CN219007313U - Photovoltaic backboard, photovoltaic module and photovoltaic system - Google Patents

Photovoltaic backboard, photovoltaic module and photovoltaic system Download PDF

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CN219007313U
CN219007313U CN202223162637.XU CN202223162637U CN219007313U CN 219007313 U CN219007313 U CN 219007313U CN 202223162637 U CN202223162637 U CN 202223162637U CN 219007313 U CN219007313 U CN 219007313U
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layer
photovoltaic
adhesive layer
backboard
thickness
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卢浩杰
陈刚
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Shenzhen Saineng Digital Energy Technology Co ltd
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Shenzhen Saineng Digital Energy Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Abstract

The application is applicable to the technical field of solar cells and provides a photovoltaic backboard, a photovoltaic module and a photovoltaic system. The photovoltaic backboard comprises a fluorine-containing layer, a first adhesive layer, a supporting layer, a second adhesive layer and a lamination adhesive layer which are sequentially laminated, wherein the supporting layer comprises an FR-4 substrate and/or an FR-5 substrate, and the thickness of the supporting layer is 0.1mm-1.5mm. In this way, the FR-4 substrate and/or the FR-5 substrate with the thickness of 0.1mm-1.5mm are/is used as the supporting layer, so that the heat resistance of the photovoltaic backboard can be improved, and the risk of deformation of the photovoltaic backboard due to poor heat resistance is reduced. Meanwhile, the structural rigidity of the photovoltaic backboard can be improved, and the risk of hidden cracking of the solar cell of the photovoltaic module in the packaging, transporting and installing processes is reduced.

Description

Photovoltaic backboard, photovoltaic module and photovoltaic system
Technical Field
The application belongs to the technical field of solar cells, and particularly relates to a photovoltaic backboard, a photovoltaic module and a photovoltaic system.
Background
Solar cell power generation is a sustainable clean energy source that uses the photovoltaic effect of semiconductor p-n junctions to convert sunlight into electrical energy. The solar cells are connected by solder strips and form a photovoltaic module together with components such as a glue film, glass, a back plate, a frame and the like.
The back sheet in the related art generally uses PET as a support layer. However, the photovoltaic module generates heat in the working process, and the heat resistance of the back plate is poor, so that for a light module without glass, the back plate is easy to deform due to gravity caused by heat, and the performance and even the safety of the photovoltaic module are affected. Moreover, the back plate has insufficient rigidity, has poor protection effect on the solar cells in the light assembly, and is easy to cause hidden cracks in the processes of production, transportation, installation and the like.
Based on this, how to design the back plate to improve heat resistance and rigidity becomes a problem to be solved.
Disclosure of Invention
The application provides a photovoltaic backboard, a photovoltaic module and a photovoltaic system, and aims to solve the problem of how to design the backboard to improve heat resistance and rigidity.
In a first aspect, the photovoltaic backboard provided by the application is characterized by comprising a fluorine-containing layer, a first adhesive layer, a supporting layer, a second adhesive layer and a lamination adhesive layer which are sequentially laminated, wherein the supporting layer comprises an FR-4 substrate and/or an FR-5 substrate, and the thickness of the supporting layer is 0.1mm-1.5mm.
Optionally, the fluorine-containing layer includes one or more of PVF layer, PVDF layer, ETFE layer, ECTFE layer, PCTFE layer, and fluorine resin paint layer.
Optionally, the thickness of the first adhesive layer is 5 μm to 20 μm.
Optionally, the first adhesive layer includes one or more of an acrylic glue layer, a polyurethane glue layer, and an epoxy glue layer.
Optionally, the second adhesive layer has a thickness of 5 μm to 20 μm.
Optionally, the second adhesive layer includes one or more of an acrylic glue layer, a polyurethane glue layer, and an epoxy glue layer.
Optionally, the thickness of the laminated adhesive layer is 10 μm to 30 μm.
Optionally, the laminated adhesive layer comprises a modified EVA layer and/or a POE adhesive film layer.
In a second aspect, the present application provides a photovoltaic module comprising a photovoltaic backsheet as described in any one of the preceding claims.
In a third aspect, the present application provides a photovoltaic system comprising a photovoltaic module as described in any one of the above.
According to the photovoltaic backboard, the photovoltaic module and the photovoltaic system, the FR-4 substrate and/or the FR-5 substrate with the thickness of 0.1mm-1.5mm are adopted as the supporting layer, so that the heat resistance of the photovoltaic backboard can be improved, and the risk of deformation of the photovoltaic backboard due to poor heat resistance is reduced. Meanwhile, the structural rigidity of the photovoltaic backboard can be improved, and the risk of hidden cracking of the solar cell of the photovoltaic module in the packaging, transporting and installing processes is reduced.
