part are combined to form a fixed step.

Preferably, the fixing step longitudinally limits the module PCB.

Preferably, the bottom of the welding part is symmetrically provided with oblique sides.

Preferably, the bending part is of an L-shaped structural design.

Preferably, the bending part comprises a fixed block and a bending block, and the included angle between the fixed block and the bending block is 90 degrees.

Preferably, the fixing block and the injection molding block are arranged correspondingly, and the bending block and the side injection molding block are arranged correspondingly.

Preferably, the fixing block is connected with the pin part, and the bending block is connected with the welding part.

Preferably, the pin part is of a cylindrical hollow cavity structure.

Preferably, the lead is an integrally formed structure.

The utility model has the technical effects and advantages that the microcircuit module lead welding positioning structure comprises:

1. the lead and the module PCB can be welded through the welding groove and the welding part, so that the welding stability of the lead is improved, the area occupied by the lead in the microcircuit module is reduced, and the power density of the module is improved;

2. through the arrangement of the fixed steps, the module PCB can be longitudinally supported and limited, so that the height of the module PCB is fixed, the module PCB can be positioned on the same horizontal plane when being installed, and the stability of the module PCB is further improved;

3. through setting the lead wire to the sheet type structure, can be well with plastic housing integrated into one piece that moulds plastics to the precision uniformity after the shaping is better, makes manufacturing process simplify, has promoted complete machine module production efficiency.

Drawings

FIG. 1 is an exploded view of the present utility model;

FIG. 2 is a schematic diagram of soldering of the leads to a module PCB of the present utility model;

FIG. 3 is a schematic view of the structure of the housing of the present utility model;

fig. 4 is a schematic structural diagram of a lead according to the present utility model.

In the figure: 1. a housing; 2. a module PCB; 3. a lead wire;

11. a mounting groove; 12. a wire outlet hole; 13. injection molding the block; 14. a side injection molding block;

21. a welding groove;

31. a bending part; 32. a lead portion; 33. a welding part; 34. a fixed step;

311. an anti-loose groove; 312. a fixed block; 313. bending blocks;

331. and a bevel edge.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to fig. 1 to 4 of the embodiments of the present utility model, and it is obvious that the described embodiments are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a microcircuit module lead welding positioning structure as shown in figures 1-4, comprising a housing, a module PCB and leads, wherein: the inside mounting groove that holds module PCB installation that is equipped with of shell, module PCB can set up in the inside mounting groove of shell.

The shell is internally provided with a plurality of wire outlet holes, the lead wire lead parts are led out through the wire outlet holes and protrude out of the shell, the lead wire lead parts are arranged in the wire outlet holes, and the wire outlet holes can fix the lead wires, so that the lead wires and the side wall of the shell keep a certain distance.

In the utility model, the lead positions are arranged on the left side and the right side of the shell, but at least cannot be lower than 4 parts, and the upper end and the lower end of the two sides of the shell are required to be respectively provided with one lead position, so that the situation that the module PCB and the leads cannot horizontally contact is avoided.

The wire outlet hole department is equipped with the piece of moulding plastics, just the shell inside wall corresponds the piece of moulding plastics and is equipped with the side piece of moulding plastics, the lead wire includes the portion of bending, just the portion of bending sets up with moulding plastics and the side piece of moulding plastics mutually corresponding, and the portion of bending can be connected with moulding plastics and the side piece of moulding plastics, can greatly increased lead wire and the joint strength sense of shell.

One end of the bending part is connected with the pin part, the other end of the bending part is connected with the welding part, the bending part, the pin part and the welding part are of an integrated structure, and the sheet stamping technology is adopted, so that the conductivity and the structural strength of the lead can be greatly enhanced.

At least one anti-loosening groove is formed in the bending part, and the lead can be further connected with the plastic shell through the anti-loosening groove after injection molding, so that the anti-loosening and anti-loosening effects are achieved.

The module PCB lateral wall is equipped with a plurality of welded slots, the welded slot corresponds the setting with the welding portion each other, makes lead wire and module PCB can weld to the welding portion can increase the area of contact of pin and module PCB, has improved the welding steadiness of pin, and reduces the area in the lead wire occupy the microcircuit module, is favorable to improving module power density.

The welding groove carries out horizontal spacing to the welding portion, and the welding groove can control the welding portion and carry out spacingly, has improved the steadiness of whole structure, prevents that the welding portion from receiving external force to cause the damage, has strengthened the welding steadiness of lead wire and module PCB simultaneously.

Specifically, the transverse width of the welding part is smaller than that of the bending part, so that the welding part and the bending part are combined to form a fixed step, the fixed step longitudinally supports and limits the module PCB, the module PCB is fixed in height through the fixed step, the stability of the module PCB is further improved, and the module PCB can be in the same horizontal plane during installation.

Specifically, the welding part bottom symmetry is equipped with the hypotenuse, makes the welding part insert the welding groove more convenient accuracy, has improved production installation effectiveness.

Specifically, the bending part is of an L-shaped structural design, and the stable mounting of the welding groove arranged on the module PCB under different packaging conditions can be realized by adjusting the range of the L-shaped included angle of the bending part, so that the lead wire is firmly arranged in the welding groove.

