CN219046557U

CN219046557U - Control circuit board of anti-static-interference bone conduction earphone

Info

Publication number: CN219046557U
Application number: CN202223434339.1U
Authority: CN
Inventors: 颜以德; 蔡阳阳; 盖伟东
Original assignee: Dongguan Liesheng Electronic Co Ltd
Current assignee: Dongguan Liesheng Electronic Co Ltd
Priority date: 2022-12-20
Filing date: 2022-12-20
Publication date: 2023-05-19
Anticipated expiration: 2032-12-20

Abstract

The utility model discloses a control circuit board of an anti-static-interference bone conduction earphone, which is arranged in the bone conduction earphone and comprises: the circuit board comprises a circuit board body, at least one chip element, an antenna and a USB interface, wherein the chip element, the antenna and the USB interface are arranged on the circuit board body, and a wave absorbing plate with the magnetic permeability of 150-200u is attached to the surface of the at least one chip element. The circuit board body is provided with a notch capable of accommodating the USB interface, and the notch penetrates through the circuit board body front and back; the USB interface is arranged at the notch and comprises a shell made of plastic materials. The chip element serving as the sensitive device on the control circuit board is attached with the wave absorbing plate, and the wave absorbing plate can absorb not only the external electromagnetic wave energy, but also the nearby clutter signal energy and static electricity, so that the bone conduction earphone can smoothly pass the test in the static electricity test.

Description

Control circuit board of anti-static-interference bone conduction earphone

Technical field:

the utility model relates to the technical field of bone conduction headphones, in particular to a control circuit board of an anti-static-interference bone conduction headphone.

The background technology is as follows:

existing bone conduction headphones generally include: the earphone comprises two earphone bodies, two ear-hanging components connected with the earphone bodies and a rear-hanging component connected with the two ear-hanging components. The two ear-hook component shells in the bone conduction earphone are respectively used for installing a battery component and a control circuit component. The control circuit component mainly comprises a control circuit board provided with a Bluetooth main control chip, and a power line and a signal line are both connected to the control circuit board and serve as a main control core of the bone conduction earphone.

Various electronic components can be integrated on the control circuit board, wherein sensitive devices such as a Bluetooth main control chip and a memory chip are arranged, and when the sensitive devices work, the sensitive devices are easily interfered by surrounding devices, for example, when an antenna in the control circuit board is close to the Bluetooth main control chip, mutual interference exists between the Bluetooth main control chip and the antenna. The Bluetooth main control chip interferes with the antenna, so that the antenna is deteriorated and the performance is reduced; on the other hand, the antenna radiates electromagnetic waves to influence the Bluetooth main control chip, so that a large amount of energy is accumulated in a short time by the Bluetooth main control chip and is not released to the ground in time, and therefore, in the static test aiming at contact discharge +/-4 kV and air discharge +/-8 kV, the phenomenon of dead halt of the Bluetooth bone conduction earphone occurs, and the static test cannot pass. A USB interface (e.g. Type-C interface) is also disposed on the control circuit board, and the existing USB interface generally has a metal housing, which not only can be used as a connection element between the USB interface and the control circuit board, but also has an anti-interference shielding effect. However, the metal housing surface is prone to couple signal interference and the metal housing is prone to static electricity, which can cause sensitive devices around the metal housing to fail. Although the USB interface adopting the plastic shell can reduce the coupling signal and static electricity, the thickness of the USB interface adopting the plastic shell can be obviously increased in terms of structure and strength, and the USB interface is difficult to assemble in the bone conduction earphone shell with a narrow space.

In addition, in order to protect the sensitive device, a shielding cover can be directly added on the periphery of the sensitive device for protection, but the method can lead to increased product cost, has higher space requirements and is difficult to realize in a bone conduction earphone shell with a narrow space.

In view of the above, the present inventors have proposed the following technical solutions.

The utility model comprises the following steps:

the utility model aims to overcome the defects of the prior art and provide a control circuit board of an anti-static-interference bone conduction earphone.

In order to solve the technical problems, the utility model adopts the following technical scheme: a control circuit board of an antistatic bone conduction earphone, the control circuit board being mounted in the bone conduction earphone, the control circuit board comprising: the circuit board comprises a circuit board body, at least one chip element, an antenna and a USB interface, wherein the chip element, the antenna and the USB interface are arranged on the circuit board body, and a wave absorbing plate with the magnetic permeability of 150-200u is attached to the surface of the at least one chip element.

Further, in the above technical solution, the wave absorbing plate includes: the wave absorbing layer and the adhesive layer attached to the lower surface of the wave absorbing layer, wherein the thickness of the wave absorbing layer is 0.5mm.

Furthermore, in the above technical solution, the circuit board body is provided with a notch capable of accommodating the USB interface, and the notch penetrates through the circuit board body from front to back; the USB interface is arranged at the notch and comprises a shell made of plastic materials.