Drawings
FIG. 1 is a schematic structural view of a photovoltaic backsheet of an embodiment of the present application;
description of main reference numerals:
the photovoltaic back sheet 10, the fluorine-containing layer 11, the first adhesive layer 12, the support layer 13, the second adhesive layer 14, and the lamination adhesive layer 15.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples. Examples of the embodiments are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application. Furthermore, it should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.
In the description of the present application, it should be understood that the terms "length," "width," "upper," "lower," "left," "right," "horizontal," "top," "bottom," and the like indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be configured and operated in a particular orientation, and are therefore not to be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments, or examples, for implementing different structures of the application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize applications of other processes and/or usage scenarios for other materials.
In the application, the FR-4 substrate and/or the FR-5 substrate with the thickness of 0.1mm-1.5mm are/is used as the supporting layer, so that the heat resistance of the photovoltaic backboard can be improved, and the risk of deformation of the photovoltaic backboard due to poor heat resistance is reduced. Meanwhile, the structural rigidity of the photovoltaic backboard can be improved, and the risk of hidden cracking of the solar cell of the photovoltaic module in the packaging, transporting and installing processes is reduced.
Example 1
Referring to fig. 1, a photovoltaic backsheet 10 according to an embodiment of the present application includes a fluorine-containing layer 11, a first adhesive layer 12, a supporting layer 13, a second adhesive layer 14, and a lamination adhesive layer 15, which are sequentially stacked, wherein the supporting layer 13 includes an FR-4 substrate and/or an FR-5 substrate, and the supporting layer 13 has a thickness of 0.1mm to 1.5mm.
According to the photovoltaic backboard 10 disclosed by the embodiment of the application, the FR-4 substrate and/or the FR-5 substrate with the thickness of 0.1mm-1.5mm are adopted as the supporting layer 13, so that the heat resistance of the photovoltaic backboard 10 can be improved, and the risk of deformation of the photovoltaic backboard 10 due to poor heat resistance is reduced. At the same time, the structural rigidity of the photovoltaic back sheet 10 can be enhanced, and the risk of hidden cracking of the solar cells of the photovoltaic module in the process of packaging, transporting and installing can be reduced.
Specifically, the fluorine-containing layer 11 is a film layer made of a fluorine-containing material. In this way, the fluorine-containing layer 11 has strong weather resistance, mechanical properties and ductility, so that the internal supporting layer 13 can be better protected, thereby ensuring the heat resistance and structural rigidity of the supporting layer 13, and being beneficial to improving the reliability of the photovoltaic backboard 10.
Specifically, the number of fluorine-containing layers 11 may be one, two, three, or other. The specific number of layers of the fluorine-containing layer 11 is not limited here.
Specifically, the fluorine-containing layer 11 has a thickness of 10 μm to 50 μm. For example 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 37 μm, 40 μm, 48 μm, 50 μm. In this way, the thickness of the fluorine-containing layer 11 is in a proper range, so that insufficient protection of the supporting layer 13 caused by too small thickness of the fluorine-containing layer 11 can be avoided, and waste of materials caused by too large thickness of the fluorine-containing layer 11 can be avoided.
Specifically, the first adhesive layer 12 is used to adhere the fluorine-containing layer 11 and the support layer 13. In this way, the fluorine-containing layer 11 and the supporting layer 13 are fixed together and cannot be randomly shifted, which is beneficial to ensuring the reliability of the photovoltaic backboard 10.
Specifically, the number of first adhesive layers 12 may be one, two, three, or other. The specific number of layers of the first adhesive layer 12 is not limited herein.
Specifically, the first adhesive layer 12 may be continuously distributed between the fluorine-containing layer 11 and the supporting layer 13, and the first adhesive layer 12 covers the entire area of the contact surface of the fluorine-containing layer 11 and the supporting layer 13. In this way, it is ensured that the contact surfaces of the fluorine-containing layer 11 and the support layer 13 are all bonded together. It will be appreciated that in other embodiments, the first adhesive layer 12 may be intermittently disposed between the fluorine-containing layer 11 and the support layer 13, or the first adhesive layer 12 may cover a portion of the area of the interface between the fluorine-containing layer 11 and the support layer 13.
