CN218938543U - Reflective sheet, light-emitting substrate, and display device - Google Patents

Abstract

The embodiment of the disclosure provides a reflector plate, a light-emitting substrate and a display device. The reflector plate is including the first reflectance coating, first glue material layer and the first type membrane that stacks gradually and sets up, and the first glue material layer is close to first type membrane's one side surface is provided with first exhaust groove, and first exhaust groove communicates with the edge on first glue material layer. According to the technical scheme, full lamination of the reflecting sheet and the luminous substrate can be achieved in the lamination process of the reflecting sheet and the luminous substrate, the lamination effect of the reflecting sheet and the luminous substrate is improved, bubbles formed by gas aggregation are avoided, and the optical effect is improved.

Description

Reflective sheet, light-emitting substrate, and display device

Technical Field

The disclosure relates to the field of display technologies, and in particular, to a reflective sheet, a light-emitting substrate, and a display device.

Background

Liquid Crystal Displays (LCDs) are the earliest popular, more mature display technology, but with the increasing performance requirements of panels, LCDs are difficult to meet future demands. Organic light emitting diode display (OLED) is a new generation of display technology following LCD, and technology is already mature. Mini LEDs (sub-millimeter light emitting diode chips) and Micro LEDs (Micro light emitting diode chips) have excellent performances of lower power consumption, faster reaction, longer service life, better color saturation contrast and the like. With technological breakthroughs, mini LEDs and Micro LEDs will become the next generation display technology following LCDs, OLEDs.

The Mini LED backlight can be applied to display products such as televisions, monitors, computers, etc., and in order to improve the reflectivity of the surface of the light-emitting substrate, a reflective sheet is attached to the surface of the light-emitting substrate in the related art to further improve the reflectivity. In view of the process limitation of attaching the reflective sheet in the prior art, after the reflective sheet is attached to the surface of the light-emitting substrate, part of the gas is sealed between the reflective sheet and the light-emitting substrate. As the process proceeds, the trapped gas polymerizes to form bubbles. In the reliability test, bubbles can become large, so that on one hand, the appearance of a product is affected, and on the other hand, the bubble area of the product bulges after the reliability test, so that the optical effect of the product is affected.

Disclosure of Invention

Embodiments of the present disclosure provide a reflective sheet, a light emitting substrate, and a display device to solve or alleviate one or more technical problems in the prior art.

As a first aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a reflection sheet, including a first reflection film, a first adhesive layer, and a first release film that are sequentially stacked, a first exhaust groove is disposed on a surface of one side of the first adhesive layer, which is close to the first release film, and the first exhaust groove is communicated with an edge of the first adhesive layer.

In some embodiments, the width of the first venting grooves is 0.05mm to 0.2mm.

In some embodiments, the depth of the first venting grooves is less than the thickness of the first glue layer.

In some embodiments, the depth of the first venting grooves is 25% to 75% of the thickness of the first glue layer.

In some embodiments, the number of first venting grooves is a plurality, the plurality of first venting grooves being in communication with one another.

In some embodiments, the plurality of first vent grooves communicate in a grid.

In some embodiments, the length of the first venting grooves is 0.5mm to 2mm.

In some embodiments, the thickness of the first glue layer is 15 μm to 30 μm; and/or the viscosity of the first adhesive layer is 1500 (g/25 mm) to 2200 (g/25 mm).

In some embodiments, the first reflective film is disposed between the first adhesive layer and the second adhesive layer.

As a second aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a light emitting substrate including:

the wiring substrate comprises a substrate, a plurality of metal wires arranged on one side of the substrate and a second reflecting layer arranged on one side of the metal wires, which is away from the substrate, wherein the second reflecting layer is provided with a plurality of windows, and part of surfaces of the metal wires are exposed by the windows;

An electronic component coupled with the exposed surface of the metal wire;

the first reflective layer, including the reflective sheet in any of the embodiments of the present disclosure, is attached to the second reflective layer surface of the wiring substrate provided with the electronic component through the first adhesive layer.

As a third aspect of the embodiments of the present disclosure, the embodiments of the present disclosure provide a light emitting substrate including:

the wiring substrate comprises a substrate, a plurality of metal wires arranged on one side of the substrate and a second reflecting layer arranged on one side of the metal wires, which is away from the substrate, wherein the second reflecting layer is provided with a plurality of windows, and part of surfaces of the metal wires are exposed by the windows; the surface of one side of the second reflecting layer, which is far away from the substrate, is provided with a second exhaust groove which is communicated with the edge of the second reflecting layer;

an electronic component coupled with the exposed surface of the metal wire;

the first reflecting layer comprises a third adhesive layer and a second reflecting film which are arranged in a laminated mode, and the second reflecting film is attached to the surface of the second reflecting layer of the wiring substrate provided with the electronic element through the third adhesive layer.

In some embodiments, the width of the second vent slot is 0.05mm to 0.2mm; and/or the depth of the second exhaust groove is 5-15 μm.

In some embodiments, the number of the second air discharge grooves is a plurality, the plurality of second air discharge grooves are communicated with each other, the plurality of second air discharge grooves are communicated into a grid shape, and the length of the second air discharge grooves is 0.5 mm-2 mm.

In some embodiments, the electronic component includes a bridge portion coupled with two metal traces;

the first reflecting layer comprises a first functional area, and the orthographic projection of the bridging part on the substrate is positioned in the orthographic projection range of the first functional area on the substrate; the first reflecting layer is provided with a plurality of first linear gaps, each first linear gap penetrates through the first reflecting layer along the direction perpendicular to the substrate, and the edge of the first functional area is formed by surrounding the first linear gaps which are arranged at intervals;

the first reflecting layer is also provided with a plurality of third linear gaps positioned in the first functional area, and the plurality of third linear gaps are mutually arranged along at least part of the edge of the first functional area at intervals.

In some embodiments, the length of a first linear slit is greater than twice the spacing between adjacent two first linear slits.

In some embodiments, the first reflective layer is further provided with a second linear slit located in the first functional region, the second linear slit penetrates the first reflective layer along a direction perpendicular to the substrate, an orthographic projection of an edge of the second linear slit on the substrate and an orthographic projection of the bridging portion on the substrate at least partially overlap, the second linear slit divides the first functional region into a first sub-region and a second sub-region, and the third linear slit is located in at least one region of the first sub-region and the second sub-region.

In some embodiments, the edges of the first functional region include a first edge, a second edge, a third edge, and a fourth edge that are sequentially connected, the first edge and the third edge are disposed opposite to each other and each extend along a first direction, the second edge and the fourth edge are disposed opposite to each other and each extend along a second direction, the first direction is an extension direction of the bridge portion, and the second direction is perpendicular to the first direction;

the first linear slit comprises a first sub-linear slit and a second sub-linear slit, the plurality of first sub-linear slits are arranged at intervals along the first edge and the third edge, the second sub-linear slit is arranged along the second edge and the fourth edge, the third linear slit corresponds to the first sub-linear slit one by one and is parallel to the first sub-linear slit, and the size of the third linear slit is the same as that of the first sub-linear slit.

In some embodiments, the light emitting substrate further includes a first package portion, the first package portion being located on a side of the bridge portion facing away from the substrate, an orthographic projection of the bridge portion on the substrate being located within an orthographic projection range of the first package portion on the substrate; the first reflecting layer is positioned on one side of the first packaging part, which is far away from the substrate, and the distance between the orthographic projection of the third linear slit on the substrate and the edge of the orthographic projection of the first packaging part on the substrate is more than or equal to 0.5mm, and the distance between the third linear slit and the corresponding first sub linear slit is 0.8-1.2 mm.

As a fourth aspect of embodiments of the present disclosure, embodiments of the present disclosure provide a display device, which is characterized by including the light-emitting substrate in any of the embodiments of the present disclosure.

According to the technical scheme, full lamination of the reflecting sheet and the luminous substrate can be achieved in the lamination process of the reflecting sheet and the luminous substrate, the lamination effect of the reflecting sheet and the luminous substrate is improved, bubbles formed by gas aggregation are avoided, and the optical effect is improved.

The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present disclosure will become apparent by reference to the drawings and the following detailed description.

Drawings

In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not to be considered limiting of its scope.

