CN219025750U

CN219025750U - Pressing mechanism with semiconductor wire pin pressing-preventing limiting function

Info

Publication number: CN219025750U
Application number: CN202320043131.2U
Authority: CN
Inventors: 施锦源; 刘兴波; 曹国荣
Original assignee: Shenzhen Xinzhantong Electronics Co ltd
Current assignee: Shenzhen Xinzhantong Electronics Co ltd
Priority date: 2023-01-06
Filing date: 2023-01-06
Publication date: 2023-05-16
Anticipated expiration: 2033-01-06

Abstract

The application relates to a pushing mechanism with a semiconductor wire pin anti-pressing limiting function, and belongs to the technical field of semiconductor detection braids. In the related technical means, the rotating speed of the down-pressing motor is abnormal due to current overload in the circuit, so that the driving force of the material taking suction nozzle is unstable, and the material taking suction nozzle has the problem of impact bending on pins of a semiconductor device. The application provides a mechanism pushes down with semiconductor terminal prevents pressing spacing function, including mounting base, push down the motor, push down the liftout subassembly and push down spacing subassembly. The lower pressing motor drives the lower pressing material ejection assembly, the lower pressing material ejection assembly pushes the material taking suction nozzle to reciprocate up and down to absorb the semiconductor device, the lower pressing motor can cause abnormal rotating speed due to current overload in a circuit, so that the driving force of the material taking suction nozzle is unstable, the limiting arm limits the lowest stroke of the lower pressing material ejection assembly, and therefore the problem that the material taking suction nozzle impacts the surface of the semiconductor device and leads to pin bending of the semiconductor device is solved.

Description

Pressing mechanism with semiconductor wire pin pressing-preventing limiting function

Technical Field

The application relates to the technical field of semiconductor detection braids, in particular to a pressing mechanism with a semiconductor wire pin pressing-preventing limiting function.

Background

In the process of inspecting the braid of the semiconductor device, the semiconductor device is generally first mounted in a material tube, then the semiconductor device is grasped by using a tower type turntable manipulator and conveyed to an inspection device for electrical inspection so as to distinguish good products from defective products, and the good products are put into a braid mechanism for braid processing.

In the related art, a pressing motor is generally arranged above a tower type turntable manipulator, and a material taking suction nozzle is driven downward to be close to a semiconductor device by the pressing motor and is used for sucking and transferring, so that the transfer of the semiconductor device is completed for detection and taping.

Aiming at the technical means, the rotating speed of the down-pressing motor is abnormal due to current overload in the circuit, so that the driving force of the material taking suction nozzle is unstable, the material taking suction nozzle impacts the surface of the semiconductor device, and the problem that pins of the semiconductor device are bent exists, so that the use of the semiconductor device is affected.

Disclosure of Invention

In order to improve the yield of semiconductor devices in the transfer process, the application provides a pressing mechanism with a semiconductor wire pin pressing prevention limiting function.

The application provides a pushing down mechanism with semiconductor wire foot prevents pressing limit function adopts following technical scheme.

The utility model provides a push down mechanism with semiconductor wire foot prevents pressing spacing function, includes mounting base, pushes down the motor, pushes down the liftout subassembly and pushes down spacing subassembly, the motor that pushes down in mounting base upper surface, push down the liftout subassembly set up in mounting base lower surface, the motor drive pushes down the liftout subassembly, pushes down the liftout subassembly and is used for promoting and gets the reciprocal motion about the material suction nozzle in order to absorb the semiconductor device, push down spacing subassembly set up in mounting base side, push down spacing subassembly including spacing arm, be used for limiting push down the minimum stroke of liftout subassembly.

Through adopting above-mentioned technical scheme, pushing down the material subassembly that pushes down by the motor drive, pushing down the material subassembly that pushes down again and getting the material suction nozzle up-and-down reciprocating motion in order to absorb the semiconductor device, pushing down the motor and can lead to the rotational speed unusual because of electric current overload in the circuit to lead to getting the driving force of material suction nozzle unstable, spacing arm restriction pushes down the minimum stroke of material subassembly, thereby improves and gets the material suction nozzle and lead to the fact the impact to the semiconductor device surface, leads to the problem that the pin of semiconductor device buckled.

Optionally, the pushing down liftout subassembly include liftout fixed plate and vertical slip set up in the liftout head of liftout fixed plate side, the motor drive that pushes down the liftout head motion, the liftout head side has liftout spacing portion, spacing arm is in the minimum stroke position of liftout spacing portion with the spacing portion of liftout forms the stopper.

