CN219042422U

CN219042422U - Control assembly and electronic equipment

Info

Publication number: CN219042422U
Application number: CN202223600999.2U
Authority: CN
Inventors: 韦林艳; 林炜彦
Original assignee: Wingtech Communication Co Ltd
Current assignee: Wingtech Communication Co Ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-05-16
Anticipated expiration: 2032-12-26

Abstract

The utility model discloses a control assembly and electronic equipment, the control assembly includes: a main board; the chip is arranged on one side of the main board and is electrically connected with the main board; the first shielding piece, first shielding piece set up in the mainboard deviates from one side of chip, first shielding piece with form first cavity between the mainboard, the edge of first shielding piece in the upper and lower direction with the chip corresponds and is provided with the chamfer. The first cavity of the control assembly can absorb impact, reduce the deformation of the main board, and improve the problem of main board desoldering of the control assembly under the ball falling working condition; the chamfer can increase the clearance between the first shielding piece and other elements, avoid interference between the first shielding piece and other elements, and improve the strain reliability of the control assembly.

Description

Control assembly and electronic equipment

Technical Field

The utility model relates to the technical field of electronic elements, in particular to a control assembly and electronic equipment.

Background

For wireless terminal equipment such as mobile phones, watches, TWS and the like, the geometrical parameters of the whole machine are pursued to be small and attractive in ID appearance, so that the whole machine is small in length and width, and especially the thickness is striven for lightness and thinness. However, the functions are required to be multiple, and the performance is superior, so that a large number of electronic components are required to be realized, and more radio frequency antenna devices and paired capacitance and inductance are added under the condition of spanning the communication technology, such as 4G to 5G. The stacked layout with poor structural reliability is difficult to avoid due to the small available layout space of the numerous electronic components.

In the related art, through opening holes in the corresponding positions of the shielding cases on the rear shell, the chip is prevented from being detached and the machine is prevented from being disabled, but the opening holes have limitations. Firstly, a critical bone position area of a shell material is not suitable for perforation, so that the shell material is easy to cause insufficient strength, and poor material monomer is caused; secondly, the rear shell opening converts the closed space of the main board into an open space, and the corrosion failure problem of components is easy to occur in the test link of the high-temperature high-humidity link. And the additional auxiliary materials can seal the holes, which has the cost problem.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model provides the control assembly, the first cavity can absorb impact, the deformation of the main board is reduced, and the problem of main board desoldering of the control assembly under the ball falling working condition is solved; the chamfer can increase the clearance between the first shielding piece and other elements, avoid interference between the first shielding piece and other elements, and improve the strain reliability of the control assembly.

The utility model further provides electronic equipment.

According to an embodiment of the first aspect of the present utility model, a control assembly comprises: a main board; the chip is arranged on one side of the main board and is electrically connected with the main board; the first shielding piece, first shielding piece set up in the mainboard deviates from one side of chip, first shielding piece with form first cavity between the mainboard, the edge of first shielding piece in the upper and lower direction with the chip corresponds and is provided with the chamfer.

According to the control assembly provided by the embodiment of the utility model, the first cavity can absorb impact, so that the deformation of the main board is reduced, and the problem of main board desoldering of the control assembly under the ball falling working condition is solved; the chamfer can increase the clearance between the first shielding piece and other elements, avoid interference between the first shielding piece and other elements, and improve the strain reliability of the control assembly.

According to a control assembly of an embodiment of the present utility model, the first shield includes: the first bottom wall, first lateral wall and first turn-ups, first lateral wall is connected first turn-ups with between the first bottom wall, the chamfer set up in first bottom wall with the junction of first lateral wall, first turn-ups with mainboard butt.

According to the control assembly of the embodiment of the utility model, the dimension of the chamfer is l, and l satisfies the relation: h is more than or equal to 0.4mm and less than or equal to 0.8mm.

According to a control assembly of an embodiment of the present utility model, the control assembly further comprises: the battery pack comprises a main board, a first shell and a battery cover, wherein the first shell is provided with one side, deviating from the main board, of the first shielding piece, a first accommodating groove is formed in the first shell, the first shielding piece is arranged in the first accommodating groove, and a battery accommodating space is defined between the first shell and the battery cover.

According to a control assembly of an embodiment of the present utility model, the control assembly further comprises: the second casing, the second casing is provided with the mainboard deviates from one side of first shield, be provided with the second holding tank on the second casing, the chip set up in the second holding tank.

According to the control assembly provided by the embodiment of the utility model, the second shell is provided with two supporting ribs, and the two supporting ribs correspond to the main board.

