CN218989446U - Chemical copper electroplating device - Google Patents
Chemical copper electroplating device Download PDFInfo
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- CN218989446U CN218989446U CN202223490438.1U CN202223490438U CN218989446U CN 218989446 U CN218989446 U CN 218989446U CN 202223490438 U CN202223490438 U CN 202223490438U CN 218989446 U CN218989446 U CN 218989446U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
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Abstract
The utility model discloses a chemical copper electroplating device which comprises an electroplating box, wherein a rotary driving piece is fixed at the center of the lower stool surface of the electroplating box, a rotary shaft is rotatably arranged at the output end of the rotary driving piece, a movable plate is fixed at the top end of the rotary shaft, sliding blocks are fixed at the edge of the lower surface of the movable plate, and four stirring plates are symmetrically arranged on the upper surface of the movable plate. According to the utility model, the rotary driving piece drives the rotary shaft to rotate, and the rotary shaft drives the movable plate to slide along the annular sliding rail through the sliding block, so that the movable plate drives the stirring plate to stir electrolyte solution in the electroplating tank, the electrolyte solution in the electroplating tank is in a flowing state, and the copper plating thickness on the surface of a workpiece is more uniform, thereby improving the workpiece performance, improving the workpiece qualification rate, avoiding reworking of the workpiece, avoiding waste of electroplating materials during electroplating processing of a chemical copper electroplating device, and better reducing the electroplating processing cost.
Description
Technical Field
The utility model relates to the technical field of chemical copper electroplating, in particular to a chemical copper electroplating device.
Background
The electroplating is a process of plating a layer of other metals or alloys on the surface of the metal by utilizing the electrolysis principle, and is a process of adhering a layer of metal film on the surface of the metal or other material parts by utilizing the electrolysis so as to play roles of preventing the metal from oxidizing, improving the wear resistance, conductivity, reflectivity, corrosion resistance, improving the appearance and the like of the metal.
The chemical copper electroplating device is generally composed of an electroplating box, a control panel, an electric cabinet, electrode lugs and a commodity shelf, and in operation, a workpiece is placed in the commodity shelf, then a plant shelf is conveyed into the commodity shelf through a sliding rod, and then the electric oven is controlled by the control panel to electrify the electrode lugs, so that electrolyte solution in the commodity shelf is used for copper plating the surface of the workpiece in the commodity shelf, but the inventor finds that the following defects still exist after working effort:
when the existing chemical copper electroplating device is used for copper plating, electrolyte solution is usually in a static state, so that when copper is plated on the surface of a workpiece, copper plating thickness is uneven, the electroplating quality of the workpiece cannot reach the standard, the performance of the workpiece is affected, the workpiece is reworked, electroplating efficiency is low, electroplating materials are wasted, and electroplating processing cost is increased.
Disclosure of Invention
The utility model aims to provide a chemical copper electroplating device, which solves the problems that in the prior art, when the existing chemical copper electroplating device is used for plating copper, electrolyte solution is usually in a static state, so that when the surface of a workpiece is plated with copper, uneven copper plating thickness often occurs, the electroplating quality of the workpiece cannot reach the standard, the performance of the workpiece is affected, the workpiece is reworked, the electroplating efficiency is low, electroplating materials are wasted and the electroplating processing cost is increased.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a chemistry copper electroplating device, includes the electroplating tank, the center department of just following of electroplating tank is fixed with rotary driving spare, rotary driving spare's output rotary mounting has the rotation axis, the top of rotation axis is fixed with the movable plate, movable plate lower surface border department is fixed with the slider, just four stirring boards are installed to movable plate upper surface symmetry, just the inside upper surface of electroplating tank is fixed with annular slide rail, the outside slidable mounting and the slider inside of annular slide rail to rotary driving spare passes through the stirring board electric solution stirring on rotation axis drive movable plate top.
Further, as a technical scheme of the utility model, a fixing frame is fixed in the exhaust holes on two sides of the electroplating tank, an exhaust fan is fixed at one end of the fixing frame, an air filter assembly is fixed at the outer side of the exhaust holes on two sides of the electroplating tank, a honeycomb-shaped activated carbon filter plate is installed in the air filter assembly, a metal isolation net is installed in an installation groove at one end of the air filter assembly, a reinforcing plate is fixed at the bottom end of the air filter assembly, and one side of the reinforcing plate is fixed on the side face of the electroplating tank so that the honeycomb-shaped activated carbon filter plate can filter gas in the air filter assembly.
