CN218916765U

CN218916765U - Vibrating mirror module and optical equipment

Info

Publication number: CN218916765U
Application number: CN202223090154.3U
Authority: CN
Inventors: 齐利克; 董南京; 王顺
Original assignee: Rongcheng Gol Microelectronics Co ltd
Current assignee: Rongcheng Gol Microelectronics Co ltd
Priority date: 2022-11-17
Filing date: 2022-11-17
Publication date: 2023-04-25
Anticipated expiration: 2032-11-17

Abstract

The embodiment of the application provides a vibrating mirror module and optical equipment. The galvanometer module includes: the transparent cover plate is covered on the shell, and a containing cavity is formed by enclosing the transparent cover plate and the shell; the vibrating mirror chip and the driving assembly are arranged in the accommodating cavity, and the driving assembly is used for driving the vibrating mirror chip to rotate; the sensing device comprises a sensing element and a circuit board, wherein the sensing element and the circuit board are arranged in a containing cavity, the sensing element is electrically connected with the circuit board, and the sensing element is used for sensing the pressure and the temperature in the containing cavity.

Description

Vibrating mirror module and optical equipment

Technical Field

The embodiment of the application relates to the technical field of optical devices, in particular to a galvanometer module and optical equipment.

Background

The vibrating mirror has the advantages of small size, low power consumption, quick response, easy integration, long service life and the like, and is used for amplifying the wonderful colors in the fields of optical projection, laser radar, 3D vision, 3D measurement and the like.

In operation, the vibrating mirror module generates temperature and other factors due to the vibrating mirror, so that the pressure and the temperature inside the vibrating mirror module can change, and the amplitude and the phase of the rotation of the vibrating mirror can be influenced after the pressure and the temperature inside the vibrating mirror module change.

The environmental difference inside the vibrating mirror module can influence the vibrating diaphragm rotation effect and the light transmission effect, so that the real-time monitoring of the environment inside the vibrating diaphragm module is particularly important.

Disclosure of Invention

The purpose of this application is to provide a novel technical scheme of galvanometer module and optical equipment.

In a first aspect, the present application provides a galvanometer module. The galvanometer module includes: the transparent cover plate is covered on the shell, and a containing cavity is formed by enclosing the transparent cover plate and the shell;

the vibrating mirror chip and the driving assembly are arranged in the accommodating cavity, and the driving assembly is used for driving the vibrating mirror chip to rotate;

the sensing device comprises a sensing element and a circuit board, wherein the sensing element and the circuit board are arranged in a containing cavity, the sensing element is electrically connected with the circuit board, and the sensing element is used for sensing the pressure and the temperature in the containing cavity.

Optionally, a mounting hole is formed in the shell, the mounting hole is communicated with the accommodating cavity, a control valve is arranged in the mounting hole, and the control valve is used for adjusting the pressure in the accommodating cavity.

Optionally, the control valve is a one-way valve or a two-way valve.

Optionally, the galvanometer module further includes a protective cover, and the protective cover is disposed on the control valve.

Optionally, a buffer component is disposed between the galvanometer chip and the driving component.

Optionally, the driving assembly includes a first magnetic member and a second magnetic member, the galvanometer chip is located above the first magnetic member and the second magnetic member, and the first magnetic member and the second magnetic member cooperate to drive the galvanometer chip to rotate.

Optionally, the driving assembly further includes a central shaft, the first magnetic member and the second magnetic member are disposed opposite to each other to form an annular structure, and the central shaft is inserted into the annular structure.

Optionally, the galvanometer module further includes a light shielding film, the light shielding film is disposed on the transparent cover plate, the light shielding film has a light through hole, the galvanometer chip has a galvanometer, and the light through hole is adapted to the galvanometer structure.

Optionally, the sensing element is a sensing chip, and the sensing chip is connected with the circuit board in an adhesive mode; or the sensing element is a sensor, and the sensor is connected with the circuit board in a welding mode.

In a second aspect, an optical device is provided. The optical device comprises a galvanometer module as described in the first aspect.

According to the embodiment of the application, a mirror module shakes is provided, set up sensing element in the holding intracavity of mirror module shakes to real-time supervision shakes the pressure and the temperature in the holding chamber of mirror module, so that the user implements and masters the pressure and the temperature that hold the intracavity, avoids influencing the normal rotation of mirror chip shakes, and avoids influencing light and shakes the normal transmission of mirror module.

Other features of the present specification and its advantages will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the specification and together with the description, serve to explain the principles of the specification.

