CN218927208U - Crystal silicon grinding and polishing device - Google Patents
Crystal silicon grinding and polishing device Download PDFInfo
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- CN218927208U CN218927208U CN202223562103.6U CN202223562103U CN218927208U CN 218927208 U CN218927208 U CN 218927208U CN 202223562103 U CN202223562103 U CN 202223562103U CN 218927208 U CN218927208 U CN 218927208U
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Abstract
The utility model provides a crystal silicon polishing device, which comprises: the workpiece clamping mechanism is arranged on the inclined working surface of the lathe body through the feeding mechanism, and the clamping direction of the workpiece clamping mechanism is parallel to the inclined working surface of the lathe body; the polishing mechanism is arranged in the movement direction of the workpiece clamping mechanism and is used for polishing a workpiece to be processed; through setting up lathe bed body slope, its upper surface and horizontal plane slope certain angle, this design can avoid lathe bed surface ponding, has solved the equipment damage problem because ponding problem leads to for feed mechanism can be put down, places on oblique lathe bed, can improve the stability when the complete machine works like this, further improves the precision to work piece processing.
Description
Technical Field
The utility model relates to the technical field of polishing devices, in particular to a crystal silicon polishing device with an inclined lathe bed.
Background
In the technical field of cutting high-hardness and brittle materials, the processing process of monocrystalline silicon wafers generally needs to be subjected to technological processes such as cutting, squaring and slicing, wherein operations such as grinding, polishing and the like are needed after the silicon rod is squared, and a workpiece feeding guide rail of a grinding and polishing device in the prior art is inconvenient to be placed under the silicon rod, water can be accumulated on a flat bed body platform under the silicon rod, and a solution containing silicon powder and water can easily corrode moving parts such as the guide rail, a sliding block and the like, so that the service life of equipment is lower, and faults are easy to occur.
Therefore, in view of the problems in the prior art, there is a need for a polishing device that can avoid water accumulation on a bed and can make a motion mechanism be placed above a bed base.
Disclosure of Invention
Aiming at the technical problems, the technical scheme of the utility model provides a crystalline silicon polishing device which is used for processing monocrystalline silicon materials in the photovoltaic field.
The utility model provides a crystal silicon polishing device, which comprises: the workpiece clamping mechanism is arranged on the inclined working surface of the lathe body through the feeding mechanism, and the clamping direction of the workpiece clamping mechanism is parallel to the inclined working surface of the lathe body; the polishing mechanism is arranged in the movement direction of the workpiece clamping mechanism and is used for polishing a workpiece to be processed.
According to the technical scheme, the inclination angle of the working face of the lathe body is further optimized to be 15-75 degrees.
According to further optimization of the technical scheme, the feeding mechanism comprises a driving motor, a feeding screw and a sliding rail, wherein the feeding screw is parallel to the sliding rail, the feeding screw is connected with the driving motor, and the workpiece clamping mechanism is arranged on the sliding rail in a sliding manner through the feeding screw.
According to further optimization of the technical scheme, the polishing mechanism comprises a rough polishing unit and a fine polishing unit, and the central connecting line of the spindle grinding wheels of the rough polishing unit and the fine polishing unit is parallel to the clamping direction of the workpiece clamping mechanism.
According to the technical scheme, the spindle base and the lathe bed body are integrally arranged or separately arranged.
According to the technical scheme, the main shaft base comprises a coarse grinding unit fixing seat and a fine grinding unit fixing seat which are arranged in a stepped mode, and the coarse grinding unit and the fine grinding unit are respectively arranged on the corresponding fixing seats.
According to further optimization of the technical scheme, the coarse grinding unit and the fine grinding unit are respectively arranged on the main shaft base through the propelling mechanism.
According to the technical scheme, the number of the spindle bases is two, and the two spindle bases are symmetrically arranged on two sides of the lathe bed body.
According to the technical scheme, the spindle further comprises a dimension measuring assembly, and the dimension measuring assembly is arranged on the spindle base.
Compared with the prior art, the technical scheme of the utility model has the advantages that:
1. by inclining the lathe bed body, the upper surface of the lathe bed body is inclined at a certain angle with the horizontal plane, the design can avoid water accumulation on the surface of the lathe bed, solves the problem of equipment damage caused by the water accumulation problem, enables the feeding mechanism to be arranged downwards and placed on the inclined lathe bed, can improve the stability of the whole machine during working, and further improves the precision of workpiece processing; in addition, the inclined lathe bed can optimize the space layout of equipment, and is lower than the vertical type grinding machine in height and smaller than the horizontal type grinding machine in occupied area.
2. The workpiece clamping mechanism is arranged on the inclined lathe bed body, and is fed obliquely through the feeding mechanism, so that the workpiece clamping mechanism can act on the screw nut along the oblique feeding through the gravity component of the mechanism, the reverse gap is eliminated, the feeding is more stable, and the reverse displacement of the grinding and polishing device when the feeding speed is changed or the grinding and polishing resistance is changed is avoided, and the grinding and polishing quality is prevented from being influenced; meanwhile, the feeding mechanism is arranged below and placed on the inclined lathe bed, and the rigidity of the mechanism is higher.
