CN218918822U

CN218918822U - Wafer conversion device

Info

Publication number: CN218918822U
Application number: CN202223479961.4U
Authority: CN
Inventors: 贾亚飞; 郭静; 季春瑞; 许桂洋; 刘佳均; 张�浩
Original assignee: Anhui Xinxinwei Semiconductor Co ltd
Current assignee: Jingliang Beijing Electronic Technology Co ltd
Priority date: 2022-12-26
Filing date: 2022-12-26
Publication date: 2023-04-25
Anticipated expiration: 2032-12-26

Abstract

The application discloses wafer conversion device belongs to wafer conversion technical field, including the mobile station, this mobile station sets up on the slide rail, and be connected with actuating mechanism, actuating mechanism is used for driving the mobile station and removes, be provided with the chassis on this mobile station, be provided with fixed establishment between chassis and the mobile station, fixed establishment includes the dog, the dog is fixed in on the mobile station, be provided with telescopic connection spare on the dog, be used for carrying out fixed connection to the chassis, telescopic connection spare includes the spring, one side that the spring is close to the chassis is provided with the ball, the ball is used for spacing the chassis, and fix the chassis through the elasticity that the spring provided. In the implementation of the technical scheme of the utility model, the chassis and the mobile station are fixedly connected by the stop block, the telescopic connecting piece is arranged on the stop block, and the chassis is installed on the mobile station by the deformation and elasticity of the spring in the installation process of the chassis, so that the chassis is fixed, the disassembly and the assembly are convenient, and the processing efficiency is improved.

Description

Wafer conversion device

Technical Field

The application relates to the technical field of wafer conversion, in particular to a wafer conversion device.

Background

In the processing of semiconductors, wafer processing is a common processing procedure, a wafer cassette corresponding to the wafer size is placed under a processing arm of a wafer, then the wafer is placed in the wafer cassette, and after the processing of one procedure is completed, the wafer needs to be transferred into another wafer cassette.

Currently, there is a wafer conversion device disclosed in chinese patent publication No. CN204720434U, which discloses a wafer conversion wafer chuck, the wafer chuck includes a chassis for placing a wafer to be processed, at least one stop block disposed near an edge of the chassis, and a clamping device disposed on the chassis, so that the wafer to be processed can be fixed on the chassis.

However, in the process of implementing the technical scheme of the utility model in the embodiment of the application, the inventor of the application finds that at least the following technical problems exist in the above technology: because the sizes of the wafers are different, for example, the sizes of the wafers commonly used at present are 8 inches and 12 inches, when the specification of the wafer cassette is not matched with the size of the wafer to be processed, the wafer is easy to shake, so that the processing of the wafer is affected, and the yield of the wafer is reduced.

It is therefore desirable to provide a wafer transfer apparatus that facilitates replacement of a boat.

It should be noted that the above information disclosed in this background section is only for understanding the background of the inventive concept and, therefore, it may contain information that does not constitute prior art.

Disclosure of Invention

Based on the above-mentioned problems existing in the prior art, an object of an embodiment of the present application is to: the wafer conversion device achieves the effect of conveniently replacing the wafer boat, and improves the wafer processing efficiency.

The technical scheme adopted for solving the technical problems is as follows: the utility model provides a wafer conversion device, includes the mobile station, this mobile station sets up on the slide rail to be connected with actuating mechanism, actuating mechanism is used for driving the mobile station and removes, is provided with the chassis on this mobile station, be provided with fixed establishment between chassis and the mobile station, fixed establishment includes the dog, the dog is fixed in on the mobile station, be provided with telescopic connection spare on the dog for carry out fixed connection to the chassis, telescopic connection spare includes the spring, the one side that the spring is close to the chassis is provided with the ball, the ball is used for spacing the chassis to fix the chassis through the elasticity that the spring provided.

In the implementation of the technical scheme of the utility model, the chassis and the mobile station are fixedly connected by the stop block, the telescopic connecting piece is arranged on the stop block, and the chassis is installed on the mobile station by the deformation and elasticity of the spring in the installation process of the chassis, so that the chassis is fixed, the disassembly and the assembly are convenient, and the processing efficiency is improved.

Further, a limiting groove is formed in the portion, contacted with the fixing mechanism, of the chassis, and the limiting groove is used for matching with the ball.

Further, a placing cavity is arranged on the chassis, and the specification of the placing cavity is matched with the wafer lattice and is used for fixing the wafer.

Further, the mobile station is provided with a sucker, and the sucking position of the sucker is the center part of the placing cavity and is used for sucking wafers with different sizes, and the sucking position is the center of the wafer.

The beneficial effects of this application are: the application provides a wafer conversion device through being provided with the dog, with chassis and mobile station fixed connection to be provided with telescopic connection spare on the dog, in the installation on chassis, through the deformation and the elasticity of spring, install the chassis on the mobile station, and fix, easy dismounting improves machining efficiency, is provided with the spacing groove simultaneously in the chassis side, with ball assorted, improves installation effectiveness, and set up the sucking disc in the central part of placing the chamber, when adsorbing the wafer of equidimension to, the center of adsorbing the department for the wafer all the time, reduces the damage probability that the wafer leads to because of the atress is uneven.

In addition to the objects, features and advantages described above, the present utility model has other objects, features and advantages. The present utility model will be described in further detail with reference to the drawings.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model. In the drawings:

FIG. 1 is a schematic diagram of a wafer transfer apparatus according to the present application;

FIG. 2 is an enlarged schematic view of area A of FIG. 1;

fig. 3 is a schematic diagram of a connection manner of the stopper in fig. 1.