Fig. 1 is an exploded view of a diaphragm module according to an embodiment of the present application.

Reference numerals illustrate:

1. a housing; 11. a receiving chamber; 111. a mounting groove;

2. a transparent cover plate; 3. a light shielding film; 31. a light-transmitting hole; 4. a galvanometer chip; 41. vibrating mirror;

5. a drive assembly; 51. a first magnetic member; 52. a second magnetic member; 53. a central shaft;

6. a buffer member;

7. a sensing element; 8. a circuit board; 9. a control valve; 10. and a protective cover.

Detailed Description

Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present application unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application, its application, or uses.

Techniques and equipment known to those of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate.

In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

The application implementation provides a galvanometer module. Referring to fig. 1, the galvanometer module includes: the device comprises a shell 1 and a transparent cover plate 2, wherein the transparent cover plate 2 is arranged on the shell 1 in a covering manner, and a containing cavity 11 is formed by enclosing the transparent cover plate 2 and the shell 1;

the vibrating mirror chip 4 and the driving component 5 are arranged in the accommodating cavity 11, and the driving component 5 is used for driving the vibrating mirror chip 4 to rotate;

the sensing device comprises a sensing element 7 and a circuit board 8, wherein the sensing element 7 and the circuit board 8 are arranged in a containing cavity 11, the sensing element 7 is electrically connected with the circuit board 8, and the sensing element 7 is used for sensing the pressure and the temperature in the containing cavity 11.

In this embodiment, the galvanometer module includes a housing 1 and a transparent cover plate 2, where the transparent cover plate 2 is covered on the housing 1, for example, the transparent cover plate 2 and the housing 1 are bonded together, or the transparent cover plate 2 and the housing 1 are connected together by a fastening manner, for example. Taking the case that the transparent cover plate 2 and the shell 1 are connected together in an adhesive manner, for example, a glue groove is formed in the circumferential direction of the shell 1, sealant is arranged in the glue groove, the transparent cover plate 2 is covered on the shell 1, and the transparent cover plate 2 is fixed on the shell 1 through the sealant. For example, the sealant is high temperature resistant and waterproof.

In a specific embodiment, sealant is arranged in the sealant groove, and then the transparent cover plate 2 is covered on the shell 1, so that the situation of sealant overflow is avoided.

In one embodiment, the transparent cover plate 2 may be transparent glass, coated glass or colored glass, or other materials that are convenient for connecting with the housing 1. Wherein the cover plate is a transparent cover plate 2 for transmitting external light to the vibrating mirror chip 4, and the cover plate is a transparent cover plate 2 for allowing a user to penetrate through the inside of the housing 1.

In this embodiment, the transparent cover plate 2 is arranged on the housing 1 in a covering manner, forming a receiving space 11, wherein the vibrating mirror chip 4, the drive assembly 5, the sensor element 7 and the circuit board 8 are arranged in the receiving space 11. The housing chamber 11 formed in the housing 1 is covered by the transparent cover plate 2, and thus the vibrating mirror chip 4, the driving assembly 5, the sensor element 7 and the circuit board 8 are all disposed in the sealed chamber.

In this embodiment, the galvanometer chip 4 and the driving assembly 5 are disposed in the accommodating cavity 11, and the galvanometer chip 4 is in an operating state during the process of driving the galvanometer chip 4 by the driving assembly 5. For example, the galvanometer module is applied to an optical machine module or an optical system, the galvanometer chip 4 is in a working state, the galvanometer chip 4 generates heat, and when the galvanometer chip 4 generates heat, for example, the temperature of the galvanometer chip 4 increases, the temperature and the pressure in the accommodating cavity 11 in the galvanometer module can be changed.

In a specific embodiment, the galvanometer chip 4 may be a DMD chip, on which hundreds of thousands or even hundreds of thousands of micro-mirrors are arranged, and each micro-mirror can be independently rotated by the driving of the driving assembly 5, and can be rotated thousands of times per second. The light source may be reflected by the micro-mirrors to form an image on the screen.

