CN2189725Y - Semi-conductor cold-producing and heat-producing device - Google Patents

Semi-conductor cold-producing and heat-producing device Download PDF

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Publication number
CN2189725Y
CN2189725Y CN 94200127 CN94200127U CN2189725Y CN 2189725 Y CN2189725 Y CN 2189725Y CN 94200127 CN94200127 CN 94200127 CN 94200127 U CN94200127 U CN 94200127U CN 2189725 Y CN2189725 Y CN 2189725Y
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CN
China
Prior art keywords
semiconductor refrigerating
pipeline
medium
refrigerating element
combined equipment
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 94200127
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Chinese (zh)
Inventor
周宇
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Individual
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Individual
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Publication date
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Priority to CN 94200127 priority Critical patent/CN2189725Y/en
Application granted granted Critical
Publication of CN2189725Y publication Critical patent/CN2189725Y/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a semiconductor refrigerating and heating device. The utility model has the structure that both sides of the cold wall of a semiconductor refrigerating element and both sides of the hot wall of the semiconductor refrigerating element are respectively fixed with medium flow guiding pipelines. Heat insulation and preservation material is filled between the semiconductor refrigerating element and a casing. The semiconductor refrigerating element is welded with conducting wires, and the conducting wires which penetrate through the heat insulation and preservation material are fixedly connected to a binding post fixed on the casing. The medium outflow and the inflow sections of the medium flow guiding pipelines are provided with heat preservation sleeve pipes.

Description

Semi-conductor cold-producing and heat-producing device
The utility model relates to a kind of semiconductor refrigerating heating combined equipment.
At present, utilize the semiconductor refrigerating element can make various cryogenic equipment, equipment, as Leng Jing, cold hot-storage box etc., cold well is a kind of refrigerating plant, but needs the hot side of water flowing with the cooling semiconductor cooling element; When needing to freeze in the case of cold hot-storage box, the hot side of partly leading cooling module is placed on natural heat dissipation in the air, otherwise, as the same.The function of semiconductor refrigerating element does not make full use of like this, and its energy has only utilized half, and waste real the genus.
The purpose of this utility model is to improve the shortcoming of prior art and a kind of semiconductor refrigerating heating combined equipment that semiconductor refrigerating heats energy that can make full use of is provided, and with energy savings, is used for the refrigeration in fields such as industrial goods, civil goods, scientific research, in the heating equipment.
The purpose of this utility model is to realize like this, the semiconductor refrigerating element is installed in a housing, two wallboards at element are " cold wall " and the fixing respectively medium diversion pipeline of going up in " hot wall " both sides, between two wallboards of medium diversion pipeline and semiconductor refrigerating element, be filled with thermal grease conduction, with stifled exhausted the air gap, quicken the heat conduction.Filling heat-insulating material between medium diversion pipeline, semiconductor refrigerating element and housing, as asbestos, foamed plastics or the like, be welded with lead on the semiconductor refrigerating element, passing heat-insulating material is fixed on the binding post that is fixed on the housing, the medium of medium diversion pipeline flows out section and inflow segment is with thermal insulation casing, its termination is made stepped or screw thread, so that be connected with outer pipeline.The used power supply of the utility model is a direct current, and voltage is 10 volts-15 volts, and power is 20 watts-80 watts.As power supply is 220 volts of interchanges, after the then necessary transformation rectification, could insert on the outer binding post of housing.Used medium is a fluid, promptly can be liquid or gas.During use, behind the connection power supply, can insert device therefor to the medium diversion pipeline respectively, can be as the refrigerant pipeline by an adiabatic good container of insulation, to do household freezer; Heating medium pipeline can be by an adiabatic good container of insulation, with the water in the heating container, force (forcing) pump is installed in the loop, so that medium circulation, medium is constantly taken away " heat " that semiconductor " cold wall " and " hot wall " are produced, after in connected equipment, consuming, flow back to again obtain in this device new additional, so move in circles, the utility model just can constantly be worked down.Certainly, be to make more powerful the utility model device, can be several, even the above-mentioned semiconductor element of dozens of links up use, to increase refrigeration, heating effect.
The utility model capacity usage ratio height; There is not conventional compressor cooling, so non-freon, noise pollution; Simple in structure, convenient, practical.
The utility model is described in further detail below in conjunction with accompanying drawing.
Fig. 1 the utility model front view
Fig. 2 the utility model side view
The A-A section of Fig. 3 Fig. 2
A kind of medium diversion pipeline of Fig. 4 structural representation
The another kind of medium diversion pipeline of Fig. 5 structural front view
The side view of Fig. 6 Fig. 5
Embodiment 1
Select semiconductor refrigerating element 1 for use, two wallboards on its both sides, the fixing metal copper medium diversion pipeline 2 of going up of the i.e. both sides of " cold wall " 1-1 and " hot wall " 1-2 difference soldering, fill at the gap location of pipeline and semiconductor refrigerating element and to be coated with the good thermal grease conduction 3(trade mark KDZ-2 of heat conductivility), the medium of pipeline flows into, flows out the section outside and is with the sleeve pipe 4 that insulation material is made, and be fixed on the housing 5, housing is the system of moulding for to be made up of square tube shape open tubular column 5-1, loam cake 5-2, the 5-3 that goes to the bottom.Fill insulant material 6 between housing is with semiconductor refrigerating element, pipeline, be welded with lead 7 on the semiconductor refrigerating element, be connected on the binding post 8 that is fixed on the housing, the medium of pipeline flows into, flows out the Duan Weiyuan section, and termination 2-1 makes stepped, so that be connected with outer pipeline, pipeline and the cavity of the semiconductor refrigerating element section of contacting for spreading all over " cold wall " and " hot wall " plate face and being complementary with its shape and size, make serpentine channel in the cavity, so that " heat " energy that medium is fully taken away semiconductor element and produced in the pipe.
Embodiment 2
The medium diversion pipeline is that a pipe is coiled into two-layer helical form planar structure 9, with the tin cast, the plane is filled up into tin in both sides between pipe, so that also fixing with semiconductor refrigerating element good fit, its clearance filled thermal grease conduction 3, all the other structures are identical with embodiment 1.

