CN212751079U - Metal plate low-pass structure of ceramic dielectric filter - Google Patents

Abstract

The utility model relates to a ceramic dielectric filter's panel beating low pass structure, including shell, dielectric block and low pass piece, the dielectric block passes through the inserts integrated into one piece of moulding plastics with the low pass piece, reduces the assembly degree of difficulty and avoids the improper low pass piece that arouses to warp, the design has the rib on the surface of dielectric block, through the rib is realized spacing with the shell installation to leave out the deformation clearance between dielectric block and shell, have enough deformation space behind the assurance thermal energy, it has the shrinkage pool still to design respectively on the upper surface of dielectric block and the lower surface, the dielectric block is packed into in the shell, on the shell punch the bump form protruding with the shrinkage pool cooperation realizes the positioning to the dielectric block, prevents to produce relative motion under the heated condition, through above optimal design, has fully guaranteed the structure and the performance stability of panel beating low pass structure.

Description

Metal plate low-pass structure of ceramic dielectric filter

Technical Field

The utility model relates to the field of communication technology, concretely relates to ceramic dielectric filter's panel beating low pass structure.

Background

In 5G large-scale array antennas, ceramic dielectric filters are widely used. However, since the ceramic dielectric filter cannot meet the requirement of far-end suppression of the antenna, low-pass (LC) matching is usually required to meet the requirement of far-end suppression of the antenna, and the ceramic dielectric filter and the antenna are connected through an SMT patch of a PCB.

The sheet metal low-pass structure of the existing ceramic dielectric filter is shown in fig. 1-2 and comprises a shell, a dielectric block and a low-pass sheet, wherein the shell, the dielectric block and the low-pass sheet are independently installed, the low-pass sheet, the dielectric block and the shell are respectively of an independent structure, the low-pass sheet is firstly plugged into the dielectric block during assembly, then the dielectric block is clamped into the shell, and after the sheet metal low-pass structure is assembled, the sheet metal low-pass structure is welded on a PCB (printed Circuit Board) to realize.

When the metal plate low-pass structure is welded with a PCB board in an SMT mode, the welding temperature is about 260 ℃, wherein the shell is made of metal materials, and the dielectric block is made of plastic materials; because the difference between the thermal expansion coefficients of the shell and the internal medium is large, the deformation can creep along the direction of the angle of the drawing die when the reflow soldering temperature of 260 ℃ is continuously reached, and if the matching size of the product during processing is loose, the relative motion can be generated after the product is heated. As shown in fig. 3, the thermal deformation of one side of the housing may be separated from the PCB board, thereby risking failure and seriously affecting the performance of the low-pass structure.

SUMMERY OF THE UTILITY MODEL

To prior art's defect, the utility model aims to provide a ceramic dielectric filter's panel beating low pass structure through optimizing inner structure, increases the positioning structure, reserves the deformation clearance, and the dielectric block is moulded plastics the integration with the low pass piece, effectively improves the stability of panel beating low pass structure, prevents to weld the inefficacy that the deformation arouses when heating.

In order to achieve the above purpose, the utility model adopts the technical scheme that:

the utility model provides a ceramic dielectric filter's panel beating low pass structure, includes shell, dielectric block and low pass piece, shell and low pass piece are the metal material, the dielectric block is the plastic material, the dielectric block passes through the inserts integrated into one piece of moulding plastics with the low pass piece, the design has the rib on the surface of dielectric block, through the rib is realized spacing with the shell installation, the surface that dielectric block and low pass piece are parallel to each other has still the shrinkage pool on upper surface and the lower surface promptly respectively, the dielectric block is packed into in the shell, be provided with the orientation on the shell the arch of shrinkage pool, protruding with the shrinkage pool cooperation realizes the positioning to the dielectric block.

Specifically, the side face of the dielectric block facing the opening of the shell is not provided with the ribs, and the ribs on the other side faces of the dielectric block are arranged along the direction of the thickness center line of the dielectric block.