Through adopting above-mentioned technical scheme, the liftout head slides and sets up in the side of liftout fixed plate, through setting up liftout spacing portion in the side of liftout head to make spacing arm can directly block with the spacing portion of liftout, spacing arm is in the spacing position of the minimum stroke of spacing portion of liftout and the spacing portion formation of liftout and block, thereby guarantees that the structure of liftout head is compacter, improves space utilization.

Optionally, the pressing limiting component further includes a fixing arm, the fixing arm is disposed on a side surface of the mounting base, and the fixing arm is detachably connected with the limiting arm.

Through adopting above-mentioned technical scheme, the fixed arm sets up in mounting base's side and can dismantle with the spacing arm simultaneously and be connected to make spacing arm can extend to the side of top stub bar, simultaneously, guarantee that spacing arm can dismantle fast, improve spacing arm's maintenance convenience.

Optionally, the spacing arm includes installation department, blocking portion and sets up the triangle connecting portion between the two, installation department with the fixed arm can dismantle the connection.

Through adopting above-mentioned technical scheme, triangle connecting portion sets up between installation department and blocking portion, and the whole rigidity of spacing arm can be strengthened to triangle connecting portion to guarantee at the in-process of liftout head impact blocking portion, triangle connecting portion can not take place to warp.

Optionally, a sliding groove is formed in a side face of the fixing arm and is used for accommodating the mounting portion, and the groove width of the sliding groove is equal to the width of the mounting portion.

Through adopting above-mentioned technical scheme, the groove of sliding can holding installation department, simultaneously, because the width of installation department equals the width of groove of sliding, consequently the lateral wall of groove of sliding can be spacing to the lateral wall formation of installation department, improves the installation stability of spacing arm.

Optionally, the mounting portion is provided with a kidney-shaped adjusting hole, and the length direction of the kidney-shaped adjusting hole is the same as the length direction of the sliding groove.

Through adopting above-mentioned technical scheme, waist shape regulation hole can be in the position of vertical direction regulation spacing arm to ensure that spacing arm can in time adjust after the position changes, further improve spacing arm's stability.

Optionally, the side of liftout fixed plate is vertical to be provided with the linear slide rail, it is provided with the linear slide block to slide on the linear slide rail, the liftout head fixed set up in the linear slide block.

Through adopting above-mentioned technical scheme, be fixed in the straight line slider with the liftout head on, because the slip between straight line slider and the straight line slide rail is more stable, consequently guarantee that the liftout head is more stable in the up-and-down reciprocating motion's in-process.

Optionally, a reset spring is arranged between the material ejection head and the material ejection fixing plate.

Through adopting above-mentioned technical scheme, reset spring can be after pushing down motor drive top stub bar moves down automatic with the top stub bar resets to guarantee that the top stub bar can in time reset, thereby be convenient for the transportation of semiconductor device.

In summary, the present application includes at least one of the following beneficial technical effects:

1. the yield is high. The lower pressing motor drives the lower pressing material ejection assembly, the lower pressing material ejection assembly pushes the material taking suction nozzle to reciprocate up and down to absorb the semiconductor device, the lower pressing motor can cause abnormal rotating speed due to current overload in a circuit, so that the driving force of the material taking suction nozzle is unstable, the limiting arm limits the lowest stroke of the lower pressing material ejection assembly, and therefore the problem that the material taking suction nozzle impacts the surface of the semiconductor device and leads to pin bending of the semiconductor device is solved.

2. The stability is high. The triangle connecting portion is arranged between the mounting portion and the blocking portion, and the whole rigidity of the limiting arm can be enhanced through the triangle connecting portion, so that deformation of the triangle connecting portion can be avoided in the process that the ejector head impacts the blocking portion. The sliding groove can accommodate the installation part, and the width of the installation part is equal to that of the sliding groove, so that the side wall of the sliding groove can limit the side wall of the installation part, and the installation stability of the limiting arm is improved.

3. The space utilization is high. The ejector head slides and sets up in the side of ejector fixing plate, through set up ejector spacing portion in the side of ejector head to make spacing arm can directly block with ejector spacing portion, spacing arm forms with ejector spacing portion at the minimum stroke position of ejector spacing portion and blocks, thereby guarantees that the structure of ejector head is compacter.

Drawings

Fig. 1 is a schematic diagram illustrating an overall structure of a pressing mechanism according to an embodiment of the present application;

FIG. 2 is a schematic diagram illustrating an overall structure of a pressing limiting assembly according to an embodiment of the present disclosure;

fig. 3 is a schematic diagram illustrating an overall structure of a pressing down and ejecting assembly according to an embodiment of the present application.

Reference numerals illustrate:

100. a mounting base; 110. a mounting block; 120. a mounting table; 200. depressing the motor; 300. pressing down the material ejection assembly; 310. a jacking fixed plate; 311. a linear slide rail; 312. a linear slide; 320. a material ejecting head; 321. a material ejection limiting part; 322. a pushing head; 330. a return spring; 400. pressing down the limiting component; 410. a fixed arm; 411. a slip groove; 420. a limiting arm; 421. a mounting part; 4211. waist-shaped adjusting holes; 422. a blocking portion; 423. and a triangle connecting part.

Detailed Description

The present application is described in further detail below with reference to the accompanying drawings.

The embodiment of the application discloses a pushing mechanism with a semiconductor wire pin anti-pressing limiting function.

Referring to fig. 1, a pressing mechanism with a semiconductor pin pressing prevention and limiting function includes a mounting base 100, a pressing motor 200, a pressing and material ejection assembly 300, and a pressing and limiting assembly 400. The pressing motor 200 and the pressing and jacking assembly 300 are respectively installed on the upper and lower surfaces of the installation base 100, the pressing limit assembly 400 is arranged on the side surface of the installation base 100, and the pressing motor 200 drives the pressing and jacking assembly 300, so that the pressing and jacking assembly 300 pushes the material taking suction nozzle to reciprocate up and down to suck the semiconductor device.

Referring to fig. 1, the mounting base 100 includes a mounting block 110 for mounting the push-down motor 200 and a mounting stage 120 for mounting the push-down limit assembly 400, the mounting stage 120 being located at a rear side of the mounting block 110. Specifically, referring to fig. 2, the pressing down ejector assembly 300 includes an ejector fixing plate 310, an ejector head 320, and a return spring 330. The ejector fixing plate 310 is fixed to the lower end face of the mounting block 110, and a linear sliding rail 311 is disposed on a side face of the ejector fixing plate 310, and a mounting direction of the linear sliding rail 311 is a vertical direction. The linear sliding rail 311 is slidably provided with a linear sliding block 312, and the ejector 320 is fixedly disposed on the linear sliding block 312. Since the sliding between the linear slider 312 and the linear slide rail 311 is more stable, the ejector head 320 is ensured to be more stable in the up-and-down reciprocating process. The pushing head 322 is made of an elastic material, and in this embodiment, the pushing head 322 is made of a soft rubber, so as to play a role in buffering.

Referring to fig. 2, the return spring 330 is a tension spring, one end of the return spring is fixed at the top end of the linear slider 312, the other end of the return spring is fixed at the top end of the top end 320, and the return spring 330 can automatically reset the top end 320 after the push-down motor 200 drives the top end 320 to move downwards, so that the top end 320 is ensured to reset in time, and the transfer of the semiconductor device is facilitated.

Referring to fig. 1 and 2, the ejector head 320 has an ejector limiting portion 321 on a side surface thereof, and the ejector limiting portion 321 is provided in a stepped manner. The pressing limiting assembly 400 comprises a fixing arm 410 and a limiting arm 420, the fixing arm 410 is fixed on the upper surface of the mounting table 120 through a bolt, the limiting arm 420 and the fixing arm 410 are detachably connected through the bolt, and the limiting arm 420 forms a blocking with the jacking limiting portion 321 at the lowest stroke position of the jacking limiting portion 321. The pressing motor 200 drives the pressing and jacking assembly 300, the pressing and jacking assembly 300 pushes the material taking nozzle to reciprocate up and down to absorb the semiconductor device, when the pressing motor 200 is abnormal in rotating speed due to current overload in a circuit, the driving force of the material taking nozzle is unstable, the limiting arm 420 limits the lowest stroke of the pressing and jacking assembly 300, and therefore the problem that the material taking nozzle impacts the surface of the semiconductor device and leads to pin bending of the semiconductor device is solved.

