CN218920875U

CN218920875U - Double-sided cooling vertical T-shaped radiator of power device

Info

Publication number: CN218920875U
Application number: CN202320055251.4U
Authority: CN
Inventors: 郑建; 常军
Original assignee: Shanghai Lianke Xihe Energy Technology Co ltd
Current assignee: Lianke Xihe Energy Technology (Suzhou) Co.,Ltd.
Priority date: 2023-01-09
Filing date: 2023-01-09
Publication date: 2023-04-25
Anticipated expiration: 2033-01-09

Abstract

The utility model discloses a double-sided cooling vertical T-shaped radiator of a power device, which is characterized in that the radiator is provided with the power device and comprises: a base plate and heat dissipation teeth; the substrate comprises a substrate upper part and a substrate lower part, the cross section of the substrate upper part is rectangular, the radiating teeth are uniformly distributed on two sides of the substrate upper part, the cross section of each radiating tooth is approximately triangular, the surface of each radiating tooth is provided with corrugations, and the top ends of the radiating teeth are fillets; the cross section of the lower part of the substrate is trapezoid, and the power devices are arranged on two sides of the lower part of the substrate.

Description

Double-sided cooling vertical T-shaped radiator of power device

Technical Field

The utility model relates to the technical field of radiators, in particular to a double-sided cooling vertical T-shaped radiator of a power device.

Background

With the continuous development of the technology of the switching power supply, the power of the switching power supply is larger and larger, the size of the switching power supply is smaller and smaller, and the heat dissipation of the power device meets new challenges.

In the use process of the radiator, along with the improvement of the power of the switching power supply, the power device generates more heat, the thickness of the cross section of the substrate of the radiator is increased on the basis of the original thickness so as to improve the conduction efficiency of the radiator, however, the contact area between the bottom of the substrate and the PCB is increased by increasing the thickness of the substrate, so that the layout space of the PCB is affected, the current loop is enlarged, the stability of a circuit is affected, and the design of the switching power supply is not facilitated.

Therefore, how to provide a heat sink that makes the circuit more reasonable is a problem that needs to be solved by those skilled in the art.

Disclosure of Invention

In view of this, the utility model provides a double-sided cooling vertical T-shaped radiator of a power device, which aims to optimize the layout space of a PCB and make a circuit more reasonable on the premise of improving the heat radiation function.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

a double-sided cooled vertical T-shaped heat sink for a power device, the power device being mounted on the heat sink, comprising: a base plate and heat dissipation teeth;

the substrate comprises a substrate upper part and a substrate lower part, the cross section of the substrate upper part is rectangular, the radiating teeth are uniformly distributed on two sides of the substrate upper part, the cross section of each radiating tooth is approximately triangular, the surface of each radiating tooth is provided with corrugations, and the top ends of the radiating teeth are fillets;

the cross section of the lower part of the substrate is trapezoid, and the power devices are arranged on two sides of the lower part of the substrate.

Preferably, n mounting holes are formed in two side surfaces of the lower portion of the substrate, wherein n is an integer greater than or equal to 1, and the mounting holes are used for mounting the power device.

Compared with the radiator in the prior art, the radiator in the utility model can be provided with a thicker substrate, a shorter conduction path and smaller thermal resistance, and can conduct more heat under the condition that the bottom area of the radiator is the same as that of the traditional radiator; and the radiator in the utility model has smaller bottom area under the condition of the same thickness as the traditional radiator base plate, can save PCB space, has smaller circuit current loop, smaller parasitic inductance and high circuit stability, and has the corrugated surface with the rugged shape, thereby enlarging the radiating area, improving the radiating effect and solving the technical problems of the radiator in the prior art.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a double-sided cooling vertical T-shaped radiator for a power device;

fig. 2 is an enlarged schematic diagram of a heat dissipation tooth structure in a double-sided cooling vertical T-shaped heat sink of a power device according to the present utility model;

FIG. 3 is a schematic diagram of the position of a mounting hole in a double-sided cooling vertical T-shaped radiator of a power device;

FIG. 4 is a front view of a double-sided cooling vertical T-shaped radiator for a power device provided by the utility model;

the power device comprises a substrate-1, a substrate upper part-2, a substrate lower part-3, a power device-4, heat dissipation teeth-5, a heat dissipation tooth surface-6, heat dissipation tooth top ends-7 and mounting holes-8.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The embodiment of the utility model discloses a double-sided cooling vertical T-shaped radiator of a power device, wherein the power device 4 is arranged on the radiator, as shown in figure 1, and comprises the following components: a base plate 1 and heat dissipation teeth 5;

the substrate 1 comprises a substrate upper part 2 and a substrate lower part 3, the cross section of the substrate upper part 2 is rectangular, as shown in fig. 2, radiating teeth 5 are uniformly distributed on two sides of the substrate upper part 2, the cross section of each radiating tooth 5 is approximately triangular, the surfaces 6 of the radiating teeth are provided with corrugations, and the top ends 7 of the radiating teeth are round corners;

the cross section of the lower substrate part 3 is trapezoid, and the power devices 4 are arranged on two sides of the lower substrate part 3.

In order to further implement the above technical solution, n mounting holes 8 are provided on two sides of the lower substrate portion 3, where n is an integer greater than or equal to 1, and the mounting holes 8 are used for mounting the power device 4, as shown in fig. 3-4.

The cross section of the radiator substrate in the prior art is rectangular, if the conduction efficiency is required to be improved, the thickness of the substrate is required to be increased, however, the contact area between the bottom of the substrate and the PCB is increased by increasing the thickness of the substrate, so that the layout space of the PCB is influenced, a current loop is enlarged, the circuit stability is influenced, and the design of a switching power supply is not facilitated; and under the condition that the thickness of the radiator is the same as that of a traditional radiator substrate, the bottom area is smaller, the PCB space can be saved, the circuit current loop is smaller, the parasitic inductance is smaller, the circuit stability is high, the technical problems of the radiator in the prior art are solved, the surface 6 of the radiating tooth is provided with the corrugation, the radiating area is enlarged, and the radiating effect is improved.

In the present specification, each embodiment is described in a progressive manner, and each embodiment is mainly described in a different point from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points refer to the description of the method section.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A double-sided cooled vertical T-shaped heat sink for a power device, the power device being mounted on the heat sink, comprising: a base plate and heat dissipation teeth;

2. The double-sided cooling vertical T-shaped heat sink for a power device according to claim 1, wherein n mounting holes are provided on both sides of the lower portion of the base plate, where n is an integer greater than or equal to 1, and the mounting holes are used for mounting the power device.