Two ribs are respectively arranged on the upper surface or the lower surface of the dielectric block in a bilateral symmetry mode, and the ribs on the upper surface and the ribs on the lower surface of the dielectric block are symmetrically arranged and communicated with each other at the side face of the dielectric block.

Specifically, the quantity of shrinkage pool is two on medium piece upper surface or the lower surface, the shrinkage pool sets up on the rib of corresponding surface.

Further, the top surface of shrinkage pool and the top surface parallel and level of rib, the bottom surface of shrinkage pool is less than the surface of the medium piece at shrinkage pool place.

The projections on the housing are formed by stamping after the dielectric block is installed in the housing.

The metal plate low-pass structure and the ceramic dielectric filter are respectively connected on the PCB through surface-mounted welding.

The utility model discloses having optimized the inner structure of panel beating low pass structure, having overcome the assembly deformation and the welding deformation problem of current low pass structure, effectively having guaranteed the stable performance of panel beating low pass structure, the concrete embodiment is following several aspects:

1. the low through piece is moulded plastics with the medium piece integration with the inserts mode, compares prior art with the low through piece insert medium piece's independent mounting means, can avoid the low through piece installation not hard up or the low through piece that assembly process misoperation caused warp.

2. The raised ribs are designed on the peripheral surface of the dielectric block, and during assembly, the ribs are installed in a matched mode with the inner surface of the shell, so that the contact area of the outer surface of the dielectric block and the shell is reduced, the requirement of limiting assembly of the shell is met, a high-temperature welding thermal expansion deformation gap is reserved, and a sufficient deformation space is ensured after the dielectric block is thermally expanded.

3. The concave hole design is added on the surface of the medium block, and after the medium block is loaded into the shell, the convex hull is punched out of the shell to be clamped into the concave hole of the medium block, so that the assembly positioning of the shell and the medium block is realized, and the relative motion between the shell and the medium block is prevented under the heating condition.

Through the above structure improvement, the utility model discloses can enough guarantee the cooperation stability of low logical piece and dielectric block, low pass piece is not hard up or warp when preventing assembly and welding, can guarantee the assembly stability between dielectric block and the shell again, considers the material coefficient of thermal expansion difference, has reserved the deformation clearance between shell and dielectric block, avoids the inefficacy problem that thermal expansion warp leads to among the welding heating process, has fully guaranteed the reliable performance of low pass structure.

Drawings

FIG. 1 is a schematic diagram of a prior art sheet metal low-pass structure;

FIG. 2 is an exploded view of a prior art sheet metal low-pass structure;

FIG. 3 is a schematic diagram of welding deformation of a sheet metal low-pass structure in the prior art;

fig. 4 is an exploded schematic view of the sheet metal low-pass structure of the present invention;

FIG. 5 is a schematic view of the integrated dielectric block low-pass sheet of the present invention;

fig. 6 is the utility model discloses panel beating low pass structure's assembly body schematic diagram.

Wherein FIG. 1 (b) is a sectional view taken along the line A-A of FIG. 1 (a), and FIG. 3 (a) is a sectional view taken along the line A of FIG. 3 (b); fig. 5 (a) is a sectional view taken along the direction B-B in fig. 5 (B), fig. 5 (C) is a perspective view of the integrated dielectric block low-pass sheet, fig. 6 (a) is a sectional view taken along the direction C-C in fig. 6 (B), D is a partially enlarged schematic view at D in fig. 6 (a), and fig. 6 (C) is a perspective view of a sheet metal low-pass structure.

Reference numerals: 1. the shell, 2, the dielectric block, 3, low logical piece, 4, PCB board, 5, the low logical piece of integration dielectric block, 6, rib, 7, shrinkage pool, 8, arch.

Detailed Description

The following description of the present invention in detail with reference to the accompanying drawings and the specific embodiments is to be understood that the present invention uses the terms of the directions such as up, down, left, right, etc. these directions are relative, and are used for combining the more clear description of the drawing, the technical solution of the present invention is not limited to the absolute directions of the structure of the present invention.