Furthermore, in the above technical scheme, the thickness of the USB interface is greater than the thickness of the circuit board body, and when the USB interface is mounted at the notch, the front and rear surfaces of the USB interface are both protruded from the front and rear surfaces of the circuit board body in the thickness direction.

In the above technical solution, the two sides of the housing are respectively extended with an ear plate parallel to the circuit board body, and the ear plates are formed with bumps along the direction perpendicular to the ear plates; the side walls of the two opposite sides of the notch are provided with clamping grooves corresponding to the convex blocks; during installation, the USB interface is installed at the notch, so that the lug plate is attached to the circuit board body, and the protruding block falls into the corresponding clamping groove.

In the above technical solution, the ear plate is disposed along or adjacent to a midline of two sides of the housing.

In the above technical solution, the outer edge of the ear plate is formed with an inwardly concave groove.

Furthermore, in the above technical solution, the chip element with the absorbing plate attached to the surface is adjacent to the USB interface.

Further, in the above-described aspect, the chip element having the absorbing plate attached to the surface thereof is adjacent to the antenna, and the antenna spans from above the chip element having the absorbing plate attached to the surface thereof.

By adopting the technical scheme, compared with the prior art, the utility model has the following beneficial effects:

1. the chip element serving as the sensitive device on the control circuit board is attached with the wave absorbing plate, and the wave absorbing plate can absorb not only the external electromagnetic wave energy, but also the nearby clutter signal energy and static electricity, so that the bone conduction earphone can smoothly pass the test in the static electricity test.

2. For the USB interface, the utility model adopts the plastic shell to reduce the possible damage of static electricity to surrounding chip elements. In order to solve the problems of the increase and the thickening of the USB interface caused by the adoption of the plastic shell, the utility model adopts a clamping installation mode, namely the UBS interface is not directly fixed on the surface of the circuit board body, but a notch is formed on the circuit board body and is used for accommodating the USB interface, so that the increase of the thickness of a product caused by the direct stacking installation mode is avoided, and the problem of smooth installation in a narrow space of the bone conduction earphone is realized.

Description of the drawings:

fig. 1 is a perspective view of a portion of a bone conduction headset in which a control circuit board is provided according to the present utility model;

FIG. 2 is a front view of a control circuit board of the present utility model;

FIG. 3 is a cross-sectional view of a chip element of the present utility model mated with a wave absorbing plate;

FIG. 4 is an exploded perspective view of the control circuit board and USB interface of the present utility model;

fig. 5 is a view from another perspective of fig. 4.

The specific embodiment is as follows:

the utility model will be further described with reference to specific examples and figures.

The utility model relates to a control circuit board of an anti-static-interference bone conduction earphone, which is generally arranged in the bone conduction earphone. See fig. 1, which is a perspective view of the application of the utility model in an ear-mounted bone conduction headset. The control circuit board 1 is arranged in an ear hook of the ear hook type bone conduction earphone, the ear hook is provided with a base 71 and a cover 72, and a cavity capable of accommodating the control circuit board 1 is formed by the base 71 and the cover 72.

As shown in fig. 2, the control circuit board 1 includes: the circuit board comprises a circuit board body 10 and at least one chip element, an antenna 3, a USB interface 4, a switching element 6 and other electronic devices arranged on the circuit board body 10. A plurality of chip elements, such as a bluetooth main control chip, a memory chip, etc., are usually disposed on the circuit board body 10, and these chip elements belong to sensitive devices, and are easily damaged due to interference of external electromagnetic signals and static electricity, so that the whole bone conduction headset is halted. Because of the small space, the control circuit board 1 has a limited area, and the antenna 3 spans over one of the chip elements 21 during installation. Electromagnetic waves radiated by the antenna 3 affect the chip element 21. In order to avoid this, the utility model attaches a layer of wave absorbing plate 5 to the surface of the chip element 21.

Referring to fig. 3, the wave absorbing plate 5 includes: the wave-absorbing layer 51 and the adhesive layer 52 attached to the lower surface of the wave-absorbing layer 51 are bonded to the surface of the chip element 21 through the adhesive layer 52. According to the test, the magnetic permeability of the wave absorbing plate 5 is best between 150 and 200u, and when the magnetic permeability is too low, the efficiency of the antenna 3 is reduced. In the utility model, the wave absorbing plate 5 with the magnetic permeability of 180u and the thickness of the wave absorbing layer of 0.5mm is preferable, and the absorption capacity is reduced due to the too small thickness of the wave absorbing layer.

Of course, the absorbing wave plate 5 may be attached not only to the chip element 21 adjacent to the antenna 3, but also to other sensitive devices. As shown in fig. 5, for example, the wave absorbing plate 5 may be attached to the surface of the chip element 23 at the rear surface of the circuit board body 10.

