CN218975457U - Optoelectronic chip packaging mechanism - Google Patents

Abstract

The utility model discloses an optoelectronic chip packaging mechanism, in particular to the technical field of optoelectronic chip packaging, which comprises a chip body and a heat dissipation frame, wherein the surface of the chip body is fixedly connected with a resin plastic layer, both sides of the resin plastic layer are fixedly connected with electrode connectors, the bottom of the chip body is provided with a heat dissipation device, the top of the chip body is provided with a supporting device, the supporting device comprises a rectangular frame, and the inner wall of the rectangular frame is fixedly connected with a plurality of top plates.

Description

Optoelectronic chip packaging mechanism

Technical Field

The utility model relates to the technical field of optoelectronic chip packaging, in particular to an optoelectronic chip packaging mechanism.

Background

The chip packaging technology is a technology for wrapping the chip to avoid the contact between the chip and the outside and prevent the damage of the outside to the chip, and impurities and bad gases in the air, and even water vapor, can corrode a precise circuit on the chip, thereby causing the reduction of electrical performance.

The inventor finds that the chip package mostly adopts the heat dissipation frame in daily work, then discharges the heat that the chip produced through the heat dissipation frame, but in the in-process that the heat dissipation frame dispels the heat to the chip, the heat that produces because the chip is higher probably can cause the condition that the heat extraction effect is not good.

In order to solve the problem that the heat dissipation frame can not be discharged because of higher heat of a chip, the prior art adopts a mode of fixing water-cooling heat dissipation on one side of the heat dissipation frame, but the heat dissipation frame is connected with the water-cooling heat dissipation joint through heat conduction silica gel, the situation that the heat conduction silica gel can not be removed when entering the inner wall of the heat dissipation frame possibly occurs, the inner wall of the heat dissipation frame is caused to block and reduce the heat dissipation effect, and then the problem of imperfect gas with higher heat discharge is caused.

Disclosure of Invention

The utility model provides an optoelectronic chip packaging mechanism, which aims to solve the problem that a heat dissipation frame cannot discharge high heat of a chip, adopts a mode of fixing water cooling heat dissipation on one surface of the heat dissipation frame to process, but is connected with a water cooling heat dissipation joint by heat conduction silica gel, and the situation that the heat conduction silica gel cannot be removed when entering the inner wall of the heat dissipation frame possibly occurs, so that the inner wall of the heat dissipation frame causes the reduction of a blocking heat dissipation effect, and further the problem of imperfect gas with high heat discharge is caused.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides an optoelectronic chip packaging mechanism, includes chip body and heat dissipation frame, the fixed surface of chip body is connected with the resin plastic layer, the equal fixedly connected with electrode connector in both sides of resin plastic layer, the bottom of chip body is provided with heat abstractor, and the top of chip body is provided with strutting arrangement, strutting arrangement includes the rectangle frame, the inner wall fixedly connected with a plurality of roof of rectangle frame.

The effects achieved by the components are as follows: through setting up strutting arrangement for the heat conduction silicone grease that heat dissipation frame and water-cooling heat dissipation are connected and are used can not flow into the inner wall of heat dissipation frame and cause the circumstances that the radiating effect of heat dissipation frame descends, and under the effect of roof, make the heat conduction silicone grease can paint on the surface of heat dissipation frame, improve with water-cooling heat dissipation's area of contact, reduce water-cooling heat dissipation and heat dissipation frame and be connected unstable and lead to unable to carry out the condition of discharging to high heat.

Preferably, the bottom both ends of the roof that are close to rectangle frame both sides all fixedly connected with bracing piece, the bottom fixedly connected with rectangle piece of bracing piece.

The effects achieved by the components are as follows: through setting up bracing piece and rectangular piece for the bracing piece can support the roof, makes the roof can keep horizontal position with the top of heat dissipation frame.

