CN219003855U - Miniature LED cleaning equipment and LED repair system - Google Patents

Abstract

The utility model belongs to the technical field of semiconductors, and discloses miniature LED cleaning equipment and an LED repairing system. The miniature LED cleaning equipment comprises a camera device, an adsorption device and a cleaning device, wherein the cleaning device comprises a position adjusting mechanism, a mounting plate, a roller releasing mechanism and a head wiping mechanism, the head wiping mechanism comprises a first mounting piece and a head wiping assembly, the head wiping assembly comprises a miniature head wiping piece, the size of the miniature head wiping piece is smaller than that of a blank position of a substrate, the miniature head wiping piece is in transmission connection with the first mounting piece, the roller releasing mechanism comprises cleaning cloth which is intermittently conveyed, and the miniature head wiping piece can be abutted against the cleaning cloth. Above-mentioned setting guarantees that miniature LED cleaning equipment and LED repair system can carry out accurate mechanized clearance to the impurity in the blank position of base plate, avoids impurity adhesion in the base plate, guarantees that impurity is adsorbed away, improves clean effect, guarantees that repair welding is successful. The LED repairing system has good cleaning effect of the empty and absent positions of the substrate and high repair welding success rate.

Description

Miniature LED cleaning equipment and LED repair system

Technical Field

The utility model relates to the technical field of semiconductors, in particular to miniature LED cleaning equipment and an LED repairing system.

Background

As the display screen is widely used in various fields, the LED (Light Emitting Diode ) is an important part of the display screen, and in the production process, the requirements for the shipment of the display screen are higher and higher. The LED comprises a glass substrate (hereinafter referred to as substrate) and a plurality of micro-core particles (hereinafter referred to as core particles) regularly arranged on the glass substrate, the core particles are carried and mounted on the substrate by bonding pads, and because the quantity of the core particles is large, the situation that the core particles fail before leaving the factory is unavoidable, so that the defect core particles must be detected before leaving the factory, the defect core particles are taken down, substrate empty positions are formed on the substrate after the defect core particles are taken down, new core particles are repair welded on the substrate empty positions, and normal operation of all the core particles in the LED is ensured.

However, after the defective core particles are removed by the defluxing, a large amount of foreign matters and flux residues are often remained on the blank positions of the substrate and the corresponding bonding pads, and the repair welding is unstable and seriously fails due to the fact that the solder paste is heated unevenly, is not easy to melt and is seriously caused by the fact that the new core particles are subjected to the repair welding if the new core particles are subjected to the repair welding directly. Because the core particle size is very small (50-80 mu m), the impurities are adsorbed after being burnt by laser in the prior art, but a small amount of impurities are adhered to a substrate or a bonding pad after being burnt by laser cleaning, and the adsorption device cannot absorb the impurities, so that the cleaning effect of the laser cleaning is not ideal, and the solder paste is not easy to melt and repair welding fails. Of course, this problem also exists when the product is reworked.

Therefore, there is a need to design a micro LED cleaning device and LED repair system to solve the above problems.

Disclosure of Invention

The utility model aims to provide a miniature LED cleaning device which can accurately and mechanically clean impurities at blank positions of a substrate, avoid the adhesion of the impurities to the substrate, ensure the adsorption of the impurities, improve the cleaning effect and ensure the success of repair welding.

To achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a miniature LED cleaning equipment for clear up the blank position of base plate on the base plate after the dismantlement defect core grain, above-mentioned miniature LED cleaning equipment includes camera device, adsorption equipment and cleaning device, and above-mentioned camera device is used for fixing a position blank position of base plate and judges the clean degree of blank position of base plate, and adsorption equipment is used for taking away impurity, and above-mentioned cleaning device includes:

the position adjusting mechanism is in communication connection with the camera device;

the mounting plate is mounted at the output end of the position adjusting mechanism;

a roll releasing mechanism mounted on the mounting plate, the roll releasing mechanism including cleaning cloth intermittently transferred; and

the cleaning head mechanism comprises a first mounting piece and a cleaning head assembly, wherein the first mounting piece is connected with the mounting plate, the cleaning head assembly comprises a miniature cleaning head arranged at the free end of the cleaning head assembly, the size of the free end of the miniature cleaning head is smaller than that of the blank position of the substrate, the miniature cleaning head is in transmission connection with the first mounting piece, the miniature cleaning head can be abutted against the cleaning cloth, and the position adjusting mechanism can adjust the positions of the miniature cleaning head and the cleaning cloth.