According to the control assembly provided by the embodiment of the utility model, in the up-down direction, the distance between at least one supporting rib and the main board is h, and h satisfies the relation: h is more than or equal to 0.2mm and less than or equal to 0.5mm.

According to a control assembly of an embodiment of the present utility model, the control assembly further comprises: the second shielding piece is arranged in the second accommodating groove, a second cavity is defined between the second shielding piece and the main board, and the chip is arranged in the second cavity.

According to a control assembly of an embodiment of the present utility model, the second shield includes: the second bottom wall, second lateral wall and second turn-ups, the second lateral wall is connected the second turn-ups with between the second bottom wall, the second turn-ups with mainboard butt is provided with on the second bottom wall and dodges the hole, in order to expose the chip.

An electronic device according to an embodiment of the second aspect of the present utility model includes: the control assembly.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic illustration of a control assembly according to an embodiment of the present utility model;

FIG. 2 is an exploded view of a control assembly according to an embodiment of the present utility model;

FIG. 3 is a partial cross-sectional view of a control assembly according to an embodiment of the present utility model;

FIG. 4 is a partial schematic view of FIG. 3;

FIG. 5 is a partial schematic view of FIG. 3;

FIG. 6 is a schematic view of a first angle of a first shield according to an embodiment of the utility model;

FIG. 7 is a schematic view of a second angle of the first shield according to an embodiment of the present utility model;

FIG. 8 is a schematic view of a first housing according to an embodiment of the utility model;

FIG. 9 is a schematic view of a second housing according to an embodiment of the utility model;

fig. 10 is a schematic diagram of a chip and a second shield according to an embodiment of the utility model.

Reference numerals:

100. a control assembly;

10. a main board;

20. a chip;

30. a first shield; 31. a first bottom wall; 32. a first sidewall; 33. a first flanging; 34. chamfering;

40. a first housing; 41. a first accommodation groove;

50. a battery cover;

60. a second housing; 61. a second accommodation groove; 62. a support rib;

70. a second shield; 71. a second bottom wall; 72. a second sidewall; 73. and a second flanging.

Detailed Description

Embodiments of the present utility model will be described in detail below, by way of example with reference to the accompanying drawings.

A control assembly 100 according to an embodiment of the present utility model is described below with reference to fig. 1 to 10, and a vehicle having the control assembly 100 is also provided.

As shown in connection with fig. 1-3, the control assembly 100 includes a motherboard 10, a chip 20, and a first shield 30. The chip 20 is disposed on one side of the motherboard 10 and electrically connected to the motherboard 10. Specifically, the chip 20 is disposed on a side of the main board 10 away from the first shielding member 30, and the chip 20 is fixedly connected with the main board 10, and may be welded, so that the chip 20 is electrically connected with the main board 10, and the normal function of the control assembly 100 is ensured.

The first shielding member 30 is disposed on a side of the main board 10 facing away from the chip 20, a first cavity 80 is formed between the first shielding member 30 and the main board 10, and edges of the first shielding member 30 correspond to the chip 20 in an up-down direction and are provided with chamfers 34. Specifically, the first shielding member 30 is located on one side of the main board 10 away from the chip 20, that is, the chip 20 and the first shielding member 30 are located on two sides of the main board 10, the first shielding member 30 is abutted against the main board 10, and a first cavity 80 is formed between the first shielding member 30 and the main board 10, when one side of the first shielding member 30 is impacted, the first cavity 80 can absorb impact, so that deformation of the main board 10 is reduced, and the device desoldering problem of the control assembly 100 under the ball falling working condition is effectively improved or solved.

As shown in fig. 5 to 7, the first shield 30 includes: first diapire 31, first side wall 32 and first turn-ups 33, first side wall 32 connect between first turn-ups 33 and first diapire 31, and chamfer 34 sets up in the junction of first diapire 31 and first side wall 32, and first turn-ups 33 and mainboard 10 butt. Specifically, the first shielding member 30 includes a first bottom wall 31, a first side wall 32 and a first flange 33, the first flange 33 is disposed on a peripheral side of the first shielding member 30, the first flange 33 abuts against the motherboard 10, so that the motherboard 10 is connected with the first shielding member 30, the first side wall 32 extends in an up-down direction, the first side wall 32 is connected with the first flange 33, the first bottom wall 31 is connected with the first side wall 32, that is, the first side wall 32 is connected between the first bottom wall 31 and the first flange 33, the chamfer 34 is located at a connection position of the first side wall 32 and the first bottom wall 31, and the chamfer 34 increases a gap between the first shielding member 30 and other components, so as to avoid interference between the first shielding member 30 and other components caused by a virtual position.

Therefore, the first cavity 80 can absorb impact, reduce deformation of the main board 10, and improve the problem of the main board 10 desoldering of the control assembly 100 under the ball falling working condition; the chamfer 34 may increase the clearance of the first shield 30 from other components, avoiding interference of the first shield 30 with other components, improving the strain reliability of the control assembly 100.

Referring to fig. 5, chamfer 34 has a dimension l that satisfies the relationship: h is more than or equal to 0.4mm and less than or equal to 0.8mm. Specifically, in the embodiment of the present utility model, the dimension l of the chamfer 34 is between 0.4mm and 0.8mm, and the dimension l of the chamfer 34 is smaller than the height of the first shielding member 30 in the up-down direction, so that the structural integrity of the first shielding member 30 is ensured while interference between the first shielding member 30 and other elements is avoided. In practice, the chamfer 34 may be sized to fit the actual internal height of the device to avoid bumping.

As shown in fig. 2 and 3, the control assembly 100 further includes: the battery pack comprises a first shell 40 and a battery cover 50, wherein the first shell 40 is provided with a side, away from the main board 10, of the first shielding piece 30, a first accommodating groove 41 is formed in the first shell 40, the first shielding piece 30 is arranged in the first accommodating groove 41, and a battery accommodating space is defined between the first shell 40 and the battery cover 50. Specifically, the control assembly 100 further includes a first housing 40 and a battery cover 50, the first housing 40 is located at a side of the first shielding member 30 facing away from the motherboard 10, the first housing 40 is located above the first shielding member 30 in an up-down direction, a first accommodating groove 41 is provided at a side of the first housing 40 facing the first shielding member 30, the first shielding member 30 is fitted in the first accommodating groove 41, the first housing 40 is disposed on the first shielding member 30, the motherboard 10 and the chip 20, and the first shielding member 30, the motherboard 10 and the chip 20 are isolated from the outside, so that the first shielding member 30, the motherboard 10 and the chip 20 are prevented from being damaged. In addition, the battery cover 50 is arranged on the first shell 40 in a covering manner, and under the ball falling working condition, the battery cover 50 can absorb more kinetic energy of the steel ball, so that deformation of the main board 10 is reduced.

As shown in connection with fig. 2, 3 and 9, the control assembly 100 further includes: the second housing 60, the second housing 60 is provided with a side of the main board 10 facing away from the first shielding member 30, the second housing 60 is provided with a second accommodating groove 61, and the chip 20 is disposed in the second accommodating groove 61. Specifically, the control assembly 100 further includes a second housing 60, the second housing 60 is located on a side of the main board 10 facing away from the first shielding member 30, a second accommodating groove 61 is provided on a side of the second housing 60 facing toward the main board 10, the chip 20 is fitted in the second accommodating groove 61, the second housing 60 provides an installation space for the chip 20, the second housing 60 is fixedly connected with the battery cover 50, the first shielding member 30, the main board 10 and the chip 20 are wrapped inside, and the second housing 60 and the battery cover 50 are connected with each other to form a whole.

As shown in fig. 9, the second housing 60 is provided with two support ribs 62, and the two support ribs 62 correspond to the main board 10. Specifically, the second housing 60 is provided with a supporting rib 62, the chip 20 is disposed between the two supporting ribs 62, and the supporting rib 62 provides a certain supporting force for the main board 10, so that the main board 10 does not press the chip 20. When the control assembly 100 is pressurized, the support ribs 62 can prevent the chip 20 from being pressed to cause the chip 20 to be not used normally.

As shown in fig. 4, in the up-down direction, the distance between the at least one support rib 62 and the main plate 10 is h, which satisfies the relationship: h is more than or equal to 0.2mm and less than or equal to 0.5mm. Specifically, there is a gap between at least one of the support ribs 62 and the main board 10, the distance between the upper end of at least one of the support ribs 62 and the lower end of the main board 10 is h, and h ranges from 0.2mm to 0.5mm, when the chamfer 34 is provided on the first shield 30, the local position of the first shield 30 is insufficient to protect the peripheral high devices on the same side, and the height of the support rib 62 on the same side is lowered to increase the distance between the support rib and the main board 10, thereby protecting the peripheral high devices.