Drawings
The utility model will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings.
FIG. 1 is a schematic structural view of a crystal silicon polishing device of the present utility model;
FIG. 2 is a schematic view of the structure of the main body and the spindle base of the present utility model;
fig. 3 is a schematic view of a partial space structure of the body and the polishing mechanism of the present utility model.
In the drawings, like parts are designated with like reference numerals. The figures are not drawn to scale.
Description of the reference numerals:
1-a lathe bed body; 2-a workpiece clamping mechanism; 31-a coarse grinding unit; 32-a fine grinding unit; 33-a spindle base; 34-a propulsion mechanism; 331-a fixing seat of the fine grinding unit; 332-a coarse grinding unit fixing seat; 41-feed screw; 42-slide rail.
Detailed Description
Other advantages and advantages of the present utility model will become apparent to those skilled in the art from the following detailed description, which, by way of illustration, is to be read in connection with certain specific embodiments, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The terminology used in the embodiments of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise, the "plurality" generally includes at least two, but does not exclude the case of at least one.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a product or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such product or system. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a commodity or system comprising such element. In the description of the present utility model, it should be understood that the terms "upper", "lower", "bottom", "top", "front", "rear", "inner", "outer", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
The utility model will be further described with reference to fig. 1-3.
In the photovoltaic crystalline silicon processing technical field, need to carry out coarse grinding and finish grinding to the silicon material after the evolution before the silicon chip is cut, can use the polishing liquid to cool and increase the polishing performance in the process of polishing, but can produce hydrops or adhere to bottom equipment after the polishing liquid flows to the lathe bed of the polishing device, because contain positions such as silica flour in the polishing liquid and have strong corrosivity to the equipment, the production that has set up the equipment trouble needs regular maintenance, the maintenance cost is higher and can influence cutting efficiency, in order to solve this, generally put up feeding mechanism etc. in the prior art, reduce its contact with polishing liquid, or set up the polishing mechanism vertical and reduce the residence time of polishing liquid on the equipment, but set up or vertical setting is higher to the stability of installation to the equipment, thereby increased the cost of manufacture of equipment, this technical scheme has designed a crystalline silicon polishing device as shown in figure 1 to the above-mentioned problem in the prior art, include: the machine tool comprises a machine tool body 1, a workpiece clamping mechanism 2, a feeding mechanism and a polishing mechanism, wherein the working face of the machine tool body 1 is obliquely arranged relative to the horizontal plane, so that water accumulation on the surface of the machine tool body can be avoided by obliquely arranging the machine tool body, equipment failure caused by corrosion of equipment or excessive silicon powder attached to the surface can be avoided, the workpiece clamping mechanism 2 is arranged on the oblique working face of the machine tool body 1 through the feeding mechanism, the clamping direction of the workpiece clamping mechanism 2 is parallel to the oblique working face of the machine tool body 1, workpiece feeding is carried out along the oblique face, and the design can enable gravity component force of the feeding mechanism and the workpiece clamping mechanism 2 to act on a screw nut to eliminate reverse clearance, so that feeding is more stable; therefore, the polishing mechanism can be effectively controlled in the movement direction of the workpiece clamping mechanism 2 so as to polish the workpiece to be processed.
Aiming at the inclination angle design of the lathe bed, the inventor of the technical scheme of the application obtains that the inclination angle of the working surface of the lathe bed body 1 is 15-75 degrees, and preferably 35 degrees, 40 degrees or 45 degrees are selected by combining two factors of the inclined flow rate of the polishing liquid and the component force of equipment in the inclined direction. The inclined design of the lathe bed body 1 can optimize the space layout of equipment, so that the height of the equipment is lower than that of a vertical type grinding machine, and the occupied area of the equipment is smaller than that of a horizontal type grinding machine.
The feeding mechanism is arranged along the inclined plane of the lathe bed body, the specific feeding mechanism comprises a driving motor, a feeding screw 41 and a sliding rail 42, the workpiece clamping mechanism 2 is matched with the feeding screw 41 through a screw nut, the workpiece clamping mechanism 2 moves on the sliding rail 42 under the driving of the driving motor, an installation groove is formed in the middle of the lathe bed body 1 for increasing the overall working performance of equipment according to an alternative implementation mode of the feeding mechanism, the feeding screw 41 and the driving motor of the workpiece clamping mechanism 2 are arranged in the installation groove, so that the equipment can be conveniently installed, the feeding stability after installation can be guaranteed to the greatest extent, meanwhile, through the design of the installation groove, the upper surface of the workpiece clamping mechanism 2 is flush with the working surface of the lathe bed body 1 after a protective cover is arranged on the feeding screw 41, the residence time of polishing liquid is reduced, and therefore the equipment is prevented from being corroded by the polishing liquid under the condition that the driving motor is benign to control the feeding screw 41 is guaranteed.