Optionally, the relative position of the wiper head assembly and the first mounting member in a direction toward the cleaning cloth is adjustable.

Optionally, the wiping head mechanism further includes an adjusting tightness driving member, the adjusting tightness driving member is mounted on the first mounting member, the wiping head assembly is mounted at an output end of the adjusting tightness driving member, and the adjusting tightness driving member can drive the wiping head assembly to move along a preset direction.

Optionally, the tightness adjusting driving member is a slider cylinder.

Optionally, the wiping head assembly further includes:

the second mounting piece is mounted at the output end of the tightness adjusting driving piece;

the guide piece extends along a preset direction and is mounted on the second mounting piece;

the limiting piece is arranged at one end of the guide piece;

the connecting piece is connected with the guide piece in a sliding fit manner, and the miniature wiper head is connected with the connecting piece; and

and the elastic piece is arranged at the other end of the guide piece and can be abutted with the connecting piece.

Optionally, the connecting piece is detachably connected with the miniature wiper head.

Optionally, the micro LED cleaning device further includes a filling mechanism, where the filling mechanism includes a filling container, a via hole is formed in the micro wiper, one end of the via hole can be abutted against the cleaning cloth, the filling container is communicated with the via hole, and the filling container can intermittently release the cleaning agent into the via hole.

Optionally, the cleaning agent is a volatile cleaning agent.

Optionally, the micro wiper head includes a body portion and a protrusion, where the protrusion is convexly disposed on the body portion and has a size smaller than a size of the substrate void, the body portion is provided with a via hole, one end of the via hole is located on a peripheral side of the protrusion, and a free end of the protrusion is a smooth spherical surface.

The utility model further aims to provide an LED repair system, which has good cleaning effect of the empty and absent positions of the substrate and high repair welding success rate.

To achieve the purpose, the utility model adopts the following technical scheme:

the LED repairing system comprises a defect core particle disassembling device, the LED repairing system further comprises the miniature LED cleaning device, the defect core particles are disassembled from the substrate by the defect core particle disassembling device to form substrate empty positions, and the miniature LED cleaning device is used for cleaning impurities on the substrate empty positions.

The utility model has the beneficial effects that:

the utility model provides miniature LED cleaning equipment, after a defective core particle is unwelded, a camera device accurately positions the position of a blank position of a substrate, a position adjusting mechanism drives a mounting plate to move, so that miniature wiping head arranged on the mounting plate drives cleaning cloth to extend into the blank position of the substrate to wipe, impurities adhered on the substrate are cleaned in a mechanical mode, the impurities are separated from the substrate and are sucked by an adsorption device, the camera device judges the cleaning degree of the blank position of the substrate, and repair welding is carried out after the clearance is qualified, if the clearance is not qualified, the clearance is cleaned again until the clearance is qualified, the cleaning degree of the blank position of the substrate is ensured, compared with laser cleaning, secondary adhesion is not caused, cleaning in place is ensured, and further the repair welding effect is ensured.

The utility model also provides an LED repairing system, which has good cleaning effect of the blank position of the substrate and high repair welding success rate by adopting the miniature LED cleaning equipment.

Drawings

Fig. 1 is a schematic structural diagram of an LED according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a micro LED cleaning device according to an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of a head wiping mechanism according to an embodiment of the present utility model.

In the figure:

10. a cleaning device; 12. a mounting plate; 13. a roller releasing mechanism; 131. a cleaning cloth; 132. a discharge roller; 133. a receiving roller; 134. an auxiliary roller; 11. a head wiping mechanism; 111. a first mounting member; 112. a wiper head assembly; 1121. a miniature wiper head; 11211. a body portion; 112111, via holes; 11212. a convex portion; 1122. a second mounting member; 1123. a guide member; 1124. a limiting piece; 1125. a connecting piece; 11251. a first connector; 11252. a second connector; 11253. a third connecting member; 1126. an elastic member; 1127. a seal ring; 1128. a third mount; 113. adjusting the tightness driving member;

20. a filling mechanism; 21. filling a container; 22. a communicating pipe;

200. an LED; 210. a substrate; 211. the substrate is free of gaps; 220. and (5) core particles.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

As shown in fig. 1, the LED200 includes a substrate 210 and a plurality of core particles 220 disposed thereon and regularly arranged, the core particles 220 are carried by bonding pads (not shown in the figure) and mounted on the substrate 210, and since the number of the core particles 220 is large, failure of the core particles 220 before shipment is unavoidable, the LED200 must detect a defective core particle 220 before shipment, remove the defective core particle 220, form a substrate empty space 211 on the substrate 210 after the defective core particle 220 is removed, and repair-weld a new core particle 220 on the substrate empty space 211, so as to ensure that all the core particles 220 in the LED200 are normally operated.