Specifically, the FR-4 substrate refers to an epoxy glass cloth laminate of FR-4 flame retardant grade. The FR-5 substrate refers to an epoxy glass cloth laminate of FR-5 fire resistant grade. In other words, the support layer 13 comprises an FR-4 epoxy glass laminate and/or an FR-5 epoxy glass laminate.
For example, the support layer 13 includes an FR-4 epoxy glass laminate and an FR-5 epoxy glass laminate; for another example, the support layer 13 comprises an FR-4 epoxy glass laminate, excluding an FR-5 epoxy glass laminate; for another example, the support layer 13 does not include an FR-4 epoxy glass laminate, including an FR-5 epoxy glass laminate.
Therefore, the supporting layer 13 has better heat resistance, even if the assembly generates hot spots, the temperature reaches 180 ℃, the FR-4 epoxy glass laminated board and the FR-5 epoxy glass laminated board cannot deform, and the flatness of the photovoltaic assembly is ensured. Second, the structural rigidity of the photovoltaic backsheet 10 can be enhanced due to the excellent mechanical skills of the FR-4 epoxy glass laminate and the FR-5 epoxy glass laminate.
Specifically, the thickness of the support layer 13 is, for example, 0.1mm, 0.2mm, 0.3mm, 0.5mm, 0.8mm, 1.0mm, 1.2mm, 1.5mm. In this way, the thickness of the supporting layer 13 is in a suitable range, so that insufficient rigidity of the photovoltaic back sheet 10 caused by too small thickness can be avoided, and waste of materials caused by too large thickness can be avoided.
Specifically, the number of layers of the support layer 13 may be one, two, three, or other. The specific number of layers of the support layer 13 is not limited here.
Specifically, the second adhesive layer 14 is used to adhere the lamination adhesive layer 15 and the support layer 13. In this way, the laminated adhesive layer 15 and the supporting layer 13 are fixed together and cannot be randomly displaced, which is beneficial to ensuring the reliability of the photovoltaic backsheet 10.
Specifically, the number of layers of the second adhesive layer 14 may be one, two, three, or other. The specific number of layers of the second adhesive layer 14 is not limited herein.
In particular, the second adhesive layer 14 may be continuously distributed between the lamination adhesive layer 15 and the support layer 13, the second adhesive layer 14 covering the entire area of the contact surface of the lamination adhesive layer 15 and the support layer 13. In this way, it is ensured that the contact surfaces of the lamination adhesive layer 15 and the support layer 13 are all bonded together. It will be appreciated that in other embodiments, the second adhesive layer 14 may be intermittently disposed between the lamination adhesive layer 15 and the support layer 13, or that the second adhesive layer 14 covers a portion of the area of the interface between the lamination adhesive layer 15 and the support layer 13.
Specifically, the lamination adhesive layer 15 is used to improve the adhesion of the contact surface of the photovoltaic backsheet 10 with the adhesive film. In this way, the reliability of the photovoltaic backsheet 10 can be improved.
Example two
In some alternative embodiments, the fluorine-containing layer 11 includes one or more of a PVF layer, a PVDF layer, an ETFE layer, an ECTFE layer, a PCTFE layer, a fluorine resin paint layer.
In this way, various forms of fluorine-containing layer 11 are provided, which can be selected according to the actual production scenario.
For example, the fluorine-containing layer 11 includes a PVF layer, a PVDF layer, an ETFE layer, an ECTFE layer, a PCTFE layer, and a fluorine resin paint layer; as another example, the fluorine-containing layer 11 includes a PVF layer, a PVDF layer, and an ETFE layer; for another example, the fluorine-containing layer 11 includes a PVF layer. The specific form of the fluorine-containing layer 11 is not limited herein.
Example III
In some alternative embodiments, the thickness of the first adhesive layer 12 is 5 μm to 20 μm. For example, 5 μm, 8 μm, 10 μm, 12 μm, 15 μm, 17 μm, 20 μm.
In this way, the thickness of the first adhesive layer 12 is in a suitable range, so that poor effect of adhering the fluorine-containing layer 11 and the supporting layer 13 caused by too small thickness can be avoided, and waste of materials caused by too large thickness can also be avoided.
Preferably, the thickness of the first adhesive layer 12 is 10 μm to 15 μm.10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm.
Thus, the bonding effect and the material saving are combined, and the overall effect is the best.
Example IV
In some alternative embodiments, the first adhesive layer 12 includes one or more of an acrylic glue layer, a polyurethane glue layer, and an epoxy glue layer.