Further, as a technical scheme of the utility model, the two sides of the top end of the electroplating tank are fixedly provided with the brackets, the telescopic air cylinders are arranged in the top ends of the brackets, and the output ends of the telescopic air cylinders are movably provided with the telescopic rods, so that the telescopic air cylinders are fixed at the top end of the electroplating tank through the brackets.
Further, as a technical scheme of the utility model, a fixing sleeve is fixed outside the bottom end of the telescopic rod, and the two sides of the fixing sleeve are provided with the basket through the hanging ropes, so that the basket is fixed on the two sides of the fixing sleeve through the hanging ropes.
Further, as a technical scheme of the utility model, the bottom end of the electroplating tank is fixed with the supporting leg, and the front surface of the electroplating tank is fixed with the control panel so as to control the electroplating device to work through the control panel on the front surface of the electroplating tank.
Further, as a technical scheme of the utility model, one side of the bottom end of the electroplating tank is fixed with a first electric control box, and the other side of the bottom end of the electroplating tank is fixed with a second electric control box, so that the electric solution in the electroplating tank is electrified through the first electric control box and the second electric control box.
Compared with the prior art, the utility model has the beneficial effects that: the chemical copper electroplating device has the advantages of reasonable structure, convenient use, simple later maintenance and the following advantages;
(1) The rotary driving piece drives the rotary shaft to rotate, the rotary shaft drives the movable plate to slide along the annular sliding rail through the sliding block, so that the movable plate drives the stirring plate to stir electrolyte solution in the electroplating tank, the electrolyte solution in the electroplating tank is in a flowing state, the copper plating thickness on the surface of a workpiece is more uniform, the workpiece performance is improved, the workpiece qualification rate is improved, the reworking of the workpiece is avoided, meanwhile, the waste of electroplating materials during the electroplating processing of the chemical copper electroplating device is avoided, and the electroplating processing cost is better reduced;
(2) Four groups of air filter assemblies are symmetrically arranged at the top ends of two sides of the electroplating tank, and then the exhaust fan is fixed in the electroplating tank through the fixing frame, so that harmful gas generated when the exhaust fan is used for plating copper in the electroplating tank is pumped out and enters the air filter assemblies, and then the harmful gas is filtered and purified by the honeycomb-shaped activated carbon filter plates fixed in the air filter assemblies and then discharged, so that the external pollution of the harmful gas generated when the chemical copper electroplating device is used for electroplating is avoided, and the damage to the body of an operator is caused;
(3) Fix the top at the electroplating tank with flexible cylinder through the support, with telescopic link movable mounting in the bottom of flexible cylinder, then fix the outside in the telescopic link bottom with fixed sleeve for flexible cylinder passes through telescopic link drive fixed sleeve longitudinal movement, will put the thing basket through the lifting rope and install in fixed sleeve's both sides again, make fixed sleeve drive put thing basket longitudinal movement, so that realize automatic will put the inside work piece of thing basket and carry inside the inside electrolyte solution of electroplating tank, thereby improve the electroplating efficiency of chemical copper electroplating device.
Drawings
FIG. 1 is a schematic diagram of the front external structure of the present utility model;
FIG. 2 is a schematic diagram of the front internal structure of the present utility model;
FIG. 3 is a schematic side view of the exterior structure of the present utility model;
FIG. 4 is an enlarged schematic view of the structure of FIG. 2A according to the present utility model;
fig. 5 is an enlarged schematic view of the structure of fig. 2B according to the present utility model.