However, after the defective core 220 is removed by the solder reflow, a large amount of foreign matters and flux residues remain on the substrate empty space 211 and the corresponding bonding pad during the solder reflow and the previous soldering, and if the new core 220 is directly soldered, the solder paste is heated unevenly due to the existence of impurities and flux, and is not easy to melt, so that the solder repair is not firm, and the repair failure of the LED200 is seriously caused. Laser cleaning can cause small amounts of impurities to adhere to the substrate 210 or the bonding pad after burning, and the cleaning effect is still not ideal.

In order to solve the above-mentioned problem, this embodiment provides a miniature LED cleaning device, can carry out accurate mechanized clearance to the impurity of the blank 211 of base plate, avoid impurity adhesion in base plate 210, guarantee that the impurity is adsorbed away, improve clean effect, guarantee that repair welding is successful. Specifically, as shown in fig. 2, the micro LED cleaning device includes a camera device, an adsorption device and a cleaning device 10, wherein the camera device is used for positioning the substrate gap 211 and determining the cleaning degree of the substrate gap 211, the adsorption device is used for sucking away impurities, the cleaning device 10 includes a position adjusting mechanism, a mounting plate 12, a roller releasing mechanism 13 and a head wiping mechanism 11, and the position adjusting mechanism is in communication connection with the camera device; the mounting plate 12 is mounted at the output end of the position adjusting mechanism; a roller releasing mechanism 13 is mounted on the mounting plate 12, the roller releasing mechanism 13 including a cleaning cloth 131 intermittently conveyed; the wiping head mechanism 11 comprises a first mounting piece 111 and a wiping head assembly 112, the first mounting piece 111 is connected with the mounting plate 12, the wiping head assembly 112 comprises a miniature wiping head 1121 arranged at the free end of the wiping head assembly 112, the size of the free end of the miniature wiping head 1121 is smaller than that of the blank space 211 of the substrate, the miniature wiping head 1121 is in transmission connection with the first mounting piece 111, the miniature wiping head 1121 can be abutted against the cleaning cloth 131, and the position adjusting mechanism can adjust the positions of the miniature wiping head 1121 and the cleaning cloth 131. Through the arrangement, after the defective core particles 220 are unwelded, the camera device accurately positions the position of the blank space 211 of the substrate, the position adjusting mechanism drives the mounting plate 12 to move, so that the miniature wiping head 1121 mounted on the mounting plate 12 drives the cleaning cloth 131 to extend into the blank space 211 of the substrate to wipe, impurities adhered to the substrate 210 are cleaned in a mechanical mode, the impurities are separated from the substrate 210 and then are sucked by the adsorption device, the camera device judges the cleaning degree of the blank space 211 of the substrate, repair welding is carried out after the qualified camera device judges the unqualified camera device, and cleaning is carried out again until the cleaning is qualified, the cleaning degree of the blank space 211 of the substrate is guaranteed, compared with laser cleaning, secondary adhesion is not caused, cleaning is guaranteed in place, and then the repair welding effect is guaranteed.

The adsorption device is a suction pipe connected with the negative pressure generator, and can suck impurities separated from the substrate 210 along with the cleaning of the cleaning device 10, which is a conventional arrangement in the prior art and will not be described herein; the camera device (not shown in the figure) includes a first camera and a second camera, the first camera is used for positioning the blank space 211 of the substrate, the second camera is used for determining the dirt condition of the blank space 211 of the substrate after the defluxing, the position adjusting mechanism is respectively connected with the first camera and the second camera in a communication way, the first camera and the second camera are vision positioning cameras, and the structure and the operation method are all in the prior art and are not described herein.

Alternatively, the position adjusting mechanism is three mutually perpendicular linear driving modules, so as to realize the adjustment of the micro wiper 1121 in two directions of vertical direction and horizontal direction, and the linear driving modules may be air cylinders, which is not limited herein. In other embodiments, the position adjustment mechanism may also be a multi-axis robot.