Preferably, a first threaded through hole is formed in one side of the rectangular block, a bolt is connected to the inner wall of the first threaded through hole in a threaded mode, a second threaded through hole is formed in one side of the heat dissipation frame, and the surface size and shape of the bolt are matched with the inner wall size and shape of the second threaded through hole.

The effects achieved by the components are as follows: through setting up first screw thread through-hole and second screw thread through-hole for the inside of first screw thread through-hole and second screw thread through-hole can be rotated into to the bolt, reaches the spacing effect to the rectangle piece.

Preferably, one end of the bolt is fixedly connected with an operation block, and two sides of the rectangular frame are fixedly connected with auxiliary plates.

The effects achieved by the components are as follows: through setting up the accessory plate for the accessory plate can drive the rectangle frame and reciprocate, and under the effect that sets up two accessory plates, makes the rectangle frame both sides can be lifted simultaneously.

Preferably, the heat dissipating device comprises heat conducting silica gel, one end of the heat conducting silica gel is fixedly connected with the chip body, one end of the heat conducting silica gel is fixedly connected with the heat dissipating frame, a plurality of heat dissipating grooves are formed in the top of the heat dissipating frame, and a plurality of top plates are arranged in the heat dissipating grooves.

The effects achieved by the components are as follows: through setting up heat abstractor for the heat accessible heat conduction silica gel that the chip body produced in the use is discharged with the heat dissipation frame, and under the effect of heat dissipation groove, the inside heat of messenger's heat dissipation frame can be faster discharge.

Preferably, the bottom fixedly connected with thermal-insulated cotton of heat dissipation frame, the chip body sets up in thermal-insulated cotton's inside.

The effects achieved by the components are as follows: through setting up thermal-insulated cotton for the heat that the chip body produced reduces outside giving off, improves the contact of heat and heat dissipation frame, makes the heat follow the heat dissipation frame and discharges and give off.

Preferably, the top of the heat dissipation frame is provided with a round through hole, and the top of the heat dissipation frame is provided with an air inlet.

The effects achieved by the components are as follows: through setting up round through-hole and air intake for the inside effect that can reach ventilation exhaust gas of heat dissipation frame, the heat to the chip body production gives off more effectively, has improved the radiating efficiency of heat dissipation frame.

In summary, the beneficial effects of the utility model are as follows:

through setting up strutting arrangement for the heat conduction silicone grease that heat dissipation frame and water-cooling heat dissipation are connected and are used can not flow into the inner wall of heat dissipation frame and cause the circumstances that the radiating effect of heat dissipation frame descends, and under the effect of roof, make the heat conduction silicone grease can paint on the surface of heat dissipation frame, improve with water-cooling heat dissipation's area of contact, reduce water-cooling heat dissipation and heat dissipation frame and be connected unstable and lead to unable to carry out the condition of discharging to high heat.

Drawings

Fig. 1 is a schematic diagram of a partial structure of a chip body according to the present utility model.

Fig. 2 is a schematic partial structure of a rectangular frame of the present utility model.

Fig. 3 is a schematic view of a partial structure of the support bar of the present utility model.

Fig. 4 is a schematic view of a partial structure of the heat insulation cotton of the present utility model.

Reference numerals illustrate:

1. a chip body; 2. a support device; 21. a rectangular frame; 22. a top plate; 23. an auxiliary plate; 24. a support rod; 25. rectangular blocks; 26. a first threaded through hole; 27. a bolt; 28. an operation block; 29. a second threaded through hole; 3. a heat sink; 31. thermally conductive silica gel; 32. thermal insulation cotton; 33. a circular through hole; 34. an air inlet; 35. a heat sink; 4. a resin plastic layer; 5. an electrode connector; 6. and a heat dissipation frame.