As shown in connection with fig. 2, 3 and 10, the control assembly 100 further includes: the second shielding member 70, the second shielding member 70 is disposed in the second accommodating groove 61, a second cavity is defined between the second shielding member 70 and the motherboard 10, and the chip 20 is disposed in the second cavity. Specifically, a second shielding member 70 is further disposed in the control assembly 100, the second shielding member 70 is mounted in the second accommodating groove 61, the second shielding member 70 is fixedly connected with the second housing 60, the peripheral side of the second shielding member 70 is attached to the second accommodating groove 61, a second cavity is formed between the second shielding member 70 and the main board 10, the chip 20 is disposed in the second cavity, the peripheral side of the chip 20 is abutted against the second shielding member 70, and the second shielding member 70 protects the chip 20. And when the control assembly 100 receives an impact, the second shielding member 70 prevents the chip 20 from colliding with the second housing 60, resulting in damage to the chip 20 and thus damage to the function of the control assembly 100.

As shown in fig. 10, the second shield 70 includes: the second bottom wall 71, the second side wall 72 and the second turn-ups 73, the second side wall 72 is connected between the second turn-ups 73 and the second bottom wall 71, the second turn-ups 73 and the mainboard 10 butt, are provided with on the second bottom wall 71 and dodge the hole to expose the chip 20. Specifically, the second shielding member 70 includes a second bottom wall 71, a second side wall 72 and a second flange 73, the second side wall 72 extends in an up-down direction, one end of the second side wall 72 is connected to the second bottom wall 71, the other end of the second side wall 72 is connected to the second flange 73, that is, the second side wall 72 is connected between the second flange 73 and the second bottom wall 71, the second flange 73 is bent relative to the second side wall 72, the second flange 73 abuts against the motherboard 10, and the motherboard 10 is fixedly connected to the second shielding member 70 through the second flange 73, which may be welded. And, be provided with on the second diapire 71 and dodge the hole, expose chip 20, the heat dissipation of chip 20 of being convenient for.

An electronic device according to an embodiment of the second aspect of the present utility model includes: control assembly 100.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. A control assembly, comprising:

a main board (10);

a chip (20), wherein the chip (20) is arranged on one side of the main board (10) and is electrically connected with the main board (10);

the first shielding piece (30), the first shielding piece (30) set up in mainboard (10) deviate from one side of chip (20), first cavity (80) are formed between first shielding piece (30) and mainboard (10), the edge of first shielding piece (30) in upper and lower direction with chip (20) corresponds and is provided with chamfer (34).

2. The control assembly of claim 1, wherein the first shield (30) comprises: first diapire (31), first side wall (32) and first turn-ups (33), first side wall (32) are connected first turn-ups (33) with between first diapire (31), chamfer (34) set up in junction of first diapire (31) with first side wall (32), first turn-ups (33) with mainboard (10) butt.

3. The control assembly according to claim 1, characterized in that the chamfer (34) has a dimension l, l satisfying the relation: h is more than or equal to 0.4mm and less than or equal to 0.8mm.

4. The control assembly of claim 1, further comprising: the battery pack comprises a first shell (40) and a battery cover (50), wherein the first shell (40) is provided with a first shielding piece (30) which is away from one side of the main board (10), a first accommodating groove (41) is formed in the first shell (40), the first shielding piece (30) is arranged in the first accommodating groove (41), and a battery accommodating space is defined between the first shell (40) and the battery cover (50).

5. The control assembly of claim 1, further comprising: the second shell (60), second shell (60) are provided with mainboard (10) deviate from one side of first shield (30), be provided with second holding tank (61) on second shell (60), chip (20) set up in second holding tank (61).

6. The control assembly according to claim 5, characterized in that two support ribs (62) are provided on the second housing (60), the two support ribs (62) corresponding to the main plate (10).

7. The control assembly according to claim 6, wherein a distance between at least one of the support ribs (62) and the main plate (10) in the up-down direction is h, h satisfying the relation: h is more than or equal to 0.2mm and less than or equal to 0.5mm.

8. The control assembly of claim 5, further comprising: the second shielding piece (70), the second shielding piece (70) set up in second holding tank (61), second cavity is injectd between second shielding piece (70) and mainboard (10), chip (20) set up in the second cavity.

9. The control assembly of claim 8, wherein the second shield (70) comprises: the second bottom wall (71), second lateral wall (72) and second turn-ups (73), second lateral wall (72) are connected second turn-ups (73) with between second bottom wall (71), second turn-ups (73) with mainboard (10) butt, be provided with on second bottom wall (71) and dodge the hole, in order to expose chip (20).

10. An electronic device, comprising: the control assembly (100) of any of claims 1-9.