CN218996665U

CN218996665U - Wafer paster device

Info

Publication number: CN218996665U
Application number: CN202223413515.3U
Authority: CN
Inventors: 陈力颖
Original assignee: Tianjin Lixin Weiye Technology Co ltd
Current assignee: Tianjin Lixin Weiye Technology Co ltd
Priority date: 2022-12-19
Filing date: 2022-12-19
Publication date: 2023-05-09
Anticipated expiration: 2032-12-19

Abstract

The application discloses a wafer patch device, which comprises a semiconductor refrigeration piece, a round substrate and a cross laser emission head, wherein the semiconductor refrigeration piece is positioned in a square hole formed in the top of a fixed plate; a groove is formed in one side of the inside of the square hole, one end of a bearing is fixedly connected in the groove, the other end of the bearing is rotationally connected with a rotary rod, and one end of the rotary rod, which is far away from the bearing, is fixedly connected with a semiconductor refrigerating sheet; one end of the semiconductor refrigerating sheet, which is far away from the rotary rod, is fixedly connected with a motor shaft, and one side of the motor shaft penetrates through the fixing plate and the circular shell to be connected with a motor. According to the semiconductor refrigerating sheet and the motor shaft on the semiconductor refrigerating sheet, the semiconductor refrigerating sheet can be rotated by the motor shaft, so that the cold end and the hot end of the semiconductor refrigerating sheet are switched, the round substrate is respectively refrigerated and heated, the refrigeration and heating equipment can be omitted, and energy sources are saved.

Description

Wafer paster device

Technical Field

The application relates to the technical field of chip processing, in particular to a wafer patch device.

Background

In the chip packaging process, the wafer mounting process is generally performed in the following manner: the cylindrical substrate is horizontally placed on a heating table, the cylindrical substrate is heated by the heating table, the cylindrical substrate is heated to 100 ℃, and then the top surface of the cylindrical substrate is coated with wax; after the wax is coated, the wafer is placed at the center of the top surface of the cylindrical substrate; the heating station is then cooled to solidify the wax to hold the wafer in a centered position on the top surface of the cylindrical substrate.

Patent number CN202023335049.2 discloses a tool for wafer paster, and the cover is located outside the cylindrical basement, including cylindric side wall board and ring form top cap, the top edge of cylindric side wall board links together with the outer circumference edge of ring form top cap, and the bore of cylindric side wall board slightly is greater than the diameter of the bottom surface of cylindrical basement, and the diameter of the interior circle of ring form top cap slightly is greater than the diameter of wafer, leaves the clearance between the bottom of ring form top cap and the upper bottom surface of cylindrical basement, and the height of this clearance is less than the thickness of wafer. According to the jig for wafer surface mounting, the placement positions of the wafers are limited, and the sizes of the positions are reasonably set in design, so that the wafers can be aligned to the center of the upper bottom surface of the cylindrical substrate when being placed from the opening of the inner circle of the circular top cover, the working efficiency of the wafer surface mounting is improved, the chips do not need to be repeatedly moved on the upper bottom surface of the cylindrical substrate, and the surface of the wafers is not scratched easily.

Currently, there are some drawbacks to the existing wafer bonding apparatus, such as; in the existing wafer patch device, the placement position of a wafer is limited, and the wafer is placed to the center position of the top surface of a cylindrical substrate after the wax is coated in the actual use process; and then the heating table is cooled to solidify the wax so that the wafer is fixed at the center of the top surface of the cylindrical substrate, and the surface mounting device is required to be provided with a cooling device and a heating device respectively, and the cooling device and the heating device are driven respectively, so that energy is wasted very much.

Disclosure of Invention

An object of the present application is to provide a wafer bonding apparatus, which solves the problem set forth in the background art.

In order to achieve the above purpose, the present application provides the following technical solutions: a wafer patch device comprises a semiconductor refrigeration piece, a round substrate and a cross laser emission head,

the semiconductor refrigerating sheet is positioned in a square hole formed in the top of the fixed plate;

a groove is formed in one side of the inside of the square hole, one end of a bearing is fixedly connected in the groove, the other end of the bearing is rotationally connected with a rotary rod, and one end of the rotary rod, which is far away from the bearing, is fixedly connected with a semiconductor refrigerating sheet;

one end of the semiconductor refrigerating sheet, which is far away from the rotary rod, is fixedly connected with a motor shaft, and one side of the motor shaft penetrates through the fixed plate and the circular shell to be connected with a motor;

the circular substrate is positioned in a circular groove formed in the top of the circular shell, and a plurality of round holes are formed in the bottom end of the inside of the circular groove.

In the technical scheme, the motor shaft can be utilized to rotate the semiconductor refrigerating sheet, so that the cold end and the hot end of the semiconductor refrigerating sheet are switched to respectively refrigerate and heat the round substrate, refrigeration and heating equipment can be omitted, and energy sources are saved.

As an alternative to the technical solution of the application, the top of the cross laser emission head is connected with a device top plate by adopting a screw.

In the technical scheme, the cross laser can be emitted to the center position of the circular substrate by using the cross laser emitting head, so that the center point of the surface of the circular substrate can be found in the process of pasting rapidly.

As an alternative scheme of this application technical scheme, device roof bottom four corners all adopts the screw connection to have the bracing piece, the bracing piece bottom adopts the screw connection to have the device bottom plate.

As an alternative of the technical scheme of the application, a motor protecting cover is connected to one side, far away from a motor shaft, of the motor by a screw, and a round shell is connected to one side of the motor protecting cover by a screw.

As an alternative of the technical scheme, the bottom of the round shell is connected with a device bottom plate by adopting screws.