Wherein, each reference sign in the figure:

1. a mobile station; 2. a slide rail; 3. a first chassis; 4. a first wafer; 5. a suction cup; 6. a stop block; 30. a second chassis; 31. a first placement cavity; 32. a limit groove; 301. a second placement cavity; 40. a second wafer; 61. a fixing hole; 62. a bolt; 63. a screw hole; 64. a fixed shaft; 65. a spring; 66. and (3) rolling balls.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the utility model described herein are, for example, capable of operation in other environments. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

As shown in fig. 1-3, the present application provides a wafer conversion device, which includes a moving table 1, wherein the moving table 1 is disposed on a sliding rail 2, and can move along the sliding rail 2 under the action of external power.

The mobile station 1 is provided with a first chassis 3, the upper surface and the lower surface of the first chassis 3 are square, and can synchronously move along with the mobile station 1, the first chassis 3 is provided with a first placing cavity 31, the first placing cavity 31 is a cylindrical cavity, and the first placing cavity 31 is used for placing a first wafer 4 matched with the specification of the first wafer 4 and plays a role in positioning the first wafer 4.

Be provided with the arm on the mobile station 1, be provided with sucking disc 5 on this arm, and this sucking disc 5 sets up in the centre of a circle top of first place chamber 31 for adsorb first wafer 4, after first wafer 4 put into first place chamber 31, sucking disc 5 adsorbs the central part of first wafer 4, avoids adsorbing the edge and leads to the wafer atress uneven, produces the damage.

The periphery of the first chassis 3 is provided with a rectangular surface, and the rectangular surface is used for matching with a fixing mechanism, in the embodiment of the utility model, the fixing mechanism is a stop block 6, the stop block 6 is in threaded connection with the mobile station 1 through a bolt, a fixing hole 61 is arranged in the direction facing the first chassis 3, and a connecting mechanism is arranged in the fixing hole 61 to connect the stop block 6 with the first chassis 3.

In the embodiment of the utility model, the connecting mechanism comprises a fixed shaft 64, threads are arranged on the fixed shaft 64, the fixed shaft 64 is connected with a fixed hole 61, the length of the fixed shaft 64 is smaller than the depth of the fixed hole 61, a chamber is arranged in the direction of the fixed shaft 64, which is close to the first chassis 3, a spring 65 is arranged in the chamber, a ball 66 is connected to the spring 65, the ball 66 is spherical and forms a telescopic connecting piece with the spring 65, the ball 66 is extruded when the first chassis 3 is installed, the spring 65 is retracted, the spring 65 extends out after the installation is completed, and is clamped and enters a limiting groove 32 arranged on a rectangular surface, the first chassis 3 is fixedly connected with a stop block 6, and the limiting groove 32 can limit the position of the first chassis 3 in the processing process to prevent the sliding of the first chassis 3.

In other embodiments of the present utility model, the first chassis 3 may be replaced with a second chassis 30, where the shape and size of the second chassis 30 are the same as those of the first chassis 3, and a second placing cavity 301 is disposed on the second chassis 30, where the second placing cavity 301 has a different specification from that of the first placing cavity 31, and placing wafers with different specifications may be achieved.

The working flow is as follows: when the first chassis 3 is replaced, the first chassis 3 with different sizes needs to be replaced, the movable table 1 moves the first chassis 3 to the lower portion of the sucker 5 through the sliding rail 2, the sucker 5 sucks the wafer to replace the first chassis 3, when the first chassis 3 is replaced, the limit grooves 32 around the first chassis 3 are aligned with the balls 66 extending out of the side faces of the limit blocks 6, after the limit grooves are pressed downwards, the springs 65 connected with the balls 66 in the limit blocks 6 retract until the first chassis 3 is in contact with the surface of the movable table 1, at the moment, the springs apply elastic force to the direction of the first chassis 3 to clamp the first chassis 3, and meanwhile, the balls 66 are matched with the limit grooves 32 to limit the position of the first chassis 3, so that sliding is prevented in the machining process, and the machining effect is affected.

The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present utility model unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

In the description of the present utility model, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present utility model; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a wafer conversion device, includes mobile station (1), and this mobile station (1) sets up on slide rail (2) to be connected with actuating mechanism, actuating mechanism is used for driving mobile station (1) and removes, is provided with the chassis on this mobile station (1), be provided with fixed establishment between chassis and mobile station (1), at its characterized in that: the fixing mechanism comprises a stop block (6), the stop block (6) is fixed on the mobile station (1), a telescopic connecting piece is arranged on the stop block (6) and used for fixedly connecting the chassis, the telescopic connecting piece comprises a spring (65), one side, close to the chassis, of the spring (65) is provided with a ball (66), and the ball (66) is used for limiting the chassis and fixing the chassis through elastic force provided by the spring (65).

2. The wafer transfer apparatus of claim 1, wherein: and a limiting groove (32) is formed in the part, which is contacted with the fixing mechanism, of the chassis, and the limiting groove (32) is used for matching with the ball (66).

3. The wafer transfer apparatus of claim 1, wherein: the chassis is provided with a placing cavity, and the specification of the placing cavity is matched with that of the wafer compass lattice and is used for fixing the wafer.

4. The wafer transfer apparatus of claim 1, wherein: the mobile station (1) is provided with a sucker (5), and the sucking position of the sucker (5) is the center part of the placing cavity and is used for sucking wafers with different sizes, and the sucking position is the center of the wafer.