In addition, another chip element 22 is also provided at a position adjacent to the USB interface 4, and if the USB interface 4 is made of metal, static electricity generated by the USB interface case of the metal may damage the chip element 22 located nearby even if a wave absorbing plate is attached to the chip element 22. To overcome this problem, the USB interface 4 of the present utility model employs a plastic housing 40. Since the plastic housing 40 increases the volume and thickness of the entire USB interface 4, if the conventional stacking structure is still used, the mounting problem is not solved, and the following method is adopted to overcome the problem:

the circuit board body 10 is provided with a notch 11 which can accommodate the USB interface 4, the notch 11 penetrates through the circuit board body 10 from front to back, and the USB interface 4 is arranged at the notch 11. Since the thickness of the USB interface 4 using the plastic housing 40 is greater than the thickness of the circuit board body 10, when the USB interface 4 is mounted at the notch 11, the front and rear surfaces of the USB interface 4 are both protruded from the front and rear surfaces of the circuit board body 10 in the thickness direction of the USB interface 4. In this way, the USB interface 4 is directly mounted at the position of the notch 11 of the circuit board body 10, and the entire thickness at the position can be further reduced by accommodating the USB interface 4 through the notch 11.

Specifically, the two sides of the housing 40 are respectively extended with an ear plate 41 parallel to the circuit board body 10, and a bump 42 is formed on the ear plate 41 along the direction perpendicular to the ear plate 41; the side walls of the two opposite sides of the notch 11 are formed with a clamping groove 110 corresponding to the bump 42. During installation, the USB interface 4 is installed at the notch 11, so that the lug plate 41 is attached to the circuit board body 10, the protruding block 42 falls into the corresponding clamping groove 110, and the mutual positioning between the USB interface 4 and the circuit board body 10 is realized by forming a buckling connection between the protruding block 32 and the clamping groove 110. And then the terminal of the USB interface 4 is welded with the welding spot on the circuit board body 10 in a welding mode.

In order to reduce the overall thickness of the USB interface 4 at the location as much as possible, the ear plate 41 should be positioned along or adjacent to the midline of the housing 40 as much as possible. An inwardly recessed groove 410 is formed on the outer edge of the ear plate 41, and the groove 410 is used for facilitating clamping of the USB interface 4 by a tool, thereby facilitating automatic installation.

By adopting the technical scheme, the bone conduction earphone can not pass through the state from the original static test aiming at the contact discharge +/-4 kV and the air discharge +/-8 kV, and the static test of smoothly passing through the contact discharge +/-6 kV and the air discharge +/-8 kV is directly realized.

It is understood that the foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, but rather is to be accorded the full scope of all such modifications and equivalent structures, features and principles as set forth herein.

Claims

1. A control circuit board of an antistatic bone conduction earphone, the control circuit board being mounted in the bone conduction earphone, the control circuit board comprising: the circuit board body and set up at least one chip component, antenna, USB interface on the circuit board body, its characterized in that:

a wave absorbing plate with magnetic permeability of 150-200u is attached to the surface of at least one chip element.

2. The control circuit board of an anti-static-interference bone conduction headset of claim 1, wherein: the wave absorbing plate comprises: the wave absorbing layer and the adhesive layer attached to the lower surface of the wave absorbing layer, wherein the thickness of the wave absorbing layer is 0.5mm.

3. The control circuit board of an anti-static-interference bone conduction headset of claim 1, wherein: the circuit board body is provided with a notch capable of accommodating the USB interface, and the notch penetrates through the circuit board body front and back;

the USB interface is arranged at the notch and comprises a shell made of plastic materials.

4. The control circuit board of an anti-static-interference bone conduction headset according to claim 3, wherein: the thickness of the USB interface is larger than that of the circuit board body, and when the USB interface is arranged at the notch, the front surface and the rear surface of the USB interface are both prominent on the front surface and the rear surface of the circuit board body in the thickness direction of the USB interface.

5. The control circuit board of an anti-static-interference bone conduction headset according to claim 3, wherein: ear plates parallel to the circuit board body are respectively extended from two sides of the shell, and protruding blocks are formed on the ear plates along the direction perpendicular to the ear plates;

the side walls of the two opposite sides of the notch are provided with clamping grooves corresponding to the convex blocks;

during installation, the USB interface is installed at the notch, so that the lug plate is attached to the circuit board body, and the protruding block falls into the corresponding clamping groove.

6. The control circuit board of an anti-static-interference bone conduction headset of claim 5, wherein: the ear plates are arranged along the midline positions of the two sides of the shell or are adjacent to the midline positions.

7. The control circuit board of an anti-static-interference bone conduction headset of claim 5, wherein: the outer edge of the ear plate is provided with an inward concave groove.

8. The control circuit board of an anti-static bone conduction headset according to any one of claims 1-7, wherein: the chip element with the wave absorbing plate attached to the surface is adjacent to the USB interface.

9. The control circuit board of an anti-static bone conduction headset according to any one of claims 1-7, wherein: the chip element with the absorbing plate attached to the surface is adjacent to the antenna, and the antenna spans from above the chip element with the absorbing plate attached to the surface.