CN218973675U

CN218973675U - Temperature sensor

Info

Publication number: CN218973675U
Application number: CN202223215024.8U
Authority: CN
Inventors: 张晟; 刘泽伟; 闵令宝; 李�浩; 王澜锦; 王会锦
Original assignee: Siemens Ltd China
Current assignee: Siemens Ltd China
Priority date: 2022-11-30
Filing date: 2022-11-30
Publication date: 2023-05-05
Anticipated expiration: 2032-11-30

Abstract

The utility model relates to a temperature sensor comprising: the temperature measuring device comprises a shell, a power taking coil, a temperature measuring probe, an antenna and a circuit board, wherein the power taking coil, the temperature measuring probe, the antenna and the circuit board are contained in the shell; the signal processing circuit of the circuit board is used for processing the signals acquired by the temperature measuring probe to obtain the temperature of the measuring target; the antenna is used for receiving an instruction from the outside of the temperature sensor and sending a signal to the outside, wherein the inside of the shell is divided into a first cavity and a second cavity by the heat insulation layer, the power taking coil and the temperature measuring probe are arranged in the first cavity of the shell, the antenna and the circuit board are arranged in the second cavity of the shell, and the temperature measuring probe is connected with the circuit board through a data line. According to the temperature sensor of the present utility model, a lower level MCU can be used to save costs, while the maximum operating temperature of the sensor can be increased in the case of using the same MCU.

Description

Temperature sensor

Technical Field

The present disclosure relates generally to the field of switchgear technology, and more particularly, to a temperature sensor.

Background

Temperature is an important safety factor for a switchgear or other electrical cabinet. Overload due to grid faults, poor mechanical connections of the bus bars, cables, and changes in the contact state of the switchgear can all cause abnormal increases in temperature, which can be observed by temperature sensors. On the other hand, a "smart grid" has been proposed for several years, and a smart device with a sensing system of thermal, electrical and even mechanical characteristics is critical to the realization that a "smart grid" provides sufficient data.

As a mature technology, wireless sensors employing inductive power (CT) technology are widely used in existing products.

Sensors with embedded temperature probes or temperature sensing substrates are currently the most common products on the market.

Since the sensor body needs to be mounted on a measurement target, such as a copper plate or bus bar, and is the hottest point, key chips of the sensor, such as an MCU, need to operate at high temperatures, and thus the maximum operating temperature of these key chips limits the maximum operating temperature of the sensor.

There are two typical wireless temperature sensor products on the market today.

A first aspect is a temperature sensor having a temperature sensing substrate.

Most of the temperature sensor products on the market today employ this arrangement, the substrate is made of a thin stainless steel plate, which is in contact with the surface of the measurement target. The temperature sensing chip is positioned at the bottom of the PCB and is connected with the substrate through the heat conducting column so as to obtain the target temperature.

Such a sensor has the following two problems.

In order to obtain an accurate temperature of the target surface, the temperature difference between the substrate and the temperature sensing point of the PCB needs to be as small as possible, while the substrate will also conduct heat to the PCB. Furthermore, the PCB needs to operate at a high temperature in consideration of the heat conducted by the induction power take-off coil, and the maximum measured temperature is limited by the maximum allowable temperature of the MCU (main control unit) on the PCB.

With respect to the accuracy problem, the thermal conductivity of the thin stainless steel plate in the direction of the plate surface development is relatively low, so that accurate temperature sensing can be obtained only at the location of the thermally conductive pillars. That is, it is difficult to measure an accurate temperature for the point contact surface and the line contact surface.

Scheme II, sensor with embedded temperature probe

In the prior art, an embedded temperature probe is located at the bottom of the sensor body, and a spring is used to provide a stable contact force for measurement. The stable contact force and direct measurement by the probe can achieve a higher accuracy than the sensor in scheme one. The target temperature of 150 ℃ can be measured in the existing product.

Also, when the sensor measures the temperature of the measurement target, heat is also transferred to the PCB, the PCB needs to operate at a high temperature, the maximum measurement temperature that the sensor can measure is limited by the maximum allowable temperature of the MCU (main control unit) on the PCB, and if the MCU with a higher maximum allowable temperature is selected, the cost of the sensor is higher.

Disclosure of Invention

The following presents a simplified summary of the utility model in order to provide a basic understanding of some aspects of the utility model. It should be understood that this summary is not an exhaustive overview of the utility model. It is not intended to identify key or critical elements of the utility model or to delineate the scope of the utility model. Its purpose is to present some concepts in a simplified form as a prelude to the more detailed description that is discussed later.

In view of this, the present utility model proposes to disclose a temperature sensor with a novel structural design, which reduces the ambient temperature of the PCB circuit board, thereby enabling high temperature applications.

According to one aspect of the present disclosure, there is provided a temperature sensor comprising: the shell, and the power taking coil, the temperature measuring probe, the antenna and the circuit board which are accommodated in the shell,

the power take-off coil is used for supplying power to the temperature sensor,

the temperature measuring probe extends out of the surface of the shell and is used for collecting signals representing the temperature of a measuring target;

the signal processing circuit of the circuit board is used for processing the signals acquired by the temperature measuring probe to obtain the temperature of the measuring target;

the antenna is used for receiving the instruction from the outside of the temperature sensor and sending a signal to the outside,

wherein,,

the inside first cavity and the second cavity that divide into by the insulating layer of casing, get electric coil with temperature probe sets up the first cavity of casing, the antenna with the circuit board sets up in the second cavity of casing, temperature probe with connect through the data line between the circuit board.

In this way, the low temperature chamber and the high temperature chamber are separated in the shell of the sensor, and the layout of elements in the shell is optimized, so that the temperature of the PCB can be reduced. Lower grade MCUs may be used to save costs, while the maximum operating temperature of the sensor may be increased with the same MCUs.

Optionally, in one example of the above aspect, the insulating layer includes 5 faces or 6 faces.

In this way, an appropriate insulation layer structure can be selected as required.

Optionally, in one example of the above aspect, the thermal insulation layer is made of a thermal insulation material.

In this way, a suitable insulating material can be selected as needed to obtain a better insulating effect.

Optionally, in one example of the above aspect, the interior of the housing employs a vacuum.

In this way, a better heat insulation effect can be obtained.

Optionally, in one example of the above aspect, the temperature probe encapsulates a temperature measuring element, the temperature measuring element being a thermistor or thermocouple.

In this way, an appropriate temperature measuring element can be selected as required.

Optionally, in one example of the above aspect, the housing is made of an insulating material.

According to the temperature sensor provided by the utility model, the low-temperature chamber and the high-temperature chamber are separated in the shell of the sensor, and the layout of elements in the shell is optimized, so that the temperature of the PCB can be reduced. Lower grade MCUs may be used to save costs, while the maximum operating temperature of the sensor may be increased with the same MCUs.

Drawings

The above and other objects, features and advantages of the present utility model will be more readily understood by reference to the following description of the embodiments of the present utility model taken in conjunction with the accompanying drawings. The components in the figures are only to illustrate the principles of the present utility model. In the drawings, the same or similar technical features or components will be denoted by the same or similar reference numerals. In the accompanying drawings:

fig. 1 is a schematic structural view of a temperature sensor according to an embodiment of the present utility model.

Wherein, the reference numerals are as follows:

10: temperature sensor 102: shell body

104: the electricity taking coil 106: temperature measuring probe

108: antenna 110: circuit board

112: insulation layer 114: first chamber

116: a second chamber

Detailed Description

The subject matter described herein will now be discussed with reference to example embodiments. It should be appreciated that these embodiments are discussed only to enable a person skilled in the art to better understand and thereby practice the subject matter described herein, and are not limiting of the scope, applicability, or examples set forth in the claims. Changes may be made in the function and arrangement of elements discussed without departing from the scope of the disclosure. Various examples may omit, replace, or add various procedures or components as desired. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. In addition, features described with respect to some examples may be combined in other examples as well.