Compared with the prior art, the beneficial effects of the application are as follows:

1. according to the semiconductor refrigerating sheet and the motor shaft on the semiconductor refrigerating sheet, the semiconductor refrigerating sheet can be rotated by the motor shaft, so that the cold end and the hot end of the semiconductor refrigerating sheet are switched, the round substrate is respectively refrigerated and heated, the refrigeration and heating equipment can be omitted, and energy sources are saved.

2. According to the cross laser emitting head, the cross laser can be emitted to the center of the round substrate by the cross laser emitting head, so that the center point of the surface of the round substrate can be found in the process of pasting rapidly.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the accompanying drawings in which:

FIG. 1 is a view of a wafer bonding apparatus in a wafer housing;

fig. 2 is a top view of a fixing plate of a wafer bonding apparatus according to the present application.

In the figure: 1. a device base plate; 101. a support rod; 102. a device top plate; 2. a round shell; 201. a motor protection cover; 202. a motor; 203. a motor shaft; 204. square holes; 205. a semiconductor refrigeration sheet; 206. a groove; 207. a rotating rod; 208. a bearing; 209. a circular groove; 210. a round hole; 211. a circular base; 3. a cross laser emitting head.

Detailed Description

Referring to fig. 1-2, the present application provides a technical solution: the wafer patch device comprises a device bottom plate 1, a round shell 2 is connected to the middle of the top end of the device bottom plate 1 through screws, a fixing plate is fixedly connected to the inside of the round shell 2, a square hole 204 is formed in the surface of the fixing plate, a groove 206 is formed in one side of the inside of the square hole 204, one end of a bearing 208 is fixedly connected to the inside of the groove 206, a motor protection cover 201 is connected to one side of the round shell 2 through screws, a motor 202 is connected to one side of the motor 202, one side of the motor 203, which is far away from the motor 202, penetrates through the round shell 2 and the fixing plate and is located in the square hole 204, a semiconductor refrigeration piece 205 for heating and refrigerating a substrate is fixedly connected to one end of the motor 203, which is far away from the motor shaft 203, a rotary rod 207 is fixedly connected to one end of the rotary rod 207, which is far away from the semiconductor refrigeration piece 205, is rotatably connected with a bearing 208, the semiconductor refrigeration piece 205 can be driven to rotate by the motor 202, so that the cold end and the hot end of the semiconductor refrigeration piece 205 can be switched, and the hot end of the semiconductor refrigeration piece 205 can be heated and cooled 211 are respectively;

round slot 209 has been seted up at circle shell 2 top, and the inside card in round slot 209 has been used for placing the circular base 211 of wafer, a plurality of round holes 210 have been seted up to circle slot 209 bottom, utilize round hole 210 can be with the contact of the interior steam of circle shell 2 and air conditioning and circular base 211 to quick heating and cooling to circular base 211.

Referring to fig. 1, four corners of the top of the bottom plate 1 of the device are all connected with supporting rods 101 by screws, the tops of the supporting rods 101 are connected with a top plate 102 by screws, a cross laser emitting head 3 for performing center positioning is connected with the middle of the bottom end of the top plate 102 by screws, and the cross laser can be rapidly and centrally positioned by using the cross laser emitting head 3 to emit cross laser on the surface of a circular substrate.

When the wafer surface mounting device is used, firstly, a round substrate 211 is placed into a round groove 209, then, a motor 202 is started, the motor 202 drives a motor shaft 203, the motor shaft 203 drives a semiconductor refrigeration piece 205 to be switched to a hot end, the hot end of the semiconductor refrigeration piece 205 is used for heating the round substrate 211, the round substrate 211 is heated to 100 ℃, then, the top surface of the round substrate is coated with wax, after the wax is coated, a cross laser emitting head 3 is started, the cross laser emitting head 3 is used for projecting cross laser on the surface of the round substrate 211, the center of the top of the round substrate 211 is positioned, after the positioning is finished, the motor 202 is started, the motor 202 drives the semiconductor refrigeration piece 205 to rotate, the semiconductor refrigeration piece 205 is switched to a cold end, and the wax is solidified, so that the wafer is fixed at the center of the top surface of the round substrate 211.

Claims

1. Wafer paster device, including semiconductor refrigeration piece (205), circular basement (211) and cross laser emission head (3), its characterized in that:

the semiconductor refrigerating sheet (205) is positioned in a square hole (204) formed in the top of the fixed plate;

a groove (206) is formed in one side of the inside of the square hole (204), one end of a bearing (208) is fixedly connected in the groove (206), the other end of the bearing (208) is rotatably connected with a rotating rod (207), and one end, far away from the bearing (208), of the rotating rod (207) is fixedly connected with a semiconductor refrigerating sheet (205);

one end of the semiconductor refrigerating sheet (205) far away from the rotary rod (207) is fixedly connected with a motor shaft (203), and one side of the motor shaft (203) penetrates through the fixed plate and the round shell (2) to be connected with a motor (202);

the round base (211) is positioned in a round groove (209) formed in the top of the round shell (2), and a plurality of round holes (210) are formed in the bottom end of the inside of the round groove (209).

2. The wafer bonding apparatus of claim 1, wherein: the top of the cross laser emission head (3) is connected with a device top plate (102) by adopting a screw.

3. A wafer bonding apparatus according to claim 2, wherein: the four corners of the bottom of the device top plate (102) are connected with supporting rods (101) by screws, and the bottom of each supporting rod (101) is connected with a device bottom plate (1) by screws.

4. The wafer bonding apparatus of claim 1, wherein: one side of the motor (202) far away from the motor shaft (203) is connected with a motor protection cover (201) by adopting a screw, and one side of the motor protection cover (201) is connected with a round shell (2) by adopting a screw.

5. The wafer bonding apparatus of claim 1, wherein: the bottom of the round shell (2) is connected with a device bottom plate (1) by adopting a screw.