Fig. 1 is a schematic plan view of a wiring substrate;

FIG. 2 is a partial schematic view of a wiring substrate in one embodiment;

FIG. 3 is a schematic cross-sectional view of C-C of FIG. 2;

FIG. 4 is an enlarged schematic view of portion M of FIG. 2;

FIG. 5 is a schematic plan view of a light-emitting substrate;

FIG. 6A is a schematic cross-sectional view of a reflector according to the related art;

FIG. 6B is a schematic plan view of a reflector in the related art;

FIG. 7 is a schematic diagram of a reflector attachment process;

FIG. 8 is a schematic cross-sectional view of a reflector in an embodiment of the disclosure;

FIG. 9A is a schematic plan view of a reflector according to an embodiment of the disclosure;

FIG. 9B is a schematic plan view of a reflector plate according to another embodiment of the disclosure;

fig. 10 is a schematic E-E sectional view of a light emitting substrate including the wiring substrate shown in fig. 2 and the reflective sheet shown in fig. 6A;

FIG. 11 is a schematic E-E cross-sectional view of a light-emitting substrate including the wiring substrate shown in FIG. 2 and a reflective sheet in an embodiment of the present disclosure;

FIG. 12 is a schematic cross-sectional view of a reflector plate according to another embodiment of the disclosure;

FIG. 13 is a schematic cross-sectional view of D1-D1 of the light-emitting substrate shown in FIG. 5 in an embodiment of the disclosure;

FIG. 14 is a schematic cross-sectional view of D1-D1 of the light-emitting substrate shown in FIG. 5 in another embodiment of the present disclosure;

FIG. 15 is a schematic plan view of a light-emitting substrate according to an embodiment of the disclosure;

FIG. 16 is an enlarged schematic view of the first functional region of FIG. 15;

FIG. 17A is a schematic cross-sectional view of F1-F1 of FIG. 16;

FIG. 17B is a schematic cross-sectional view of F2-F2 of FIG. 16;

FIG. 18 is a schematic cross-sectional view of D1-D1 in the light-emitting substrate shown in FIG. 15;

FIG. 19 is a schematic cross-sectional view of D2-D2 in the light-emitting substrate of FIG. 15;

fig. 20 is a schematic plan view of a light-emitting substrate according to another embodiment of the disclosure.

Reference numerals illustrate:

10. a substrate; 11. a buffer layer; 12. a metal wiring; 120. an electronic component; 121. a light emitting element; 1210. a second encapsulation part; 122. a micro driving chip; 1220. a third encapsulation part; 123. a bridge; 1230. a first encapsulation part; 13. a passivation layer; 131. a first opening; 14. a second reflective layer; 141. windowing; 21. a first pad group; 22. a second pad group; 23. a third pad group; 30. a first reflective layer; 41. a first reflective film; 42. a first glue layer; 421. a first exhaust groove; 43. a first release film; 44. a transparent film; 45. a second glue layer; 51. a second reflective film; 52. a third glue layer; 53. a second release film; 61. a first linear slit; 62. a second linear slit; 63. a third linear slit; 80. a reflection part.

Detailed Description

Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways, and the different embodiments may be combined arbitrarily without conflict, without departing from the spirit or scope of the present disclosure. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.

Herein, the light emitting diode may be a sub-millimeter light emitting diode (Mini Light Emitting Diode, mini LED) or may be a Micro light emitting diode (Micro Light Emitting Diode, micro LED).

In the related art, the substrate provided with the light emitting diode may be an FR4 type Printed Circuit Board (PCB), or may be any one of a glass substrate, a quartz substrate, a sapphire substrate, a ceramic substrate, and the like. Wherein, several LED chips are divided into several lamp areas, each lamp area can be controlled independently, thus it realizes fine local light modulation and better High Dynamic Range (HDR) effect with liquid crystal display panel.

Specifically, each light zone may be driven by a micro-driving chip.

Fig. 1 is a schematic plan view of a wiring substrate; FIG. 2 is a partial schematic view of a wiring substrate in one embodiment; FIG. 3 is a schematic cross-sectional view of C-C of FIG. 2; fig. 4 is an enlarged schematic view of the portion M in fig. 2. As shown in fig. 1 to 4, the wiring board includes a substrate 10 and a plurality of metal traces 12 located on one side of the substrate 10. The metal wiring 12 may include a first Voltage Line (VLED) 112, a second voltage line (GND) 111, a power signal line (PWR) 103, an address signal line (ADDR) 108, a cascade line 109, and a feedback signal line (FB) 110. As shown in fig. 1, the wiring substrate is provided with a plurality of columns of element arrangement regions, each of which is provided with a plurality of lamp regions 104. Each light region 104 corresponds to one third bonding pad group 23, and each light region 104 includes one or at least two second bonding pad groups 22. Illustratively, the third padset 23 is used to couple with a micro-drive chip. Each second pad group 22 includes a second pad 221 and a second pad 222, and the second pad group 22 is for coupling with a light emitting element such as an LED.

As shown in fig. 3, the wiring substrate may include a buffer layer 11 and a passivation layer 13, the buffer layer 11 is located between the substrate 10 and the metal trace 12, the passivation layer 13 is located on a side of the metal trace 12 facing away from the substrate 10, and the buffer layer 11 and the passivation layer 13 may be made of an inorganic material, for example, at least one of silicon oxide, silicon nitride, and silicon oxynitride. The passivation layer 13 may protect the metal trace 12. The passivation layer 13 is provided with a plurality of first openings 131, and the first openings 131 expose a part of the surface of the metal trace 12.

As shown in fig. 3, the wiring substrate may further include a second reflective layer 14, the second reflective layer 14 being located on a side of the metal trace facing away from the substrate 10. Illustratively, the second reflective layer 14 is located on a side of the passivation layer 13 facing away from the substrate 10. The passivation layer 13 is provided with a plurality of first openings 131. The second reflecting layer 14 is provided with a plurality of fenestrations 141. The window 141 exposes a portion of the surface of the metal trace. Illustratively, the front projection of the first opening 131 onto the substrate 10 falls within the front projection of the fenestration 141 onto the substrate 10, such that the first opening 131 and the fenestration 141 together expose a portion of the surface of the metal track 12. In fig. 3, the edge of the first opening 131 is shown by an arrow in the label 131, and the edge of the fenestration 141 is shown by an arrow in the label 141.

It will be appreciated that only the metal trace 12 and the exposed area of the metal trace 12 are shown in the plan view of the wiring substrate, and that the exposed area of the metal trace 12 may form a pad. The bonding pads are used for being coupled with the electronic components in a die bonding mode. The electronic components may include light emitting elements such as LEDs, micro driving chips, and bridges.

As shown in fig. 2, the wiring substrate may further include a first pad group 21, the first pad group 21 including a first pad 211 and a second pad 212. The first pad group 21 is for coupling with the bridge portion 123.

In one embodiment, as shown in fig. 2 and 4, the wiring substrate may include a third pad group 23. The third pad group 23 includes a power supply pad Pwr and an output pad Out. Optionally, the third pad set 23 is coupled with a micro driving chip. The power signal line 103 is coupled to the power supply pad Pwr. The second bonding pad group 22 is coupled with the light emitting diode chip. The lamp region 104 includes a plurality of second pad groups 22 electrically connected to each other, each second pad group 22 including at least a second pad 221 and a second pad 222, the second pad 221 may be a positive electrode, and the second pad 222 may be a negative electrode. The second pad 221 of the first one of the plurality of second pad groups 22 in each of the lamp regions 104 is coupled to the first voltage line 112, and the second pad 222 of the last one of the plurality of second pad groups 22 in each of the lamp regions 104 is coupled to the output pad Out of the corresponding third pad group 23 in the lamp region. The power supply pad Pwr of each third pad group 23 in each column element arrangement region is connected to the power supply signal line 103.

Illustratively, as shown in fig. 4, the third pad group 23 further includes an address pad Di and a ground pad Gnd, the address pad Di belonging to the same third pad group 23 being disposed at intervals in the second direction Y, which is perpendicular to the first direction X, with the power supply pad Pwr and being disposed at intervals in the first direction X with the output pad Out. The ground pad Gnd is spaced apart from the power supply pad Pwr in the first direction X and spaced apart from the output pad Out in the first direction X.