The sheet metal low-pass structure of the utility model is used for matching with the ceramic dielectric filter to meet the far-end inhibition requirement of the antenna, and the sheet metal low-pass structure and the ceramic dielectric filter are connected by being pasted on the PCB 4 through the SMT, as shown in fig. 4, the sheet metal low-pass structure includes a housing 1, a dielectric block 2 and a low-pass sheet 3, the housing 1 and the low-pass sheet 3 are made of metal, the dielectric block 2 is made of plastic, different from the prior art, the dielectric block 2 and the low-pass sheet 3 of the present invention are integrally formed by an injection molding and insert molding process, during the molding, preparing the low-pass sheet 2 in advance and placing the low-pass sheet into an injection mold, bonding and solidifying the molten material and the insert to finally obtain the integrated medium block low-pass sheet 5, manufacturing the low-pass sheet into the insert, on one hand, saving manual installation, reducing workload, due to the existence of machining tolerance, in the prior art, the form of independent assembly of the low-pass sheet can be loosened or too difficult to assemble, and the problem of assembly can be avoided when the insert is made; on the other hand, the deformation failure of the low pass sheet caused by assembly is prevented, the thickness of the low pass sheet is small, usually 0.5mm, the low pass sheet is easy to deform and the performance failure is easily caused by improper manual assembly operation.

As shown in fig. 5 is a schematic diagram of the integrated medium block low-pass piece, wherein fig. 5 (a) is a B-B direction cross-sectional view of fig. 5 (B), fig. 5 (c) is a three-dimensional view of the integrated medium block low-pass piece, and the problem of thermal deformation during welding of the sheet metal low-pass structure is solved, the utility model discloses a there is rib 6 on the surface of medium block 2, through rib 6 realizes spacing with the installation of shell 1, the surface that medium block 2 parallels with low-pass piece 3 is that there is shrinkage pool 7 on upper surface and the lower surface respectively, integrated medium block low-pass piece 5 is packed into when in the shell 1, be provided with protruding 8 towards the medium block on the shell 1, protruding 8 with shrinkage pool 7 cooperates, realizes the assembly positioning to medium block 2

Specifically, the surfaces of the dielectric block 2 except the surface facing the opening of the shell are provided with ribs 6, and the dielectric block 2 is matched with the shell 1 for limiting through the ribs 6; in one embodiment, the ribs 6 on the side surface of the dielectric block 2 are arranged along the direction of the thickness center line of the dielectric block 2, two ribs 6 are respectively arranged on the upper surface or the lower surface of the dielectric block 2 (the upper surface or the lower surface is parallel to the surface of the low pass sheet) in a bilateral symmetry manner, and the ribs 6 on the upper surface and the ribs 6 on the lower surface of the dielectric block 2 are symmetrically arranged and communicated at the side surface of the dielectric block 2.

The ribs 6 play a supporting role, the assembly limit of the dielectric block 2 and the shell 1 is realized, the contact area of the dielectric block 2 and the shell 1 is reduced by the design of the ribs 6, a sufficient gap is reserved between the dielectric block 2 and the shell 1, the thermal expansion deformation of the dielectric block is adapted, and in one embodiment, the linear expansion coefficient of the dielectric block at 260 ℃ is about 22.5 x 10^-5And when the length of the dielectric block is 18mm, the expansion amount at high temperature of 260 ℃ is Delta L =22.5 x 10^-518=0.04mm, and the linear expansion coefficient of the shell at 260 ℃ is 12.6 x 10^-6The length of the shell is 19mm, and the expansion amount at high temperature of 260 ℃ is Delta L₁=12.6*10^-619=0.003mm, and the dielectric block is spaced from the shell by 0.1mm on one side, so that enough thermal deformation space is reserved.