Optionally, as shown in fig. 2, the discharging mechanism 13 further includes a discharging roller 132, a receiving roller 133 and an auxiliary roller 134 mounted on the mounting plate 12, the cleaning cloth 131 extends from the discharging roller 132, and is rolled up from the receiving roller 133 through the auxiliary roller 134 and the micro wiper head 1121, wherein at least one of the discharging roller and the receiving roller 133 is connected with a rotation driving member to intermittently drive the discharging roller or the receiving roller 133 to rotate so as to intermittently move the cleaning cloth 131, and when the cleaning cloth 131 located on the micro wiper head 1121 is polluted, the cleaning cloth 131 moves to move the clean cleaning cloth 131 to the micro wiper head 1121 for the next cleaning. Optionally, a plurality of auxiliary rollers 134 are provided to increase the tension of the cleaning cloth 131, avoiding piling up of the cleaning cloth 131 while moving.

Preferably, the relative position of the wiping head assembly 112 and the first mounting member 111 in the direction towards the cleaning cloth 131 is adjustable, so that the force of the wiping head assembly 112 against the cleaning cloth 131 can be controlled, and the tightening force of the cleaning cloth 131 can be adjusted.

Optionally, as shown in fig. 3, the wiping head mechanism 11 further includes an adjusting tightness driving member 113, where the adjusting tightness driving member 113 is mounted on the first mounting member 111, and the wiping head assembly 112 is mounted on an output end of the adjusting tightness driving member 113, and the adjusting tightness driving member 113 can drive the wiping head assembly 112 to move along a preset direction. By the arrangement, the relative position of the wiping head assembly 112 and the first mounting piece 111 can be adjusted. In this embodiment, the preset direction is a vertical direction, and in other embodiments, the preset direction may be adjusted according to the placement direction of the product and the direction of the cleaning surface.

Preferably, the tightness adjusting driving member 113 is a sliding block cylinder, and compared with a common cylinder, the sliding block cylinder has a guiding function, is compact in structure, saves parts, and does not need to be additionally provided with a guide rail.

Preferably, as shown in fig. 2, the mounting plate 12 is provided with a avoiding groove, so that part of the head wiping mechanism 11 is positioned in the avoiding groove, and the size of the miniature LED cleaning device in the vertical direction is reduced.

Preferably, as shown in fig. 3, the wiping head assembly 112 further includes a second mounting member 1122, a guide member 1123, a limiting member 1124, a connecting member 1125 and an elastic member 1126, the second mounting member 1122 being mounted to the output end of the adjustment tightness driving member 113; the guide 1123 extends in a predetermined direction and is mounted to the second mount 1122; the limiting piece 1124 is mounted at one end of the guide piece 1123; the connecting piece 1125 is connected with the guiding piece 1123 in a sliding fit manner, and the miniature wiper 1121 is connected with the connecting piece 1125; the elastic member 1126 is provided at the other end of the guide member 1123 and can abut against the connecting member 1125. Through the arrangement, when the cleaning cloth 131 is not installed on the micro LED cleaning device, the connecting piece 1125 is limited at the limiting piece 1124, so that the connecting piece 1125 and the micro wiping head 1121 are prevented from falling off, after the cleaning cloth 131 is installed, the cleaning cloth 131 is tightly stretched to enable the micro wiping head 1121 to move towards the elastic piece 1126, so that the elastic piece 1126 is compressed to provide a counterforce for the cleaning cloth 131, namely, in the cleaning process, the micro wiping head 1121 is in a floating state under the counterforce of the elastic piece 1126, the wiping force of the micro wiping head 1121 on the blank position 211 of the substrate is properly adjusted, excessive impact force caused by the movement of the position adjusting mechanism on the substrate 210 is avoided, the adjusting precision of the position adjusting mechanism in the preset direction is reduced, and meanwhile, the cleaning force is ensured; in addition, based on the setting of the adjustment tightness driving member 113, the elastic member 1126 can be appropriately compressed or relaxed to adjust the initial wiping force to the substrate 210, so as to ensure that the initial wiping force is applicable to the substrates 210 with different strengths or the substrates 210 with different dirt levels.

Optionally, the wiping head assembly 112 further includes a third mounting member 1128, the third mounting member 1128 being mounted on the second mounting member 1122 and located at one end of the guide member 1123, and the elastic member 1126 being mounted on the third mounting member 1128 for mounting the elastic member 1126. In other embodiments, the second mounting member 1122 may be integrally provided with the third mounting member 1128 in an L-shape, or the mounting of the elastic member 1126 may be achieved, which is not limited herein.

