CN218941614U - Terminal equipment - Google Patents
Terminal equipment Download PDFInfo
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- CN218941614U CN218941614U CN202222834329.0U CN202222834329U CN218941614U CN 218941614 U CN218941614 U CN 218941614U CN 202222834329 U CN202222834329 U CN 202222834329U CN 218941614 U CN218941614 U CN 218941614U
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Abstract
The utility model discloses terminal equipment, which comprises a shell, a display panel and an external radiation heat dissipation layer, wherein the display panel is arranged on one side of the shell; the external radiation heat dissipation layer is provided on an outer surface of at least one of the housing and the display panel. According to the terminal equipment disclosed by the embodiment of the disclosure, the external radiation heat dissipation layer is arranged on the outer surface of at least one of the shell and the display panel, so that the heat of at least one of the shell and the display panel can be transferred to the external environment by utilizing the external radiation heat dissipation layer in a heat radiation mode, the heat of the surface of the terminal equipment is transferred to the external environment, the heat dissipation effect of the terminal equipment is effectively improved, the temperature rise of the terminal equipment can be reduced, the performance of the terminal equipment is improved, and the user experience is improved.
Description
Technical Field
The disclosure relates to the technical field of electronic equipment, in particular to terminal equipment.
Background
With the development of terminal devices, such as smart phones, the performance of the terminal devices is continuously improved, and the power consumption of main devices such as a CPU, a camera, a display screen assembly and the like is also greatly improved, so that the heat dissipation requirement on the terminal devices is also higher and higher.
In the related art, the main heat dissipation modes of the terminal equipment are as follows: the heat conduction of the internal structure and the natural convection of the external part and the air. The above heat dissipation mode of the terminal equipment has poor heat dissipation effect, so that the temperature rise of the terminal equipment is higher, the performance is poorer, and the user experience is poorer.
Disclosure of Invention
The present disclosure aims to solve, at least to some extent, one of the technical problems in the related art.
For this reason, embodiments of the present disclosure provide a terminal device to improve the heat dissipation effect of the terminal device.
The terminal equipment of the embodiment of the disclosure comprises a shell, a display panel and an external radiation heat dissipation layer, wherein the display panel is arranged on one side of the shell; the external radiation heat dissipation layer is provided on an outer surface of at least one of the housing and the display panel.
According to the terminal equipment disclosed by the embodiment of the disclosure, the external radiation heat dissipation layer is arranged on the outer surface of at least one of the shell and the display panel, so that heat of at least one of the shell and the display panel can be transferred to the external environment by utilizing the external radiation heat dissipation layer in a heat radiation mode, and therefore, heat of the surface of the terminal equipment is transferred to the external environment. It will be appreciated that the external radiant heat sink layer may also transfer heat from the external surface of the terminal device to the external environment by natural convection. Compared with the prior art, the heat dissipation effect of the terminal equipment can be effectively improved by only radiating the outer surface of the terminal equipment in a natural convection mode, so that the temperature rise of the terminal equipment can be reduced, the performance of the terminal equipment can be improved, and the user experience can be improved.
In some embodiments, the external radiant heat sink layer is adhered to an outer surface of at least one of the housing and the display panel.
In some embodiments, the terminal device further comprises a camera module, a CPU, a battery, a motherboard, a small board, and an internal radiation heat dissipation layer, wherein the camera module, the CPU, the battery, the motherboard, and the small board are all disposed in the housing, the internal radiation heat dissipation layer is disposed on an outer surface of at least one of the camera module, the CPU, the battery, the motherboard, and the small board, and the housing is a transparent housing.
In some embodiments, the internal radiant heat sink layer is bonded to an outer surface of at least one of the camera module, the CPU, the battery, the motherboard, and the small board.
In some embodiments, the CPU includes a CPU body and a CPU shield disposed on the CPU body, the internal radiant heat sink layer disposed on the CPU shield; and/or the internal radiation heat dissipation layer is arranged on one side of the battery far away from the display panel.
