CN219010494U

CN219010494U - Electroplating annealing equipment for chip surface

Info

Publication number: CN219010494U
Application number: CN202223251897.4U
Authority: CN
Inventors: 施振潮
Original assignee: Guangdong Kehui Semiconductor Co ltd
Current assignee: Guangdong Kehui Semiconductor Co ltd
Priority date: 2022-12-01
Filing date: 2022-12-01
Publication date: 2023-05-12
Anticipated expiration: 2032-12-01

Abstract

The utility model relates to the technical field of semiconductor packaging equipment, in particular to electroplating annealing equipment for the surface of a chip; the chip baking oven comprises an oven body, a chip placing jig and a discharging conveyor, wherein a feed inlet is formed in the lower end of the front side surface of the oven body, a discharge outlet is formed in the upper end of the rear side surface of the oven body, sealing cover plates are rotationally connected to the feed inlet and the discharge outlet, the discharging conveyor is connected with the outer end of the discharge outlet, a conveying mechanism for conveying the chip placing jig upwards layer by layer and a heating unit for baking a chip electroplated layer are arranged in the oven body, and a discharging pushing unit aligned with the discharge outlet is arranged at the upper end of the oven body; the electroplating annealing equipment realizes the flow baking annealing of the electroplated layer of the chip, greatly improves the annealing treatment efficiency of the electroplated layer on the surface of the chip, has no excessive heat loss in the whole process, and has certain energy-saving and environment-friendly effects.

Description

Electroplating annealing equipment for chip surface

Technical Field

The utility model relates to the technical field of semiconductor packaging equipment, in particular to electroplating annealing equipment for the surface of a chip.

Background

A plating layer is required to be plated on the base frame of the loadframe during the chip packaging process to prevent the influence of external environment (moisture and heat). After the chip is electroplated, the chip is sent into annealing equipment to be annealed at 125+/-5 ℃.

At present, the existing annealing equipment for a chip electroplated layer is a baking oven with a baking function, an operator is required to open a door of the baking oven to send the jig with the plated chips arranged therein in the annealing process, then the door is closed, an internal heating device is started to raise the temperature to a set temperature for a period of time for annealing, and the door is required to be opened again to take out the jig after the annealing is completed. The whole annealing process is serious in heat energy waste caused by opening and closing of the box door, and feeding are needed manually or by means of a mechanical arm each time, so that the efficiency of the whole annealing process is low. Based on this, the application proposes an electroplating annealing device for chip surfaces, which can effectively solve the above technical problems.

Disclosure of Invention

The utility model aims to provide electroplating annealing equipment for the surface of a chip, so as to solve the defects of the existing baking box type annealing equipment.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

the electroplating annealing equipment for the surface of the chip comprises an oven body, a chip placing jig and a discharge conveyor, wherein a feed inlet is formed in the lower end of the front side surface of the oven body, a discharge outlet is formed in the upper end of the rear side surface of the oven body, sealing cover plates are respectively and rotatably connected to the feed inlet and the discharge outlet, and the discharge conveyor is connected with the outer end of the discharge outlet;

the chip plating device is characterized in that a conveying mechanism for conveying the chip placing jig upwards layer by layer and a heating unit for baking the chip plating layer are arranged in the baking box body, and a discharging pushing unit aligned with the discharging hole is arranged at the upper end of the baking box body.

Compared with the prior art, the utility model has the beneficial effects that:

1. when the electroplating annealing equipment provided by the utility model is used for annealing the chip electroplated layer, the chip placing jig loaded with the chip is fed in from the feed inlet step by step, then is fed out from the discharge outlet, and then the chip is conveyed from bottom to top to finish annealing treatment.

2. According to the electroplating annealing equipment, the baking box body does not need to open the whole box door in the feeding and discharging process, only the corresponding small-area sealing cover plates on the corresponding feeding port and the corresponding discharging port are required to be opened, excessive heat loss does not occur in the whole process, and certain energy-saving and environment-friendly effects are achieved.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the drawings used for describing the embodiments will be briefly described below.