Alternatively, as shown in fig. 3, the connecting member 1125 includes a first connecting member 11251, a second connecting member 11252 and a third connecting member 11253, where the first connecting member 11251 is slidably connected to the guiding member 1123, the second connecting member 11252 is mounted on the first connecting member 11251, the elastic member 1126 can abut against the second connecting member 11252, the third connecting member 11253 is mounted on the second connecting member 11252, the micro wiper 1121 is connected to the third connecting member 11253, and by the above arrangement, the third connecting member 11253 provides a larger mounting surface for the micro wiper 1121, and the second connecting member 11252 provides a suitable position for the abutment of the elastic member 1126, although the first connecting member 11251 and the second connecting member 11252 may be integrally provided, or all of them may be integrally provided, without limitation.

Preferably, the connector 1125 is detachably connected to the micro wiper 1121, and the micro wiper 1121 may be replaced with a different size to fit the substrate space 211 with a different size. Specifically, the third connection member 11253 is screwed to the micro wiper 1121.

Preferably, as shown in fig. 2 and 3, the micro LED cleaning device further comprises a filling mechanism 20, the filling mechanism 20 comprises a filling container 21, the micro wiping head 1121 is provided with a through hole 112111, one end of the through hole 112111 can be abutted against the cleaning cloth 131, the filling container 21 is communicated with the through hole 112111, and the filling container 21 can intermittently release the cleaning agent into the through hole 112111, so that the cleaning capability of the cleaning cloth 131 is improved through the arrangement.

Preferably, the cleaning agent is a volatile cleaning agent, that is, the cleaning agent will not remain on the substrate 210 after wiping, so as to prevent the secondary pollution of the substrate 210 caused by the cleaning agent, and the cleaning agent will not adhere to impurities to cause the situation that the impurities cannot be sucked away. In this embodiment, the cleaning agent is alcohol, and in other embodiments, the cleaning agent may be other volatile liquid, which is not limited herein. Alternatively, as shown in fig. 2 and 3, the filling container 21 is communicated with the via hole 112111 through a communicating pipe 22, the communicating pipe 22 includes a fixed pipe and a hose, the fixed pipe is provided on the third connecting member 11253 and is communicated with the via hole 112111, and the hose is communicated between the fixed pipe and the filling container 21.

Preferably, the via 112111 is a stepped hole, and the wiper head assembly 112 further comprises a sealing ring 1127, wherein the sealing ring 1127 is disposed on a stepped surface of the stepped hole to seal the third connecting member 11253 from the micro wiper head 1121, so as to prevent the volatile cleaning agent from volatilizing between the third connecting member 11253 and the micro wiper head.

Preferably, the micro wiping head 1121 comprises a body portion 11211 and a convex portion 11212, the convex portion 11212 is convexly arranged on the body portion 11211, the size of the convex portion is smaller than that of the substrate gap 211, the body portion 11211 is provided with a through hole 112111, one end of the through hole 112111 is located on the periphery side of the convex portion 11212, the free end of the convex portion 11212 is a smooth spherical surface, through the arrangement, the convex portion 11212 precisely wipes the substrate gap 211, the wiping range is better controlled, and the friction force to the cleaning cloth 131 is reduced due to the arrangement of the smooth spherical surface.

The present embodiment further provides an LED repairing system, which includes a defective core disassembly device and the above micro LED cleaning device, where the defective core 220 is disassembled from the substrate 210 by the defective core disassembly device to form a substrate empty gap 211, and the micro LED cleaning device is used for cleaning impurities on the substrate empty gap 211. By adopting the miniature LED cleaning equipment, the cleaning effect of the blank space 211 of the substrate is good, and the repair welding success rate is high.

The cleaning flow of the miniature LED cleaning device specifically comprises the following steps:

s1: the first camera marks the substrate empty space 211; and accurately positioning the substrate gap 211.

S2: the filling mechanism 20 fills the cleaning cloth 131 with a preset amount of cleaning agent; in this embodiment, the filling amount is 1ml, and the filling amount is controlled by the filling container 21, and in other embodiments, the filling amount can be adaptively adjusted according to the required amount of the cleaning cloth 131.

S3: the position adjusting mechanism drives the substrate 210 to move so that the micro wiper 1121 reaches the substrate gap 211; s2 and S3 sequences can be exchanged;

s4: the position adjusting mechanism drives the miniature wiping head 1121 to wipe at the blank position 211 of the substrate;

s5: the adsorption device sucks the dropped impurities away; s4 and S5 are synchronously carried out;

s6: the second camera judges the dirt condition of the blank 211 of the substrate after the wiping, and if the cleaning is qualified, the repair welding process is carried out; and if the cleaning is not qualified, repeating the steps S2-S5 until the second camera judges that the cleaning is qualified.