In some embodiments, the terminal device further comprises a thermochromic layer disposed on an outer surface of at least one of the outer radiant heat dissipation layer and the inner radiant heat dissipation layer.
In some embodiments, the thermochromic layer is a white layer when the temperature is greater than or equal to a preset temperature, and the thermochromic layer is a transparent layer when the temperature is less than the preset temperature.
In some embodiments, the thermochromic layer is bonded to an outer surface of at least one of the outer radiant heat dissipation layer and the inner radiant heat dissipation layer; or the thermochromic layer is a vapor deposition layer.
In some embodiments, at least one of the outer radiant heat dissipation layer and the inner radiant heat dissipation layer is doped with a thermochromic material.
In some embodiments, the reflectance of the external radiant heat dissipation layer to light having a wavelength of 0.2um to 3um is 90% or more; and/or the emissivity of the external radiation heat dissipation layer to light with the wavelength of 8 um-13 um is more than or equal to 90%; and/or the reflectivity of the internal radiation heat dissipation layer to the light with the wavelength of 0.2 um-3 um is more than or equal to 90%; and/or the emissivity of the internal radiation heat dissipation layer to light with the wavelength of 8 um-13 um is more than or equal to 90%.
Drawings
Fig. 1 is an exploded view of a terminal device of one embodiment of the present disclosure.
Fig. 2 is a cross-sectional view of the battery cover of fig. 1.
Fig. 3 is a graph of the radiant energy of the outer radiant heat sink layer of fig. 1 versus different wavelengths of light, and is also a graph of the radiant energy of the inner radiant heat sink layer of fig. 1 versus different wavelengths of light.
Reference numerals:
a terminal device 100;
a battery cover 1;
a middle frame 2;
a display panel 3;
an external radiation heat dissipation layer 4;
a thermochromic layer 5;
a CPU main body 6;
a CPU shield case 7;
an inner radiation heat dissipation layer 8;
a battery 9;
a main board 10;
a small plate 11;
a camera module 12.
Detailed Description
Embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings, are described in detail below. The embodiments described below by referring to the drawings are exemplary and intended for the purpose of explaining the present disclosure and are not to be construed as limiting the present disclosure.
As shown in fig. 1 to 3, a terminal device 100 of an embodiment of the present disclosure includes a housing, a display panel, and an external radiation heat dissipation layer 4, the display panel 3 being provided at one side of the housing. An external radiation heat dissipation layer 4 is provided on an outer surface of at least one of the housing and the display panel 3.
The terminal device 100 may be a mobile phone, a tablet computer, a notebook computer, etc.
The external radiation heat dissipation layer 4 is provided on the outer surface of at least one of the housing and the display panel 3, and can be understood as: the external radiation heat dissipation layer 4 is provided only on the outer surface of the case, and the outer surface of the display panel 3 is not provided with the external radiation heat dissipation layer; alternatively, the external radiation heat dissipation layer 4 is provided only on the outer surface of the display panel 3, and the external radiation heat dissipation layer 4 is not provided on the outer surface of the case; alternatively, the number of the external radiation heat dissipation layers 4 is plural, a part of the plural external radiation heat dissipation layers 4 is provided on the outer surface of the case, and another part of the plural external radiation heat dissipation layers 4 is provided on the outer surface of the display panel 3.
By providing the external radiation heat dissipation layer 4 on the outer surface of at least one of the housing and the display panel 3, the heat of at least one of the housing and the display panel 3 can be transferred to the external environment by heat radiation using the external radiation heat dissipation layer 4, thereby transferring the heat of the surface of the terminal device 100 to the external environment. It will be appreciated that the external radiant heat sink 4 may also transfer heat from the external surface of the terminal device 100 to the external environment by natural convection. Compared with the prior art, the heat dissipation effect of the terminal equipment 100 can be effectively improved by only radiating the external surface of the terminal equipment in a natural convection mode, so that the temperature rise of the terminal equipment 100 can be reduced, the performance of the terminal equipment 100 can be improved, and the user experience can be improved.