Detailed Description

Referring to fig. 1 and 2, this embodiment discloses an optoelectronic chip packaging mechanism, including chip body 1 and heat dissipation frame 6, chip body 1's fixed surface is connected with resin plastic layer 4, the equal fixedly connected with electrode connector 5 in both sides of resin plastic layer 4, chip body 1's bottom is provided with heat abstractor 3, chip body 1's top is provided with strutting arrangement 2, strutting arrangement 2 includes rectangular frame 21, rectangular frame 21's inner wall fixedly connected with a plurality of roof 22, through setting up strutting arrangement 2, make the heat conduction silicone grease that heat dissipation frame 6 and water-cooling heat dissipation are connected can not flow into the inner wall of heat dissipation frame 6 and cause the condition that heat dissipation frame 6's radiating effect descends, and under the effect of roof 22, make the heat conduction silicone grease can paint on heat dissipation frame 6's surface, improve the area of contact with water-cooling heat dissipation, reduce water-cooling heat dissipation and heat dissipation frame 6 and be connected unstable and lead to unable the condition that carries out the discharge to high heat.

Referring to fig. 2 and 3, this embodiment discloses that the bottom both ends of roof 22 that are close to both sides of rectangular frame 21 are all fixedly connected with bracing piece 24, the bottom fixedly connected with rectangle piece 25 of bracing piece 24, through setting up bracing piece 24 and rectangle piece 25, make bracing piece 24 can support roof 22, make roof 22 can keep horizontal position with the top of heat dissipation frame 6, first screw thread through-hole 26 has been seted up to one side of rectangle piece 25, the inner wall threaded connection of first screw thread through-hole 26 has bolt 27, second screw thread through-hole 29 has been seted up to one side of heat dissipation frame 6, the surface size and the shape of bolt 27 and the inner wall size and the shape looks adaptation of second screw thread through-hole 29, through setting up first screw thread through-hole 26 and second screw thread through-hole 29, make bolt 27 can rotate into the inside of first screw thread through-hole 26 and second screw thread through-hole 29, reach the spacing effect to rectangle piece 25.

Referring to fig. 2 and 3, this embodiment discloses that one end of a bolt 27 is fixedly connected with an operation block 28, two sides of a rectangular frame 21 are fixedly connected with auxiliary plates 23, by arranging the auxiliary plates 23, the auxiliary plates 23 can drive the rectangular frame 21 to move up and down, and under the action of arranging two auxiliary plates 23, two sides of the rectangular frame 21 can be lifted simultaneously.

Referring to fig. 4, this embodiment discloses heat abstractor 3 including heat conduction silica gel 31, the one end and the chip body 1 fixed connection of heat conduction silica gel 31, the one end and the heat dissipation frame 6 fixed connection of heat conduction silica gel 31, a plurality of heat dissipation groove 35 has been seted up at the top of heat dissipation frame 6, a plurality of roof 22 sets up the inside at a plurality of heat dissipation groove 35, through setting up heat abstractor 3 for the heat that chip body 1 produced in the use accessible heat conduction silica gel 31 and heat dissipation frame 6 are discharged, and under the effect of heat dissipation groove 35, make the inside heat of heat dissipation frame 6 discharge more fast.

Referring to fig. 4, this embodiment discloses thermal insulation cotton 32 of bottom fixedly connected with of heat dissipation frame 6, chip body 1 sets up in thermal insulation cotton 32's inside, through setting up thermal insulation cotton 32 for the heat that chip body 1 produced reduces outside giving off, improves the contact of heat and heat dissipation frame 6, makes the heat follow heat dissipation frame 6 and discharges and give off, and round through hole 33 has been seted up at the top of heat dissipation frame 6, and air intake 34 has been seted up at the top of heat dissipation frame 6, through setting up round through hole 33 and air intake 34, makes the inside effect that can reach ventilation exhaust gas of heat dissipation frame 6, gives off the heat that produces to chip body 1 more effectively, has improved the radiating efficiency of heat dissipation frame 6.