Preferably, the camera device further includes a third camera, and the third camera is configured to monitor the state of the repair welded core particle 220, if the repair welding is qualified, end the repair process, and if the repair welding is not qualified, re-enter the cleaning process and repair welding again after the repair welded core particle 220 is unwelded.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims (10)

1. Miniature LED cleaning equipment for clear up substrate vacancy position (211) on base plate (210) behind the dismantlement defect core particle (220), its characterized in that, miniature LED cleaning equipment includes camera device, adsorption equipment and cleaning device (10), camera device is used for fixing a position substrate vacancy position (211) and judging the clean degree of substrate vacancy position (211), and adsorption equipment is used for taking away impurity, cleaning device (10) include:

the position adjusting mechanism is in communication connection with the camera device;

a mounting plate (12) mounted on the output end of the position adjusting mechanism;

a roll releasing mechanism (13) mounted on the mounting plate (12), the roll releasing mechanism (13) comprising a cleaning cloth (131) intermittently conveyed; and

the cleaning head mechanism (11) comprises a first mounting piece (111) and a cleaning head assembly (112), wherein the first mounting piece (111) is connected with the mounting plate (12), the cleaning head assembly (112) comprises a miniature cleaning head (1121) arranged at the free end of the cleaning head assembly (112), the size of the free end of the miniature cleaning head (1121) is smaller than that of the blank position (211) of the substrate, the miniature cleaning head (1121) is in transmission connection with the first mounting piece (111), the miniature cleaning head (1121) can be abutted against the cleaning cloth (131), and the position adjusting mechanism can adjust the positions of the miniature cleaning head (1121) and the cleaning cloth (131).

2. The micro LED cleaning device according to claim 1, wherein the wiping head assembly (112) is adjustable in relative position to the first mounting member (111) in a direction towards the cleaning cloth (131).

3. The micro LED cleaning apparatus according to claim 2, wherein the wiping head mechanism (11) further comprises an adjustment tightness drive (113), the adjustment tightness drive (113) is mounted to the first mounting member (111), the wiping head assembly (112) is mounted to an output end of the adjustment tightness drive (113), and the adjustment tightness drive (113) is capable of driving the wiping head assembly (112) to move in a preset direction.

4. A micro LED cleaning device according to claim 3, characterized in that the adjustment tightness drive (113) is a slider cylinder.

5. A micro LED cleaning device according to claim 3, wherein the wiper head assembly (112) further comprises:

a second mounting member (1122) mounted to an output end of the adjustment tension driver (113);

a guide (1123) extending in a predetermined direction and mounted to the second mounting member (1122);

a stopper (1124) mounted to one end of the guide (1123);

a connector (1125) slidably coupled to the guide (1123), the micro wiper (1121) being coupled to the connector (1125); and

an elastic member (1126) provided at the other end of the guide member (1123) and capable of abutting against the connecting member (1125).

6. The micro LED cleaning device of claim 5, wherein the connector (1125) is detachably connected to the micro wiper head (1121).

7. The micro LED cleaning device according to any one of claims 1-5, further comprising a filling mechanism (20), wherein the filling mechanism (20) comprises a filling container (21), a via hole (112111) is formed in the micro wiper head (1121), one end of the via hole (112111) can be abutted to the cleaning cloth (131), the filling container (21) is communicated with the via hole (112111), and the filling container (21) can intermittently release the cleaning agent into the via hole (112111).

8. The micro LED cleaning apparatus of claim 7, wherein the cleaning agent is a volatile cleaning agent.

9. The micro LED cleaning device according to claim 7, wherein the micro wiper head (1121) comprises a body portion (11211) and a protrusion (11212), the protrusion (11212) is convexly arranged on the body portion (11211) and has a size smaller than that of the substrate gap (211), the body portion (11211) is provided with a via hole (112111), one end of the via hole (112111) is located on the periphery of the protrusion (11212), and the free end of the protrusion (11212) is a smooth spherical surface.

LED repair system comprising a defective core disassembly device, characterized in that the LED repair system further comprises a micro LED cleaning device according to any of claims 1-9, wherein the defective core (220) is disassembled from the substrate (210) by the defective core disassembly device to form a substrate empty defect (211), and the micro LED cleaning device is used for cleaning impurities on the substrate empty defect (211).

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