Specifically, as shown in the embodiment of fig. 5, 2 concave holes 7 are respectively reserved on the upper and lower surfaces of the dielectric block 2, in actual use, the number of the concave holes 7 is determined according to needs, is not limited to 2, and can be more than 2, the concave holes 7 are arranged on the ribs, the edges of the concave holes 7 are communicated with the ribs 6, the top surfaces of the concave holes 7 are flush with the top surfaces of the ribs 6, and the bottom surfaces of the concave holes 7 are lower than the outer surface of the dielectric block 2 where the concave holes 7 are located.

As shown in fig. 6, after the dielectric block 2 is loaded into the housing 1, the housing 1 is punched with the convex points to form the protrusions 8, and the protrusions 8 are clamped into the reserved concave holes 7, so that the integral assembly positioning is realized, and the relative motion is prevented under the heating condition.

When the metal plate low-pass structure and the ceramic dielectric filter are used for a 5G large-scale array antenna, the metal plate low-pass structure and the ceramic dielectric filter are respectively welded on the PCB 4 through surface mounting to realize connection, and through the structure optimization of the utility model, the dielectric block low-pass sheet is integrally injection-molded, so that the low-pass sheet is prevented from being independently installed and loosened or deformed due to improper assembly process; the surface of the dielectric block is provided with four concave holes, the shell is designed to be punched with convex packages, the concave holes of the dielectric block are clamped into the concave holes of the dielectric block to realize the fixation of the dielectric block and the shell, the relative motion between the dielectric block and the shell is prevented, ribs are arranged on the periphery of the surface of the dielectric block and are limited with the installation of the shell, a gap is reserved to ensure that a sufficient deformation space is reserved after high-temperature welding thermal expansion, and the failure caused by.

The above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above description in any form, and although the present invention has been disclosed with reference to the preferred embodiment, it is not limited to the present invention, and any skilled person in the art can make modifications or changes equivalent to the equivalent embodiment of the above embodiments without departing from the scope of the present invention.

Claims (7)

1. The utility model provides a ceramic dielectric filter's panel beating low pass structure, includes shell, dielectric block and low pass piece, shell and low pass piece are the metal material, the dielectric block is the plastic material, a serial communication port, the dielectric block is through the inserts integrated into one piece of moulding plastics with the low pass piece, the design has the rib on the surface of dielectric block, through the rib is realized spacing with the shell installation, the surface that dielectric block and low pass piece are parallel to each other has still the shrinkage pool on upper surface and the lower surface promptly respectively, the dielectric block is packed into in the shell, be provided with the orientation on the shell the arch of shrinkage pool, the arch with the shrinkage pool cooperation realizes the positioning to the dielectric block.

2. The sheet metal low-pass structure of a ceramic dielectric filter according to claim 1, wherein no rib is provided on a side surface of the dielectric block facing the opening of the case, and ribs on the remaining side surfaces of the dielectric block are provided along a thickness center line direction of the dielectric block.

3. The sheet metal low-pass structure of a ceramic dielectric filter according to claim 1, wherein two ribs are symmetrically arranged on the upper surface or the lower surface of the dielectric block left and right, respectively, and the ribs on the upper surface and the ribs on the lower surface of the dielectric block are symmetrically arranged and communicated with each other at the side surface of the dielectric block.

4. A sheet-metal low-pass structure of a ceramic dielectric filter according to claim 1, wherein the number of the concave holes on the upper surface or the lower surface of the dielectric block is two, and the concave holes are provided on the ribs of the corresponding surface.

5. A sheet metal low pass structure of a ceramic dielectric filter according to claim 1, wherein the top surface of the recess is flush with the top surface of the rib, and the bottom surface of the recess is lower than the outer surface of the dielectric block where the recess is located.

6. A sheet-metal low-pass structure of a ceramic dielectric filter as claimed in claim 1, wherein said projections on the housing are formed by stamping after the dielectric block is fitted into the housing.

7. The sheet metal low-pass structure of a ceramic dielectric filter according to claim 1, wherein the sheet metal low-pass structure and the ceramic dielectric filter are respectively connected by surface-mount welding on a PCB.

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