In this way, the first adhesive layer 12 may be formed using one or more of an acrylic adhesive, a polyurethane adhesive, and an epoxy adhesive, and the effect of bonding the fluorine-containing layer 11 and the support layer 13 is better.
Example five
In some alternative embodiments, the thickness of the second adhesive layer 14 is 5 μm to 20 μm. For example, 5 μm, 6 μm, 10 μm, 15 μm, 18 μm, 20 μm.
In this way, the thickness of the second adhesive layer 14 is in a proper range, so that poor effects of adhering the laminated adhesive layer 15 and the supporting layer 13 caused by too small thickness can be avoided, and waste of materials caused by too large thickness can also be avoided.
Preferably, the thickness of the second adhesive layer 14 is 10 μm to 15 μm.10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm.
Thus, the bonding effect and the material saving are combined, and the overall effect is the best.
Example six
In some alternative embodiments, the second adhesive layer 14 includes one or more of an acrylic glue layer, a polyurethane glue layer, and an epoxy glue layer.
In this way, the second adhesive layer 14 may be formed using one or more of an acrylic adhesive, a polyurethane adhesive, and an epoxy adhesive, and the effect of bonding the lamination adhesive layer 15 and the support layer 13 is better.
Example seven
In some alternative embodiments, the thickness of the lamination adhesive layer 15 is 10 μm-30 μm. For example, 10 μm, 12 μm, 15 μm, 18 μm, 20 μm, 23 μm, 25 μm, 27 μm, 30 μm.
In this way, the thickness of the lamination adhesive layer 15 is in a proper range, so that poor effect of improving the adhesive force of the contact surface of the photovoltaic backboard 10 and the adhesive film caused by too small thickness can be avoided, and waste of materials caused by too large thickness can also be avoided.
Preferably, the thickness of the lamination adhesive layer 15 is 15 μm to 25 μm. For example 15 μm, 18 μm, 20 μm, 23 μm, 25 μm.
Thus, the effect of improving the adhesion of the contact surface of the photovoltaic backboard 10 and the adhesive film and the material saving are combined, and the overall effect is the best.
Example eight
In some alternative embodiments, the lamination adhesive layer 15 includes a modified EVA layer and/or POE adhesive film layer.
In this way, the adhesion force of the contact surface of the photovoltaic backboard 10 and the adhesive film can be better improved, and the reliability of the photovoltaic backboard 10 is improved.
For example, the lamination adhesive layer 15 includes a modified EVA layer and a POE adhesive film layer; for another example, the lamination adhesive layer 15 includes a modified EVA layer, excluding a POE adhesive film layer; for another example, the lamination adhesive layer 15 does not include a modified EVA layer, including a POE adhesive film layer.
Example nine
The photovoltaic module of the present embodiment includes the photovoltaic backsheet 10 of any one of embodiments one to eight.
According to the photovoltaic module, the FR-4 substrate and/or the FR-5 substrate with the thickness of 0.1mm-1.5mm are/is used as the supporting layer 13, so that the heat resistance of the photovoltaic backboard 10 can be improved, and the risk of deformation of the photovoltaic backboard 10 due to poor heat resistance is reduced. At the same time, the structural rigidity of the photovoltaic back sheet 10 can be enhanced, and the risk of hidden cracking of the solar cells of the photovoltaic module in the process of packaging, transporting and installing can be reduced.
In this embodiment, a plurality of solar cells in the photovoltaic module may be serially connected in sequence to form a cell string, so as to realize serial bus output of current, for example, serial connection of the battery pieces may be realized by providing a solder strip (bus bar, interconnection bar), a conductive back plate, and the like.
It will be appreciated that in such embodiments, the photovoltaic module may also include a metal frame, photovoltaic backsheet 10, photovoltaic glass and a glue film. The adhesive film can be filled between the front and back surfaces of the solar cell, the photovoltaic glass, the adjacent cell sheets and the like, and can be a transparent colloid with good light transmittance and ageing resistance, for example, the adhesive film can be an EVA adhesive film or a POE adhesive film, and the adhesive film can be specifically selected according to actual conditions and is not limited.
The photovoltaic glass may be an ultra-white glass, which has high light transmittance, high transparency, and excellent physical, mechanical, and optical properties, for example, the ultra-white glass may have a light transmittance of 92% or more, which may protect the solar cell without affecting the efficiency of the solar cell as much as possible, and may be coated on the adhesive film on the front surface of the solar cell. Meanwhile, the photovoltaic glass and the solar cell can be bonded together by the adhesive film, and the solar cell can be sealed and insulated, and is waterproof and dampproof by the adhesive film.