The working principle is as follows: when needs encapsulate chip body 1, wrap up chip body 1's top and all around through resin plastic layer 4 this moment, scribble heat conduction silica gel 31 at chip body 1's the back this moment, then remove chip body 1 for chip body 1 and the laminating of the bottom of heat dissipation frame 6, and then make heat conduction silica gel 31 and heat dissipation frame 6 adhesion, the adhesion is wrapped up chip body 1's a week at the thermal-insulated cotton 32 of heat dissipation frame 6 bottom this moment, carries out electric connection by electrode connector 5 butt joint chip body 1 and external again, accomplishes the encapsulation to chip body 1 this moment.

When the chip body 1 generates more heat to cause the heat dissipation frame 6 to be unable to effectively dispel the heat, remove the auxiliary plate 23 this moment, make the auxiliary plate 23 drive rectangular frame 21 and remove, make rectangular frame 21 drive roof 22 and remove, make roof 22 drive bracing piece 24 and remove, make bracing piece 24 drive rectangular piece 25 and remove, when rectangular piece 25 remove to the bottom laminating with cooling trough 35, make first screw thread through-hole 26 and second screw thread through-hole 29 coincide, rotate operation piece 28 this moment, make operation piece 28 drive bolt 27 rotate, when bolt 27 rotates into the inside of first screw thread through-hole 26 and second screw thread through-hole 29, accomplish the fixed to rectangular piece 25, this moment is under the effect of bracing piece 24, make roof 22 and the top of heat dissipation frame 6 be horizontal position, at this moment scribble heat conduction silicone grease at roof 22 and the top of heat dissipation frame 6, this moment is through heat conduction silicone grease and heat dissipation frame 6 adhesion, this moment, accomplish the higher radiating effect to chip body 1 heat.

Claims (7)

1. An optoelectronic chip packaging mechanism comprises a chip body (1) and a heat dissipation frame (6), and is characterized in that: the surface fixing of chip body (1) is connected with resin plastic layer (4), the equal fixedly connected with electrode connector (5) in both sides of resin plastic layer (4), the bottom of chip body (1) is provided with heat abstractor (3), and the top of chip body (1) is provided with strutting arrangement (2), strutting arrangement (2) include rectangle frame (21), the inner wall fixedly connected with a plurality of roof (22) of rectangle frame (21).

2. An optoelectronic chip packaging mechanism as recited in claim 1, wherein: the two ends of the bottom of the top plate (22) at two sides of the rectangular frame (21) are fixedly connected with supporting rods (24), and the bottoms of the supporting rods (24) are fixedly connected with rectangular blocks (25).

3. An optoelectronic chip packaging mechanism as claimed in claim 2 wherein: a first threaded through hole (26) is formed in one side of the rectangular block (25), a bolt (27) is connected with the inner wall of the first threaded through hole (26) in a threaded mode, a second threaded through hole (29) is formed in one side of the radiating frame (6), and the surface size and shape of the bolt (27) are matched with the inner wall size and shape of the second threaded through hole (29).

4. An optoelectronic chip packaging mechanism according to claim 3, wherein: one end of the bolt (27) is fixedly connected with an operation block (28), and two sides of the rectangular frame (21) are fixedly connected with auxiliary plates (23).

5. An optoelectronic chip packaging mechanism as recited in claim 1, wherein: the heat dissipation device (3) comprises heat conduction silica gel (31), one end of the heat conduction silica gel (31) is fixedly connected with the chip body (1), one end of the heat conduction silica gel (31) is fixedly connected with the heat dissipation frame (6), a plurality of heat dissipation grooves (35) are formed in the top of the heat dissipation frame (6), and a plurality of top plates (22) are arranged in the heat dissipation grooves (35).

6. An optoelectronic chip packaging mechanism as recited in claim 5, wherein: the bottom of heat dissipation frame (6) fixedly connected with thermal-insulated cotton (32), chip body (1) set up in thermal-insulated cotton (32) inside.

7. An optoelectronic chip packaging mechanism as recited in claim 6, wherein: the top of the heat dissipation frame (6) is provided with a round through hole (33), and the top of the heat dissipation frame (6) is provided with an air inlet (34).

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