Therefore, the terminal device 100 of the embodiment of the present disclosure has advantages of low temperature rise, good performance, and the like.
It will be appreciated that as long as the temperature of the external radiant heat dissipation layer 4 is higher than the external environment, the external radiant heat dissipation layer 4 can transfer heat to the articles in the external environment by radiating heat, and the larger the temperature difference between the external radiant heat dissipation layer 4 and the articles in the external environment is, the larger the radiating heat dissipation capacity of the external radiant heat dissipation layer 4 is. So that the heat of the terminal device 100 can be effectively transferred to the external environment by the external radiation heat dissipation layer 4.
It should be noted that the external radiation heat dissipation layer 4 may be a radiation heat dissipation layer in the prior art, and will not be described herein.
Alternatively, the case includes a battery cover 1 and a middle frame 2, the battery cover 1 is provided at one side in the thickness direction of the middle frame 2, and the display panel 3 is provided at the other side in the thickness direction of the middle frame 2. The surface of the battery cover 1 far from the middle frame 2 and the outer surface of the middle frame 2 are both the outer surface of the shell, and the surface of the display panel 3 far from the middle frame 2 is the outer surface of the display panel 3.
Optionally, the outer surface of the housing and the outer surface of each of the display panels 3 are provided with an external heat sink layer 4.
Alternatively, the battery cover 1 is bonded to the middle frame 2, and the display panel 3 is bonded to the middle frame 2.
Optionally, an external radiation heat dissipation layer 4 is adhered to an outer surface of at least one of the housing and the display panel 3.
For example, the number of the external radiation heat dissipation layers 4 is two, one of the two external radiation heat dissipation layers 4 is adhered to the outer surface of the case, and the other of the two external radiation heat dissipation layers 4 is adhered to the outer surface of the display panel 3.
The external radiation heat dissipation layer 4 is fixed on the outer surface of at least one of the casing and the display panel 3 in an adhesive manner, so that the external radiation heat dissipation layer 4 is convenient to fix, and the fixing stability of the external radiation heat dissipation layer 4 is improved.
Optionally, the external radiation heat dissipation layer 4 is adhered to an outer surface of at least one of the housing and the display panel 3 by a heat conductive adhesive.
In some embodiments, as shown in fig. 1, the terminal device 100 further includes a camera 12, a CPU, a battery 9, a motherboard 10, a small board 11, and an internal radiation heat dissipation layer 8, where the camera 12, the CPU, the battery 9, the motherboard 10, and the small board 11 are all disposed within a housing. The internal radiation heat dissipation layer 8 is provided on an outer surface of at least one of the camera 12, the CPU, the battery 9, the main board 10, and the small board 11. The inner radiation heat dissipation layer is a radiation heat dissipation layer, and the shell is a transparent shell.
For example, both sides in the thickness direction of the center 2 are provided with accommodating grooves for stacked mounting of the camera 12, CPU, battery 9, main board 10, small board 11, and the like. The accommodation groove adjacent to the battery cover 1 is a first accommodation groove, and the accommodation groove adjacent to the display panel 3 is a second accommodation groove. The CPU is adhered to the main board 10, the battery 9, the main board 10, the small board 11 and the camera 12 are arranged in the first accommodating groove, and the battery cover 1 seals the notch of the first accommodating groove. The display panel 3 blocks the notch of the second accommodation groove.