As used herein, the term "comprising" and variations thereof mean open-ended terms, meaning "including, but not limited to. The term "based on" means "based at least in part on". The terms "one embodiment" and "an embodiment" mean "at least one embodiment. The term "another embodiment" means "at least one other embodiment". The terms "first," "second," and the like, may refer to different or the same object. Other definitions, whether explicit or implicit, may be included below. Unless the context clearly indicates otherwise, the definition of a term is consistent throughout this specification.

The present utility model discloses a temperature sensor for high temperature applications that reduces the ambient temperature of a PCB circuit board through a novel structural design.

Fig. 1 is a schematic structural diagram of a temperature sensor 10 according to one embodiment of the present utility model.

As shown in fig. 1, the temperature sensor 10 includes: the temperature probe comprises a housing 102, an electricity taking coil 104, a temperature probe 106, an antenna 108 and a PCB circuit board 110 which are accommodated in the housing 102.

Wherein the power take-off coil 104 is used to power the temperature sensor 10.

The technical scheme of the utility model mainly aims at a wireless temperature sensor adopting an induction power taking technology, and therefore, the wireless temperature sensor comprises a power taking coil for supplying power to the sensor.

The temperature probe 106 protrudes from an opening in the housing 102 beyond the surface of the housing 102 for acquiring a signal indicative of the temperature of the measurement target.

Specifically, the temperature probe 106 encapsulates a temperature measuring element, which may be a thermistor or thermocouple, etc. Preferably, the housing of the temperature probe is made of a metal material, such as copper stamped nickel. The temperature measurement probe can adopt a modularized design, so that the switching of different functional components is facilitated.

Preferably, the power taking coil and the temperature probe assembly are both in a modularized design, and when the power taking coil and the temperature probe assembly are applied to different products, only the power taking coil assembly is required to be changed into a socket of a power supply, or the temperature probe assembly is required to be changed into a structural part of an external probe, so that the cost of different product variants can be reduced.

The signal processing circuit of the circuit board 110 can process the signals collected by the temperature measuring probe 106 to obtain the temperature of the measuring target.

The antenna 108 is used to receive an instruction from the outside of the temperature sensor 10 and to transmit a signal to the outside, for example, to transmit a measured temperature signal to the outside.

In the temperature sensor 10 according to the present utility model, the inside of the housing 10 is partitioned into a first chamber 114 and a second chamber 116 by a heat insulating layer 112 made of a heat insulating material. The electric pickup coil 104 and the temperature probe 106 are disposed in the first chamber 114, and the temperature probe 106 needs to contact the measurement target, so that the temperature in the first chamber 114 is high, and the first chamber can also be called a high-temperature chamber; the antenna 108 and the circuit board 11 are disposed in the second chamber 116, and since the second chamber 116 and the first chamber 114 are separated by a heat insulating layer, there is no thermal convection between the second chamber and the first chamber, and only very limited thermal conduction, the interior of the second chamber can be kept at a very low temperature, which can also be referred to as a low temperature chamber.

The temperature probe 106 in the first chamber 114 is connected to the circuit board 108 in the second chamber 116 by data lines (not shown).

The data wire is connected from the first chamber to the second chamber by two thin wires, such as grooves on the side surface of the shell, and is used for transmitting signals collected by the temperature measuring probe to the circuit board, and the signal processing circuit of the circuit board processes the signals to obtain the temperature of the measurement target.

The insulating layer 112 may include four sides disposed inside the second chamber 116 in addition to the barrier between the first chamber 114 and the second chamber 116. In this case, the five faces of the second chamber 116 are provided with insulation, only the upper face is not provided with insulation, and the upper face is used for heat dissipation in a steady state condition.