Referring to fig. 1 and 3, in detail, the fixing arm 410 is generally provided in an "L" shape and one end is fixed to the mounting table 120 by a bolt, and a side surface of the other end of the fixing arm 410 is provided with a sliding slot 411 for mounting the limiting arm 420. The limiting arm 420 is generally L-shaped and includes a mounting portion 421, a blocking portion 422, and a triangular connecting portion 423 disposed therebetween. The triangular connection portion 423 can strengthen the overall rigidity of the limiting arm 420, thereby ensuring that the triangular connection portion 423 is not deformed in the process of the ejector head 320 impacting the blocking portion 422. The mounting portion 421 is disposed in the sliding portion 411, and the slot width of the sliding portion 411 is equal to the width of the mounting portion 421, so that the side wall of the sliding portion 411 can limit the side wall of the mounting portion 421, thereby improving the mounting stability of the limiting arm 420.

Referring to fig. 3, in order to ensure that the position of the stopper arm 420 can be adjusted in time after the position is changed, the mounting portion 421 is provided with a kidney-shaped adjustment hole 4211, and the length direction of the kidney-shaped adjustment hole 4211 is the same as the length direction of the sliding slot 411. In this embodiment, two kidney-shaped adjusting holes 4211 are arranged side by side, and the position of the limiting arm 420 can be adjusted in the vertical direction by locking bolts in the kidney-shaped adjusting holes 4211, so that the limiting arm 420 can be adjusted in time after the position of the limiting arm 420 is changed, and the stability of the limiting arm 420 is further improved.

The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way. Wherein like parts are designated by like reference numerals. It should be noted that the words "front", "back", "left", "right", "upper" and "lower" used in the above description refer to directions in the drawings, and the words "inner" and "outer" refer to directions toward or away from, respectively, the geometric center of a particular component. Therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims

1. The utility model provides a push down mechanism with spacing function is prevented pressing by semiconductor terminal, its characterized in that includes mounting base (100), pushes down motor (200), pushes down liftout subassembly (300) and pushes down spacing subassembly (400), push down motor (200) set up in mounting base (100) upper surface, push down liftout subassembly (300) set up in mounting base (100) lower surface, push down motor (200) drive push down liftout subassembly (300), push down liftout subassembly (300) are used for promoting and get the material suction nozzle up-and-down reciprocating motion in order to absorb the semiconductor device, push down spacing subassembly (400) set up in mounting base (100) side, push down spacing subassembly (400) include spacing arm (420), be used for the restriction push down the minimum stroke of liftout subassembly (300).

2. The pressing mechanism with the semiconductor wire pin pressing prevention limiting function according to claim 1, wherein the pressing and pushing assembly (300) comprises a pushing fixed plate (310) and a pushing head (320) vertically sliding on the side edge of the pushing fixed plate (310), the pressing motor (200) drives the pushing head (320) to move, a pushing limiting part (321) is arranged on the side surface of the pushing head (320), and the limiting arm (420) forms a blocking with the pushing limiting part (321) at the lowest stroke position of the pushing limiting part (321).

3. The pressing mechanism with the semiconductor-terminal pressing prevention limiting function according to claim 2, wherein the pressing limiting assembly (400) further comprises a fixing arm (410), the fixing arm (410) is disposed on the side surface of the mounting base (100), and the fixing arm (410) is detachably connected with the limiting arm (420).

4. A pressing mechanism with a semiconductor-terminal-pressing prevention limit function according to claim 3, wherein the limit arm (420) includes a mounting portion (421), a blocking portion (422), and a triangular connecting portion (423) provided therebetween, the mounting portion (421) being detachably connected with the fixed arm (410).

5. The pressing mechanism with the semiconductor pin pressing prevention limit function according to claim 4, wherein a sliding groove (411) is provided on a side surface of the fixed arm (410) for accommodating the mounting portion (421), and a groove width of the sliding groove (411) is equal to a width of the mounting portion (421).

6. The pressing mechanism with the semiconductor stitch pressure prevention limit function as recited in claim 5, wherein the mounting portion (421) is provided with a kidney-shaped adjustment hole (4211), and a length direction of the kidney-shaped adjustment hole (4211) is the same as a length direction of the sliding slot (411).

7. The pressing mechanism with the semiconductor wire pin pressing prevention limiting function according to claim 2, wherein a linear sliding rail (311) is vertically arranged on the side face of the material ejection fixing plate (310), a linear sliding block (312) is slidably arranged on the linear sliding rail (311), and the material ejection head (320) is fixedly arranged on the linear sliding block (312).

8. The pressing mechanism with the semiconductor pin pressing prevention limiting function according to claim 7, wherein a return spring (330) is arranged between the ejector head (320) and the ejector fixing plate (310).