Because the vibrating diaphragm chip is in the operating condition, the vibrating diaphragm chip can generate heat, and after the vibrating mirror chip 4 generates heat, the pressure and the temperature in the accommodating cavity 11 in the vibrating mirror module can be changed, so that the rotating amplitude and the rotating phase of the DMD chip are affected. Or when the pressure and temperature in the accommodating cavity 11 change, the humidity in the accommodating cavity 11 also changes, and when the humidity in the accommodating cavity 11 is too high, the vibrating mirror module is applied to the optical machine module or other optical systems, and the trend of the light path can be influenced in the light propagation process (for example, moisture can interfere with the transmission of the light path in the system)

For this reason, in the embodiment of the present application, the sensing element 7 is disposed in the accommodating chamber 11, wherein the sensing element 7 monitors the pressure and temperature in the accommodating chamber 11 in real time, and transmits the detected pressure and temperature to the external device through the circuit board 8, so that the user can grasp the pressure and temperature in the accommodating chamber 11 in real time. For example, the amplitude and phase of rotation of the galvanometer chip 4 may change with changes in driving voltage, ambient temperature, humidity, pressure, etc., for example, according to experience, a pressure threshold and a temperature threshold may be set on an external device, the pressure monitored by the sensing element 7 exceeds the pressure threshold, and the temperature exceeds the temperature threshold, so that the user may react in time to avoid affecting the normal rotation of the galvanometer chip 4. Wherein referring to fig. 1, the sensing element 7 and the circuit board 8 are not electrically connected together for the sake of clarity.

Therefore, in the embodiment of the application, the sensing element 7 is arranged in the accommodating cavity 11 of the vibrating mirror module, so that the pressure and the temperature of the accommodating cavity 11 in the vibrating mirror module are monitored in real time, the user can grasp the pressure and the temperature in the accommodating cavity 11 conveniently, the influence on the normal rotation of the vibrating mirror chip 4 is avoided, and the influence on the normal transmission of light in the vibrating mirror module is avoided.

In an alternative embodiment, the galvanometer chip 4 is electrically connected to the circuit board 8, for example by wire bonding or soldering the galvanometer chip 4 to the circuit board 8.

In an alternative embodiment, referring to fig. 1, a portion of the circuit board 8 may extend beyond the galvanometer module to facilitate connection to external devices. The circuit board 8 can extend out of the galvanometer module in the mode shown in fig. 1, or a slit can be formed in the wall of the shell 1, the slit is communicated with the accommodating cavity 11, and the circuit board 8 extends out of the galvanometer module through the slit. For example, the circuit board 8 may be a hard circuit board 8, or a flexible circuit board 8, or the like. The circuit board 8 is connected with the internal and external circuits of the vibrating mirror module and plays a role in transmitting signals.

In one embodiment, referring to fig. 1, the housing 1 is provided with a mounting hole, the mounting hole is communicated with the accommodating cavity 11, a control valve 9 is disposed in the mounting hole, and the control valve 9 is used for adjusting the pressure in the accommodating cavity 11.

In this embodiment, a mounting hole is provided in the housing 1, and the control valve 9 is mounted in the mounting hole such that the accommodation chamber 11 forms a sealed environment.

In this embodiment, a control valve 9 is provided on the housing 1, and the control valve 9 communicates with an external air supply device or with a negative pressure device to control the pressure in the accommodating chamber 11 so that the pressure and temperature in the accommodating chamber 11 meet the requirements. In general, the internal environment of the accommodating cavity 11 is in a dry state, which is more beneficial to the work of the galvanometer module. For example, when the sensing element 7 monitors that the environment in the accommodating cavity 11 is too humid, dry gas can be introduced into the accommodating cavity 11 through the control valve 9 to improve the environment in the accommodating cavity 11, or the accommodating cavity 11 can be in a vacuum environment through the control valve 9, so that the working of the galvanometer module is more facilitated, that is, the working environment of the galvanometer chip 4 in the galvanometer module is more met. In an alternative embodiment, the mounting holes are pressure equalizing holes.

In a specific embodiment, the control valve 9 is a one-way valve or a two-way valve.

For example, the control valve 9 is a one-way valve, and only allows gas to enter the accommodating cavity 11, for example, gas (for example, helium or other colored gas can be introduced into the accommodating cavity 11 through the one-way valve, the colored gas can be introduced into the accommodating cavity), and the overall tightness of the galvanometer module can be judged by observing the depth of the color of the gas, so that the environment inside the accommodating cavity 11 is improved, the environment inside the accommodating cavity 11 is beneficial to the working of the galvanometer module, and the working environment of the galvanometer chip 4 in the galvanometer module is more met.

For example, the control valve 9 is a two-way valve, and may be configured to introduce gas into the accommodating chamber 11 or to vacuum the accommodating chamber 11.