Illustratively, each third padset 23 may be coupled to one micro-driver chip, and each second padset 22 is coupled to an LED. In some embodiments, address pads Di may receive address signals for gating the micro-drive chips for the corresponding addresses. The power supply pad Pwr may provide the micro-driving chip with a first operating voltage and communication data that may be used to control the light emitting brightness of the corresponding light emitting element. The output pad Out may output a relay signal and a driving signal, respectively, in different periods, alternatively, the relay signal is an address signal supplied to the address pad Di in the third pad group 23 of the next stage, and the driving signal is a driving current for driving the light emitting element coupled to the third pad group 23 where the output pad Out is located to emit light. The ground pad Gnd receives a common voltage signal.

The third pad group 23 shown in fig. 2 and 4 includes four third pads, and thus, the third pad group 23 may be coupled with a micro driving chip having four pins. The number of pads of the third pad group 23 is not limited to 4, but may be a smaller number or a larger number, for example, 8. The number of pads of the third pad group 23 may be set according to a specific micro driving chip.

In some embodiments, as shown in fig. 1, the metal traces 12 further include address signal lines 108, one address signal line 108 may be coupled with the address pad Di of the third pad group 23.

As shown in fig. 2, the metal wiring 12 further includes a cascade line 109, the number of the third pad groups 23 being plural, the cascade line 109 being configured to connect the output pad Out of the nth stage third pad group 23 and the address pad Di of the (n+1) th stage third pad group 23 of the same column element arrangement region, n being a positive integer, to supply the relay signal output from the output pad Out of the nth stage third pad group 23 to the address pad Di of the (n+1) th stage third pad group 23 through the cascade line 109.

As shown in fig. 1, the metal trace 12 further includes a feedback signal line (FB) 110, and one feedback signal line (FB) 110 is coupled to the output pad Out of the last third pad group 23 in the multi-stage third pad group 23.

As shown in fig. 1 and 2, one second voltage line (GND) 111 is coupled to the ground pads GND of all the third pad group 23 in one column of the element arrangement region.

In fig. 2, the power signal line 103, the address signal line 108, the cascade line 109, the feedback signal line 110, the first voltage line 112 and the second voltage line 111 are represented with different fills for better distinguishing between the metal traces 12. Note that the power signal line 103, the address signal line 108, the cascade line 109, the feedback signal line 110, the first voltage line 112, and the second voltage line 111 are formed simultaneously by the same process, and thus, in fig. 3, the metal wirings for transmitting different signals are formed by the same hatching.

For example, in the wiring substrate, in order for the metal wirings that are not connected to satisfy electrical requirements such as transmitting the same signal, a bridge portion may be employed to connect the two metal wirings.

For example, as shown in fig. 2, the wiring substrate may include a plurality of power signal lines 103 for convenience of metal routing. In order for each power signal line 103 to transmit the same signal, adjacent power signal lines 103 may be connected through the bridge portion 123. It should be noted that, for convenience of description, one bridge portion 123 is shown in fig. 2 to be coupled to the first pad group 21, and it is understood that, for the wiring substrate, the bridge portion 123 is not a part of the wiring substrate.

The bridge portion 123 includes a conductive portion. The conductive portion plays a role of conductivity. In some examples, the conductive portion is made of a conductive material, such as copper or aluminum. In other examples, the conductive portion may be a resistor, a capacitor, or the like.

Fig. 5 is a schematic plan view of a light-emitting substrate. The light emitting substrate 200 may include the wiring substrate 100 described above, and further include electronic components coupled to the exposed surfaces of the metal traces 12 of the wiring substrate 100. The electronic component may include a light emitting element, a micro driving chip, and a bridge portion, for example.

In the wiring substrate, the bridge portion is coupled to the first land group 21, the light emitting element is coupled to the second land group 22, and the micro driving chip is coupled to the third land group 23.

The second reflective layer 14 is illustratively an insulating reflective material. On the one hand, the second reflecting layer 14 can play a role of electric isolation, so that the risk of faults such as short circuit and the like of the light-emitting substrate 200 is reduced. On the other hand, the second reflective layer 14 is enabled to function as a reflective light (e.g., light emitted from an LED), thereby improving the brightness of the light emitting substrate 200 and reducing the power consumption of the light emitting substrate 200.

In some examples, the material of the second reflective layer 14 includes white ink. By way of example, the material of the second reflective layer 14 may include at least one of photosensitive white ink and curable white ink.

Although the second reflective layer 14 can reflect light, it is verified by the test that the reflective effect of the second reflective layer 14 cannot meet the higher requirement.

In one embodiment, as shown in fig. 5, the light emitting substrate 200 may further include a first reflective layer 30. Illustratively, the first reflective layer 30 may include a reflective patch attached to a surface of the second reflective layer 14 on a side facing away from the substrate 10.

Compared with the method of reflecting light by using the second reflecting layer 14, the reflectivity of the reflecting sheet is higher after the reflecting sheet is attached to the upper surface of the second reflecting layer 14, so that the picture effect of the display device is better and the power consumption is lower.

The preparation process of the luminous substrate adopting the reflector plate mainly comprises the following steps: a die bonding process; packaging technology; cutting; and (3) a reflector plate attaching process.

In the die bonding process, an electronic component such as a light emitting element, a micro driving chip or a bridge portion is coupled to a pad of a wiring substrate in a die bonding manner. In the packaging process, a packaging part covering the electronic component is formed on the electronic component, for example, a hemispherical Lens (Lens) is formed by spraying high thixotropic glue onto the light emitting component and the micro driving chip by a dispenser. The encapsulation portion can protect the electronic component and can improve the light efficiency. In the embodiment, the package portion covering the bridge portion may be referred to as a first package portion, the package portion covering the light emitting element may be referred to as a second package portion, and the package portion covering the micro driving chip may be referred to as a third package portion.

In fig. 5, the first reflective layer 30 has a plurality of first functional areas Q1, and at least a portion of the orthographic projection of the bridge portion on the substrate 10 is located in the first functional areas Q1. The first reflective layer 30 has a plurality of second functional areas Q2, and at least a portion of the orthographic projection of the micro-driving chip on the substrate 10 is located in the second functional areas Q2.

In order to increase the reflectivity, as shown in fig. 5, the reflective sheet is designed to have a straight slit in the first functional region Q1 and a cross slit in the second functional region Q2. The reflecting sheet adopts an open hole design at the position of the light emitting element 121, as shown in fig. 5, the reflecting sheet is provided with a first through hole M1, and the orthographic projection of the light emitting element 121 on the substrate 10 is located in the orthographic projection of the first through hole M1 on the substrate 10, so that the light emitting element 121 can be exposed through the first through hole M1.

Since the reflector needs to be slit or perforated, the reflector attaching process must be performed after the packaging process. The electronic element exists on the luminous substrate, the reflector cannot be rolled by the roller in the reflector attaching process, the reflector can be attached only by adopting the attaching mode of the attaching jig, and the attaching jig needs to be provided with holes at positions corresponding to the electronic element to avoid the electronic element.

Fig. 6A is a schematic cross-sectional structure of a reflective sheet according to the related art, and fig. 6B is a schematic plan structure of a reflective sheet according to the related art. As shown in fig. 6A, the reflection sheet 50 may include a second reflection film 51, a third adhesive layer 52, and a second release film 53, which are sequentially stacked. Illustratively, the reflective sheet 50 may further include a protective layer (the protective layer is not shown in fig. 6A) on a side of the second reflective film 51 facing away from the third adhesive layer 52. Before attaching the reflective sheet, it is necessary to punch out the first through hole M1 at the position corresponding to the light emitting element of the reflective sheet 50, as shown in fig. 6B, the aperture of the first through hole M1 is about 5mm. Illustratively, a cross slit is formed at the position of the reflecting sheet corresponding to the micro driving chip; a straight slit is arranged at the position corresponding to the bridging position of the reflecting sheet. In fig. 6B, the cross slit and the straight slit are not shown.