As shown in fig. 1 and fig. 3, a spindle base 33 is further disposed on one side of the lathe body 1, where the spindle base 33 and the lathe body 1 may be integrally disposed or may be separately disposed, and when integrally disposed, the stability of the whole lathe body 1 is stronger, but a stable mounting platform needs to be preset when the polishing mechanism needs to be stably fixed on the spindle base 33; when the split setting, the flexibility of whole equipment is stronger, and installation and regulation are more convenient.
In order to adapt to the inclined design of the bed base, the spindle base 33 is designed into a coarse grinding unit fixing seat 332 and a fine grinding unit fixing seat 331 which are in a stepped shape, and the coarse grinding unit 31 and the fine grinding unit 32 are respectively arranged on the spindle base 33 through a propelling mechanism 34; the central connecting line of the spindle grinding wheels of the rough grinding unit 31 and the fine grinding unit 32 is parallel to the clamping direction of the workpiece clamping mechanism 2, so that effective contact with the workpiece during grinding and polishing can be effectively ensured; in this technical solution, the number of the spindle bases 33 is preferably two, and the two spindle bases 33 are symmetrically disposed on two sides of the lathe bed body 1, and rough grinding and fine grinding are performed on the workpiece according to the workpiece data measured by the size measuring component under the action of the controller through the propulsion control mechanism. The preferred dimensional measuring assembly is disposed on the spindle base 33 so that the workpiece can be measured and machined in a targeted manner.
In the technical scheme, besides the workpiece clamping mechanism 2 is arranged on the base body through the feeding mechanism in the embodiment, the workpiece clamping mechanism 2 can be fixed, the polishing mechanism is arranged on the base body in a sliding manner, and only the sliding base of the polishing mechanism is required to be arranged into the stepped polishing mechanism installation fixing base in the embodiment.
All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
While the utility model has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present utility model is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (9)
1. The utility model provides a crystalline silicon grinds throwing device which characterized in that includes: the workpiece clamping mechanism is arranged on the inclined working surface of the lathe body through the feeding mechanism, and the clamping direction of the workpiece clamping mechanism is parallel to the inclined working surface of the lathe body; the polishing mechanism is arranged in the movement direction of the workpiece clamping mechanism and is used for polishing a workpiece to be processed.
2. The crystalline silicon polishing apparatus as claimed in claim 1, wherein the working surface of the body is inclined at an angle of 15-75 degrees.
3. The crystal silicon polishing device according to claim 2, wherein the feeding mechanism comprises a driving motor, a feeding screw and a sliding rail, wherein the feeding screw and the driving motor are mutually parallel, and the workpiece clamping mechanism is arranged on the sliding rail in a sliding manner through the feeding screw.
4. A crystalline silicon polishing apparatus according to any one of claims 1 to 3, wherein the polishing mechanism comprises a rough polishing unit and a finish polishing unit, and a line connecting the centers of spindle grinding wheels of the rough polishing unit and the finish polishing unit is parallel to a clamping direction of the workpiece clamping mechanism.
5. The crystal silicon polishing apparatus according to claim 4, further comprising a spindle base, wherein the spindle base is integrally provided with the bed body or separately provided.
6. The device of claim 5, wherein the spindle base comprises a coarse grinding unit fixing seat and a fine grinding unit fixing seat which are arranged in a stepped manner, and the coarse grinding unit and the fine grinding unit are respectively arranged on the corresponding fixing seats.
7. The crystalline silicon polishing apparatus as recited in claim 6, wherein the rough grinding unit and the fine grinding unit are respectively provided on the spindle base by a propelling mechanism.
8. The crystal silicon polishing device according to claim 5, wherein the number of the spindle bases is two, and the two spindle bases are symmetrically arranged on two sides of the lathe body.
9. The crystalline silicon polishing apparatus as recited in claim 5 further comprising a dimension measurement assembly disposed on the spindle base.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223562103.6U CN218927208U (en) | 2022-12-30 | 2022-12-30 | Crystal silicon grinding and polishing device |
| PCT/CN2023/103094 WO2024002138A1 (en) | 2022-06-30 | 2023-06-28 | Wire cutting machine and cutting method and control method thereof, and crystal silicon grinding and polishing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223562103.6U CN218927208U (en) | 2022-12-30 | 2022-12-30 | Crystal silicon grinding and polishing device |
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| Publication Number | Publication Date |
|---|---|
| CN218927208U true CN218927208U (en) | 2023-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223562103.6U Active CN218927208U (en) | 2022-06-30 | 2022-12-30 | Crystal silicon grinding and polishing device |
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| CN (1) | CN218927208U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024002138A1 (en) * | 2022-06-30 | 2024-01-04 | 青岛高测科技股份有限公司 | Wire cutting machine and cutting method and control method thereof, and crystal silicon grinding and polishing device |
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2022
- 2022-12-30 CN CN202223562103.6U patent/CN218927208U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024002138A1 (en) * | 2022-06-30 | 2024-01-04 | 青岛高测科技股份有限公司 | Wire cutting machine and cutting method and control method thereof, and crystal silicon grinding and polishing device |
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