FIG. 1 is a first perspective assembly view of the present utility model;

FIG. 2 is a second perspective assembly view of the present utility model;

FIG. 3 is a schematic perspective view of the interior of the baking oven according to the present utility model;

fig. 4 is a perspective view of a conveyor mechanism according to the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Example 1

Embodiment 1 discloses a electroplate annealing equipment for chip surface, referring to fig. 1, the main body of the electroplate annealing equipment comprises a baking oven body 1, a chip placing jig 2 and a discharging conveyor 3. A feed inlet is formed in the lower end of the front side surface of the baking box body 1, a discharge outlet is formed in the upper end of the rear side surface of the baking box body 1, and a sealing cover plate 101 is rotatably connected to the feed inlet and the discharge outlet in order to prevent heat in the inner cavity of the box body from being emitted. The sealing cover plates 101 on the feeding port and the discharging port are all arranged in an outward opening type rotary connection mode, so that the sealing cover plates 101 can be opened outwards. Meanwhile, a telescopic driving piece 7 is connected to the baking box 1 above the feed inlet, a hydraulic telescopic rod can be selected as a specific telescopic driving piece 7, and the lower end of the hydraulic telescopic rod is rotationally connected with a sealing cover plate 101 on the feed inlet. When annealing the electroplated chip, the sealing cover plate 101 at the feed inlet is opened by the action of the telescopic driving piece 7, then the chip placing jig 2 is fed into the baking box body 1 through the feed inlet, and the annealed chip is communicated with the chip placing jig 2 from the discharge outlet and is sent out together.

In order to realize the automatic delivery of the baked chip placing jig 2, a discharging conveyor 3 is connected with the outer end of a discharging hole, and a discharging pushing unit 6 aligned with the discharging hole is arranged at the upper end of the baking oven body 1. The specific discharging pushing unit 6 comprises a bracket 601 fixed on the front side surface of the oven body 1, a telescopic pushing piece 602 is arranged on the bracket 601, an air cylinder or a hydraulic cylinder can be selected as the telescopic pushing piece 602, and a pushing plate (not shown in the figure) is connected to the end part of the telescopic pushing piece 602 extending into the inner cavity of the oven body 1. The outfeed conveyor 3 comprises a conveyor frame 301, the conveyor frame 301 being provided with a row of conveyor rollers 302 horizontally aligned with the outfeed opening. The pushing action of the telescopic pushing piece 602 can push the chip placing jig 2 to the discharge hole, then the sealing cover plate 101 is automatically opened, and the chip placing jig 2 falls on the conveying roller 302 after being sent out from the discharge hole and is conveyed by the conveying roller 302.

A conveying mechanism 4 for conveying the chip placing jig 2 upwards layer by layer and a heating unit 5 for baking the chip electroplated layer are arranged in the baking box body 1. The specific conveying mechanism 4 comprises two conveying boxes 401 arranged on the left side surface and the right side surface of the oven body 1, driving wheels 402 are connected to the upper end and the lower end of each conveying box 401 through rotating shafts 405, motors 406 for driving the rotating shafts 405 are arranged on the outer side surfaces of the conveying boxes 401, closed-loop conveying members 403 are connected between the upper driving wheels 402 and the lower driving wheels 402, and the upper end and the lower end of each closed-loop conveying member 403 are respectively arranged corresponding to the heights of a discharge port and a feed port. The driving wheel 402 and the closed-loop conveying member 403 in the conveying mechanism 4 have two designs, one selects a sprocket and a conveying chain as a conveying main body, the other selects a belt pulley and a conveying belt as a conveying main body, and no matter which technical scheme is selected, the motor 406 preferably selects a servo motor or a stepping motor, so that the conveying distance of each closed-loop conveying member 403 can be accurately controlled.

In addition, a plurality of positioning rails 404 are connected to the outer side surface of the closed-loop conveying member 403 at equal intervals, and the left and right ends of the chip placement jig 2 are arranged in a matching manner with the positioning rails 404. The chip placing jig 2 can be fed from a feed inlet and inserted between two positioning rails 404 at the lowest end for fixing in the running process of the device, and then can be conveyed from bottom to top under the action of a closed-loop conveying piece 403.

Finally, the heating unit 5 in this embodiment may be a conventional resistance heating device, and two resistance heating devices are provided, and then both resistance heating devices are provided on the front and rear inner walls of the oven body 1.