The internal radiation heat dissipation layer 8 is provided on the outer surface of at least one of the camera 12, the CPU, the battery 9, the main board 10, and the small board 11, and can be understood as: an internal radiation heat dissipation layer 8 is arranged on the outer surface of each of the camera 12, the CPU, the battery 9, the main board 10 and the small board 11; alternatively, the internal radiation heat dissipation layer 8 is provided on the outer surface of one part of the camera 12, the CPU, the battery 9, the main board 10 and the small board 11, and the internal radiation heat dissipation layer 8 is not provided on the outer surface of the other part of the camera 12, the CPU, the battery 9, the main board 10 and the small board 11.
It will be appreciated that providing the housing with a transparent housing may reduce or even avoid the housing affecting the heat dissipation of the inner radiation heat dissipation layer 8 to the external environment by means of heat radiation. So that the inner radiant heat-dissipating layer 8 can directly transfer heat to the external environment by means of heat radiation.
The housing is provided with a transparent housing by providing an internal radiation heat dissipation layer 8 on an outer surface of at least one of the camera 12, the CPU, the battery 9, the main board 10, and the small board 11, and setting the internal radiation heat dissipation layer 8 as a radiation heat dissipation layer. So that heat of at least one of the camera 12, the CPU, the battery 9, the main board 10 and the small board 11 can be directly transferred to the external environment by means of heat radiation using the internal radiation heat dissipation layer 8, thereby reducing the temperature of the internal components of the terminal device 100. Compared with the prior art that the heat conduction mode is adopted in the terminal equipment to be transferred to the shell, and the shell transfers heat to the external environment in a heat convection mode, the heat dissipation effect of the internal components of the terminal equipment 100 can be effectively improved, the heat dissipation effect of the terminal equipment 100 can be further improved, and therefore the temperature rise of the terminal equipment 100 can be effectively reduced, and the performance of the terminal equipment 100 can be improved.
It should be noted that the inner radiation heat dissipation layer 8 may be a radiation heat dissipation layer in the prior art, and will not be described herein.
Optionally, an internal radiant heat sink 8 is provided on the outer surface of each of the camera 12, CPU, battery 9, motherboard 10 and small board 11.
By using the internal radiation heat dissipation layer 8 provided on each of the camera 12, the CPU, the battery 9, the main board 10 and the small board 11, each easily-heated component inside the terminal device 100 can be effectively dissipated, the consistency of the temperatures of each position of the terminal device 100 is ensured, the temperature of the local hot spot of the terminal device 100 is reduced, and the performance of the terminal device 100 is further improved.
Alternatively, as shown in fig. 2, the CPU includes a CPU body 6 and a CPU shield 7, the CPU shield 7 being provided on the CPU body 6, and an internal radiation heat dissipation layer 8 being provided on the CPU shield 7.
Through establishing inside radiation heat dissipation layer 8 on CPU's CPU shield cover 7, compare with establishing inside radiation heat dissipation layer 8 on CPU's CPU body 6, can effectively avoid reducing even avoid CPU shield cover 7 to influence the CPU and dispel the heat to external environment through the heat radiation mode to be favorable to improving the radiating effect of CPU, be favorable to further improving terminal equipment 100's performance.
Optionally, the camera module 12 includes a camera housing, and the inner radiant heat dissipation layer 8 is disposed on the camera housing.
Alternatively, the internal radiation heat dissipation layer 8 is provided on a side of the battery 9 remote from the display panel 3.
Therefore, the battery 9 can be effectively prevented from separating the internal radiation heat dissipation layer 8 from the external environment, and the heat dissipation of the battery 9 to the external environment is affected in a heat radiation mode, so that the heat dissipation effect of the battery 9 is improved, and the performance of the terminal equipment 100 is further improved.
Optionally, the internal radiant heat dissipation layer 8 is adhered to an outer surface of at least one of the camera module 12, the CPU, the battery 9, the motherboard 10, and the small board 11.
The internal radiation heat dissipation layer 8 is fixed on the outer surface of at least one of the camera module 12, the CPU, the battery 9, the main board 10 and the small board 11 in an adhesive manner, so that the internal radiation heat dissipation layer 8 is convenient to fix, and the fixing stability of the internal radiation heat dissipation layer 8 is improved.
Optionally, the inner radiation heat dissipation layer 8 is adhered to an outer surface of at least one of the camera module 12, the CPU, the battery 9, the main board 10 and the small board 11 by a heat conductive adhesive.
Alternatively, the reflectance of the external radiation heat dissipation layer 4 to light having a wavelength of 0.2um to 3um is 90% or more, and the emissivity of the external radiation heat dissipation layer 4 to light having a wavelength of 8um to 13um is 90% or more.
It is understood that the light with the wavelength of 0.2um to 3um is sunlight irradiated in the environment, and the external radiation heat dissipation layer 4 is set to have the reflectivity of 90% or more for the light with the wavelength of 0.2um to 3um, so that the external radiation heat dissipation layer 4 can reflect the sunlight irradiated on the terminal device 100, thereby reducing the heat of the external environment absorbed by the terminal device 100, and reducing the temperature rise of the terminal device 100 caused by heat absorption. The light with the wavelength of 8um to 13um is the infrared light emitted by the terminal device 100, and the emissivity of the external radiation heat dissipation layer 4 to the light with the wavelength of 8um to 13um is more than or equal to 90%, so that most of heat emitted by the terminal device 100 can be transferred to the external environment by the external radiation heat dissipation layer 4 in a thermal radiation mode, and the temperature rise of the terminal device 100 caused by low heat dissipation efficiency is reduced.
Optionally, the reflectance of the inner radiation heat dissipation layer 8 to light with a wavelength of 0.2um to 3um is 90% or more, and the radiance of the inner radiation heat dissipation layer 8 to light with a wavelength of 8um to 13um is 90% or more.
It is understood that the light with the wavelength of 0.2um to 3um is sunlight irradiated in the environment, and the internal radiation heat dissipation layer 8 is set to have the reflectivity of 90% or more for the light with the wavelength of 0.2um to 3um, so that the internal radiation heat dissipation layer 8 can reflect the sunlight irradiated on the terminal device 100, thereby reducing the heat of the external environment absorbed by the terminal device 100, and reducing the temperature rise of the terminal device 100 caused by heat absorption. The light with the wavelength of 8um to 13um is the infrared light emitted by the terminal device 100, and the emissivity of the internal radiation heat dissipation layer 8 to the light with the wavelength of 8um to 13um is more than or equal to 90%, so that most of heat emitted by the terminal device 100 can be transferred to the external environment by the internal radiation heat dissipation layer 8 in a thermal radiation mode, and the temperature rise of the terminal device 100 caused by low heat dissipation efficiency is reduced.
Optionally, the terminal device 100 further comprises a thermochromic layer 5, the thermochromic layer 5 being provided on an outer surface of at least one of the outer radiation heat dissipation layer 4 and the inner radiation heat dissipation layer 8.
The thermochromic layer 5 is provided on the outer surface of at least one of the outer radiation heat dissipation layer 4 and the inner radiation heat dissipation layer 8, which can be understood as: the thermochromic layer 5 is arranged on the outer surface of the outer radiation heat dissipation layer 4, and the thermochromic layer 5 is not arranged on the inner radiation heat dissipation layer 8; alternatively, the thermochromic layer 5 is provided on the outer surface of the inner radiation heat dissipation layer 8, while the outer radiation heat dissipation layer 4 is not provided with the thermochromic layer 5; alternatively, the number of the thermochromic layers 5 is plural, a part of the thermochromic layers 5 being provided on the outer surface of the outer radiation heat dissipation layer 4, and another part of the thermochromic layers 5 being provided on the outer surface of the inner radiation heat dissipation layer 8.
For example, as shown in fig. 2, an external radiation heat dissipation layer 4 is provided on the outer surface of the battery cover 1, and a thermochromic layer 5 is provided on the outer surface of the external radiation heat dissipation layer 4.
By providing the thermochromic layer on the terminal device 100, one color is presented when the temperature of the external radiation heat dissipation layer 4 and the internal radiation heat dissipation layer 8 is equal to or higher than a preset temperature, and another color is presented when the temperature of the external radiation heat dissipation layer 4 and the internal radiation heat dissipation layer 8 is lower than the preset temperature. The temperature of the terminal equipment 100 is conveniently judged by a user through the straight pipe, and the appearance attractiveness of the terminal equipment 100 is improved.
Wherein the preset temperature may be a certain determined temperature value, for example 35 ℃; the preset temperature may also be a certain value of the temperature range, for example 20-40 ℃.
Optionally, the thermochromic layer 5 is a white layer when the temperature is equal to or higher than a preset temperature, and the thermochromic layer 5 is a transparent layer when the temperature is lower than the preset temperature.
It is understood that the preset temperature may be determined according to a temperature at which the terminal device 100 is suitably operated, for example, the temperature at which the terminal device 100 is suitably operated is 20 to 40 ℃, and then the preset temperature is 20 to 40 ℃.
It should be noted that the thermochromic layer 5 may be made of a thermochromic material in the prior art. The thickness of the thermochromic layer 5 may be designed as desired.
When the temperature is greater than or equal to the preset temperature, the thermochromic layer 5 is a white layer, so that the light reflection capability of the thermochromic layer 5 can be enhanced, the heat absorbed by the terminal device 100 in the external environment is reduced, and the temperature rise of the terminal device 100 caused by heat absorption is reduced. When the temperature is less than the preset temperature, the thermochromic layer 5 is a transparent layer, so that the radiation and reflection capabilities of the radiation heat dissipation layer (the external radiation heat dissipation layer 4 and/or the internal radiation heat dissipation layer 8) can be weakened, and the heat dissipation capacity of the terminal equipment 100 is reduced, so that the terminal equipment 100 is maintained at a stable and proper operation temperature (for example, 20-40 ℃), and the performance of the terminal equipment 100 is further improved.
Optionally, the thermochromic layer 5 is adhered to an outer surface of at least one of the outer radiant heat sink layer 4 and the inner radiant heat sink layer 8, or the thermochromic layer 5 is a vapor deposited layer.
The thermochromic layer 5 is fixed on the outer surface of at least one of the external radiation heat dissipation layer 4 and the internal radiation heat dissipation layer 8 in an adhesive manner, so that the fixing of the thermochromic layer 5 is facilitated, and the fixing stability of the thermochromic layer 5 is improved.
The thermochromic layer 5 is a vapor deposition layer, which can be understood as: the thermochromic material is deposited on the outer surface of at least one of the outer radiation heat dissipation layer 4 and the inner radiation heat dissipation layer 8 by vapor deposition to form the thermochromic layer 5.
By setting the thermochromic layer 5 as a vapor deposition layer, the thickness of the thermochromic layer 5 is advantageously reduced, and the light and thin design of the terminal device 100 is facilitated.
Alternatively, the outer radiation heat dissipation layer 4 and the inner radiation heat dissipation layer 8 are radiation heat dissipation films.
Optionally, the thermochromic layer 5 is a thermochromic film.
Optionally, at least one of the outer radiant heat dissipation layer 4 and the inner radiant heat dissipation layer 8 is doped with a thermochromic material.
By doping at least one of the outer radiation heat dissipation layer 4 and the inner radiation heat dissipation layer 8 with a thermochromic material, one color is exhibited when the temperature of the outer radiation heat dissipation layer 4 and the inner radiation heat dissipation layer 8 is equal to or higher than a preset temperature, and the other color is exhibited when the temperature of the outer radiation heat dissipation layer 4 and the inner radiation heat dissipation layer 8 is lower than the preset temperature. The temperature of the terminal equipment 100 is conveniently judged by a user through the straight pipe, and the appearance attractiveness of the terminal equipment 100 is improved.
According to the terminal equipment 100 disclosed by the embodiment of the utility model, the radiation heat dissipation layer is arranged on the outer surface of the terminal equipment 100 and the outer surface of the internal part, so that the radiation heat dissipation capacity of the terminal equipment can be effectively improved, the temperature rise of the terminal equipment 100 is reduced, and the performance and the user experience of the terminal equipment 100 are improved.
In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present disclosure.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present disclosure, the meaning of "a plurality" is at least two, such as two, three, etc., unless explicitly specified otherwise.
In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.
In this disclosure, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In this disclosure, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
While embodiments of the present disclosure have been shown and described above, it should be understood that the above embodiments are illustrative and not to be construed as limiting the present disclosure, and that variations, modifications, alternatives, and variations of the above embodiments may be made by those of ordinary skill in the art without departing from the scope of the present disclosure.
Claims (10)
1. A terminal device, comprising:
a housing;
the display panel is arranged on one side of the shell; and
an external radiation heat dissipation layer provided on an outer surface of at least one of the housing and the display panel.
2. The terminal device of claim 1, wherein the external radiant heat sink layer is bonded to an outer surface of at least one of the housing and the display panel.
3. The terminal device of claim 1, further comprising a camera module, a CPU, a battery, a motherboard, a platelet, and an internal radiant heat sink layer, wherein the camera module, the CPU, the battery, the motherboard, and the platelet are all disposed within the housing, and the internal radiant heat sink layer is disposed on an outer surface of at least one of the camera module, the CPU, the battery, the motherboard, and the platelet, and the housing is a transparent housing.
4. A terminal device according to claim 3, wherein the internal radiant heat sink layer is bonded to an outer surface of at least one of the camera module, the CPU, the battery, the motherboard and the small board.
5. A terminal device according to claim 3, wherein the CPU comprises a CPU body and a CPU shield provided on the CPU body, the internal radiation heat dissipation layer being provided on the CPU shield; and/or
The internal radiation heat dissipation layer is arranged on one side of the battery far away from the display panel.
6. A terminal device according to claim 3, further comprising a thermochromic layer provided on an outer surface of at least one of the outer radiation heat sink layer and the inner radiation heat sink layer.
7. The terminal device of claim 6, wherein the thermochromic layer is a white layer at a temperature greater than or equal to a preset temperature and is a transparent layer at a temperature less than the preset temperature.
8. The terminal device of claim 7, wherein the thermochromic layer is bonded to an outer surface of at least one of the outer radiant heat sink layer and the inner radiant heat sink layer; or alternatively
The thermochromic layer is a vapor deposition layer.
9. A terminal device according to claim 3, characterized in that at least one of the outer radiation heat sink layer and the inner radiation heat sink layer is doped with a thermochromic material.
10. A terminal device according to claim 3, wherein the reflectance of the external radiation heat dissipation layer to light having a wavelength of 0.2um to 3um is 90% or more; and/or
The emissivity of the external radiation heat dissipation layer to light with the wavelength of 8-13 um is more than or equal to 90%; and/or
The reflectivity of the internal radiation heat dissipation layer to light with the wavelength of 0.2 um-3 um is more than or equal to 90%; and/or
The emissivity of the internal radiation heat dissipation layer to light with the wavelength of 8 um-13 um is more than or equal to 90 percent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222834329.0U CN218941614U (en) | 2022-10-26 | 2022-10-26 | Terminal equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222834329.0U CN218941614U (en) | 2022-10-26 | 2022-10-26 | Terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218941614U true CN218941614U (en) | 2023-04-28 |
Family
ID=86087833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222834329.0U Active CN218941614U (en) | 2022-10-26 | 2022-10-26 | Terminal equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218941614U (en) |
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2022
- 2022-10-26 CN CN202222834329.0U patent/CN218941614U/en active Active
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