Fig. 7 is a schematic diagram of one process of the reflector attaching process. In the related art, the reflective sheet is attached by a way of hard-to-hard bonding on the whole surface, and the lower suction jig 91 vacuum-sucks the light-emitting substrate 200, and the surface of the light-emitting substrate 200 at this time is the surface of the second reflective layer 14. The upper adsorption jig 92 vacuum adsorbs the reflecting sheet 40/50, the release film of the reflecting sheet 40/50 is torn off, and the upper adsorption jig 92 is turned over 180 degrees to enable the reflecting sheet to face the luminous substrate 200 of the lower adsorption jig 91. The upper suction jig 92 is provided with an opening for avoiding the electronic component on the light-emitting substrate. After CCD alignment (optical alignment), the lower suction jig 91 is raised, so that the lower suction jig 91 and the upper suction jig 92 are pressed together, and the reflective sheet is attached to the light-emitting substrate 200. Because the upper adsorption jig 92 is provided with an opening for avoiding the electronic component, the electronic component is not damaged when the lower adsorption jig 51 and the upper adsorption jig 92 are pressed together.

The hard-to-hard bonding process has certain drawbacks, in the bonding process, the influence of flatness of the jig platform, thickness uniformity of the reflecting sheet and the like cannot be guaranteed, the reflecting sheet cannot be completely bonded with the surface of the second reflecting layer 14 of the light-emitting substrate 200, and in the bonding process, no vacuumizing and exhausting equipment is used for assisting, so that part of gas is sealed between the reflecting sheet and the surface of the second reflecting layer 14 of the light-emitting substrate. When the reflection sheet 50 shown in fig. 6A is used, since the periphery of the reflection sheet 50 is already firmly bonded with the second reflection layer, the trapped gas cannot be discharged. As the process proceeds, the trapped gas polymerizes to form bubbles.

As shown in fig. 6A, the thickness of the third adhesive layer 52 is generally between 20 μm and 100 μm, and the thicker the thickness of the third adhesive layer 52 is, the stronger the adhesiveness is, but the thicker the thickness of the third adhesive layer 52 is, the more the adhesive layer turns yellow after reliability, and the optical effect is affected. A third glue layer 52 of 20 μm may be used, which has a viscosity between 2000 (g/25 mm) and 2400 (g/25 mm), a sufficient tackiness, and no peeling (peeling) of the reliable back reflector from the edge of the light-emitting substrate. However, since the lamination of the reflective sheet as shown in fig. 6A is performed by a hard-to-hard lamination method, after the reflective sheet is attached to the light-emitting substrate, gas is present between the reflective sheet and the light-emitting substrate, and there is no path for the gas sealed between the reflective sheet and the light-emitting substrate, and the gas is polymerized to form bubbles, which not only affects the appearance, but also affects the optical effect.

Fig. 8 is a schematic cross-sectional view of a reflective sheet according to an embodiment of the disclosure, fig. 9A is a schematic plan view of a reflective sheet according to an embodiment of the disclosure, fig. 9B is a schematic plan view of a reflective sheet according to another embodiment of the disclosure, fig. 9A and 9B show surfaces of a first adhesive layer facing a side of a first release film, and fig. 9 does not show the first release film. The embodiment of the disclosure proposes a reflective sheet, as shown in fig. 8, 9A and 9B, including a first reflective film 41, a first adhesive layer 42 and a first release film 43 sequentially stacked. A first air exhaust groove 421 is formed in a surface of the first adhesive layer 42, which is close to the first release film 43, and the first air exhaust groove 421 is communicated with the edge of the first adhesive layer 42.

Fig. 10 is a schematic E-E sectional view of a light emitting substrate including the wiring substrate shown in fig. 2 and the reflective sheet shown in fig. 6A; fig. 11 is an E-E cross-sectional schematic view of a light emitting substrate including the wiring substrate shown in fig. 2 and a reflective sheet in an embodiment of the present disclosure. It should be noted that, before the reflector is attached to the surface of the light-emitting substrate, the release film of the reflector needs to be removed, and then the reflector is attached to the surface of the second reflective layer 14 of the light-emitting substrate through the first adhesive layer 42, so that the release film of the reflector in fig. 10 and 11 is removed.

As shown in fig. 6A and 10, in the related art, the third adhesive layer 52 of the reflection sheet is a plain adhesive layer. When the reflective sheet is attached to the surface of the second reflective layer 14 of the light emitting substrate by the attaching process shown in fig. 7, the third adhesive layer 52 is completely in contact with the surface of the second reflective layer 14, and a part of the area is affected by the flatness of the jig platform, the uniformity of the thickness of the reflective sheet, and the like, so that gas is sealed between the second reflective layer 14 and the third adhesive layer 52, and the gas is accumulated to form bubbles due to no channel that can be eliminated.

When the reflective sheet in the embodiment of the present disclosure is attached to the surface of the second reflective layer 14 of the light emitting substrate, as shown in fig. 11, a first air exhaust groove 421 is present between the first adhesive layer 42 and the second reflective layer 14, and the first air exhaust groove 421 communicates with an edge of the first adhesive layer 42, so that the first air exhaust groove 421 may form an air exhaust channel. Therefore, the gas sealed in the attaching process can be discharged through the first exhaust groove 421, so that full attachment between the reflecting sheet and the light-emitting substrate can be realized, the attaching effect of the reflecting sheet and the light-emitting substrate is improved, gas aggregation is avoided to form bubbles, and the optical effect is improved.

In one embodiment, as shown in fig. 9A and 9B, the width w of the first air discharge groove 421 may range from 0.05mm to 0.2mm (inclusive). Illustratively, the width of the first air discharge groove 421 may be any one of 0.05mm to 0.2mm, for example, the width of the first air discharge groove 421 may be 0.05mm, 0.1mm, 0.15mm, or 0.2mm.

If the width of the first exhaust groove 421 is less than 0.05mm, gas exhaust is not facilitated and difficulty in the manufacturing process of the first exhaust groove 421 is increased; if the width of the first air discharge groove 421 is greater than 0.2mm, the reliability and shrink resistance of the reflective layer may be reduced. The width of the first air discharge groove 421 is set to be 0.05 mm-0.2 mm, so that the air can be discharged, the manufacturing process difficulty of the first air discharge groove 421 is reduced, and the reliability and the shrinkage resistance of the reflecting layer are not affected.

In one embodiment, the depth of the first air vent 421 may be the same as the thickness of the first glue layer 42.

In one embodiment, the depth d1 of the first air vent 421 may be smaller than the thickness d2 of the first glue layer 42. In this arrangement, although the first air vent 421 is provided, the surface area of the first adhesive layer 42 facing the light-emitting substrate is not reduced. During the process of attaching the reflective layer to the second reflective layer 14 of the light emitting substrate, the gas may not only be discharged from the first air discharge groove 421; and, along with the increase of laminating pressure, first material layer 42 can extrude first exhaust groove 421, is favorable to first material layer 42 to fill first exhaust groove 421, guarantees the laminating area of first material layer 42 and second reflection layer 14, guarantees the laminating fastness of reflector plate and second reflection layer 14, avoids reflector plate edge and second reflection layer 14 surface to peel off (peeling).

In one embodiment, the depth d1 of the first air vent 421 may be 25% to 75% (inclusive) of the thickness d2 of the first glue layer 42.

In one embodiment, the thickness d2 of the first glue layer 42 may be 15 μm to 30 μm (inclusive). Illustratively, the thickness d2 of the first glue layer 42 may be any one of 15 μm to 30 μm, for example, the thickness d2 of the first glue layer 42 may be 15 μm, 20 μm, 25 μm or 30 μm. When the thickness of the first adhesive layer 42 is too large, the yellowing of the first adhesive layer 42 is more serious after reliability, which affects the optical effect. The thickness d2 of the first adhesive layer 42 is set to 15 μm-30 μm, so that the first adhesive layer 42 can be ensured to have enough adhesiveness, peeling (peeling) between the reflective sheet and the edge of the light-emitting substrate after reliability is prevented, the first adhesive layer 42 has no yellowing problem after reliability, and the optical effect is improved.

For example, the thickness d2 of the first adhesive layer 42 is 20 μm, and the depth d1 of the first air discharge groove 421 may be 5 μm to 15 μm.

In one embodiment, the depth d1 of the first exhaust groove 421 is 5 μm to 15 μm.

In the process of attaching the reflective layer to the second reflective layer 14 of the light-emitting substrate, the first adhesive layer 42 presses the first air discharge groove 421 with increasing attaching pressure, so that the area of the air discharge channel of the first air discharge groove 421 is reduced. Setting d1 to 25% -75% of d2 or to 5-15 μm not only can ensure that gas can be discharged through the first exhaust groove 421 in the attaching process, but also the first exhaust groove 421 can be filled by deformation of the first adhesive layer 42 after the attaching is completed, so that the attaching area of the first adhesive layer 42 and the second reflecting layer 14 is ensured, and the attaching firmness of the reflecting sheet and the second reflecting layer 14 is ensured.

In one embodiment, as shown in fig. 9A and 9B, the number of the first air discharge grooves 421 is plural, and the plural first air discharge grooves 421 communicate with each other. With this arrangement, the gas can be discharged more quickly along the first exhaust grooves 421 communicating with each other, preventing the gas from accumulating to form bubbles.

Illustratively, as shown in fig. 9A and 9B, the plurality of first air discharge grooves 421 communicate in a mesh shape. With this structure, the distribution density of the first air discharge grooves 421 can be increased, and the air can be more easily introduced into the first air discharge grooves 421 and discharged.

In one embodiment, as shown in fig. 9A, the plurality of first air discharge grooves 421 may communicate in a quadrangular mesh. In another embodiment, as shown in fig. 9B, the plurality of first air discharge grooves 421 may communicate in a hexagonal grid. In other embodiments, the plurality of first air discharge grooves 421 may communicate in various shapes of grids such as triangle or pentagon, and is not limited to a quadrangular, hexagonal grid.

In one embodiment, as shown in fig. 9A and 9B, the first air discharge groove 421 is a straight air discharge groove, and in other embodiments, the first air discharge groove 421 may be a curved air discharge groove. When the first air discharge grooves 421 are curved air discharge grooves, the plurality of first air discharge grooves 421 may be communicated in an arc-shaped mesh such as a circle or an ellipse.

In one embodiment, as shown in fig. 9A and 9B, the length L of the first air discharge groove 421 ranges from 0.5mm to 2mm (inclusive). Illustratively, the length L of the first air discharge slot 421 may be any one of 0.5mm to 2mm, for example, the length L of the first air discharge slot 421 may be 0.5mm, 1mm, 1.5mm, or 2mm. If the length L of the first air discharge groove 421 is less than 0.5mm, the difficulty of the manufacturing process of the first air discharge groove 421 increases, the area of the mesh formed by the first air discharge groove 421 is reduced, and the adhesion between the reflective sheet and the second reflective layer 14 is reduced. If the length L of the first exhaust groove 421 is greater than 2mm, the area of the mesh through which the first exhaust groove 421 communicates is excessively large, resulting in gas being trapped in the mesh and not being exhausted through the first exhaust groove 421. The length L of the first exhaust groove 421 is set to be 0.5-2 mm, so that the manufacturing process difficulty of the first exhaust groove 421 is reduced, and the mesh area formed by the communication of the plurality of first exhaust grooves 421 is proper, so that the sealed gas can easily enter the first exhaust groove 421 and be discharged.

In one embodiment, as shown in fig. 8, the first exhaust groove 421 may have a rectangular cross section. The cross-sectional shape of the first air discharge groove 421 is not limited herein, and in other embodiments, the cross-section of the first air discharge groove 421 may be various shapes such as "U" shape or semi-circular shape, as long as the air discharge function is achieved.

In one embodiment, the first glue layer 42 has a tack of 1500 (g/25 mm) to 2200 (g/25 mm) (inclusive). The adhesiveness of the first adhesive layer 42 is sufficient to avoid peeling between the reliable back reflector and the edge of the light-emitting substrate.

In one embodiment, the material of the first reflective film 41 may include at least one of titanium dioxide and polymethyl methacrylate (PMMA). The material of the first adhesive layer 42 may include an acrylic adhesive. The material of the first release film may include polyethylene terephthalate (PET).

The process of manufacturing the reflective sheet shown in fig. 8 may include the steps of: coating a first glue layer 42 on the surface of the first reflective film 41; pre-curing the first glue layer 42; before the first reflective film 41 is attached to the first release film 43, the surface of the first adhesive layer 42 is pressed into the first air discharge grooves 421 in a mesh shape by a rolling method. Illustratively, the roller surface is provided with grid-like protrusions having the same cross-sectional structure as the first air discharge grooves 421, so that the first adhesive layer 42 surface forms the grid-like first air discharge grooves 421 when the roller is rolled from the first adhesive layer 42 surface. Then, the first release film 43 is bonded to the surface of the first adhesive layer 42, on which the first mesh-shaped air vent grooves 421 are formed, by a roll-to-roll bonding process. After being wound, the first adhesive layer 42 is cured, and then cut to obtain a finished reflector plate.

Fig. 12 is a schematic cross-sectional view of a reflective sheet in another embodiment of the present disclosure. In one embodiment, as shown in fig. 12, the reflective sheet 40 further includes a transparent film 44 and a second adhesive layer 45 disposed between the first adhesive layer 42 and the first reflective film 41, the second adhesive layer 45 being adjacent to the first reflective film 41.

In one embodiment, the first glue layer 42 may have a tack of 800 (g/25 mm) to 1200 (g/25 mm). The second glue layer 45 may have a viscosity of 1300 (g/25 mm) to 1500 (g/25 mm).

Illustratively, the material of the second adhesive layer 45 may include an acrylic adhesive. The material of the transparent film 44 may include a transparent material such as polyethylene terephthalate (PET).

Fig. 13 is a schematic view of a section D1-D1 of the light emitting substrate shown in fig. 5 in an embodiment of the present disclosure, wherein the first reflective layer 30 in the light emitting substrate adopts a laminated structure of the reflective sheet 40 in the embodiment of the present disclosure.

The embodiment of the present disclosure also provides a light emitting substrate including a wiring substrate, an electronic component, and a first reflective layer 30, as shown in fig. 13.

The wiring substrate includes a substrate 10, a plurality of metal traces 12 disposed on a side of the substrate 10, and a second reflective layer 14 disposed on a side of the plurality of metal traces 12 facing away from the substrate 10. The second reflective layer 14 is provided with a plurality of windows 141, and the windows 141 expose a portion of the surface of the metal trace 12. The exposed area of the metal trace 12 may form a pad. The pads are used for die bonding with the electronic component 120. The electronic components may include LEDs, micro-drive chips, or bridges.

The wiring substrate may include a first pad group 21, and the first pad group 21 is coupled with the bridge 123. The wiring substrate may further include a second pad group 22, the second pad group 22 being coupled with the light emitting element 121. The wiring substrate may further include a third pad group 23, the third pad group 23 being coupled with the micro driving chip.

Fig. 13 shows the optical element 121 and the second package 1210.

The first reflection layer 30 has a laminated structure of the reflection sheet 40 as in the embodiment of the present disclosure. The first reflection film 41 of the reflection sheet 40 is attached to the surface of the second reflection layer 14 of the wiring substrate provided with the electronic component through the first adhesive layer 42, as shown in fig. 13.

Fig. 14 is a schematic view of a section D1-D1 of the light emitting substrate shown in fig. 5 in another embodiment of the present disclosure, wherein the first reflective layer 30 in the light emitting substrate has a laminated structure as shown in fig. 6A. As shown in fig. 14, the light emitting substrate includes a wiring substrate, an electronic element, and a first reflective layer 30.

The wiring substrate includes a substrate 10, a plurality of metal traces 12 disposed on a side of the substrate 10, and a second reflective layer 14 disposed on a side of the plurality of metal traces 12 facing away from the substrate 10. The second reflective layer 14 is provided with a plurality of windows 141, and the windows 141 expose a portion of the surface of the metal trace 12. The surface of the second reflective layer 14 facing away from the substrate 10 is provided with a second air vent groove 142, the second air vent groove 142 communicating with an edge of the second reflective layer 14.

The exposed area of the metal trace 12 may form a pad. The pads are used for die bonding with the electronic component 120. The electronic components may include LEDs, micro-drive chips, or bridges.

The wiring substrate may include a first pad group 21, and the first pad group 21 is coupled with the bridge 123. The wiring substrate may further include a second pad group 22, the second pad group 22 being coupled with the light emitting element 121. The wiring substrate may further include a third pad group 23, the third pad group 23 being coupled with the micro driving chip.