In the figure: 1. an electroplating box; 101. an annular slide rail; 2. support legs; 3. a bracket; 4. a telescopic cylinder; 5. a telescopic rod; 6. a fixed sleeve; 7. a basket for placing articles; 8. a control panel; 9. an air filter assembly; 10. a reinforcing plate; 11. a first electric control box; 12. a second electric control box; 13. a fixing frame; 14. an exhaust fan; 15. honeycomb activated carbon filter plate; 16. a metal isolation net; 17. a rotary driving member; 18. a rotation shaft; 19. a moving plate; 20. a slide block; 21. the agitation plate.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, an embodiment of the present utility model is provided: the chemical copper electroplating device comprises an electroplating box 1, wherein a rotary driving piece 17 is fixed at the center of the lower stool surface of the electroplating box 1, a rotary shaft 18 is rotatably installed at the output end of the rotary driving piece 17, a movable plate 19 is fixed at the top end of the rotary shaft 18, a sliding block 20 is fixed at the edge of the lower surface of the movable plate 19, four stirring plates 21 are symmetrically installed on the upper surface of the movable plate 19, an annular sliding rail 101 is fixed on the upper surface of the inside of the electroplating box 1, and the outside of the annular sliding rail 101 is slidably installed inside the sliding block 20;
when the electroplating device is used, the rotary shaft 18 is driven to rotate by the rotary driving piece 17, the rotary shaft 18 drives the movable plate 19 to slide along the annular sliding rail 101 through the sliding block 20, so that the movable plate 19 drives the stirring plate 21 to stir electrolyte solution in the electroplating tank 1, the electrolyte solution in the electroplating tank 1 is in a flowing state, and the copper plating thickness on the surface of a workpiece is more uniform;
as one embodiment of the utility model, a fixing frame 13 is fixed in the exhaust holes at two sides of the electroplating tank 1, an exhaust fan 14 is fixed at one end of the fixing frame 13, an air filter assembly 9 is fixed at the outer side of the exhaust holes at two sides of the electroplating tank 1, a honeycomb-shaped activated carbon filter plate 15 is arranged in the air filter assembly 9, a metal isolation net 16 is arranged in the installation groove at one end of the air filter assembly 9, a reinforcing plate 10 is fixed at the bottom end of the air filter assembly 9, and one side of the reinforcing plate 10 is fixed at the side surface of the electroplating tank 1;
when in use, the exhaust fan 14 is fixed on the two sides of the electroplating tank 1 through the fixing frame 13, so that the exhaust fan 14 conveys harmful gas in the electroplating tank 1 to the back of the air filter assembly 9, and then the harmful gas is purified through the honeycomb activated carbon filter plate 15 fixed in the air filter assembly 9;
as an implementation mode of the utility model, two sides of the top end of the electroplating tank 1 are fixed with brackets 3, a telescopic cylinder 4 is arranged in the top end of each bracket 3, and a telescopic rod 5 is movably arranged at the output end of each telescopic cylinder 4;
when in use, the telescopic cylinder 4 is fixed at the top end of the electroplating tank 1 through the bracket 3, so that the telescopic cylinder 4 drives the telescopic rod 5 to longitudinally move;
as one embodiment of the utility model, a fixed sleeve 6 is fixed outside the bottom end of the telescopic rod 5, and a basket 7 is arranged on two sides of the fixed sleeve 6 through a lifting rope;
when in use, the fixing sleeve 6 is fixed outside the bottom end of the telescopic rod 5, so that the fixing sleeve 6 can fix the basket 7 at the bottom of the telescopic rod 5 through the pull rope;
as one embodiment of the utility model, the bottom end of the electroplating tank 1 is fixed with a supporting leg 2, and the front surface of the electroplating tank 1 is fixed with a control panel 8;
when the electroplating device is used, the control panel 8 is fixed on the front surface of the electroplating box 1, so that the electroplating device is controlled to work through the control panel 8, then the supporting legs 2 are fixed at the bottom end of the electroplating box 1, and the electroplating box 1 is supported through the supporting legs 2, so that the electroplating device is more stable in working;
as one embodiment of the utility model, a first electric control box 11 is fixed on one side of the bottom end of the electroplating box 1, and a second electric control box 12 is fixed on the other side of the bottom end of the electroplating box 1;
when in use, the first electric control box 11 and the second electric control box 12 are respectively fixed at two sides of the bottom end of the electroplating box 1, so that the first electric control box 11 and the second electric control box 12 electrify the electric solution in the electroplating box 1 through the electrodes, thereby carrying out copper plating treatment on the surfaces of the workpieces.