Specifically, the transparent cover plate 2 is made of glass, when the pressure and temperature inside the accommodating cavity 11 are not suitable (which is beneficial to water vapor), water drops and the like are condensed on the transparent cover plate 2, and normal transmission of light rays is affected; in addition, when the pressure and temperature inside the accommodating cavity 11 are not suitable, normal transmission of light inside the galvanometer module is affected, and rotation of the galvanometer chip 4 is also affected. At this time, the accommodating chamber 11 may be subjected to a vacuum-pumping process, so that the environment inside the accommodating chamber 11 meets the requirements (for example, the pressure and the temperature inside the accommodating chamber 11 may be monitored in real time, and whether the pressure and the temperature inside the accommodating chamber 11 meet the requirements may be determined). Or the gas can be introduced into the accommodating cavity 11 so that the pressure and the temperature inside the accommodating cavity 11 meet the requirements.

In one embodiment, referring to fig. 1, the galvanometer module further includes a protective cover 10, the protective cover 10 being provided on the control valve 9.

In this embodiment, a protective cover 10 is provided over the control valve 9 to protect the control valve 9 from a user's mistouching the control valve 9.

In one embodiment, referring to fig. 1, a buffer member 6 is disposed between the galvanometer chip 4 and the driving assembly 5.

In this embodiment, the buffer member 6 is disposed between the galvanometer chip 4 and the driving assembly 5, so as to avoid hard collision between the galvanometer chip 4 and the driving assembly 5 during rotation, and damage to the galvanometer chip 4. For example, the buffer member 6 may be made of a flexible material such as silicone or sponge.

The driving mode of the driving component 5 to the vibrating mirror chip 4 may include, but is not limited to, electrostatic driving, electromagnetic driving, piezoelectric driving, electrothermal driving, etc. The rotation (e.g., turning) of the galvanometer chip 4 may be achieved by the above-described driving method.

In a specific embodiment, referring to fig. 1, the driving assembly 5 includes a first magnetic member 51 and a second magnetic member 52, the galvanometer chip 4 is located above the first magnetic member 51 and the second magnetic member 52, and the first magnetic member 51 and the second magnetic member 52 cooperate to drive the galvanometer chip 4 to rotate.

In this embodiment, the driving assembly 5 includes a first magnetic member 51 and a second magnetic member 52, for example, the first magnetic member 51 is an N pole, the second magnetic member 52 is an S pole, and the first magnetic member 51 and the second magnetic member 52 are matched together to drive the galvanometer chip 4 to rotate in an electromagnetic driving manner.

In one embodiment, referring to fig. 1, the driving assembly 5 further includes a central shaft 53, and the first magnetic member 51 and the second magnetic member 52 are disposed opposite to form an annular structure, and the central shaft 53 is inserted into the annular structure.

In this embodiment, a central shaft 53 is provided between the first magnetic member 51 and the second magnetic member 52 so that magnetic induction lines between the first magnetic member 51 and the second magnetic member 52 are more concentrated to strengthen driving forces of the first magnetic member 51 and the second magnetic member 52 on the galvanometer chip 4.

In an alternative embodiment, the drive assembly 5 and the housing 1 may be assembled together in an assembled manner. For example, the housing 1 is a plastic housing 1, the housing 1 is formed by injection molding, wherein a mounting groove 111 for mounting the driving assembly 5 is formed in the housing 1 (the mounting groove 111 is formed in the accommodating cavity 11), the driving assembly 5 is mounted in the mounting groove 111, and the transparent cover plate 2 is covered on the housing 1, so that the transparent cover plate 2 and the housing 1 form a sealed accommodating cavity 11. In the case where the control valve 9 is provided on the housing 1, a mounting hole is formed on the housing 1, and the control valve 9 is mounted in the mounting hole so that the accommodation chamber 11 is still in a sealed state. Or the driving component 5 and the shell 1 can be injection molded together by adopting an injection molding process, so that complicated assembly processes are avoided, and the cost is reduced.

In one embodiment, referring to fig. 1, the galvanometer module further includes a light shielding film 3, the light shielding film 3 is disposed on the transparent cover plate 2, the light shielding film 3 has a light passing hole 31, the galvanometer chip 4 has a galvanometer 41, and the light passing hole 31 is structurally matched with the galvanometer 41.

In this embodiment, the galvanometer module further includes a light shielding film 3, where the light shielding film 3 may be attached to the transparent cover plate 2, and the light shielding film 3 is provided with a light through hole 31 so as not to affect the transmission of external light inside the galvanometer module.