The first reflection layer 30 has a laminated structure as shown in fig. 6A. The reflection sheet 50 is attached to the surface of the second reflection layer 14 of the wiring substrate provided with the electronic component after the second release film 53 is peeled off, as shown in fig. 14. Therefore, in fig. 14, the first reflection layer 30 includes a third adhesive layer 52 and a second reflection film 51 which are laminated, and the second reflection film 51 is attached to the surface of the second reflection layer 14 of the wiring substrate provided with the electronic component through the third adhesive layer 52.

In the embodiment of the present disclosure, the second air exhaust groove 142 is disposed on the surface of the second reflective layer 14 facing away from the substrate 10, and the second air exhaust groove 142 communicates with the edge of the second reflective layer 14, so that the second air exhaust groove 142 may form an air exhaust channel. Therefore, the gas sealed in the attaching process can be discharged through the second exhaust groove 142, so that full attachment between the reflecting sheet and the light-emitting substrate can be realized, the attaching effect of the reflecting sheet and the light-emitting substrate is improved, gas aggregation is avoided to form bubbles, and the optical effect is improved.

In one embodiment, the width of the second venting grooves 142 is 0.05mm to 0.2mm.

In one embodiment, the depth of the second venting grooves 142 is 5 μm to 15 μm.

In one embodiment, the number of the second air discharging grooves 142 is plural, the plurality of second air discharging grooves 142 are communicated with each other, the plurality of second air discharging grooves are communicated in a grid shape, and the length of the second air discharging grooves 142 is 0.5 mm-2 mm.

Illustratively, the structure, size, and communication shape of the second air vent grooves 142 provided at the surface of the second reflecting layer 14 on the side facing away from the substrate may be the same as those of the first air vent grooves 421.

In order to form the second air vent 142 on the surface of the second reflecting layer 14 facing away from the substrate 10, the material of the second reflecting layer 14 may be photosensitive white ink, and the second air vent 142 may be formed on the surface of the second reflecting layer 14 facing away from the substrate 10 by an exposure and development process.

In the related art, when the reflective sheet 50 having the laminated structure as shown in fig. 6A is used as the light-emitting substrate, the entire surface of the third adhesive layer 52 facing the wiring substrate is an adhesive layer, and the reflective sheet is difficult to tear after being attached to the second reflective layer 14, which reduces the repairability of the process and is not beneficial to the replacement of the reflective sheet. According to the light-emitting substrate disclosed by the embodiment of the disclosure, the first exhaust groove 421 is formed in the surface of the first adhesive layer 42 facing the wiring substrate or the second exhaust groove 142 is formed in the surface of the second reflecting layer 14 facing away from the substrate 10, so that the bonding strength between the reflecting sheet and the second reflecting layer 14 can be properly reduced, the adhering effect is ensured, the repairability of the adhering process is improved, and the reflecting sheet is convenient to replace.

Through a reliability high-temperature test, the shrinkage rate of the reflecting sheet in the light-emitting substrate of the embodiment of the disclosure is about 0.12%, and the process condition of the existing shrinkage rate of 0.18% can be satisfied.

In the related art, as shown in fig. 5, a straight slit structure as shown in fig. 5 is adopted in the first functional area Q1. Because of the larger size of the bridge portion, the protrusion of the first package portion is higher, typically about 1mm, after the bridge portion is packaged, which results in the reflector sheet not being fully consolidated at the first package portion. In the reliability process, after the reflector is contracted, the reflector at the first packaging part bulges to influence the optical effect.

Fig. 15 is a schematic plan view of a light emitting substrate according to an embodiment of the disclosure, fig. 16 is an enlarged schematic view of a first functional region in fig. 15, fig. 17A is a schematic cross-sectional view of F1-F1 in fig. 16, and fig. 17B is a schematic cross-sectional view of F2-F2 in fig. 16. The first functional area in fig. 16 is a first functional area corresponding to the bridge portion 123 shown in fig. 2.

In one embodiment, as shown in fig. 16, the electronic component may include a bridge portion 123, where the bridge portion 123 is coupled to two metal wires. In fig. 16, the bridge portion 123 is coupled to two power signal lines 103, and the two power signal lines 103 are two non-connected metal traces in the metal trace pattern.

As shown in fig. 15 and 16, the first reflective layer 30 has a first functional region Q1, and the bridge portion 123 is orthographically projected on the substrate 10 within an orthographically projected range of the first functional region Q1 on the substrate 10. The first reflective layer 30 is provided with a plurality of first linear slits 61, each first linear slit 61 penetrates the first reflective layer 30 along a direction perpendicular to the substrate 10, and the edge of the first functional region Q1 is surrounded by a plurality of first linear slits 61 arranged at intervals.

As shown in fig. 15 and 16, the first reflective layer 30 is further provided with a plurality of third linear slits 63 located in the first functional area Q1, and the plurality of third linear slits 63 are disposed along at least a portion of the edge of the first functional area Q1 at intervals.

In the reliability process, since the bridge portion 123 bulges, the reflective sheet generates shrinkage stress in the first functional area Q1, and the first linear slit 61 provides a stress release path, and the third linear slit 63 is disposed in the first functional area Q1, so that the stress release path is increased, and in the reliability process, when the reflective sheet shrinks in the first functional area Q1, the stress can be released in the first linear slit 61 and the third linear slit 63 at the same time, thereby avoiding the reflective sheet from bulging in the first functional area Q1 and improving the optical effect.

In one embodiment, as shown in fig. 16, the first reflective layer 30 is further provided with a second linear slit 62 located in the first functional region Q1. The second linear slit 62 penetrates the first reflective layer 30 in a direction perpendicular to the substrate. The orthographic projection of the edge of the second linear slit 62 on the substrate 10 at least partially overlaps with the orthographic projection of the bridge 123 on the substrate 10. The second linear slit 62 divides the first functional region Q1 into a first sub-region and a second sub-region, and the third linear slit 63 is located in at least one of the first sub-region and the second sub-region.

It will be appreciated that the height of the protrusion at the position of the bridge portion 123 is highest, and the orthographic projection of the edge of the second linear slit 62 on the substrate 10 is set to at least partially overlap with the orthographic projection of the bridge portion 123 on the substrate 10, so that the stress at the highest position of the bridge portion 123 can be released by the second linear slit 62, and the bulge of the reflective sheet is avoided. Illustratively, the third linear slit 63 is located in the first sub-region and the second sub-region, so that the third linear slit 63 located in the first sub-region can release the shrinkage stress of the first sub-region, and the third linear slit 63 located in the second sub-region can release the shrinkage stress of the second sub-region, thereby avoiding uneven stress release, further improving the problem of swelling of the reflective sheet, and improving the optical effect.

In one embodiment, as shown in fig. 16, the interval between two adjacent first linear slits 61 is g, and the length of the first linear slits 61 is f, which may be greater than two portions of g. It will be appreciated that in the first functional region Q1, the reflective sheet located between two adjacent first linear slits 61 may generate shrinkage stress during the reliability test, and if this stress is not sufficiently released, the risk of the reflective sheet swelling may increase. By setting f to two portions larger than g, the first linear slit 61 can more sufficiently release the shrinkage stress of the reflective sheet, avoiding the reflective sheet from swelling in the first functional region Q1.

In one embodiment, as shown in fig. 16, the edges of the first functional region Q1 include a first edge 71a, a second edge 71b, a third edge 71c, and a fourth edge 71d that are sequentially connected, the first edge 71a and the third edge 71c being disposed opposite to each other and each extending in the first direction X, and the second edge 71b and the fourth edge 71d being disposed opposite to each other and each extending in the second direction Y. The first direction X is an extending direction of the bridge portion 123, and the second direction Y is perpendicular to the first direction X.

The first linear slit 61 includes a first sub-linear slit 611 and a second sub-linear slit 612, the plurality of first sub-linear slits 611 being disposed along the first edge 71a and the third edge 71c at a distance from each other, and the second sub-linear slit 612 being disposed along the second edge 71b and the fourth edge 71 d. The third linear slits 63 are in one-to-one correspondence with and parallel to the first sub-linear slits 611, and the size of the third linear slits 63 is the same as the size of the first sub-linear slits 611.

With this configuration, the first sub-linear slit 611 and the third linear slit 63 can release the contraction stress of the reflective sheet together, thereby further reducing the risk of swelling of the reflective sheet and improving the optical effect.

In one embodiment, as shown in fig. 16, the second linear slit 62 may extend in the first direction X. In other examples, the second linear slit 62 may extend in the second direction Y. In still other examples, the second linear slit 63 may extend in a direction intersecting both the first direction X and the second direction Y.

In one embodiment, in the second direction Y, the orthographic projection of the second linear slit 62 on the substrate 10 is within the range of the orthographic projection of the bridge 123 on the substrate 10, as shown in fig. 16.

In one embodiment, as shown in fig. 16, the orthographic projection of the bridge 123 on the substrate 10 may be rectangular. The dimension of the bridge portion 123 in the first direction X is W1, and the dimension of the bridge portion 123 in the second direction Y is L1. The gap between the window 141 of the second reflective layer 14 and the bridge portion 123 is a, the offset of the window 141 is b, the precision of the dispensing position of the white glue is c, and the overflow size of the glue is d.

As shown in fig. 16 and 17A and 17B, the light emitting substrate may further include a first package portion 1230, where the first package portion 1230 is located on a side of the bridge portion 123 facing away from the substrate 10, and an orthographic projection of the bridge portion 123 on the substrate 10 is located within an orthographic projection range of the first package portion 1230 on the substrate 10. The first reflective layer 30 is located on a side of the first encapsulation portion 1230 facing away from the substrate 10.

The dimension w2=w1+2 (a+b) +2xc+2×d of the first package portion 1230 in the first direction X, and the dimension l2=l1+2 (a+b) +2xc+2×d of the first package portion 1230 in the second direction Y.

Illustratively, a distance d3 between an orthographic projection of the third linear slit 63 on the substrate 10 and an edge of an orthographic projection of the first encapsulation portion 1230 on the substrate 10 is greater than or equal to 0.5mm, and a distance d4 between the third linear slit and the corresponding first sub-linear slit is 0.8mm to 1.2mm.

Illustratively, the second linear slit 62 may have a size in the first direction X that is greater than the size of the first encapsulation portion 1230 in the first direction X. The difference between the size of the second sub-linear slit 612 in the second direction Y and the size L2 of the first encapsulation portion 1230 in the second direction Y may be greater than 3mm.

In some examples, the length of the third linear slit 63 may range from 1.5mm to 4.5mm, from 2mm to 4mm, from 2.5mm to 3.5mm, or the like. In some examples, the length of the third linear slit 63 may take a value of 1.2mm, 2.8mm, 3.4mm, 4.8mm, or the like.

In some examples, the width of the third linear slit 63 may have a value ranging from 100 μm to 250 μm, 120 μm to 220 μm, or 150 μm to 200 μm, etc. In some examples, the width of the third linear slit 63 may take on a value of 80 μm, 120 μm, 220 μm, 280 μm, or the like.

It will be appreciated that the lengths and widths of the plurality of third linear slits 63 may be the same or different.

It can be appreciated that the length and width of the third linear slit 63 are set to different values, so as to meet different use requirements and improve the reliability of the light-emitting substrate.

It is understood that the length of the linear slit is the dimension of the linear slit in the extending direction thereof, and the width of the linear slit is the dimension of the linear slit in the direction perpendicular to the extending direction.

In one embodiment, the length of the second linear slit 62 may be greater than the dimension W2 of the first encapsulation portion 1230 in the first direction X.

In some examples, the width of the second linear slit 62 may range from 100 μm to 250 μm, from 120 μm to 220 μm, from 150 μm to 200 μm, or the like. In some examples, the width of the second linear slit 62 may take on a value of 80 μm, 120 μm, 220 μm, 280 μm, or the like. The width of the second linear slit 62 may be the same as or different from the width of the third linear slit 63.

Illustratively, the material of the first encapsulation portion 1230 may be a light transmissive material, such as transparent silicone. In other examples, the material of the first encapsulation portion 1230 may also be a reflective material, such as white silica gel. Embodiments of the present disclosure do not further limit the material of the first encapsulation portion 1230.

It should be noted that, in the above description, each dimension of the bridge portion 123 is a dimension of an orthographic projection of the bridge portion 123 on the substrate 10; each dimension of the first package portion 1230 is the dimension of the orthographic projection of the first package portion 1230 on the substrate 10.

Illustratively, at least a partial region of the side of the first encapsulation portion 1230 remote from the substrate 10 may reflect light. In some examples, the area of the first package portion 1230 far from the side of the substrate 10 and exposed by the second linear slit 62 may reflect light, so as to reduce the influence of the first package portion 1230 on the brightness of the substrate, and improve the light utilization rate of the area of the first package portion 1230 incident on the substrate and improve the brightness uniformity of the substrate.

Fig. 18 is a schematic sectional view of D1-D1 in the light emitting substrate shown in fig. 15, and fig. 19 is a schematic sectional view of D2-D2 in the light emitting substrate shown in fig. 15.

In one embodiment, as shown in fig. 15 and 18, the electronic component may include a light emitting element 121, such as an LED. The light emitting substrate may further include a second encapsulation portion 1210, and an orthographic projection of the light emitting element 121 on the substrate 10 is located within an orthographic projection range of the second encapsulation portion 1210 on the substrate 10. The first reflective layer 30 is provided with a first through hole M1, and the orthographic projection of the second encapsulation portion 1210 on the substrate 10 is located in the orthographic projection of the first through hole M1 on the substrate 10, so that the second encapsulation portion 1210 can be exposed through the first through hole M1.

Illustratively, as shown in fig. 18, the second package portion 1210 covers the light emitting element 121, which can protect the light emitting element 21 and prolong the service life of the light emitting element 121. The material of the second packaging part 1210 is a light-transmitting material, so that the shielding of the second packaging part 1210 to light is reduced, and the intensity of light capable of passing through the second packaging part 1210 is improved.

In some examples, the material of the second encapsulation 1210 includes transparent glue. In some embodiments, the second encapsulation portion 1210 may be mushroom-shaped or approximately mushroom-shaped.

In one embodiment, as shown in fig. 15 and 19, the electronic components may include a micro-drive chip 122. The light emitting substrate may further include a third encapsulation portion 1220, and the front projection of the micro driving chip 122 on the substrate 10 is located within the front projection range of the third encapsulation portion 1220 on the substrate 10. The first reflective layer 30 has a second functional region Q2, and the orthographic projection of the third encapsulation portion 1220 on the substrate 10 is located within the orthographic projection range of the second functional region Q2 on the substrate 10. The first reflective layer 30 is provided with a fourth linear slit 64. The fourth linear slit 64 is located in the second functional region Q2. The fourth linear slit 64 penetrates the first reflective layer 30 in a direction perpendicular to the substrate 10, and the orthographic projection of the fourth linear slit 64 on the substrate 10 at least partially overlaps with the orthographic projection of the micro driving chip 122 on the substrate 10. The fourth linear slit 64 can release the shrinkage stress of the reflection sheet in the second functional region Q2, and prevent the reflection sheet from swelling in the second functional region Q2.

The number of the fourth linear slits 64 located in the same second functional area Q2 may be one or more. The number of fourth linear slits 64 in the different second functional areas Q2 may be the same or different.

In some examples, as shown in fig. 15, at least two fourth linear slits 64 are located in the same second functional region Q2, and at least two fourth linear slits 64 located in the same second functional region Q2 are distributed in the second functional region Q2 in the circumferential direction.

Illustratively, at least two fourth linear slits 64 located in the same second functional region Q2 intersect at the same position, as shown in fig. 15, so that at least two fourth linear slits 64 located in the same second functional region Q2 are intersecting slits, such as cross-shaped slits or X-shaped slits. The fourth linear slit 64 in the second functional region Q2 is configured as a cross slit, so that the shrinkage stress of the central region of the second functional region Q2 can be better released, and the second functional region Q2 reflective sheet is prevented from swelling.

Illustratively, the third encapsulation portion 1220 covers the micro driving chip, and can protect the micro driving chip and prolong the life thereof.

Illustratively, the material of the third encapsulation portion 1220 may be a light-transmitting material, such as transparent silicone. In other examples, the material of the third encapsulation portion 1220 may also be a reflective material, such as white silica gel. Embodiments of the present disclosure do not further limit the material of the third encapsulation portion 1220.

Fig. 20 is a schematic plan view of a light-emitting substrate according to another embodiment of the disclosure. As shown in fig. 20, the fourth linear slit 64 located in the same second functional region Q2 may intersect into a cross-shaped slit. In the embodiment shown in fig. 15, the first reflective layer 30 covers the third encapsulation portion 1220. In another embodiment, as shown in fig. 20, the first reflective layer 30 is provided with a second through hole M5. The second through hole M2 penetrates the first reflective layer 30 along a direction perpendicular to the substrate 10, and the third package 1220 and the micro driving chip 122 can be exposed through the second through hole M2, so that shrinkage stress of the third package 1220 on the first reflective layer 30 is avoided.

In one embodiment, as shown in fig. 13, 14 and 18, the light emitting substrate further includes a plurality of reflective parts 80, and the reflective parts 80 are disposed at edges of the window 141.

It will be appreciated that the reflective portion 80 functions to reflect light. In some examples, the material of the reflective portion 80 includes white glue. The reflecting portion 80 may be formed by way of a supplementary white glue, for example.

The embodiment of the disclosure also provides a display device, which comprises the light-emitting substrate in any embodiment of the disclosure.

The light emitting substrate in the embodiments of the present disclosure may be mounted in a display device as a display panel, or may be mounted in a display device as a light source, and the display device may be: electronic paper, mobile phone, tablet computer, television, display, notebook computer, digital photo frame, navigator, wearable display device, etc.

The luminescent substrate in the embodiments of the present disclosure may also be used as a luminescent light source in a lighting product.

In the description of the present specification, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present disclosure.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present disclosure, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; the device can be mechanically connected, electrically connected and communicated; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art as the case may be.

In this disclosure, unless expressly stated or limited otherwise, a first feature being "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is less level than the second feature.

The above disclosure provides many different embodiments or examples for implementing different structures of the disclosure. The components and arrangements of specific examples are described above in order to simplify the present disclosure. Of course, they are merely examples and are not intended to limit the present disclosure. Furthermore, the present disclosure may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed.

The above is merely a specific embodiment of the disclosure, but the protection scope of the disclosure is not limited thereto, and any person skilled in the art can easily think of various changes or substitutions within the technical scope of the disclosure, which should be covered in the protection scope of the disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (19)

1. The utility model provides a reflector plate, its characterized in that, including the first reflectance coating, first glue material layer and the first from the type membrane that the lamination set gradually, first glue material layer be close to first from the type membrane one side surface is provided with first exhaust groove, first exhaust groove with the edge intercommunication on first glue material layer.

2. The reflective sheet of claim 1, wherein the width of the first air vent groove is 0.05mm to 0.2mm.

3. The reflective sheet of claim 1, wherein a depth of the first air vent is less than a thickness of the first glue layer.

4. A reflective sheet according to claim 3 wherein the depth of the first air vent is from 25% to 75% of the thickness of the first glue layer.

5. The reflective sheet according to claim 1, wherein the number of the first air discharge grooves is plural, and the plural first air discharge grooves are communicated with each other.

6. The reflector sheet of claim 5, wherein a plurality of the first air discharge grooves are connected in a mesh shape.

7. The reflective sheet of claim 6, wherein the first air discharge groove has a length of 0.5mm to 2mm.

8. The reflective sheet according to claim 1, wherein the thickness of the first adhesive layer is 15 μm to 30 μm; and/or the viscosity of the first adhesive layer is 1500 (g/25 mm) to 2200 (g/25 mm).

9. The reflective sheet of claim 1 further comprising a transparent film and a second glue layer disposed between said first glue layer and said first reflective film, said second glue layer being proximate to said first reflective film.

10. A light-emitting substrate, comprising:

the wiring substrate comprises a substrate, a plurality of metal wires arranged on one side of the substrate and a second reflecting layer arranged on one side of the metal wires, which is away from the substrate, wherein the second reflecting layer is provided with a plurality of windows, and the windows expose part of the surfaces of the metal wires;

an electronic component coupled with the exposed surface of the metal wire;

a first reflecting layer comprising the reflecting sheet according to any one of claims 1 to 9, the reflecting sheet being attached to a second reflecting layer surface of the wiring substrate provided with the electronic component through a first adhesive layer.

11. A light-emitting substrate, comprising:

the wiring substrate comprises a substrate, a plurality of metal wires arranged on one side of the substrate and a second reflecting layer arranged on one side of the metal wires, which is away from the substrate, wherein the second reflecting layer is provided with a plurality of windows, and the windows expose part of the surfaces of the metal wires; a second exhaust groove is formed in the surface of the second reflecting layer, which is away from one side of the substrate, and the second exhaust groove is communicated with the edge of the second reflecting layer;

An electronic component coupled with the exposed surface of the metal wire;

the first reflecting layer comprises a third adhesive layer and a second reflecting film which are arranged in a laminated mode, and the second reflecting film is attached to the surface of the second reflecting layer of the wiring substrate provided with the electronic element through the third adhesive layer.

12. The light-emitting substrate according to claim 11, wherein a width of the second exhaust groove is 0.05mm to 0.2mm; and/or the depth of the second exhaust groove is 5-15 μm.

13. The light-emitting substrate according to claim 11, wherein the number of the second air discharge grooves is plural, the plural second air discharge grooves are communicated with each other, the plural second air discharge grooves are communicated in a lattice shape, and the length of the second air discharge grooves is 0.5mm to 2mm.

14. The light emitting substrate of any one of claims 10-13, wherein the electronic component comprises a bridge portion coupled with two of the metal traces;

the first reflecting layer comprises a first functional area, and the orthographic projection of the bridging part on the substrate is positioned in the orthographic projection range of the first functional area on the substrate; the first reflecting layer is provided with a plurality of first linear gaps, each first linear gap penetrates through the first reflecting layer along the direction perpendicular to the substrate, and the edge of the first functional area is formed by surrounding a plurality of first linear gaps which are arranged at intervals;

The first reflecting layer is also provided with a plurality of third linear gaps positioned in the first functional area, and the third linear gaps are mutually arranged along at least part of the edges of the first functional area at intervals.

15. The light-emitting substrate according to claim 14, wherein a length of the first linear slit is greater than twice a spacing between adjacent two of the first linear slits.

16. The light-emitting substrate according to claim 14, wherein the first reflective layer is further provided with a second linear slit located in the first functional region, the second linear slit penetrating the first reflective layer in a direction perpendicular to the substrate, an orthographic projection of an edge of the second linear slit on the substrate at least partially overlapping an orthographic projection of the bridge portion on the substrate, the second linear slit dividing the first functional region into a first sub-region and a second sub-region, and the third linear slit being located in at least one of the first sub-region and the second sub-region.

17. The light-emitting substrate according to claim 14, wherein edges of the first functional region include a first edge, a second edge, a third edge, and a fourth edge that are sequentially connected, the first edge and the third edge being disposed opposite to each other and extending in a first direction, the second edge and the fourth edge being disposed opposite to each other and extending in a second direction, the first direction being an extending direction of the bridge portion, the second direction being perpendicular to the first direction;

The first linear slit comprises a first sub-linear slit and a second sub-linear slit, the plurality of first sub-linear slits are arranged at intervals along the first edge and the third edge, the second sub-linear slit is arranged along the second edge and the fourth edge, the third linear slit corresponds to the first sub-linear slit one by one and is parallel to the first sub-linear slit, and the size of the third linear slit is the same as that of the first sub-linear slit.

18. The light emitting substrate of claim 17, further comprising a first encapsulation portion on a side of the bridge portion facing away from the substrate, an orthographic projection of the bridge portion on the substrate being within an orthographic projection range of the first encapsulation portion on the substrate; the first reflection layer is positioned on one side of the first encapsulation part, which is far away from the substrate, the distance between the orthographic projection of the third linear slit on the substrate and the edge of the orthographic projection of the first encapsulation part on the substrate is greater than or equal to 0.5mm, and the distance between the third linear slit and the corresponding first sub-linear slit is 0.8-1.2 mm.

19. A display device comprising the light-emitting substrate according to any one of claims 10 to 18.

Images