When the embodiment of the application is used, the following steps are adopted: firstly, workpieces are placed in the basket 7, then the basket 7 is installed outside the fixed sleeve 6 through a lifting rope, the telescopic cylinder 4 drives the fixed sleeve 6 to longitudinally move through the telescopic rod 5, the fixed sleeve 6 drives the basket 7 to longitudinally move, the basket 7 drives the workpieces to enter the electrolyte solution inside the stirring plate 21, then the first electric control box 11 and the second electric control box 12 are controlled to be electrified through the control panel 8, the electrolyte solution inside the electroplating box 1 is electrified through electrode lugs at one ends of the first electric control box 11 and the second electric control box 12, copper plating treatment is conducted on the surfaces of the workpieces inside the basket 7, then the exhaust fan 14 fixed inside the electroplating box 1 is controlled to be started through the control panel 8, harmful gas generated when the exhaust fan 14 is used for copper plating inside the electroplating box 1 is conveyed into the air filter assembly 9, and then the honeycomb-shaped activated carbon filter plate 15 inside the air filter assembly 9 is used for purifying and filtering the harmful gas and then discharging the harmful gas, so that the use of the chemical copper electroplating device is completed.
The embodiments of the present utility model have been shown and described for the purpose of illustration and description, it being understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made therein by one of ordinary skill in the art without departing from the scope of the utility model.
Claims (6)
1. A chemical copper electroplating device, comprising an electroplating tank (1), characterized in that: the center department of just following face of electroplating tank (1) is fixed with rotary driving piece (17), rotary driving piece (17) output rotary mounting has rotation axis (18), the top of rotation axis (18) is fixed with movable plate (19), movable plate (19) lower surface border department is fixed with slider (20), just four stirring boards (21) are installed to movable plate (19) upper surface symmetry, just the inside upper surface of electroplating tank (1) is fixed with annular slide rail (101), the outside slidable mounting of annular slide rail (101) is inside with slider (20).
2. A chemical copper plating apparatus according to claim 1, wherein: the inside of electroplating tank (1) both sides exhaust hole is fixed with mount (13), the one end of mount (13) is fixed with air exhauster (14), the outside of electroplating tank (1) both sides exhaust hole is fixed with air cleaner subassembly (9), the internally mounted of air cleaner subassembly (9) has cellular activated carbon filter board (15), just the internally mounted of air cleaner subassembly (9) one end mounting groove has metal isolation net (16), just the bottom mounting of air cleaner subassembly (9) has reinforcing plate (10), one side of reinforcing plate (10) is fixed in electroplating tank (1) side.
3. A chemical copper plating apparatus according to claim 1, wherein: the electroplating device is characterized in that brackets (3) are fixed on two sides of the top end of the electroplating box (1), a telescopic cylinder (4) is mounted in the top end of the brackets (3), and a telescopic rod (5) is movably arranged at the output end of the telescopic cylinder (4).
4. A chemical copper plating apparatus according to claim 3, wherein: the outer part of the bottom end of the telescopic rod (5) is fixedly provided with a fixed sleeve (6), and two sides of the fixed sleeve (6) are provided with a storage basket (7) through a lifting rope.
5. A chemical copper plating apparatus according to claim 1, wherein: the bottom end of the electroplating box (1) is fixed with supporting legs (2), and the front surface of the electroplating box (1) is fixed with a control panel (8).
6. A chemical copper plating apparatus according to claim 1, wherein: one side of the bottom end of the electroplating box (1) is fixed with a first electric control box (11), and the other side of the bottom end of the electroplating box (1) is fixed with a second electric control box (12).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223490438.1U CN218989446U (en) | 2022-12-27 | 2022-12-27 | Chemical copper electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223490438.1U CN218989446U (en) | 2022-12-27 | 2022-12-27 | Chemical copper electroplating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218989446U true CN218989446U (en) | 2023-05-09 |
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ID=86193695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223490438.1U Active CN218989446U (en) | 2022-12-27 | 2022-12-27 | Chemical copper electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218989446U (en) |
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2022
- 2022-12-27 CN CN202223490438.1U patent/CN218989446U/en active Active
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