The photovoltaic backboard 10 can be attached to an adhesive film on the back of the solar cell, the backboard can protect and support the solar cell, the photovoltaic backboard 10 has reliable insulativity, water resistance and aging resistance, the photovoltaic backboard 10 can be selected multiple times, and can be toughened glass, organic glass, an aluminum alloy TPT composite adhesive film and the like, and the photovoltaic backboard can be specifically set according to specific conditions and is not limited herein. The whole of photovoltaic back plate 10, solar cell, glued membrane and photovoltaic glass constitution can set up on metal frame, and metal frame is as the main outside bearing structure of whole photovoltaic module, and can carry out stable support and installation for photovoltaic module, for example, can install photovoltaic module in the position that needs the installation through metal frame.
Examples ten
The photovoltaic system of the embodiment of the application comprises the photovoltaic module of the ninth embodiment.
According to the photovoltaic system of the embodiment of the application, as the photovoltaic backboard 10 adopts the FR-4 substrate and/or the FR-5 substrate with the thickness of 0.1mm-1.5mm as the supporting layer 13, the heat resistance of the photovoltaic backboard 10 can be improved, and the risk of deformation of the photovoltaic backboard 10 due to poor heat resistance is reduced. At the same time, the structural rigidity of the photovoltaic back sheet 10 can be enhanced, and the risk of hidden cracking of the solar cells of the photovoltaic module in the process of packaging, transporting and installing can be reduced.
In this embodiment, the photovoltaic system may be applied to a photovoltaic power station, such as a ground power station, a roof power station, a water power station, or the like, and may also be applied to a device or apparatus that uses solar energy to generate power, such as a user solar power source, a solar street lamp, a solar car, a solar building, or the like. Of course, it is understood that the application scenario of the photovoltaic system is not limited thereto, that is, the photovoltaic system may be applied to all fields where solar energy is required to generate electricity. Taking a photovoltaic power generation system network as an example, the photovoltaic system can comprise a photovoltaic array, a confluence box and an inverter, wherein the photovoltaic array can be an array combination of a plurality of photovoltaic modules, for example, the photovoltaic modules can form a plurality of photovoltaic arrays, the photovoltaic arrays are connected with the confluence box, the confluence box can confluence currents generated by the photovoltaic arrays, and the confluence currents flow through the inverter to be converted into alternating currents required by a commercial power grid and then are connected with the commercial power network so as to realize solar power supply.
In the description of the present specification, reference to the terms "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiments or examples is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the foregoing description of the preferred embodiment is provided for the purpose of illustration only, and is not intended to limit the utility model to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims (10)

1. The photovoltaic backboard is characterized by comprising a fluorine-containing layer, a first adhesive layer, a supporting layer, a second adhesive layer and a lamination adhesive layer which are sequentially laminated, wherein the supporting layer comprises an FR-4 substrate and/or an FR-5 substrate, and the thickness of the supporting layer is 0.1mm-1.5mm.
2. The photovoltaic backsheet of claim 1 wherein the fluorine-containing layer comprises one or more of a PVF layer, a PVDF layer, an ETFE layer, an ECTFE layer, a PCTFE layer, a fluororesin coating layer.
3. The photovoltaic backsheet of claim 1 wherein the first adhesive layer has a thickness of 5 μιη to 20 μιη.
4. The photovoltaic backsheet of claim 1 wherein the first adhesive layer comprises one or more of an acrylic adhesive layer, a polyurethane adhesive layer, and an epoxy adhesive layer.
5. The photovoltaic backsheet of claim 1 wherein the second adhesive layer has a thickness of 5 μm to 20 μm.
6. The photovoltaic backsheet of claim 1 wherein the second adhesive layer comprises one or more of an acrylic adhesive layer, a polyurethane adhesive layer, and an epoxy adhesive layer.
7. The photovoltaic backsheet of claim 1 wherein the lamination tie layer has a thickness of 10 μm to 30 μm.
8. The photovoltaic backsheet according to claim 1, characterized in that the lamination adhesive layer comprises a modified EVA layer and/or POE adhesive film layer.
9. A photovoltaic module comprising the photovoltaic backsheet of any one of claims 1-8.
10. A photovoltaic system comprising the photovoltaic module of claim 9.
CN202223162637.XU 2022-11-23 2022-11-23 Photovoltaic backboard, photovoltaic module and photovoltaic system Active CN219007313U (en)

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