Alternatively, the insulating layer 112 may also include six faces disposed inside the second chamber 116. In this case, the circuit board 110 and the antenna 108 are arranged in a 6-sided closed thermal insulation layer, so that the duration before the temperature of the circuit board 108 is overheated increases significantly, in the case of electronic switch cabinet applications, it may take enough time to cut off the current before the temperature sensor is damaged.

Alternatively, a vacuum may be applied to the interior of the housing 102, which may further reduce heat transfer between the first and second chambers.

Wherein the housing 102 is made of an insulating material.

The temperature sensor according to the utility model has at least one of the following technical advantages:

the PCB circuit board is disposed on the upper portion of the sensor body, away from the heat source, and well isolated from the heat source, has no thermal convection, and has only very limited heat conduction, so that the low temperature chamber can be maintained at a very low temperature.

Under vacuum condition, since there is no convection between the low temperature chamber and the high temperature chamber, and there is no heat conduction from the high temperature chamber where the temperature probe and the electricity taking coil are located, the ambient temperature of the circuit board is lower, and the temperature sensor according to the present utility model can use a lower-priced MCU with a lower maximum operating temperature or can measure a higher target temperature with the same MCU when measuring the same temperature as the temperature sensor in the prior art.

The temperature sensor provided by the utility model adopts the embedded temperature probe, so that the temperature sensor has higher measurement accuracy.

By applying a vacuum chamber and optimizing the structure of the chamber, the temperature sensor according to the present utility model can provide a low temperature ambient temperature to the circuit board at a target temperature of 200 ℃ or even higher.

The inventor has conducted tests and simulations with respect to the technical solution of the present utility model, according to the test results, the temperature of the circuit board can be reduced by more than 10 ℃ in the case of the most important working temperature (150 ℃) and possibly more if applied to the case of ultra-high temperature.

Not all of the elements in the above-described block diagrams are necessary, and some of the elements may be omitted according to actual needs. The apparatus structures described in the foregoing embodiments may be physical structures or logical structures, that is, some units may be implemented by the same physical entity, or some units may be implemented by a plurality of physical entities respectively, or may be implemented jointly by some components in a plurality of independent devices.

The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the scope of the disclosure. Thus, the disclosure is not limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Claims

1. A temperature sensor (10), comprising: a housing (102) and a power take-off coil (104), a temperature probe (106), an antenna (108) and a circuit board (110) which are accommodated in the housing (102),

the power take-off coil (104) is used for supplying power to the temperature sensor (10),

the temperature measuring probe (106) extends out of the surface of the shell (102) and is used for collecting signals representing the temperature of a measuring target;

the signal processing circuit of the circuit board (110) processes the signals acquired by the temperature measuring probe (106) to obtain the temperature of the measuring target;

the antenna (108) is used for receiving the instruction from the outside of the temperature sensor (10) and sending a signal to the outside,

it is characterized in that the method comprises the steps of,

the inside of casing (102) is separated into first cavity (114) and second cavity (116) by insulating layer (112), get electric wire (104) with temperature probe (106) set up first cavity (114) of casing (102), antenna (108) with circuit board (110) set up in second cavity (116) of casing (102), temperature probe (106) with be connected through the data line between circuit board (110).

2. The temperature sensor (10) of claim 1, wherein the insulating layer (112) comprises 5 faces or 6 faces.

3. The temperature sensor (10) of claim 2, wherein the thermally insulating layer (112) is made of a thermally insulating material.

4. A temperature sensor (10) according to any one of claims 1-3, wherein the interior of the housing (102) is evacuated.

5. The temperature sensor (10) of claim 1, wherein the temperature probe (106) encapsulates a temperature sensing element, the temperature sensing element being a thermistor or thermocouple.

6. A temperature sensor (10) according to any one of claims 1-3, wherein the housing (102) is made of an insulating material.