Specifically, the bending part comprises a fixed block and a bending block, the included angle between the fixed block and the bending block is 90 degrees, the fixed block is connected with the pin part, the bending block is connected with the welding part, and the pin part, the fixed block, the bending block and the pin part are integrally formed, so that the conductivity and the structural strength of the lead can be greatly enhanced.

Specifically, the fixed block corresponds the setting with the piece of moulding plastics each other, just the piece of bending corresponds the setting with the side piece of moulding plastics each other, and the piece of moulding plastics through fixed block and the piece of moulding plastics of bending and side are moulded plastics integrative, can greatly increased lead wire and the shaping intensity of shell.

Specifically, the pin part is of a cylindrical hollow cavity structure and is arranged to be of a cylindrical hollow cavity structure, so that the pin part can be punched conveniently.

Specifically, the lead is of an integrated structure, the lead adopts a sheet stamping process, a hollow lead part with relatively uniform thickness is formed by stamping, a bending part is formed by bending a side plate of the lead part by 90 degrees, and finally, a welding part, a fixed step, a locking groove and a bevel edge are stamped and cut, so that the manufacturing process can be reduced, and the integrated lead is good in conductivity, high in strength and durable.

According to the utility model, a plating layer with uniform thickness can be arranged outside the lead according to the requirement, so that the lead part can be effectively protected from oxidation.

Working principle, this microcircuit module lead wire welding location structure:

firstly, processing a lead, namely, adopting a sheet stamping process, firstly forming a hollow lead part with relatively uniform thickness by stamping, bending a side plate of the lead part by 90 degrees to form a bending part, and finally stamping and cutting out a welding part, a fixed step, a locking groove and a bevel edge to finish the forming of the lead;

after the lead is molded, the lead is pre-buried with the plastic shell, namely, the lead is pre-placed in an injection mold, the position of the lead is fixed, then the mold injection molding operation is carried out, the lead can be integrally molded with the shell after injection molding, and the lead can be further connected with the plastic shell through an anti-loosening groove, so that the effects of anti-loosening and anti-loosening are achieved;

the side wall of the module PCB is grooved at the corresponding lead position, single side of 0.2mm is pre-placed according to the PCB machining tolerance in IPC-D-300 and the GB/T14486-2008 molding piece tolerance, the module PCB is reversely buckled in a mounting groove arranged in the module shell during welding, the plane height of the module PCB is limited by a fixing step of the lead, so that the module PCB is horizontally contacted with the lead, and at the moment, a welding part arranged on the lead is inserted into the welding groove and welded in the welding groove.

Finally, it should be noted that: the foregoing description is only illustrative of the preferred embodiments of the present utility model, and although the present utility model has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements or changes may be made without departing from the spirit and principles of the present utility model.

Claims (10)

1. The utility model provides a microcircuit module lead wire welding location structure, includes shell, module PCB and lead wire, its characterized in that:

the shell is internally provided with a mounting groove for accommodating the installation of a module PCB;

the shell is internally provided with a plurality of wire outlet holes, and the lead parts are led out through the wire outlet holes and protrude out of the shell;

an injection molding block is arranged at the wire outlet hole, and a side injection molding block is arranged on the inner side wall of the shell corresponding to the injection molding block;

the lead comprises a bending part, and the bending part, the injection molding block and the side injection molding block are arranged correspondingly;

one end of the bending part is connected with the pin part, and the other end of the bending part is connected with the welding part;

at least one anti-loosening groove is formed in the bending part;

the module PCB lateral wall is equipped with a plurality of welding grooves, welding groove and welding portion correspond each other and set up, just the welding groove carries out horizontal spacing to the welding portion.

2. The microcircuit module wire bonding positioning structure of claim 1, wherein: the transverse width of the welding part is smaller than that of the bending part, so that the welding part and the bending part are combined to form a fixed step.

3. The microcircuit module wire bonding positioning structure of claim 2, wherein: the fixed step longitudinally limits the module PCB.

4. The microcircuit module wire bonding positioning structure of claim 1, wherein: hypotenuse is symmetrically arranged at the bottom of the welding part.

5. The microcircuit module wire bonding positioning structure of claim 1, wherein: the bending part is of an L-shaped structural design.

6. The microcircuit module wire bonding positioning structure of claim 1, wherein: the bending part comprises a fixed block and a bending block, and the included angle between the fixed block and the bending block is 90 degrees.

7. The microcircuit module wire bonding positioning structure of claim 6, wherein: the fixed block and the injection molding block are arranged correspondingly, and the bending block and the side injection molding block are arranged correspondingly.

8. The microcircuit module wire bonding positioning structure of claim 6, wherein: the fixed block is connected with the pin part, and the bending block is connected with the welding part.

9. The microcircuit module wire bonding positioning structure of claim 1, wherein: the pin part is of a cylindrical hollow cavity structure.

10. The microcircuit module wire bonding positioning structure of claim 1, wherein: the lead is of an integrated structure.

Images