The specific operation steps and working principles of the electroplating annealing equipment disclosed in this embodiment 1 are as follows:

before the device carries out annealing treatment on the chip electroplated layer, the heating unit 5 is started to preheat the inside of the baking oven body 1, then the sealing cover plate 101 on the feeding hole is quickly opened through the telescopic driving piece 7, then the chip placing jig 2 with the electroplated layer chip is inserted into the baking oven body 1 from the feeding hole, and at the moment, the left end and the right end of the chip placing jig 2 can be smoothly inserted into the two positioning rails 404 at the bottommost end.

Then, by controlling the motor 406 to rotate a certain angle, the closed-loop conveying member 403 drives the chip placing jig 2 to convey upwards under the driving of the motor 406, and the positioning rail 404 at the lowest end can repeat the above steps and insert a chip placing jig 2 with electroplated chips until the conveying mechanism 4 is fully inserted with the chip placing jig 2.

In the process that the chip placing jig 2 is conveyed upwards along with the closed-loop conveying member 403 layer by layer, annealing treatment can be performed at the internal high temperature, when the chip placing jig 2 is conveyed to be aligned with the discharge hole, the discharge pushing unit 6 is started at this time to push the chip placing jig 2 out of the discharge hole, and after the chip placing jig 2 completely extends out of the discharge hole, the sealing cover plate 101 on the discharge hole can be automatically closed under the action of gravity, and the sent chip placing jig 2 is conveyed to the next procedure by the discharge conveyor 3 for processing treatment.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The electroplating annealing equipment for the chip surface is characterized by comprising a baking oven body (1), a chip placing jig (2) and a discharge conveyor (3), wherein a feed inlet is formed in the lower end of the front side surface of the baking oven body (1), a discharge outlet is formed in the upper end of the rear side surface of the baking oven body, sealing cover plates (101) are rotationally connected to the feed inlet and the discharge outlet, and the discharge conveyor (3) is connected with the outer end of the discharge outlet;

the chip-placing and drying device is characterized in that a conveying mechanism (4) for conveying the chip-placing jig (2) upwards layer by layer and a heating unit (5) for drying a chip electroplated layer are arranged in the drying oven body (1), and a discharging pushing unit (6) aligned with a discharging hole is arranged at the upper end of the drying oven body (1).

2. A plating annealing apparatus for a chip surface according to claim 1, wherein: the conveying mechanism (4) comprises two conveying boxes (401) arranged on the left side surface and the right side surface of the oven body (1), each conveying box (401) is connected with a driving wheel (402) through a rotating shaft (405), the outer side surfaces of the conveying boxes (401) are provided with motors (406) used for driving the rotating shafts (405), closed-loop conveying members (403) are connected between the upper groups of driving wheels (402) and the lower groups of driving wheels (402), the upper ends and the lower ends of the closed-loop conveying members (403) are respectively arranged corresponding to the heights of a discharge hole and a feed inlet, a plurality of positioning rails (404) are connected to the outer side surfaces of the closed-loop conveying members (403) at equal intervals, and the left ends and the right ends of the chip placing jig (2) are arranged in a matched mode with the positioning rails (404).

3. A plating annealing apparatus for a chip surface according to claim 2, wherein: the driving wheel (402) is a belt pulley, and the closed-loop conveying member (403) is a conveying belt.

4. A plating annealing apparatus for a chip surface according to claim 2, wherein: the driving wheel (402) is a chain wheel, and the closed-loop conveying member (403) is a conveying chain.

5. A plating annealing apparatus for a chip surface according to claim 1, wherein: the discharge conveyor (3) comprises a conveying frame (301), and a row of conveying rollers (302) horizontally aligned with the discharge port are arranged on the conveying frame (301).

6. A plating annealing apparatus for a chip surface according to claim 1, wherein: the sealing cover plates (101) on the feeding hole and the discharging hole are all arranged in an outward opening type rotating connection mode, a telescopic driving piece (7) is connected to the baking box body (1) above the feeding hole, and the lower end of the telescopic driving piece (7) is connected with the sealing cover plates (101) on the feeding hole.

7. A plating annealing apparatus for a chip surface according to claim 1, wherein: the heating unit (5) comprises two resistance heating devices arranged on the front inner wall and the rear inner wall of the baking oven body (1).

8. A plating annealing apparatus for a chip surface according to claim 1, wherein: the discharging pushing unit (6) comprises a bracket (601) fixed on the front side surface of the oven body (1), a telescopic pushing piece (602) is arranged on the bracket (601), and a pushing plate is connected to the end part of the telescopic pushing piece (602) extending into the inner cavity of the oven body (1).