In a specific embodiment, the galvanometer 41 on the galvanometer chip 4 has a circular structure, and the light through hole 31 formed on the light shielding film 3 has a circular structure, and the two structures are matched with each other, so that the light received by the galvanometer 41 in the galvanometer chip 4 is not affected.

In one embodiment, the sensing element 7 is a sensing chip, and the sensing chip is connected with the circuit board 8 by adopting an adhesion mode; or the sensing element 7 is a sensor, and the sensor is connected with the circuit board 8 in a welding mode.

For example, the sensor element 7 is a pressure sensor element 7, wherein the pressure sensor element 7 can monitor both the pressure and the temperature inside the receiving chamber 11, or the sensor element 7 is a temperature-pressure sensor element 7, or the sensor element 7 is a combination sensor of the temperature sensor element 7 and the pressure sensor element 7.

For example, the sensor chip is arranged in the accommodating cavity 11 in an adhesive manner, for example, the sensor chip is arranged on the circuit board 8 in an adhesive manner, and the sensor chip and the circuit board are connected in a gold wire bonding manner.

For example, the sensor is a finished sensor product, wherein the sensor comprises a housing 1, and holes are formed in the housing 1 so that the sensor can monitor pressure and temperature. The sensor is provided with solder joints, and the sensor can be soldered on the circuit board 8.

In a second aspect, an optical device is provided. The optical equipment comprises the vibrating mirror module. For example, the optical device may be a head mounted display device, or a projection light engine or the like.

The foregoing embodiments mainly describe differences between the embodiments, and as long as there is no contradiction between different optimization features of the embodiments, the embodiments may be combined to form a better embodiment, and in consideration of brevity of line text, no further description is given here.

While certain specific embodiments of the utility model have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the utility model. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the utility model. The scope of the utility model is defined by the appended claims.

Claims

1. The utility model provides a mirror module shakes, its characterized in that, mirror module shakes includes:

the device comprises a shell (1) and a transparent cover plate (2), wherein the transparent cover plate (2) is arranged on the shell (1) in a covering mode, and a containing cavity (11) is formed by enclosing the transparent cover plate (2) and the shell (1);

the vibrating mirror chip (4) and the driving assembly (5) are arranged in the accommodating cavity (11), and the driving assembly (5) is used for driving the vibrating mirror chip (4) to rotate;

the sensing device comprises a sensing element (7) and a circuit board (8), wherein the sensing element (7) and the circuit board (8) are arranged in a containing cavity (11), the sensing element (7) is electrically connected with the circuit board (8), and the sensing element (7) is used for sensing the pressure and the temperature in the containing cavity (11).

2. Vibrating mirror module according to claim 1, characterized in that the housing (1) is provided with a mounting hole, the mounting hole is communicated with the accommodating cavity (11), a control valve (9) is arranged in the mounting hole, and the control valve (9) is used for adjusting the pressure in the accommodating cavity (11).

3. Vibrating mirror module according to claim 2, characterized in that the control valve (9) is a one-way valve or a two-way valve.

4. A galvanometer module according to claim 2 or 3, characterized in that the galvanometer module further comprises a protective cover (10), the protective cover (10) being arranged over the control valve (9).

5. Vibrating mirror module according to claim 1, characterized in that a buffer member (6) is arranged between the vibrating mirror chip (4) and the drive assembly (5).

6. The galvanometer module according to claim 1 or 5, characterized in that the driving assembly (5) comprises a first magnetic member (51) and a second magnetic member (52), the galvanometer chip (4) is located above the first magnetic member (51) and the second magnetic member (52), and the first magnetic member (51) and the second magnetic member (52) cooperate to drive the galvanometer chip (4) to rotate.

7. Vibrating mirror module according to claim 6, characterized in that the drive assembly (5) further comprises a central shaft (53), the first magnetic element (51) and the second magnetic element (52) being arranged opposite to form an annular structure, the central shaft (53) being inserted in the annular structure.

8. The galvanometer module according to claim 1, further comprising a light shielding film (3), wherein the light shielding film (3) is arranged on the transparent cover plate (2), the light shielding film (3) is provided with a light through hole (31), the galvanometer chip (4) is provided with a galvanometer (41), and the light through hole (31) is structurally adapted to the galvanometer (41).

9. Vibrating mirror module according to claim 1, characterized in that the sensor element (7) is a sensor chip, which is connected to the circuit board (8) in an adhesive manner; or the sensor element (7) is a sensor, and the sensor is connected with the circuit board (8) in a welding mode.

10. An optical device comprising a galvanometer module as claimed in any one of claims 1 to 9.