Claims (5)

1, a kind of semiconductor refrigerating heating combined equipment, form by semiconductor refrigerating element, housing, heat-insulating material, medium, pipeline, lead, binding post etc., it is characterized in that cold wall and hot wall both sides difference mounting medium diversion pipeline at the semiconductor refrigerating element, filling heat-insulating material between semiconductor refrigerating element, pipeline are with housing, be welded with lead on the semiconductor refrigerating element, it passes insulation material and is fixed on the binding post that is fixed on the housing, and the medium of medium diversion pipeline flows out section and is with thermal insulation casing with inflow segment.
2, a kind of semiconductor refrigerating heating combined equipment as claimed in claim 1, the termination that it is characterized in that the medium diversion pipeline is the circle section and makes stepped or screw thread.
3, a kind of semiconductor refrigerating heating combined equipment as claimed in claim 1 is characterized in that pipeline and the semiconductor refrigerating element section of contacting make serpentine channel for spreading all in " cold wall " and " hot wall " plate face and the cavity that is complementary with its shape, size, the cavity.
4, a kind of semiconductor refrigerating heating combined equipment as claimed in claim 1 is characterized in that the medium diversion pipeline for to coil two-layer helical form planar structure with a pipe, fills with tin between the pipe, and both side surface fills into the plane with tin.
5, a kind of semiconductor refrigerating heating combined equipment as claimed in claim 1 is characterized in that, filling thermal grease conduction between semiconductor refrigerating element and medium diversion pipeline.
CN 94200127 1994-01-11 1994-01-11 Semi-conductor cold-producing and heat-producing device Expired - Fee Related CN2189725Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 94200127 CN2189725Y (en) 1994-01-11 1994-01-11 Semi-conductor cold-producing and heat-producing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 94200127 CN2189725Y (en) 1994-01-11 1994-01-11 Semi-conductor cold-producing and heat-producing device

Publications (1)

Publication Number Publication Date
CN2189725Y true CN2189725Y (en) 1995-02-15

Family

ID=33820546

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 94200127 Expired - Fee Related CN2189725Y (en) 1994-01-11 1994-01-11 Semi-conductor cold-producing and heat-producing device

Country Status (1)

Country Link
CN (1) CN2189725Y (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112127102A (en) * 2020-09-21 2020-12-25 珠海格力电器股份有限公司 Washing machine temperature control device, washing machine comprising same and control method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112127102A (en) * 2020-09-21 2020-12-25 珠海格力电器股份有限公司 Washing machine temperature control device, washing machine comprising same and control method

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C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee